EP0970437A1 - Electronic module for chip card - Google Patents

Electronic module for chip card

Info

Publication number
EP0970437A1
EP0970437A1 EP98914903A EP98914903A EP0970437A1 EP 0970437 A1 EP0970437 A1 EP 0970437A1 EP 98914903 A EP98914903 A EP 98914903A EP 98914903 A EP98914903 A EP 98914903A EP 0970437 A1 EP0970437 A1 EP 0970437A1
Authority
EP
European Patent Office
Prior art keywords
electronic module
support
contact
module according
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP98914903A
Other languages
German (de)
French (fr)
Inventor
Michael Zafrany
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Gemplus Card International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SCA, Gemplus Card International SA filed Critical Gemplus SCA
Priority to EP01117497A priority Critical patent/EP1168240B1/en
Publication of EP0970437A1 publication Critical patent/EP0970437A1/en
Ceased legal-status Critical Current

Links

Classifications

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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Abstract

The invention concerns an electronic module, in particular designed to be fixed in an electronic device in the form of a card, comprising a medium (40) including at least a surface (44) provided with contact pads (46; 48; 50) and a microcircuit (56) which is fixed on said medium (40) and which comprises exit hubs (60, 62) each connected to a medium contact pad. The invention is characterised in that the connections (66, 68) between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance matching the relief of the medium. Advantageously, the conductive substance is a conductive isotropic adhesive.

Description

MODULE ELECTRONIQUE POUR CARTE A PUCE ELECTRONIC MODULE FOR CHIP CARD
La présente invention concerne les modules électroniques, notamment destinés à être montés dans un dispositif électronique sous forme de carte, comprenant un support comportant au moins une face munie de pistes de contact et un microcircuit qui est fixé sur ledit support et qui comporte des plots de sortie reliés chacun à une piste de contact du support.The present invention relates to electronic modules, in particular intended to be mounted in an electronic device in the form of a card, comprising a support comprising at least one face provided with contact tracks and a microcircuit which is fixed on said support and which comprises contact pads. output each connected to a contact track of the support.
De tels dispositifs sous forme de carte comprennent, en particulier, les cartes à circuit(s) intégré(s), aussi appelées cartes à puce, mais aussi des supports d'éléments électroniques pour la télévision, les magnétoscopes, etc. Une carte à puce est constituée d'un corps de carte et d'un module comprenant la puce et intégré dans le corps de carte.Such card-shaped devices include, in particular, integrated circuit cards, also called smart cards, but also supports for electronic elements for television, video recorders, etc. A smart card consists of a card body and a module comprising the chip and integrated into the card body.
Un module de carte à puce est constitué d'un support, généralement en verre époxy, qui est métallisé sur une face de manière à présenter des pistes de contact et d'une puce qui est collée sur l'autre face du support et qui comporte des plots de sortie sur sa face extérieure. Des puits de connexion sont aménagés à travers le support pour le passage de fils de connexion reliant un plot de sortie à une piste de contact. Les fils de connexion, en métal inoxydable tel que l'or ou de l'aluminium, sont soudés en utilisant différentes technologies, telles que le soudage par ultrasons ou par thermocompression, qui nécessitent un enrobage ("glob top") ultérieur des fils de connexion au moyen d'une résine pour les protéger. Il est parfois nécessaire de fixer préalablement une barrière de retenue de la résine, telle qu'un anneau métallique ou en siiicone, sur le support.A smart card module consists of a support, generally made of epoxy glass, which is metallized on one side so as to present contact tracks and a chip which is glued on the other side of the support and which comprises output pads on its outer face. Connection wells are arranged through the support for the passage of connection wires connecting an output pad to a contact track. The connection wires, made of stainless metal such as gold or aluminum, are welded using different technologies, such as ultrasonic or thermocompression welding, which require subsequent coating ("glob top") of the wires. connection by means of a resin to protect them. It is sometimes necessary to fix a resin retaining barrier, such as a metal or silicon ring, on the support beforehand.
La masse de résine est déposée de manière non contrôlable et, lorsqu'elle est polymérisée, elle forme une goutte de grande épaisseur qui dépasse en hauteur les spécifications des cartes à puce. Il est donc nécessaire d'effectuer une opération de fraisage pour réduire l'épaisseur du module à la valeur requise. Cette opération de fraisage peut endommager le module, ce qui constitue la cause principale des rebuts de fabrication.The mass of resin is deposited in an uncontrollable manner and, when it is polymerized, it forms a drop of great thickness which exceeds in height the specifications of the smart cards. It is therefore necessary to perform a milling operation to reduce the thickness of the module to the required value. This milling operation can damage the module, which is the main cause of manufacturing waste.
Dans le corps de la carte à puce, on aménage une cavité qui est destinée à recevoir le module et qui doit être relativement profonde pour recevoir un module de hauteur importante. Il en résulte que l'épaisseur du corps de la carte au niveau de la cavité est faible, ce qui provoque, lorsque la carte à puce subit des flexions, une déformation importante du corps de la carte qui limite la fiabilité et la durée de vie de la carte. De plus, la polymérisation de cette goutte de résine provoque un phénomène de bombement du module.In the body of the smart card, there is a cavity which is intended to receive the module and which must be relatively deep to receive a module of significant height. As a result, the thickness of the card body at the level of the cavity is small, which causes, when the smart card undergoes bending, a significant deformation of the card body which limits the reliability and the lifetime. from the menu. In addition, the polymerization of this drop of resin causes the module to bulge.
Ce bombement peut entraîner une détérioration des lecteurs de carte à puce.This bulging can lead to deterioration of smart card readers.
Le problème à la base de l'invention est de fournir un module électronique de hauteur réduite de manière à supprimer les inconvénients précités.The problem underlying the invention is to provide an electronic module of reduced height so as to eliminate the aforementioned drawbacks.
Le module électronique selon l'invention est notamment remarquable en ce que les connexions entre les plots de sortie et les pistes de contact sont constituées par un cordon de substance conductrice adhesive épousant le relief du support.The electronic module according to the invention is notably remarkable in that the connections between the output pads and the contact tracks consist of a bead of adhesive conductive substance conforming to the relief of the support.
Ces connexions ne nécessitent pas d'enrobage de protection, ce qui permet de réduire notablement la hauteur du module. Il en résulte que la fabrication est simplifiée et que, en particulier, l'opération de fraisage est supprimée, ce qui réduit fortement le taux de rebuts de fabrication.These connections do not require a protective coating, which makes it possible to significantly reduce the height of the module. As a result, the manufacturing is simplified and, in particular, the milling operation is eliminated, which greatly reduces the rate of manufacturing scrap.
Avantageusement, la substance conductrice est une colle conductrice isotrope.Advantageously, the conductive substance is an isotropic conductive adhesive.
On peut aussi utiliser un métal déposé par sérigraphie. Dans le cas où le support comporte des puits de connexion, ceux-ci sont remplis par la substance conductrice.It is also possible to use a metal deposited by screen printing. In the case where the support comprises connection wells, these are filled with the conductive substance.
Le support peut comporter deux faces munies de pistes de contact et les connexions sont réalisées directement sur deux faces sans utiliser de puits de connexion.The support may have two faces provided with contact tracks and the connections are made directly on two faces without using connection wells.
Avantageusement, une des faces du support est recouverte par un film adhésif activable.Advantageously, one of the faces of the support is covered by an activatable adhesive film.
Ceci constitue une protection supplémentaire du microcircuit et permet de simplifier l'opération de fixation du module dans le corps de la carte. Les plots de sortie du microcircuit peuvent comporter des bosses de connexion de manière à réduire la résistance de contactThis constitutes additional protection of the microcircuit and makes it possible to simplify the operation of fixing the module in the body of the card. The output pads of the microcircuit may have connection bumps so as to reduce the contact resistance
L'invention a aussi pour objet un procédé de fabrication d'un module électronique, caractérisé en ce que le cordon est réalisé par dépôt d'une substance conductrice visqueuseThe invention also relates to a method of manufacturing an electronic module, characterized in that the cord is produced by depositing a viscous conductive substance
Cette technique de dépôt au moyen d'une seringue ou analogue est rapide et facile à mettre en oeuvreThis deposition technique using a syringe or the like is quick and easy to implement
L'invention a encore pour objet une carte à puce caractérisée en ce qu'elle comporte au moins un module électronique du type précitéThe invention also relates to a smart card characterized in that it comprises at least one electronic module of the aforementioned type
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui suit pour la compréhension de laquelle on se reportera aux dessins annexes dans lesquelsOther characteristics and advantages of the invention will appear on reading the detailed description which follows for the understanding of which reference will be made to the accompanying drawings in which
- la figure 1 est un schéma qui représente, en section transversale, un module électronique de type connu ,FIG. 1 is a diagram which represents, in cross section, an electronic module of known type,
- la figure 2 représente un module électronique conforme à la présente invention , - la figure 3 est une vue de dessus d'un mode de réalisation d'un module dont le support comporte deux faces munies de pistes de contact ,FIG. 2 represents an electronic module in accordance with the present invention, FIG. 3 is a top view of an embodiment of a module, the support of which has two faces provided with contact tracks,
La figure 1 représente un module électronique de type connu II comprend un support 10, par exemple en verre époxyFIG. 1 represents an electronic module of known type II comprises a support 10, for example made of epoxy glass
Une de ses faces 12 comporte des pistes de contact 14 réalisées par métallisation L'autre face 16 comporte une couche de colle 18 servant à fixer la face inférieure d'un microcircuit 20 qui comporte des plots de sortie 22 sur sa face supérieure libre Les connexions entre les plots de sortie 22 et les pistes de contact 14 sont réalisées par soudage de fils métalliques 24 qui passent chacun à travers un puits 26 de connexion réalisé dans le support 10 Après l'opération de soudure des fils 24, ceux-ci sont enrobés d'une résine polyméπsable qui forme une goutte 28 qui est retenue par un anneau périphérique 30 en siliconeOne of its faces 12 has contact tracks 14 produced by metallization The other face 16 has a layer of adhesive 18 used to fix the lower face of a microcircuit 20 which has output pads 22 on its free upper face The connections between the output pads 22 and the contact tracks 14 are produced by welding of metal wires 24 which each pass through a connection well 26 made in the support 10 After the welding operation of the wires 24, these are coated of a polymerizable resin which forms a drop 28 which is retained by a peripheral ring 30 of silicone
Cette goutte 28 est appliquée de manière non contrôlée et elle présente une épaisseur importante qui augmente considérablement la hauteur du module si bien qu'il est nécessaire d'araser sa partie supérieure par une opération d'usinage, tel qu'un fraisage, comme schématisé par la ligne en pointillés 32. Comme indiqué plus haut, la présence de cette goutte 28 peut réduire la résistance mécanique de la carte à puce au niveau de la cavité recevant le module de telle sorte que la résistance mécanique de la carte à ce niveau est insuffisante et que, en outre, la carte peut présenter un bombement à ce niveau.This drop 28 is applied in an uncontrolled manner and it has a significant thickness which increases considerably the height of the module so that it is necessary to level off its upper part by a machining operation, such as milling, as shown schematically by the dotted line 32. As indicated above, the presence of this drop 28 can reduce the mechanical resistance of the smart card at the level of the cavity receiving the module so that the mechanical resistance of the card at this level is insufficient and that, in addition, the card can have a bulge at this level.
La figure 2 représente un module électronique conforme à la présente invention. Le support 40 comporte des puits de connexion 42. La face inférieure 44 du support 40 est métallisée et comporte des pistes de contact 46, 48 et 50. La face supérieure 52 du support 40 porte une couche 54 de colle servant à la fixation d'une puce 56 qui comporte, sur sa face supérieure 58, des plots de sortie 60 et 62 qui peuvent être munis de bosses de contact (bumps) non représentées. Un revêtement 64 d'adhésif isolant est appliqué sur la périphérie de la puce 56, sur la face 52 du support au voisinage de la puce et dans les puits de connexion 42.FIG. 2 represents an electronic module in accordance with the present invention. The support 40 has connection wells 42. The lower face 44 of the support 40 is metallized and has contact tracks 46, 48 and 50. The upper face 52 of the support 40 carries a layer 54 of glue used for fixing a chip 56 which comprises, on its upper face 58, output pads 60 and 62 which may be provided with contact bumps (bumps) not shown. A coating 64 of insulating adhesive is applied to the periphery of the chip 56, on the face 52 of the support in the vicinity of the chip and in the connection wells 42.
Conformément à l'invention, les connexions 66 et 68 entre les plots de sortie 60 et 62 et les pistes de contact 46 et 50 sont constitués par un cordon de substance conductrice adhesive qui épouse le relief du support, plus particulièrement qui est en contact avec le revêtement adhésif 64 et dont les extrémités sont en contact le plot de sortie et la piste de contact associée. Cette substance est appliquée à l'état visqueux.According to the invention, the connections 66 and 68 between the output pads 60 and 62 and the contact tracks 46 and 50 are constituted by a bead of adhesive conductive substance which marries the relief of the support, more particularly which is in contact with the adhesive coating 64 and the ends of which are in contact with the output pad and the associated contact track. This substance is applied in a viscous state.
L'application de cette substance, par exemple une colle conductrice isotrope, est réalisée par une technique de dépôt dite de "dispense" selon laquelle on applique une substance liquide ou de faible viscosité au moyen d'une seringue ou analogue à débit et ouverture commandés.The application of this substance, for example an isotropic conductive adhesive, is carried out by a deposition technique called "dispensing" according to which a liquid or low viscosity substance is applied by means of a syringe or the like with controlled flow and opening. .
Cette opération de dispense est réalisée par exemple au moyen d'une installation commercialisée sous la dénomination CAM/ALOT par la société américaine Camelot Systems Inc. et utilisée pour la réalisation en ligne de circuits électroniques. Le déplacement et l'ouverture de la seringue sont commandés par un programme informatique.This exemption operation is carried out for example by means of an installation marketed under the name CAM / ALOT by the American company Camelot Systems Inc. and used for the online production of electronic circuits. The movement and opening of the syringe are controlled by a computer program.
On peut aussi réaliser ces connexions en utilisant un métal déposé par sérigraphie. Pour améliorer le contact électrique, les plots de sortie peuvent comporter des bossages de contact et le contact des extrémités des cordons de substance conductrice se fait avec ces derniers.These connections can also be made using a metal deposited by screen printing. To improve the electrical contact, the output pads may include contact bosses and the ends of the beads of conductive substance are in contact with them.
L'invention s'applique aussi au cas où le support comporte deux faces métallisées comportant des pistes de contact.The invention also applies to the case where the support comprises two metallized faces comprising contact tracks.
Ceci est illustré sur la figure 3 qui est une vue partielle de dessus du module où l'on voit une puce 70 avec ses plots de sortie 72, 74, 76, 78 et 80. Les plots 72, 74 et 76 sont reliés à une piste de contact de la face inférieure du support et les plots 78 et 80 sont reliés à une piste 82, respectivement 84, disposée sur la face supérieure du support, également par un cordon de substance conductrice adhesive 86, respectivement 88.This is illustrated in FIG. 3 which is a partial top view of the module where we see a chip 70 with its output pads 72, 74, 76, 78 and 80. The pads 72, 74 and 76 are connected to a contact track on the underside of the support and the pads 78 and 80 are connected to a track 82, respectively 84, disposed on the upper face of the support, also by a bead of adhesive conductive substance 86, respectively 88.
Le module électronique selon l'invention peut être recouvert par un film adhésif activable, par exemple par chauffage ou rayonnement ultraviolet, afin, d'une part, d'augmenter la protection de la puce et, d'autre part, de simplifier l'opération de fixation du module dans la cavité du corps de carte. La réalisation de connexions directes selon la présente invention s'applique à la fabrication de tout dispositif électronique sous forme de carte tel que les cartes de commande d'appareils vidéo ou d'appareils ménagers.The electronic module according to the invention can be covered with an activatable adhesive film, for example by heating or ultraviolet radiation, in order, on the one hand, to increase the protection of the chip and, on the other hand, to simplify the fixing operation of the module in the cavity of the card body. The realization of direct connections according to the present invention applies to the manufacture of any electronic device in the form of a card such as control cards for video devices or household appliances.
On voit que l'invention permet de supprimer l'enrobage des connexions et, par suite, de réduire l'épaisseur des modules.It can be seen that the invention makes it possible to eliminate the coating of the connections and, consequently, to reduce the thickness of the modules.
Par ailleurs, les résines utilisées comme substance conductrice sont très souples, ce qui augmente la fiabilité du module.Furthermore, the resins used as conductive substance are very flexible, which increases the reliability of the module.
Les opérations liées à l'enrobage des connexions, à savoir la mise en place d'une barrière de retenue telle qu'un anneau de silicone, le dépôt de la résine d'enrobage et l'usinage de la goutte de résine, sont supprimées. Il en résulte une simplification de la fabrication et une réduction du coût de fabrication. L'invention permet d'avoir une épaisseur du corps de carte plus importante au niveau du module et, par conséquent, d'accroître la résistance mécanique de la carte.The operations related to the coating of the connections, namely the installation of a retaining barrier such as a silicone ring, the deposition of the coating resin and the machining of the drop of resin, are eliminated. . This results in a simplification of the manufacturing and a reduction in the manufacturing cost. The invention makes it possible to have a greater thickness of the card body at the level of the module and, consequently, to increase the mechanical resistance of the card.
Grâce à l'invention, on peut réduire les dimensions des modules dans le plan du microcircuit, ce qui permet de fabriquer les modules en chaîne avec deux lignes adjacentes de modules.Thanks to the invention, the dimensions of the modules can be reduced in the plane of the microcircuit, which makes it possible to manufacture the modules in a chain with two adjacent lines of modules.
Enfin, l'invention permet de supprimer le phénomène de bombement et, par suite, d'éviter la détérioration des lecteurs. Finally, the invention makes it possible to eliminate the bulging phenomenon and, consequently, to avoid deterioration of the readers.

Claims

REVENDICATIONS
1 . Module électronique (94), notamment destiné à être monté dans un dispositif électronique sous forme de carte, comprenant un support (10 ; 40 ; 108) comportant au moins une face (12 ; 44) munie de pistes de contact (14 ; 46 ; 48 ; 50) et un microcircuit (20 ; 56 ; 70 ; 98) qui est fixé sur ledit support (10 ; 40 ; 108) et qui comporte des plots de sortie (22 ; 60,62 ; 72, 74, 76, 78, 80) reliés chacun à une piste de contact du support, caractérisé en ce que les connexions (66, 68 ; 86, 88) entre les plots de sortie et les pistes de contact sont constituées par un cordon de substance conductrice adhesive épousant le relief du support.1. Electronic module (94), in particular intended to be mounted in an electronic device in the form of a card, comprising a support (10; 40; 108) comprising at least one face (12; 44) provided with contact tracks (14; 46; 48; 50) and a microcircuit (20; 56; 70; 98) which is fixed on said support (10; 40; 108) and which has output pads (22; 60,62; 72, 74, 76, 78 , 80) each connected to a contact track of the support, characterized in that the connections (66, 68; 86, 88) between the output pads and the contact tracks consist of a bead of adhesive conductive substance matching the relief of support.
2. Procédé de fabrication d'un module électronique selon la revendication 1 , caractérisé en ce que le cordon est réalisé par dépôt d'une substance conductrice visqueuse.2. A method of manufacturing an electronic module according to claim 1, characterized in that the cord is produced by depositing a viscous conductive substance.
3. Module électronique selon la revendication 1 , caractérisé en ce que la substance conductrice est une colle conductrice isotrope. 3. Electronic module according to claim 1, characterized in that the conductive substance is an isotropic conductive adhesive.
4. Module électronique selon l'une quelconque des revendications 1 à 3, caractérisé en ce que le support comporte deux faces munies de pistes de contact.4. Electronic module according to any one of claims 1 to 3, characterized in that the support has two faces provided with contact tracks.
5. Module électronique selon l'une quelconque des revendications 1 à 4, caractérisé en ce qu'une des faces du module est recouverte par un film adhésif activable.5. Electronic module according to any one of claims 1 to 4, characterized in that one of the faces of the module is covered by an activatable adhesive film.
6. Module électronique selon l'une quelconque des revendications 1 à 5, caractérisé en ce que les plots de sortie du microcircuit comportent des bosses de connexion.6. Electronic module according to any one of claims 1 to 5, characterized in that the output pads of the microcircuit have connection bumps.
7. Carte à puce caractérisée en ce qu'elle comporte au moins un module électronique selon l'une quelconque des revendications 1 à 6. 7. Chip card characterized in that it comprises at least one electronic module according to any one of claims 1 to 6.
EP98914903A 1997-03-27 1998-03-09 Electronic module for chip card Ceased EP0970437A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01117497A EP1168240B1 (en) 1997-03-27 1998-03-09 Connection by depositing a viscous material following the relief shape

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9704094A FR2761498B1 (en) 1997-03-27 1997-03-27 ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
FR9704094 1997-03-27
PCT/FR1998/000500 WO1998044451A1 (en) 1997-03-27 1998-03-09 Electronic module for chip card

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP01117497A Division EP1168240B1 (en) 1997-03-27 1998-03-09 Connection by depositing a viscous material following the relief shape

Publications (1)

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EP0970437A1 true EP0970437A1 (en) 2000-01-12

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Family Applications (2)

Application Number Title Priority Date Filing Date
EP01117497A Expired - Lifetime EP1168240B1 (en) 1997-03-27 1998-03-09 Connection by depositing a viscous material following the relief shape
EP98914903A Ceased EP0970437A1 (en) 1997-03-27 1998-03-09 Electronic module for chip card

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP01117497A Expired - Lifetime EP1168240B1 (en) 1997-03-27 1998-03-09 Connection by depositing a viscous material following the relief shape

Country Status (12)

Country Link
US (2) US6435414B1 (en)
EP (2) EP1168240B1 (en)
JP (1) JP3869860B2 (en)
CN (1) CN1183486C (en)
AU (1) AU720691B2 (en)
BR (1) BR9808062A (en)
CA (1) CA2283692A1 (en)
DE (1) DE69832104T2 (en)
FR (1) FR2761498B1 (en)
HK (1) HK1028833A1 (en)
RU (1) RU2200975C2 (en)
WO (1) WO1998044451A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2761498B1 (en) * 1997-03-27 1999-06-18 Gemplus Card Int ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
FR2785072B1 (en) * 1998-10-23 2001-01-19 St Microelectronics Sa SELF-ADHESIVE ELECTRONIC CIRCUIT
FR2797075B1 (en) * 1999-07-26 2001-10-12 Gemplus Card Int METHOD FOR MANUFACTURING A PORTABLE DEVICE WITH INTEGRATED CIRCUITS, OF THE SMART CARD TYPE OF REDUCED FORMAT IN RELATION TO THE STANDARD FORMAT
FR2797995B1 (en) * 1999-08-25 2002-03-22 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2797996B1 (en) * 1999-08-25 2003-10-03 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2799306B1 (en) * 1999-10-04 2003-09-19 Gemplus Card Int METHOD FOR INSULATING AN INTEGRATED CIRCUIT CHIP BY DEPOSITING MATERIAL ON THE ACTIVE FACE
FR2800198B1 (en) * 1999-10-26 2002-03-29 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY VACUUM SUCTION
FR2808920B1 (en) * 2000-05-10 2003-10-03 Gemplus Card Int INTEGRATED CIRCUIT CHIP PROTECTION METHOD
FR2818800B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int DEFORMABLE MEMBER INTERCONNECTION FOR ELECTRONIC DEVICES
FR2818801B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int INTERCONNECTION BY CUT-OUT INSULATION DEVICE AND CONDUCTION CORD
FR2823011B1 (en) * 2001-03-30 2004-11-19 Gemplus Card Int CONNECTION BY CONDUCTIVE CORD DEPOSIT ON CONNECTION AREA DEDICATED BY INSULATING MASK
FR2845805B1 (en) * 2002-10-10 2005-06-03 Gemplus Card Int SHUTTERING ADHESIVE FORMING SHUTTLE
FR2847365B1 (en) * 2002-11-15 2005-03-11 Gemplus Card Int SIMULTANEOUS CONNECTION / CONNECTION BY INHIBITING ADHESIVE DRILLING
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2007042071A1 (en) * 2005-10-10 2007-04-19 Alphasem Ag Assembly comprising at least two components that are electrically conductively operatively connected, and method for producing the assembly
DE102006056361B4 (en) * 2006-11-29 2012-08-16 Infineon Technologies Ag Module with polymer-containing electrical connection element and method
DE102008019571A1 (en) 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chip card and method for its production
TWM425346U (en) * 2011-05-20 2012-03-21 Mxtran Inc Integrated circuit film for smart card and mobile communication device
US8991711B2 (en) * 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
DE102014105861B4 (en) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensor device and method for producing a sensor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4325458A1 (en) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Support element for an IC module
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE9315652U1 (en) * 1993-10-15 1993-12-23 Nordson Corp Application head for applying adhesive to a substrate, in particular for gluing a chip to a card
US5423889A (en) * 1994-06-24 1995-06-13 Harris Corporation Process for manufacturing a multi-port adhesive dispensing tool
JPH0839974A (en) * 1994-07-27 1996-02-13 Dainippon Printing Co Ltd Ic module for ic card, production thereof and ic card
DE4441052A1 (en) * 1994-11-18 1996-05-23 Orga Kartensysteme Gmbh Carrier element for electronic module for insertion into e.g. smart card
EP1335422B1 (en) * 1995-03-24 2013-01-16 Shinko Electric Industries Co., Ltd. Process for making a chip sized semiconductor device
JPH08310172A (en) * 1995-05-23 1996-11-26 Hitachi Ltd Semiconductor device
FR2761498B1 (en) * 1997-03-27 1999-06-18 Gemplus Card Int ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
US6107109A (en) * 1997-12-18 2000-08-22 Micron Technology, Inc. Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9844451A1 *

Also Published As

Publication number Publication date
CN1257599A (en) 2000-06-21
FR2761498A1 (en) 1998-10-02
JP3869860B2 (en) 2007-01-17
CN1183486C (en) 2005-01-05
EP1168240A2 (en) 2002-01-02
EP1168240A3 (en) 2002-01-30
EP1168240B1 (en) 2005-10-26
US6435414B1 (en) 2002-08-20
WO1998044451A1 (en) 1998-10-08
US6769619B2 (en) 2004-08-03
JP2002511188A (en) 2002-04-09
DE69832104D1 (en) 2005-12-01
DE69832104T2 (en) 2006-11-23
CA2283692A1 (en) 1998-10-08
HK1028833A1 (en) 2001-03-02
RU2200975C2 (en) 2003-03-20
BR9808062A (en) 2000-03-08
FR2761498B1 (en) 1999-06-18
AU6922598A (en) 1998-10-22
AU720691B2 (en) 2000-06-08
US20020125329A1 (en) 2002-09-12

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