WO2000077854A1 - Method for making all or part of an electronic device by material jet spraying - Google Patents

Method for making all or part of an electronic device by material jet spraying Download PDF

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Publication number
WO2000077854A1
WO2000077854A1 PCT/FR2000/001551 FR0001551W WO0077854A1 WO 2000077854 A1 WO2000077854 A1 WO 2000077854A1 FR 0001551 W FR0001551 W FR 0001551W WO 0077854 A1 WO0077854 A1 WO 0077854A1
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WO
WIPO (PCT)
Prior art keywords
conductive
manufacturing
jet
drops
insulating material
Prior art date
Application number
PCT/FR2000/001551
Other languages
French (fr)
Inventor
Paul Morgavi
Olivier Brunet
Philippe Patrice
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU54122/00A priority Critical patent/AU5412200A/en
Publication of WO2000077854A1 publication Critical patent/WO2000077854A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Definitions

  • the invention proposes to make all or part of this device by material jet on a base supporting the electronics of said device.
  • the ejected material can be conductive and / or insulating material.
  • connection between the antenna and the metal grid 18 can be made by tin / lead soldering or by conductive bonding or lamination, or by any other suitable known technique.
  • the present invention more particularly provides a method of manufacturing an electronic device of the chip card type making it possible to carry out, online, the steps of isolating, connecting and protecting the chip quickly and precisely.
  • the conductive element is an electronic and / or electrical component chosen from a resistor, a fuse, a choke, a capacitor, an antenna.
  • the insulating material comprises a cationic resin crosslinking with ultraviolet.
  • the invention also applies to a printed circuit board comprising electronic and / or electrical components, conductive tracks, and connection points arranged on a support, characterized in that the tracks and connection points consist of points of conductive material obtained by spraying drops of conductive material.
  • the connections of the components to the conductive tracks or connection points consist of points of conductive material obtained by jet of drops of conductive material.
  • the manufacturing method according to the invention has the advantage of considerably simplifying the connection of the chips to the connection pads of the grid, and more particularly of refining the precision of these connections.
  • the piezo technology constitutes a preferred embodiment.
  • the materials used in the other two techniques must be of low viscosity, and they are generally subject to an electrical potential between the ejection nozzle and the drop of material to be ejected.
  • this protection 71 constitutes a protective film which conforms perfectly to the shape of the micromodule and the thickness of which is much less than the encapsulation drops generally obtained by the conventional “glob top” technique. No milling step is therefore necessary.
  • the third ejection head 75 is preferably of the “piezo” type like the previous, but it can also be thermal or continuous deflected jet for example.
  • the thicknesses of the layers of material deposited respectively for the insulation of the wafers 61, the connection 51 and the protection 71 depend on the resolution and the number of passages of the respective ejection heads 55, 65 and 75. Thus, for a resolution of 600 Dpi, a layer is obtained having a thickness between 4 and 9 ⁇ m, while for a resolution of 80 Dpi, the thickness of the layer will be between 80 and 100 ⁇ m.
  • the process according to the invention thus makes it possible to obtain micromodules of controlled thickness and with a production rate clearly higher than that of conventional processes.
  • FIG. 6 schematically illustrates, in perspective, one of the material deposition steps according to the present invention, in this case the step of isolating the chip wafers.
  • the chips 10 are arranged on the support film 15 in rows of two.
  • a double ejection head 65 comprising a large number of nozzles inject insulating material 60 onto the edges of each chip 10.
  • the use of heads having a large number of ejection nozzles is desirable in order to maintain a production rate greater than or equal to 57,000 pieces per hour.
  • the overall rate will be imposed by the lowest rate step.
  • working frequencies between 2 kHz and 40 kHz, and ejection head resolution between 60 and 600 Dpi, we obtain a minimum rate of 8 chips per second and per channel, for a chip of 10 mm in length .
  • the chips being generally arranged in rows of two on the support film, the minimum rate is 57,600 chips per hour.
  • An integrated circuit chip 10 is transferred into the cavity 120 of a card body 200 previously decorated by contact tracks 19. These tracks 19 are advantageously produced by jet of drops of conductive material according to the method described in the present invention.
  • the conductive tracks Pi, the connection points 8, the resistor R and the antenna A can be produced directly on the support of the card CI by jet of drops of conductive material.
  • FIG. 9 illustrates the application of the method according to the invention to the production of a capacity.
  • a layer of conductive material M can be deposited by jet of drops of conductive material, on which a layer of insulating material deposited by jet of drops of insulating material is superimposed, a second layer of conductive material M deposited using the same process terminating the capacity C.
  • the turns of antenna A are produced by a jet of conductive material on any dielectric support.
  • the use of the material jet makes it possible to perfectly control the shape of the antenna A as well as the spacing between the turns which can be minimized.
  • Connection points 8 are made, also by jet of conductive material, in order to allow connection of the antenna A to another electronic component.
  • an insulating pond 80 is produced, by jet of insulating material, over the turns of the antenna A in order to bring the connection points 8 to a given location.
  • FIGS. 12a and 12b illustrate the application of the method according to the invention to the production of a two-sided module 300 with current leads.
  • FIG. 12a illustrates the rear face 305 of the module and FIG. 12b the front face on which the contacts 306 are located. Perforations 310 are made in the support of the module 300 in order to allow current leads to connect the rear face 305 with the contact pads 11 of the front face 306.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns a method for making an electronic device, comprising at least an electronic and/or an electric circuit. The invention is characterised in that all or part of said circuit is produced by jet spraying drops of material. More particularly, the invention concerns a method for making a portable integrated circuit electronic device, by transferring an integrated circuit chip (10) onto a support film (15) provided with connection pads (18). The invention is characterised in that the connection between the bump contacts (11) of the chip (10) and the connection pads (18) of the support film (15) is produced by jet spraying a conductive material (50).

Description

PROCEDE DE FABRICATION DE TOUT OU PARTIE D'UN DISPOSITIF ELECTRONIQUE PAR JET DE MATIERE METHOD FOR MANUFACTURING ALL OR PART OF AN ELECTRONIC DEVICE BY JET OF MATERIAL
L'invention concerne un procédé de fabrication d'un dispositif électronique ou électrique.The invention relates to a method of manufacturing an electronic or electrical device.
L' invention propose de réaliser tout ou partie de ce dispositif par jet de matière sur une base support de l'électronique dudit dispositif. La matière éjectée peut être de la matière conductrice et/ou isolante.The invention proposes to make all or part of this device by material jet on a base supporting the electronics of said device. The ejected material can be conductive and / or insulating material.
Le jet de matière, dont la direction et la quantité peuvent être parfaitement maîtrisées, permet de réaliser des pistes conductrices, des points de connexion, des protections isolantes sur et autour de puces de circuit intégré. Il est également possible de réaliser une antenne, par exemple, par jet de matière conductrice sur un support isolant, ou une capacité, par exemple, par superposition de couches métalliques et isolantes, ou tout autre dispositif électronique ou électrique connu.The material jet, the direction and quantity of which can be perfectly controlled, makes it possible to produce conductive tracks, connection points, insulating protections on and around integrated circuit chips. It is also possible to produce an antenna, for example, by jet of conductive material on an insulating support, or a capacitor, for example, by superposition of metallic and insulating layers, or any other known electronic or electrical device.
La présente invention concerne plus particulièrement la fabrication d'un dispositif électronique portable, comportant au moins une puce de circuit intégré disposée dans un support et électriquement reliée à des éléments d'interface constitués par un bornier de connexion et/ou par une antenne . Ces dispositifs électroniques portables constituent par exemple des cartes à puce avec et/ou sans contact ou encore des étiquettes électroniques.The present invention relates more particularly to the manufacture of a portable electronic device, comprising at least one integrated circuit chip placed in a support and electrically connected to interface elements constituted by a connection terminal block and / or by an antenna. These portable electronic devices constitute, for example, smart cards with and / or contactless, or even electronic labels.
Les cartes à puce avec et/ou sans contact sont destinées à la réalisation de diverses opérations telles que, par exemple, des opérations bancaires, des communications téléphoniques, diverses opérations d'identification, ou des opérations de type télébillétique. Les cartes à contact comportent des metallisations affleurant la surface de la carte, disposées a un endroit précis du corps de carte, défini par la norme usuelle ISO 7816. Ces metallisations sont destinées à venir au contact d'une tête de lecture d'un lecteur en vue d'une transmission électrique de données.Smart cards with and / or contactless are intended for carrying out various operations such as, for example, banking operations, telephone communications, various identification operations, or operations of the teleticketing type. Contact cards include metallizations flush with the surface of the card, arranged at a precise location on the card body, defined by the usual standard ISO 7816. These metallizations are intended to come into contact with a read head of a reader for electrical data transmission.
Les cartes sans contact comportent une antenne permettant d'échanger des informations avec l'extérieur grâce à un couplage électromagnétique entre l'électronique de la carte et un appareil récepteur ou lecteur. Ce couplage peut être effectué en mode lecture ou en mode lecture/écriture, et la transmission de données s'effectue par radiofrequence ou par hyperfréquence . II existe également des cartes hybrides ou « combicards » qui comportent a la fois des metallisations affleurant la surface de la carte et une antenne noyée dans le corps de la carte. Ce type de carte peut donc échanger des données avec l'extérieur soit en mode contact, soit sans contact.Contactless cards include an antenna for exchanging information with the outside world thanks to an electromagnetic coupling between the card's electronics and a receiving or reading device. This coupling can be carried out in read mode or in read / write mode, and the data transmission is carried out by radio frequency or by microwave. There are also hybrid cards or "combicards" which include both metallizations flush with the surface of the card and an antenna embedded in the body of the card. This type of card can therefore exchange data with the outside either in contact mode or without contact.
Telles qu' elles sont réalisées actuellement, les cartes, avec ou sans contact, sont des éléments portables de faible épaisseur et de dimensions normalisées. La norme ISO 7810 définie les dimensions nominale d'une carte de format standard qui correspond à 85 mm de longueur, 54 mm de largeur et à 0.76 mm d'épaisseur moyenne.As they are currently produced, cards, with or without contact, are portable elements of small thickness and standardized dimensions. The ISO 7810 standard defines the nominal dimensions of a standard format card which corresponds to 85 mm in length, 54 mm in width and 0.76 mm in average thickness.
La majorité des procédés de fabrication de carte à puce est basée sur l'assemblage de la puce de circuit intégré dans un sous-ensemble appelé micromodule qui est relié à une interface de communication et encarté, c' est à dire place dans une cavité ménagée dans le corps de carte, en utilisant des techniques connues de l'homme du métier. La figure 1 est un schéma synoptique des différentes étapes de fabrication d'un micromodule selon des techniques classiques.The majority of chip card manufacturing methods are based on the assembly of the integrated circuit chip in a subassembly called a micromodule which is connected to a communication interface and inserted, that is to say place in a cavity in the card body, using techniques known to those skilled in the art. Figure 1 is a block diagram of the different stages of manufacturing a micromodule according to conventional techniques.
Dans un premier temps, une machine positionne les puces de circuit intègre sur un film support diélectrique ou métallique muni de plages de connexion. Les connexions entre les plots de contact de chaque puce et les plages de connexion correspondantes sont alors réalisées par câblage filaire par exemple, ou par tout autre moyen connu. Une étape de protection suit, dans laquelle chaque puce et ses connexions sont enrobées dans une résine dite d' encapsulation qui doit ensuite être polymerisee dans une etuve pendant un temps donne. Les étapes de positionnement, de connexion et de protection sont généralement réalisées en ligne dans un procède continu. L'étape de polymérisation, longue et nécessitant un appareillage lourd, interrompt cette linéarité avant la découpe des micromodules. Un procédé classique de fabrication est illustré sur la figure 2. Un tel procède consiste a coller une puce de circuit intègre 10 en disposant sa face active avec ses plots de contact 11 vers le haut, et en collant sa face opposée sur une feuille de support diélectrique 15. La feuille diélectrique 15 est elle- même disposée sur une grille de contact 18 telle qu'une plaque métallique en cuivre nickelé et doré par exemple. Des puits de connexion 16 sont pratiqués dans la feuille diélectrique 15 afin de permettre a des fils de connexion 17 de relier les plots de contact 11 de la puce 10 aux points de connexion de la grille 18. Ces fils 17 sont généralement soudes aux deux extrémités par des ultrasons. Selon certaines variantes, il est possible de coller la puce 10, face active vers le haut, directement sur la grille de contact 18, puis de la connecter par câblage filaire 17. Dans une telle variante, la grille 18 est déposée sur un support diélectrique 15 et les plages de contact et de connexion de ladite grille sont définies par gravure chimique ou tout autre moyen connu.First, a machine positions the integrated circuit chips on a dielectric or metallic support film provided with connection pads. The connections between the contact pads of each chip and the corresponding connection pads are then made by wire wiring for example, or by any other known means. A protection step follows, in which each chip and its connections are coated in a so-called encapsulation resin which must then be polymerized in an oven for a given time. The positioning, connection and protection steps are generally carried out online in a continuous process. The polymerization step, long and requiring heavy equipment, interrupts this linearity before cutting the micromodules. A conventional manufacturing process is illustrated in FIG. 2. Such a process consists in bonding an integrated circuit chip 10 by placing its active face with its contact pads 11 upwards, and by sticking its opposite face on a support sheet. dielectric 15. The dielectric sheet 15 is itself disposed on a contact grid 18 such as a metallic plate of nickel-plated and gilded copper for example. Connection wells 16 are formed in the dielectric sheet 15 in order to allow connection wires 17 to connect the contact pads 11 of the chip 10 to the connection points of the grid 18. These wires 17 are generally welded at both ends by ultrasound. According to certain variants, it is possible to stick the chip 10, active side up, directly on the contact grid 18, then to connect it by wire wiring 17. In such a variant, the grid 18 is deposited on a dielectric support 15 and the contact and connection areas of said grid are defined by chemical etching or any other known means.
Une étape de protection ou d' encapsulation vient ensuite protéger la puce 10 et les fils de connexion 17 soudés. On utilise généralement une technique appelée « glob top » en terminologie anglaise, qui désigne l'enrobage de la puce par le dessus. Cette technique consiste à verser une goutte de résine 20, à base d' époxy par exemple, thermodurcissable ou à réticulation aux ultraviolets, sur la puce 10 et ses fils de connexion 17.A protection or encapsulation step then protects the chip 10 and the welded connection wires 17. We generally use a technique called "glob top" in English terminology, which designates the coating of the chip from above. This technique consists in pouring a drop of resin 20, based on epoxy for example, thermosetting or crosslinking with ultraviolet, on the chip 10 and its connection wires 17.
La figure 3 illustre une variante de réalisation dans laquelle la puce 10 est connectée à la grille métallique 18 selon un procédé de « flip chip » qui désigne une technique connue dans laquelle la puce est retournée .FIG. 3 illustrates an alternative embodiment in which the chip 10 is connected to the metal grid 18 according to a “flip chip” method which designates a known technique in which the chip is turned over.
Dans l'exemple illustré, la puce 10 est connectée à la grille métallique 18 au moyen d'une colle 350 à conduction électrique anisotrope bien connue et souvent utilisée pour le montage de composants passifs sur une surface. Les plots de contact 11 de la puce 10 sont placés en vis à vis des plages de connexions de la grille 18. Cette colle 350 contient en fait des particules conductrices élastiquement déformables qui permettent d'établir une conduction électrique suivant l'axe z (c'est à dire suivant l'épaisseur) lorsqu'elles sont pressées entre les plots de sortie 11 et les plages de connexion de la grille 18, tout en assurant une isolation suivant les autres directions (x, y) .In the example illustrated, the chip 10 is connected to the metal grid 18 by means of an adhesive 350 with anisotropic electrical conduction well known and often used for mounting passive components on a surface. The contact pads 11 of the chip 10 are placed opposite the connection areas of the grid 18. This adhesive 350 actually contains elastically deformable conductive particles which make it possible to establish an electrical conduction along the axis z (c (i.e. depending on the thickness) when they are pressed between the output pads 11 and the connection areas of the grid 18, while ensuring insulation along the other directions (x, y).
Dans une variante de réalisation, la connexion électrique entre la puce 10 et la grille 18 peut être améliorée par des bossages 12, en alliage thermofusible de type Sn/Pb ou en polymère conducteur, réalisés sur les plots 11 de la puce 10.In an alternative embodiment, the electrical connection between the chip 10 and the grid 18 can be improved by bosses 12, made of Sn / Pb type hot-melt alloy or of conductive polymer, produced on the pads 11 of the chip 10.
Le support diélectrique 15 avec la puce 10 collée et protégée par la résine 20 est découpé pour constituer un micromodule 100.The dielectric support 15 with the chip 10 glued and protected by the resin 20 is cut to form a micromodule 100.
Dans le cas d'une carte a puce a contact, le micromodule 100 est encarte dans la cavité d'un corps de carte préalablement décore. Le corps de carte est réalisé selon un procède classique, par exemple par injection de matière plastique dans un moule. La cavité est obtenue soit par fraisage du corps de carte, soit par injection au moment de la fabrication du corps de carte dans un moule adapte.In the case of a smart card with contact, the micromodule 100 is inserted into the cavity of a card body previously decorated. The card body is produced according to a conventional method, for example by injecting plastic material into a mold. The cavity is obtained either by milling the card body, or by injection at the time of manufacture of the card body in a suitable mold.
_' opération d' encartage peut être effectuée par dépôt d'une colle liquide dans la cavité du corps de carte avant report du micromodule._ The inserting operation can be carried out by depositing a liquid adhesive in the cavity of the card body before transfer of the micromodule.
Une autre technique d' encartage consiste a déposer un film adhésif thermoactivable par lammation à chaud sur le film diélectrique 15 préférentiellement avant la découpe du micromodule 100. Ce dernier est alors encarté dans la cavité du corps de carte et collé en réactivant l'adhésif thermoactivable par pressage à chaud au moyen d'une presse dont la forme est adaptée à celle de la cavité. Dans le cas d'une carte à puce sans contact ou d'une étiquette électronique, le micromodule 100 est connecté à une antenne.Another insertion technique consists in depositing a heat-activatable adhesive film by hot lammation on the dielectric film 15, preferably before cutting the micromodule 100. The latter is then inserted into the cavity of the card body and glued by reactivating the heat-activatable adhesive. by hot pressing by means of a press whose shape is adapted to that of the cavity. In the case of a contactless smart card or an electronic label, the micromodule 100 is connected to an antenna.
L'antenne peut être réalisée sur un support isolant constitué par du PVC ou au PE ou tout autre matériau adapté (Polychlorure de Vinyle, Poly Ethylène) . Elle est constituée d'un matériau conducteur, et peut être déposée en bobine, par sérigraphie d' encre conductrice, ou par gravure chimique d'un métal déposé sur un support isolant. Elle peut présenter la forme d'une spirale ou tout autre motif selon les applications souhaitées .The antenna can be carried out on an insulating support constituted by PVC or PE or any other material suitable (Polyvinyl Chloride, Poly Ethylene). It consists of a conductive material, and can be deposited on a coil, by screen printing of conductive ink, or by chemical etching of a metal deposited on an insulating support. It can have the shape of a spiral or any other pattern depending on the desired applications.
La connexion entre l'antenne et la grille métallique 18 peut être réalisée par soudure étain/plomb ou par collage conducteur ou lamination, ou par tout autre technique connue adaptée.The connection between the antenna and the metal grid 18 can be made by tin / lead soldering or by conductive bonding or lamination, or by any other suitable known technique.
Le corps de la carte sans contact est alors réalisée par lamination à chaud de films plastiques pour avoir l'épaisseur finale ou par coffrage d'une résine entre des feuilles diélectriques séparées par une entretoise.The body of the contactless card is then produced by hot lamination of plastic films to obtain the final thickness or by formwork of a resin between dielectric sheets separated by a spacer.
Dans le cas d'une étiquette électronique, l'antenne, dans sa forme définitive, est choisie par moulage du corps de l'étiquette autour de l'électronique ou par lamination de films plastiques ou encore par insertion dans un boîtier plastique.In the case of an electronic label, the antenna, in its final form, is chosen by molding the body of the label around the electronics or by laminating plastic films or by insertion into a plastic case.
Il s'avère que ces technologies connues de fabrication présentent un grand nombre d'opérations entraînant un coût élevé.It turns out that these known manufacturing technologies present a large number of operations entailing a high cost.
En particulier, l'étape de connexion entre les plots de contact de la puce de les plages de connexion de la grille métallique nécessite un appareillage précis et lourd. En effet, les machines de soudure ultrasons utilisées pour un câblage filaire sont encombrantes et onéreuses. De même, la connexion selon le procédé dit de « flip chip », bien que de plus en plus utilisé, nécessite des conditions opératoires lourdes et des étapes préliminaires telles que la réalisation de bossages, ou bumps en terminologie anglaise, qui constituent des prolongements en matériau conducteur des plots de contact de la puce. En outre, la puce doit être retournée.In particular, the step of connection between the contact pads of the chip of the connection pads of the metal grid requires precise and heavy equipment. Indeed, the ultrasonic welding machines used for wired wiring are bulky and expensive. Likewise, the connection according to the so-called “flip chip” process, although increasingly used, requires heavy operating conditions and preliminary steps such as making bosses, or bumps in English terminology, which constitute extensions of conductive material of the contact pads of the chip. In addition, the chip must be returned.
De plus, lorsqu'une protection par résine est réalisée, il est généralement nécessaire de procéder au fraisage de la résine pour adapter sa forme et son épaisseur, ce qui constitue une opération longue, délicate, coûteuse et stressante pour la puce.In addition, when resin protection is carried out, it is generally necessary to mill the resin to adapt its shape and thickness, which constitutes a long, delicate, expensive and stressful operation for the chip.
En outre, les résines utilisées sont généralement des résines thermiques, un passage en étuve étant alors nécessaire pour polymériser la protection, ce qui représente une étape coûteuse en temps et en matériel. De plus, l'étape de polymérisation interrompt la linéarité de la fabrication entre les étapes d' encapsulation et de découpe des micromodules, ce qui ralentit nécessairement la cadence de production.In addition, the resins used are generally thermal resins, a passage in an oven is then necessary to polymerize the protection, which represents a step which is costly in time and in material. In addition, the polymerization step interrupts the linearity of the manufacturing between the steps of encapsulation and cutting of the micromodules, which necessarily slows down the production rate.
Le but de la présente invention est de pallier aux inconvénients de l'art antérieur.The object of the present invention is to overcome the drawbacks of the prior art.
A cet effet, la présente invention propose un procédé de fabrication d'un dispositif électronique ou électrique réalisé en tout ou partie par jet de gouttes de matière.To this end, the present invention provides a method of manufacturing an electronic or electrical device produced in whole or in part by jet of material drops.
La présente invention propose plus particulièrement un procédé de fabrication d'un dispositif électronique de type carte à puce permettant de réaliser, en ligne, les étapes d' isolation, de connexion et de protection de la puce rapidement et avec précision.The present invention more particularly provides a method of manufacturing an electronic device of the chip card type making it possible to carry out, online, the steps of isolating, connecting and protecting the chip quickly and precisely.
En outre, l'invention permet principalement de simplifier l'étape de connexion de la puce en réalisant la connexion par un jet de matière conductrice. La présente invention concerne un procède de fabrication d'un dispositif électronique, comportant au moins un circuit électronique et/ou électrique, caractérise en ce que tout ou partie dudit circuit est réalise par et de gouttes de matière.In addition, the invention mainly makes it possible to simplify the step of connecting the chip by making the connection by a jet of conductive material. The present invention relates to a method of manufacturing an electronic device, comprising at least one electronic and / or electrical circuit, characterized in that all or part of said circuit is produced by and of drops of material.
Selon une caractéristique, ledit circuit comporte des éléments ou composants conducteurs dont tout ou partie est réalise par et de gouttes de matière conductrice . Selon une autre caractéristique ledit circuit comporte des éléments isolants ou zones isolantes dont tout ou partie est réalise par et de gouttes de matière isolante.According to one characteristic, said circuit comprises conductive elements or components, all or part of which is produced by and from drops of conductive material. According to another characteristic, said circuit includes insulating elements or insulating zones, all or part of which is produced by and drops of insulating material.
Selon les applications, l'élément conducteur est choisi parmi une piste conductrice, un circuit conducteur, une connexion, un plot ou point de connexion .Depending on the applications, the conductive element is chosen from a conductive track, a conductive circuit, a connection, a pad or connection point.
Selon d'autres applications, l'élément conducteur est un composant électronique et/ou électrique choisi parmi une résistance, un fusible, une self, une capacité, une antenne.According to other applications, the conductive element is an electronic and / or electrical component chosen from a resistor, a fuse, a choke, a capacitor, an antenna.
Selon une autre caractéristique, la matière isolante constitue une protection mécanique ou constitue une isolation électrique d'un élément conducteur ou semi-conducteur.According to another characteristic, the insulating material constitutes mechanical protection or constitutes electrical insulation of a conductive or semiconductor element.
Selon une application, ladite matière isolante est disposée entre les plans conducteurs d'une capacité ou condensateur .According to one application, said insulating material is disposed between the conducting planes of a capacitor or capacitor.
L' invention concerne plus particulièrement un procède de fabrication, une puce de circuit intègre étant reportée sur un film muni de points de connexion, caractérise en ce que les connexions entre les plots de contact de la puce et les points de connexion sont réalisées par et de gouttes de matière conductrice. L'invention s'applique également à un procédé de fabrication, une puce de circuit intégré étant reportée sur un support, caractérisé en ce qu' il comporte en outre une étape d' isolation des tranches de puce, l'isolation étant réalisée par jet de gouttes de matière isolante.The invention relates more particularly to a manufacturing process, an integrated circuit chip being transferred onto a film provided with connection points, characterized in that the connections between the contact pads of the chip and the connection points are made by and drops of conductive material. The invention also applies to a manufacturing process, an integrated circuit chip being transferred onto a support, characterized in that it further comprises a step of isolating the chip wafers, the insulation being produced by jet drops of insulating material.
L' invention concerne également un procédé de fabrication, une puce de circuit intégré étant reportée sur un support et connectée à des points de connexion, caractérisé en ce qu'il comporte en outre une étape d'enrobage par une matière protectrice de la puce et de ses connexions, ledit enrobage étant réalisée par jet de gouttes de matière isolante.The invention also relates to a manufacturing method, an integrated circuit chip being transferred onto a support and connected to connection points, characterized in that it further comprises a step of coating with a protective material of the chip and of its connections, said coating being produced by spraying drops of insulating material.
Selon une variante de réalisation, la matière conductrice comporte des particules métalliques.According to an alternative embodiment, the conductive material comprises metallic particles.
Selon une autre variante de réalisation, la matière conductrice comporte un matériau polymère conducteur.According to another alternative embodiment, the conductive material comprises a conductive polymer material.
Selon une variante de réalisation, la matière isolante comporte une résine cationique à réticulation aux ultraviolets.According to an alternative embodiment, the insulating material comprises a cationic resin crosslinking with ultraviolet.
Selon une autre variante de réalisation, la matière isolante comporte une résine thermo-polymérisable .According to another alternative embodiment, the insulating material comprises a heat-polymerizable resin.
Selon un mode de réalisation préférentiel, les jets de gouttes de matière sont réalisés au moyen d'une tête d'éjection piézoélectrique.According to a preferred embodiment, the material drop jets are produced by means of a piezoelectric ejection head.
Selon un autre mode de réalisation, les jets de gouttes de matière sont réalisés au moyen d'une tête d'éjection thermique.According to another embodiment, the material drop jets are produced by means of a thermal ejection head.
Selon un autre mode de réalisation, les jets de gouttes de matière sont réalisés au moyen d'une tête d'éjection à jet continu dévié.According to another embodiment, the material drop jets are produced by means of a deflected continuous jet ejection head.
Selon un mode de réalisation, les têtes d'éjection comportent une pluralité de buses de manière à effectuer un unique passage par puce. Selon un autre mode de réalisation, le support se déplace de manière indexée, les têtes d'injection effectuant alors plusieurs passages sur chaque puce.According to one embodiment, the ejection heads comprise a plurality of nozzles so as to make a single pass per chip. According to another embodiment, the support moves in an indexed manner, the injection heads then making several passages on each chip.
L' invention concerne également un procédé de fabrication, caractérisé en ce que tout ou partie d'un élément ou composant électronique est réalisé sur un support, simultanément à sa connexion à des points de connexion, par jet de gouttes de matière conductrice.The invention also relates to a manufacturing method, characterized in that all or part of an electronic element or component is produced on a support, simultaneously with its connection to connection points, by jet of drops of conductive material.
Selon une caractéristique, les points de connexion se situent sur un autre composant électronique.According to one characteristic, the connection points are located on another electronic component.
Selon une autre application du procédé, une pluralité de puces de circuit intégré étant disposées sur un support, les connexions entre les puces, espacées les unes des autres, sont réalisées par jet de gouttes de matière conductrice.According to another application of the method, a plurality of integrated circuit chips being arranged on a support, the connections between the chips, spaced from each other, are made by jet of drops of conductive material.
Selon une variante de réalisation, une pluralité de puces de circuit intégré étant disposées sur un support, les connexions entre les puces, empilées les unes sur les autres, sont réalisées par jet de gouttes de matière conductrice.According to an alternative embodiment, a plurality of integrated circuit chips being arranged on a support, the connections between the chips, stacked on each other, are made by jet of drops of conductive material.
Selon une caractéristique de la variante précédente, un dépôt de matière isolante entre les faces actives de chaque puce empilées est réalisé par jet de gouttes de matière isolante. Selon une autre application du procédé, un pont isolant est réalisé entre des pistes conductrices croisées par jet de gouttes de matière isolante.According to a characteristic of the preceding variant, a deposit of insulating material between the active faces of each stacked chip is produced by spraying drops of insulating material. According to another application of the method, an insulating bridge is produced between conductive tracks crossed by a jet of drops of insulating material.
Selon une autre application du procédé, un support diélectrique perforé portant des plages de contact d'un module électronique et des amenées de courant étant réalisées sur la face opposée, lesdites amenées sont réalisées par jet de gouttes de matière conductrice à travers les perforations. L'invention concerne en outre un dispositif électronique comportant un circuit électronique et/ou électrique, caractérisé en ce que tout ou partie dudit circuit se compose de points de matière obtenus par jet de gouttes de matière.According to another application of the method, a perforated dielectric support carrying contact pads of an electronic module and current leads being made on the opposite face, said leads are made by jet of drops of conductive material through the perforations. The invention further relates to an electronic device comprising an electronic and / or electrical circuit, characterized in that all or part of said circuit consists of dots of material obtained by jet of material drops.
Selon une caractéristique, les points de matière présentent une résolution supérieure ou égale à 60 Dpi.According to one characteristic, the material dots have a resolution greater than or equal to 60 Dpi.
Selon une variante, ledit dispositif comporte des éléments conducteurs dont tout ou partie se compose de points de matière conductrice obtenus par jet de gouttes de matière.According to a variant, said device comprises conductive elements of which all or part consists of points of conductive material obtained by jet of material drops.
Selon une autre variante, ledit dispositif comporte en outre des éléments isolants ou zones isolantes dont tout ou partie se compose de points de matière isolante obtenus par jet de gouttes de matière.According to another variant, said device further comprises insulating elements or insulating zones, all or part of which is made up of points of insulating material obtained by jet of material drops.
Selon les applications, l'élément conducteur est choisi parmi une piste conductrice, un circuit conducteur, une connexion, un plot ou un point de connexion. Selon une autre application, l'élément conducteur est un composant électronique et/ou électrique.Depending on the applications, the conductive element is chosen from a conductive track, a conductive circuit, a connection, a pad or a connection point. According to another application, the conductive element is an electronic and / or electrical component.
Selon les applications, le composant est choisi parmi une résistance, un fusible, une self, une capacité, une antenne. Selon une caractéristique, la matière isolante constitue une protection mécanique d' éléments conducteurs .Depending on the applications, the component is chosen from a resistor, a fuse, an inductor, a capacitor, an antenna. According to one characteristic, the insulating material constitutes mechanical protection of conductive elements.
Selon une application, la matière isolante constitue une isolation électrique d'éléments conducteurs.According to one application, the insulating material constitutes electrical insulation of conductive elements.
Selon une application, la matière isolante est disposée entre les plans conducteurs d' une capacité ou d'un condensateur. Selon une autre application, la matière isolante constitue un support du dispositif tel qu'une carte, ou un film support, ou un enrobage.According to one application, the insulating material is arranged between the conducting planes of a capacitor or of a capacitor. According to another application, the insulating material constitutes a support for the device such as a card, or a support film, or a coating.
Selon une caractéristique, le circuit comporte au moins une puce de circuit intégré.According to one characteristic, the circuit comprises at least one integrated circuit chip.
Selon une variante de réalisation, le circuit comporte une pluralité de puce de circuit intégré empilées, les connexions entre lesdites puces se composant de points de matière conductrice obtenus par jet de matière.According to an alternative embodiment, the circuit comprises a plurality of stacked integrated circuit chips, the connections between said chips consisting of points of conductive material obtained by jet of material.
Selon une autre variante, circuit comporte en outre une isolation entre les faces actives de chaque puce empilée, l'isolation se composant de points de matière isolante obtenus par et de matière. L'invention s'applique en outre a un module électronique biface comportant des plages de contact sur un support diélectrique, le support comportant des perforations respectivement au niveau de chaque plage de contact et comportant des amenées de courant sur la face opposée du support à travers lesdites perforations, caractérisé en ce que les amenées de courant se composent de points de matière conductrice obtenus par jet de matière.According to another variant, the circuit further comprises insulation between the active faces of each stacked chip, the insulation consisting of points of insulating material obtained by and of material. The invention also applies to a two-sided electronic module comprising contact pads on a dielectric support, the support comprising perforations respectively at each contact pad and comprising current leads on the opposite face of the support through said perforations, characterized in that the current leads consist of points of conductive material obtained by jet of material.
L'invention s'applique également à un élément conducteur tel qu'une antenne ou une résistance, caractérisé en ce que tout ou partie dudit élément et sa connexion se composent de points de matière conductrice obtenus par jet de gouttes de matière.The invention also applies to a conductive element such as an antenna or a resistor, characterized in that all or part of said element and its connection consist of points of conductive material obtained by jet of material drops.
L'invention concerne de même un dispositif électronique portable tel qu'une carte à puce à contact, caractérise en ce que les plages de contact de la carte se composent de points de matière conductrice obtenus par jet de matière. L' invention concerne de même un dispositif électronique portable tel qu'une carte à puce sans contact ou tel qu'une étiquette électronique, caractérisé en ce que l'antenne et la connexion des plots de contact de la puce à l'antenne se composent de points de matière conductrice obtenus par jet de matière .The invention likewise relates to a portable electronic device such as a smart card with contact, characterized in that the contact areas of the card consist of points of conductive material obtained by jet of material. The invention likewise relates to a portable electronic device such as a contactless smart card or such as an electronic label, characterized in that the antenna and the connection of the contact pads of the chip to the antenna consist points of conductive material obtained by jet of material.
L'invention s'applique en outre à un circuit imprimé comprenant des pistes conductrices déposées sur un support, caractérisé en ce que les pistes se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice.The invention also applies to a printed circuit comprising conductive tracks deposited on a support, characterized in that the tracks consist of points of conductive material obtained by jet of drops of conductive material.
L'invention s'applique de même à une carte de circuit imprimé comportant des composants électroniques et/ou électriques, des pistes conductrices, et des points de connexion disposés sur un support, caractérisé en ce que les pistes et les points de connexion se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice. Selon une caractéristique, les connexions des composants aux pistes conductrices ou points de connexion se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice.The invention also applies to a printed circuit board comprising electronic and / or electrical components, conductive tracks, and connection points arranged on a support, characterized in that the tracks and connection points consist of points of conductive material obtained by spraying drops of conductive material. According to one characteristic, the connections of the components to the conductive tracks or connection points consist of points of conductive material obtained by jet of drops of conductive material.
Selon une autre caractéristique, les composants sont protégés par une couche de matière isolante constituée de points de matière isolante obtenus par jet de gouttes de matière isolante.According to another characteristic, the components are protected by a layer of insulating material consisting of points of insulating material obtained by spraying drops of insulating material.
La présente invention permet d'obtenir, avec un procédé simple et économique un micromodule électronique de faible épaisseur.The present invention makes it possible to obtain, with a simple and economical process, a thin electronic micromodule.
L'utilisation d'un jet de matière permet en effet de contrôler parfaitement la forme et le volume des éléments du dispositif. En particulier, le procède selon l'invention permet de réaliser les étapes d' isolation, de connexion et de protection en ligne de manière continue, avec une technologie commune et sans aucun contact avec le support et les puces de circuit intègre.The use of a material jet makes it possible to perfectly control the shape and the volume of the elements of the device. In particular, the method according to the invention makes it possible to carry out the steps of isolation, connection and online protection continuously, with a common technology and without any contact with the support and the integrated circuit chips.
En outre, le procède est entièrement digital, un changement dans le motif de connexion, dans la taille des puces ou dans le positionnement des puces sur le film ne nécessite aucun changement de matériel, mais seulement une modification du programme de commande des tête d' éjection de matière.In addition, the process is entirely digital, a change in the connection pattern, in the size of the chips or in the positioning of the chips on the film does not require any change of material, but only a modification of the control program of the head material ejection.
De plus, les matières utilisées pour les étapes d' isolation, de connexion et de protection sont de nature permettant une polymérisation (si nécessaire) rapide a l'air libre ou par exposition aux ultraviolets .In addition, the materials used for the insulation, connection and protection steps are of a nature allowing rapid polymerization (if necessary) in the open air or by exposure to ultraviolet light.
En outre, le procède de fabrication selon l'invention présente l'avantage de simplifier considérablement la connexion des puces aux plages de connexion de la grille, et plus particulièrement d'affiner la précision de ces connexions.In addition, the manufacturing method according to the invention has the advantage of considerably simplifying the connection of the chips to the connection pads of the grid, and more particularly of refining the precision of these connections.
De plus, les étapes d' encapsulation et de fraisage sont supprimées au profit d'une étape de protection réalisée par jet de matière isolante. La protection ainsi obtenu constitue alors un film épousant parfaitement la forme du micromodule et dont l'épaisseur est minimisée. Le procède permet de contrôler le volume de la protection obtenue et ainsi le volume global du composant. Enfin, le procède selon l'invention permet d'atteindre des cadences supérieures a 57000 pièces par heure, contre 6000 pièces par heure dans un procède de fabrication classique. D'autres particularités et avantages de l'invention apparaîtront à la lecture de la description qui suit donnée à titre d'exemple illustratif et non limitatif et faite en référence aux figures annexées dans lesquelles :In addition, the steps of encapsulation and milling are eliminated in favor of a protection step performed by jet of insulating material. The protection thus obtained then constitutes a film which conforms perfectly to the shape of the micromodule and the thickness of which is minimized. The process makes it possible to control the volume of the protection obtained and thus the overall volume of the component. Finally, the process according to the invention makes it possible to achieve rates higher than 57,000 pieces per hour, against 6000 pieces per hour in a conventional manufacturing process. Other particularities and advantages of the invention will appear on reading the following description given by way of illustrative and non-limiting example and made with reference to the appended figures in which:
La figure 1, déjà décrite, est un schéma synoptique des étapes de fabrication d'un micromodule selon un procédé classique ; La figure 2, déjà décrite, est un schéma en coupe transversale illustrant un procédé traditionnel de fabrication d'un micromodule ; La figure 3, déjà décrite, est un schéma en coupe transversale illustrant un procédé traditionnel de fabrication d'un micromodule avec une variante de réalisation dans la connexion de la puce ;FIG. 1, already described, is a block diagram of the steps for manufacturing a micromodule according to a conventional method; Figure 2, already described, is a cross-sectional diagram illustrating a traditional method of manufacturing a micromodule; Figure 3, already described, is a cross-sectional diagram illustrating a traditional method of manufacturing a micromodule with an alternative embodiment in the connection of the chip;
La figure 4, est un schéma synoptique des étapes de fabrication du procédé selon la présente invention l'invention ; - La figure 5 illustre schématiquement le déroulement des étapes du procédé de fabrication selon la présente invention ;Figure 4 is a block diagram of the manufacturing steps of the method according to the present invention; - Figure 5 schematically illustrates the progress of the steps of the manufacturing process according to the present invention;
La figure 6 est un schéma en perspective d'une des étapes du procédé de fabrication selon la présente invention ;FIG. 6 is a perspective diagram of one of the stages of the manufacturing method according to the present invention;
La figure 7 illustre l'application du procédé selon l'invention à une carte à puce ; La figure 8 illustre l'application du procédé selon l'invention à une carte de circuit imprimé ;FIG. 7 illustrates the application of the method according to the invention to a smart card; FIG. 8 illustrates the application of the method according to the invention to a printed circuit board;
- La figure 9 illustre l'application du procédé selon l'invention à une capacité ; La figure 10 illustre une vue en coupe de l'application du procède selon l'invention a un empilement de puces ;- Figure 9 illustrates the application of the method according to the invention to a capacity; Figure 10 illustrates a sectional view of the application of the method according to the invention to a stack of chips;
La figure 11 illustre l'application du procède selon l'invention a une antenne ; - Les figures 12a et 12b illustrent respectivement la face arrière et la face avant d'un module biface obtenu par le procède selon l'invention.FIG. 11 illustrates the application of the method according to the invention to an antenna; - Figures 12a and 12b respectively illustrate the rear face and the front face of a two-sided module obtained by the method according to the invention.
La description qui suit se réfère plus particulièrement a un procède de fabrication d'un dispositif électronique portable du type carte a puce ou étiquette électronique.The following description refers more particularly to a method of manufacturing a portable electronic device of the chip card or electronic label type.
En se référant a la figure 4, le procède selon l'invention propose de réaliser les étapes de connexion et de protection en continu avec la même technologie.Referring to FIG. 4, the method according to the invention proposes to carry out the connection and protection steps continuously with the same technology.
Tel que cela est connu de l'art antérieur, des puces de circuit intègre sont positionnées sur un film support diélectriques muni de plages de connexion, ou directement sur une grille métallique. Une étape d'isolation est mentionnée. Elle est indispensable dans le cas ou le semi-conducteur de la puce de circuit intègre utilisée présente une tranche conductrice. Dans le cas contraire, cette étape est supprimée . De même, une étape de polymérisation est mentionnée après chaque étape du procède. La polymérisation est nécessaire selon le type de matière utilisée pour réaliser ces différentes étapes. Preferentiellement, des matériaux sans polymérisation ou a polymérisation rapide a l'air libre ou aux ultraviolets sont utilises dans le cadre de ce procède.As is known in the prior art, integrated circuit chips are positioned on a dielectric support film provided with connection pads, or directly on a metal grid. An isolation step is mentioned. It is essential in the case where the semiconductor of the integrated circuit chip used has a conductive wafer. Otherwise, this step is deleted. Likewise, a polymerization step is mentioned after each step of the process. Polymerization is necessary depending on the type of material used to carry out these different steps. Preferably, materials without polymerization or with rapid polymerization in the open air or with ultraviolet rays are used within the framework of this process.
Enfin, l'étape de protection peut être supprimée dans le cas d'un report du micromodule obtenu dans un corps de carte par un procède connu de surmoulage. En se référant a la figure 5, le film support 15 comporte des plages de connexion 18 et des puces de circuit intègre 10 reportées selon des techniques classiques . L' invention propose principalement de réaliser la connexion 51 entre les plots de contact 11 de chaque puce 10 et les plages de connexion 18 par jet de matière conductrice 50. Cette matière conductrice 50 peut être composée de particules métalliques ou d'un polymère conducteur, par exemple.Finally, the protection step can be omitted in the case of a transfer of the micromodule obtained in a card body by a known process of overmolding. Referring to FIG. 5, the support film 15 comprises connection pads 18 and integrated circuit chips 10 reported according to conventional techniques. The invention mainly proposes to make the connection 51 between the contact pads 11 of each chip 10 and the connection pads 18 by jet of conductive material 50. This conductive material 50 may be composed of metallic particles or of a conductive polymer, for example.
Une tête d' éjection 55 dépose un jet de matière conductrice 50 de manière a réaliser une connexion 51 reliant chaque plot αe contact 11 d'une puce a la plage de connexion 18 correspondante. Avantageusement, le jet de matière conductrice 50 permet d'obtenir une connexion 51 fine et précise, quelque soit le motif des plages de connexion 18. En effet, il est possible d' imprimer un chemin de conduction non linéaire pour réaliser une connexion 51. Preferentiellement, une tête d' éjection 55 comportant une pluralité de buses utilisant une technologie piézoélectrique, ou « piezo », est utilisée pour réaliser les connexions 51. Cette technologie est avantageusement indépendante de la viscosité des matériaux a injecter et elle ne met pas en contact le matériau éjecté et les électrodes de mise en œuvre de la tête.An ejection head 55 deposits a jet of conductive material 50 so as to make a connection 51 connecting each contact pad 11 of a chip to the corresponding connection pad 18. Advantageously, the jet of conductive material 50 makes it possible to obtain a fine and precise connection 51, whatever the pattern of the connection pads 18. In fact, it is possible to print a non-linear conduction path to make a connection 51. Preferably, an ejection head 55 comprising a plurality of nozzles using a piezoelectric technology, or “piezo”, is used to make the connections 51. This technology is advantageously independent of the viscosity of the materials to be injected and it does not bring into contact the material ejected and the electrodes for implementing the head.
En outre, les tête d' éjection de type « piezo » sont actuellement parmi les plus rapides, et il est courant d'atteindre des fréquences disponibles de 12.24 et 40 kHz, ce qui permet de garantir des vitesses d'éjection de gouttes suffisamment rapides pour des applications industrielles. La résolution des buses de la tête d'éjection 55 est préferentiellement élevée, de 300 à 600 Dpi (Dot per inch en unité de mesure anglaise, points par pouce) , afin de garantir un tracé de piste de connexion 51 précis et dense si nécessaire.In addition, the “piezo” type ejection heads are currently among the fastest, and it is common to reach available frequencies of 12.24 and 40 kHz, which makes it possible to guarantee sufficiently rapid drop ejection speeds. for industrial applications. The resolution of the nozzles of the ejection head 55 is preferably high, from 300 to 600 Dpi (Dot per inch in English measurement unit, dots per inch), in order to guarantee a precise and dense connection track layout 51 if necessary .
Cette résolution des buses peut cependant évoluée avec la technique future.This resolution of the nozzles can however be improved with the future technique.
L'isolation des tranches de chaque puce (si nécessaire) est préferentiellement réalisée par jet de matière isolante 60. Cette matière isolante 60 peut être composée d'une résine cationique à réticulation aux ultraviolets, par exemple, ou d'une résine de type thermopolymérisable, par exemple.The insulation of the wafers of each chip (if necessary) is preferably carried out by a jet of insulating material 60. This insulating material 60 can be composed of a cationic resin crosslinked with ultraviolet rays, for example, or a resin of the heat-curing type. , for example.
Une résine thermopolymérisable est chauffée avant d'être éjectée, et refroidi au contact du support 15 et de l'air ambiant. Une telle résine polymérise donc rapidement à l'air libre et son utilisation ne ralentit pas la cadence de production.A thermopolymerizable resin is heated before being ejected, and cooled in contact with the support 15 and the ambient air. Such a resin therefore quickly polymerizes in the open air and its use does not slow down the production rate.
Dans le cas où une résine à réticulation aux ultraviolets est utilisée, une étape intermédiaire de polymérisation est alors réalisée, dans la continuité du procédé de fabrication, par un passage en ligne sous des lampes à ultraviolets.In the case where an ultraviolet crosslinking resin is used, an intermediate polymerization step is then carried out, in continuity with the manufacturing process, by passing in line under ultraviolet lamps.
Le jet de matière isolante 60 permet de bien maîtriser l'épaisseur et l'emplacement de la protection 61 déposée.The jet of insulating material 60 makes it possible to properly control the thickness and the location of the protection 61 deposited.
Une deuxième tête d'éjection 65 est alors utilisée. Cette tête 65 peut également être une tête « piézo » ou une tête d'éjection à jet continu dévié, ou une tête d'éjection thermique, par exemple.A second ejection head 65 is then used. This head 65 can also be a “piezo” head or an ejection head with a deviated continuous jet, or a thermal ejection head, for example.
Néanmoins, la technologie « piézo » constitue un mode de réalisation préférentiel. En effet, les matériaux utilisés dans les deux autres techniques doivent être de faible viscosité, et ils sont généralement soumis a un potentiel électrique entre la buse d' éjection et la goutte de matière a éjecter.Nevertheless, the “piezo” technology constitutes a preferred embodiment. Indeed, the materials used in the other two techniques must be of low viscosity, and they are generally subject to an electrical potential between the ejection nozzle and the drop of material to be ejected.
La resolution αes ouses de la tête d' éjection 65 peut être une resolution dite basse, par exemple de 65 a 100 Dpi. En effet, le niveau de précision n'est pas aussi important que αans la réalisation des connexionsThe resolution of the ejection head 65 can be a so-called low resolution, for example from 65 to 100 Dpi. Indeed, the level of precision is not as important as αans making the connections
51.51.
La protection de l'ensemble du micromodule (si nécessaire) est également réalisée par la technique du jet de matière.Protection of the entire micromodule (if necessary) is also achieved by the material jet technique.
Une troisième tête d' éjection 75 délivre un et de matière isolante 70 recouvrant l'ensemble de la face active de la puce 10 et les connexions 51.A third ejection head 75 delivers an insulating material 70 covering the whole of the active face of the chip 10 and the connections 51.
Avantageusement, cette protection 71 constitue un film de protection épousant parfaitement la forme du micromodule et dont l'épaisseur est largement inférieure aux gouttes d' encapsulation généralement obtenues par la technique classique du « glob top ». Aucune étape de fraisage n' est par conséquent nécessaire.Advantageously, this protection 71 constitutes a protective film which conforms perfectly to the shape of the micromodule and the thickness of which is much less than the encapsulation drops generally obtained by the conventional “glob top” technique. No milling step is therefore necessary.
Du fait que les différentes buses de la tête d' éjection 75 peuvent être commandées individuellement, la forme géométrique et l'épaisseur de la protection 71 seront parfaitement contrôlées. Il est ainsi possible de réaliser un enrobage de protection de la puce 10 et de ses connexions 51 qui corresponde a un volume complémentaire de la cavité dans laquelle le micromodule sera place, comme la cavité d'un corps de carte par exemple. La matière isolante 70 utilisée peut être une résine thermopolymérisable, par exemple.Because the different nozzles of the ejection head 75 can be controlled individually, the geometric shape and the thickness of the protection 71 will be perfectly controlled. It is thus possible to produce a protective coating for the chip 10 and its connections 51 which corresponds to a volume complementary to the cavity in which the micromodule will be placed, such as the cavity of a card body for example. The insulating material 70 used can be a thermopolymerizable resin, for example.
La troisième tête d' éjection 75 est preferentiellement de type « piezo » comme les précédentes, mais elle peut également être thermique ou a jet continu dévie par exemple.The third ejection head 75 is preferably of the “piezo” type like the previous, but it can also be thermal or continuous deflected jet for example.
Les épaisseurs des couches de matière déposées respectivement pour l'isolation des tranches 61, la connexion 51 et la protection 71 dépendent de la résolution et du nombre de passage des têtes d' éjection 55, 65 et 75 respectives. Ainsi, pour une resolution de 600 Dpi, on obtient une couche présentant une épaisseur comprise entre 4 et 9 μm, alors que pour une resolution de 80 Dpi, l'épaisseur de la couche sera comprise entre 80 et 100 μm.The thicknesses of the layers of material deposited respectively for the insulation of the wafers 61, the connection 51 and the protection 71 depend on the resolution and the number of passages of the respective ejection heads 55, 65 and 75. Thus, for a resolution of 600 Dpi, a layer is obtained having a thickness between 4 and 9 μm, while for a resolution of 80 Dpi, the thickness of the layer will be between 80 and 100 μm.
Le procède selon l'invention permet ainsi d'obtenir des micromodules d'épaisseur maîtrisée et avec une cadence de fabrication nettement supérieure a celle des procèdes classiques.The process according to the invention thus makes it possible to obtain micromodules of controlled thickness and with a production rate clearly higher than that of conventional processes.
La figure 6 illustre schematiquement, en perspective, une des étape de dépôt de matière selon la présente invention, en l'occurrence l'étape d'isolation des tranches de puce. Selon un mode de réalisation préférentiel, les puces 10 sont disposées sur le film support 15 par rangée de deux.FIG. 6 schematically illustrates, in perspective, one of the material deposition steps according to the present invention, in this case the step of isolating the chip wafers. According to a preferred embodiment, the chips 10 are arranged on the support film 15 in rows of two.
Une double tête d' éjection 65 comprenant un important nombre de buses injectent de la matière isolante 60 sur les tranches de chaque puce 10.A double ejection head 65 comprising a large number of nozzles inject insulating material 60 onto the edges of each chip 10.
Les trois têtes d' éjection 55, 65, 75 sont préferentiellement placées dans des systèmes en ligne afin de garantir une cadence de production maximale.The three ejection heads 55, 65, 75 are preferably placed in on-line systems in order to guarantee a maximum production rate.
Selon les spécificités des têtes d' éjection 55, 65, 75 utilisées, différents types de montage peuvent être envisages pour la chaîne de production.According to the specificities of the ejection heads 55, 65, 75 used, different types of assembly can be envisaged for the production line.
Par exemple, dans le cas ou le film support 15 défile de manière continue, l'utilisation de têtes présentant un grand nombre de buses d'éjection est souhaitable afin de tenir une cadence de production supérieure ou égale à 57000 pièces à l'heure.For example, in the case where the support film 15 runs continuously, the use of heads having a large number of ejection nozzles is desirable in order to maintain a production rate greater than or equal to 57,000 pieces per hour.
Dans le cas où le film support 15 se déplace de façon indexée, l'utilisation de têtes présentant un petit nombre de buses d'éjection peut être envisageable sans compromettre la cadence de production. Il est alors possible dans ce cas de déplacer les têtes en plusieurs passages au dessus de chaque puce.In the case where the support film 15 moves in an indexed fashion, the use of heads having a small number of ejection nozzles can be envisaged without compromising the production rate. It is then possible in this case to move the heads in several passes over each chip.
Il est évident que la cadence sera supérieure avec un film défilant en continu et des têtes d'éjection comportant un grand nombre de buses, néanmoins de telles têtes sont plus coûteuses.It is obvious that the rate will be higher with a film running continuously and ejection heads comprising a large number of nozzles, nevertheless such heads are more expensive.
Les étapes du procède de fabrication selon l'invention étant réalisées en série, la cadence globale sera imposée par l'étape de cadence la plus faible. Avec des fréquences de travail comprises entre 2 kHz et 40 kHz, et des résolution de tête d'éjection comprises entre 60 et 600 Dpi, on obtient une cadence minimale de 8 puces par seconde et par voie, pour une puce de 10 mm de longueur. Ainsi, les puces étant généralement disposées par rangées de deux sur le film support, la cadence minimale est de 57600 puces à 1' heure .The stages of the manufacturing process according to the invention being carried out in series, the overall rate will be imposed by the lowest rate step. With working frequencies between 2 kHz and 40 kHz, and ejection head resolution between 60 and 600 Dpi, we obtain a minimum rate of 8 chips per second and per channel, for a chip of 10 mm in length . Thus, the chips being generally arranged in rows of two on the support film, the minimum rate is 57,600 chips per hour.
Les fréquences de travail et les résolutions des buses des têtes d'éjection sont susceptibles d'évoluer avec la technique future.The working frequencies and the resolutions of the nozzles of the ejection heads are likely to change with future technology.
La résolution des points de matière dépend de l'application que l'on souhaite réaliser.The resolution of the material points depends on the application that one wishes to realize.
Ainsi, pour une connexion, la resolution peut être supérieure ou égale à 600 Dpi, alors que pour une isolation des tranches de la puce, la résolution peut être comprise entre 200 et 300 Dpi, et pour une protection mécanique par enrobage dans une résine, la résolution peut être seulement supérieure ou égale à 60 Dpi .Thus, for a connection, the resolution can be greater than or equal to 600 Dpi, while for an isolation of the wafers of the chip, the resolution can be between 200 and 300 Dpi, and for mechanical protection by coating in a resin, the resolution can only be greater than or equal to 60 Dpi.
Dans le cas d'une connexion à 600 Dpi, et en fonction du matériau conducteur utilisé, les points obtenus peuvent présenter une épaisseur variant entre 4 et 9 μm avec un diamètre d'environ 60 μm. La connexion peut en outre être composée de plusieurs couches de points de matière conductrice.In the case of a connection at 600 Dpi, and depending on the conductive material used, the points obtained can have a thickness varying between 4 and 9 μm with a diameter of approximately 60 μm. The connection can also be composed of several layers of points of conductive material.
La figure 7 illustre l'application du procédé selon l'invention à la réalisation d'une carte à puce.FIG. 7 illustrates the application of the method according to the invention to the production of a smart card.
Une puce de circuit intègre 10 est reportée dans la cavité 120 d'un corps de carte 200 préalablement décorée par des pistes de contact 19. Ces pistes 19 sont avantageusement réalisées par jet de gouttes de matière conductrice selon le procède décrit dans la présente invention.An integrated circuit chip 10 is transferred into the cavity 120 of a card body 200 previously decorated by contact tracks 19. These tracks 19 are advantageously produced by jet of drops of conductive material according to the method described in the present invention.
Lors du report du micromodule 100 constitué par la puce 10 et par ses plages de connexions 18, ces dernières seront en liaison avec les plages de contact 19 pour une communication électrique.During the transfer of the micromodule 100 constituted by the chip 10 and by its connection pads 18, the latter will be in connection with the contact pads 19 for electrical communication.
Ainsi, dans une telle application, les pistes de contact 19, les plages de connexions 18 et les pistes de connexion entre ces éléments conducteurs peuvent être réalisés en tout ou partie par jet de gouttes de matière conductrice selon le procédé de l'invention.Thus, in such an application, the contact tracks 19, the connection pads 18 and the connection tracks between these conductive elements can be produced in whole or in part by jet of drops of conductive material according to the method of the invention.
La figure 8 illustre l'application du procédé selon l'invention à la réalisation d'une carte de circuit imprimé . Dans l'exemple illustré, une telle carte comporte des pistes conductrices Pi, des points de connexion 8 et un emplacement réserve 9 pour une puce de circuit intégré. Une telle carte peut également comporter au moins une capacité C, une résistance R et une antenne A.FIG. 8 illustrates the application of the method according to the invention to the production of a printed circuit board. In the example illustrated, such a card comprises conductive tracks Pi, connection points 8 and a reserve location 9 for an integrated circuit chip. Such a card may also include at minus a capacitor C, a resistor R and an antenna A.
Les pistes conductrices Pi, les points de connexions 8, la résistance R et l'antenne A peuvent être réalisés directement sur le support de la carte CI par jet de gouttes de matière conductrice.The conductive tracks Pi, the connection points 8, the resistor R and the antenna A can be produced directly on the support of the card CI by jet of drops of conductive material.
Ces composants, ainsi que la puce, peuvent être protégés par enrobage dans une matière isolante déposée par jet de goutte de matière isolante. La carte de circuit imprimé CI peut également comprendre une capacité C réalisée selon le procédé de 1' invention .These components, as well as the chip, can be protected by coating in an insulating material deposited by a jet of insulating material. The printed circuit board CI can also include a capacitor C produced according to the method of the invention.
La figure 9 illustre l'application du procédé selon l'invention à la réalisation d'une capacité. Une couche en matériau conducteur M peut être déposée par jet de gouttes de matière conductrice, sur laquelle on superpose une couche de matière isolante déposée par jet de gouttes de matière isolante, une deuxième couche en matériau conducteur M déposée de selon le même procédé terminant la capacité C.FIG. 9 illustrates the application of the method according to the invention to the production of a capacity. A layer of conductive material M can be deposited by jet of drops of conductive material, on which a layer of insulating material deposited by jet of drops of insulating material is superimposed, a second layer of conductive material M deposited using the same process terminating the capacity C.
Les électrodes El et E2 peuvent également être réalisée selon le procédé de jet de matière de la présente invention.The electrodes E1 and E2 can also be produced according to the material jet method of the present invention.
La figure 10 illustre l'application du procédé selon l'invention à la réalisation d'un empilement de puces de circuit intégré.FIG. 10 illustrates the application of the method according to the invention to the production of a stack of integrated circuit chips.
Une puce 10 de circuit intégré est reportée sur un support 15 muni de points de connexion 18. Une isolation des tranches de la puce 10 peut être réalisée selon le procède de l'invention par jet de matière isolante 61, puis la puce 10 est connectée aux points de connexion 18 par jet de matière conductrice 51. Une protection peut alors être réalisée par jet de matière isolante 71. Une seconde puce 10' , de dimensions inférieures à celle de la précédente, peut être reportée sur la première 10 et connectée aux pistes conductrices 51 de la première puce 10. On peut ainsi réaliser, avec le procédé selon l'invention, un empilement de puces de circuit intégré, connectées entre elles par jet de matière conductrice et protégées par enrobage dans de la matière isolante déposée par jet de matière. La pile de puces de circuit intégré ainsi obtenu est compacte et facile à connecter.An integrated circuit chip 10 is transferred onto a support 15 provided with connection points 18. Insulation of the edges of the chip 10 can be carried out according to the method of the invention by jet of insulating material 61, then the chip 10 is connected at the connection points 18 by jet of conductive material 51. Protection can then be produced by jet of insulating material 71. A second chip 10 ′, of dimensions smaller than that of the previous one, can be transferred to the first chip 10 and connected to the conductive tracks 51 of the first chip 10. It is thus possible to produce, with the method according to the invention, a stack of integrated circuit chips, connected together by jet of conductive material and protected by coating in insulating material deposited by jet of material. The stack of integrated circuit chips thus obtained is compact and easy to connect.
La figure 11 illustre l'application du procédé selon l'invention à la réalisation d'une antenne.FIG. 11 illustrates the application of the method according to the invention to the production of an antenna.
Les spires de l'antenne A sont réalisées par jet de matière conductrice sur un support diélectrique quelconque. L'utilisation du jet de matière permet de maîtriser parfaitement la forme de l'antenne A ainsi que l'espacement entre les spires qui peut être minimisé . Des points de connexion 8 sont réalisés, également par jet de matière conductrice, afin de permettre la connexion de l'antenne A à un autre composant électronique .The turns of antenna A are produced by a jet of conductive material on any dielectric support. The use of the material jet makes it possible to perfectly control the shape of the antenna A as well as the spacing between the turns which can be minimized. Connection points 8 are made, also by jet of conductive material, in order to allow connection of the antenna A to another electronic component.
Selon le motif choisi, un pond isolant 80 est réalisé, par jet de matière isolante, par dessus les spires de l'antenne A afin d'amener les points de connexion 8 à un emplacement donné.Depending on the pattern chosen, an insulating pond 80 is produced, by jet of insulating material, over the turns of the antenna A in order to bring the connection points 8 to a given location.
Les figures 12a et 12b illustrent l'application du procédé selon l'invention à la réalisation d'un module biface 300 avec des amenées de courant.FIGS. 12a and 12b illustrate the application of the method according to the invention to the production of a two-sided module 300 with current leads.
La figure 12a illustre la face arrière 305 du module et la figure 12b la face avant sur laquelle se trouve les contacts 306. Des perforations 310 sont réalisées dans le support du module 300 afin de permettre à des amenées de courant de connecter la face arrière 305 avec les plots de contact 11 de la face avant 306.FIG. 12a illustrates the rear face 305 of the module and FIG. 12b the front face on which the contacts 306 are located. Perforations 310 are made in the support of the module 300 in order to allow current leads to connect the rear face 305 with the contact pads 11 of the front face 306.
Selon l'invention, ces amenées de courant sont réalisées par jet de matière conductrice à travers les perforations 310. According to the invention, these current leads are produced by jet of conductive material through the perforations 310.

Claims

REVENDICATIONS
1. Procédé de fabrication d'un dispositif électronique, comportant au moins un circuit électronique et/ou électrique, caractérisé en ce que tout ou partie dudit circuit est réalisé par jet de gouttes de matière.1. A method of manufacturing an electronic device, comprising at least one electronic and / or electrical circuit, characterized in that all or part of said circuit is produced by jet of material drops.
2. Procédé de fabrication selon la revendication 1 caractérisé en ce que ledit circuit comporte des éléments ou composants conducteurs dont tout ou partie est réalisé par jet de gouttes de matière conductrice.2. Manufacturing process according to claim 1 characterized in that said circuit comprises elements or conductive components of which all or part is produced by jet of drops of conductive material.
3. Procédé de fabrication selon la revendication 1 ou 2 caractérisé en ce que ledit circuit comporte des éléments isolants ou zones isolantes dont tout ou partie est réalisé par jet de gouttes de matière isolante .3. The manufacturing method according to claim 1 or 2 characterized in that said circuit comprises insulating elements or insulating zones of which all or part is produced by jet of drops of insulating material.
. Procédé de fabrication selon la revendication 2 caractérisé en ce que l'élément conducteur est choisi parmi une piste conductrice, un circuit conducteur, une connexion, un plot ou point de connexion.. Manufacturing method according to claim 2 characterized in that the conductive element is chosen from a conductive track, a conductive circuit, a connection, a pad or connection point.
5. Procédé de fabrication selon la revendication 2 caractérisé en ce que l'élément conducteur est un composant électronique et/ou électrique.5. The manufacturing method according to claim 2 characterized in that the conductive element is an electronic and / or electrical component.
6. Procédé de fabrication selon la revendication 5 caractérisé en ce que le composant est choisi parmi une résistance, un fusible, une self, une capacité, une antenne. 6. The manufacturing method according to claim 5 characterized in that the component is chosen from a resistance, a fuse, a choke, a capacitor, an antenna.
7. Procédé de fabrication selon la revendication 3, caractérisé en ce que ladite matière isolante constitue une protection mécanique ou constitue une isolation électrique d'un élément conducteur ou semi-conducteur.7. The manufacturing method according to claim 3, characterized in that said insulating material constitutes a mechanical protection or constitutes an electrical insulation of a conductive or semiconductor element.
8. Procède de fabrication selon la revendication 3, caractérisé en ce que ladite matière isolante est disposée entre les plans conducteurs d'une capacité ou d'un condensateur.8. The manufacturing method according to claim 3, characterized in that said insulating material is disposed between the conducting planes of a capacitor or a capacitor.
9. Procédé de fabrication selon l'une des revendications 1, 2 ou 4, une puce de circuit intégré (10) étant reportée sur un support (15) muni de points de connexion (18), caractérise en ce que les connexions entre les plots de contact (11) de la puce (10) et les points de connexion (18) sont réalisées par jet de gouttes de matière conductrice (50).9. Manufacturing method according to one of claims 1, 2 or 4, an integrated circuit chip (10) being transferred to a support (15) provided with connection points (18), characterized in that the connections between the contact pads (11) of the chip (10) and the connection points (18) are produced by spraying drops of conductive material (50).
10. Procédé de fabrication selon l'une des revendications 1, 3, 7 ou 9, une puce de circuit intégré (10) étant reportée sur un support (15), caractérisé en ce qu' il comporte en outre une étape d'isolation des tranches de puce (10), l'isolation (71) étant réalisée par jet de gouttes de matière isolante (70) .10. The manufacturing method according to one of claims 1, 3, 7 or 9, an integrated circuit chip (10) being transferred to a support (15), characterized in that it further comprises an isolation step chip wafers (10), the insulation (71) being produced by spraying drops of insulating material (70).
11. Procédé de fabrication selon l'une des revendications 1, 3, 7, 9 ou 10, une puce de circuit intégré (10) étant reportée sur un support (15) et connectée à des points de connexion (18), caractérisé en ce qu'il comporte en outre une étape d'enrobage par une matière isolante protectrice de la puce (10) et de ses connexions (51), ledit enrobage (61) étant réalisée par et de gouttes de matière isolante (60). 11. Manufacturing method according to one of claims 1, 3, 7, 9 or 10, an integrated circuit chip (10) being transferred onto a support (15) and connected to connection points (18), characterized in what it further comprises a step of coating with an insulating material protecting the chip (10) and its connections (51), said coating (61) being produced by and drops of insulating material (60).
12. Procédé de fabrication selon la revendication 9, caractérisé en ce que la matière conductrice comporte des particules métalliques.12. The manufacturing method according to claim 9, characterized in that the conductive material comprises metallic particles.
13. Procédé de fabrication selon la revendication 9, caractérisé en ce que la matière conductrice comporte un matériau polymère conducteur.13. The manufacturing method according to claim 9, characterized in that the conductive material comprises a conductive polymeric material.
14. Procédé de fabrication selon l'une des revendications 10 a 11, caractérise en ce que la matière isolante comporte une résine cationique à réticulation aux ultraviolets.14. The manufacturing method according to one of claims 10 to 11, characterized in that the insulating material comprises a cationic resin crosslinked with ultraviolet.
15. Procédé de fabrication selon l'une des revendications 10 à 11, caractérisé en ce que la matière isolante comporte une résine thermopolymérisable .15. The manufacturing method according to one of claims 10 to 11, characterized in that the insulating material comprises a thermopolymerizable resin.
16. Procédé de fabrication selon l'une quelconque des revendications 9 a 11, caractérisé en ce que les jets de gouttes de matière conductrice et isolante sont réalisés au moyen de têtes d' éjection piézoélectrique (55, 65, 75) .16. The manufacturing method according to any one of claims 9 to 11, characterized in that the jets of drops of conductive and insulating material are produced by means of piezoelectric ejection heads (55, 65, 75).
17. Procédé de fabrication selon l'une quelconque des revendications 10 à 11, caractérisé en ce que les jets de gouttes de matière isolante sont réalisés au moyen de têtes d'éjection thermique (65, 75) .17. The manufacturing method according to any one of claims 10 to 11, characterized in that the jets of drops of insulating material are produced by means of thermal ejection heads (65, 75).
18. Procédé de fabrication selon l'une quelconque des revendications 10 à 11, caractérisé en ce que les jets de gouttes de matière isolante sont réalisés au moyen de têtes d'éjection à jet continu dévié (65, 75). 18. The manufacturing method according to any one of claims 10 to 11, characterized in that the jets of drops of insulating material are produced by means of ejection heads with continuous deflected jet (65, 75).
19. Procédé de fabrication selon l'une quelconque des revendications 16 à 18, caractérisé en ce que les têtes d'éjection (55, 65, 75) comportent une pluralité de buses de manière à effectuer un unique passage par puce ( 10) .19. The manufacturing method according to any one of claims 16 to 18, characterized in that the ejection heads (55, 65, 75) comprise a plurality of nozzles so as to make a single pass per chip (10).
20. Procédé de fabrication selon l'une quelconque des revendications 16 à 18, le support (15) se déplaçant de manière indexée, caractérisé en ce que les têtes d'injection (55, 65, 75) effectuent plusieurs passages sur chaque puce (10) .20. The manufacturing method according to any one of claims 16 to 18, the support (15) moving in an indexed manner, characterized in that the injection heads (55, 65, 75) carry out several passages on each chip ( 10).
21. Procédé de fabrication selon l'une des revendications 1 à 2 ou 4 à 6, caractérisé en ce que tout ou partie d'un élément ou composant électronique est réalisé sur un support, simultanément à sa connexion à des points de connexion, par jet de gouttes de matière conductrice.21. Manufacturing method according to one of claims 1 to 2 or 4 to 6, characterized in that all or part of an electronic element or component is produced on a support, simultaneously with its connection to connection points, by jet of drops of conductive material.
22. Procédé de fabrication selon la revendication 21, caractérisé en ce que les points de connexion se situent sur un autre composant électronique.22. The manufacturing method according to claim 21, characterized in that the connection points are located on another electronic component.
23. Procédé de fabrication selon l'une des revendications 1 à 2 ou , une pluralité de puces de circuit intégré étant disposées sur un support, caractérisé en ce que les connexions entre les puces, espacées les unes des autres, sont réalisées par jet de gouttes de matière conductrice.23. Manufacturing method according to one of claims 1 to 2 or, a plurality of integrated circuit chips being arranged on a support, characterized in that the connections between the chips, spaced from each other, are made by jet of drops of conductive material.
24. Procédé de fabrication selon l'une des revendications 1 à 2 ou 4, une pluralité de puces de circuit intégré étant disposées sur un support, caractérisé en ce que les connexions entre les puces, empilées les unes sur les autres, sont réalisées par jet de gouttes de matière conductrice.24. Manufacturing method according to one of claims 1 to 2 or 4, a plurality of integrated circuit chips being arranged on a support, characterized in that the connections between the chips, stacked one on the other, are made by jet of drops of conductive material.
25. Procède de fabrication selon la revendication 24, caractérise en ce qu'un dépôt de matière isolante entre les faces actives de chaque puce empilées est réalisé par jet de gouttes de matière isolante.25. The manufacturing method according to claim 24, characterized in that a deposit of insulating material between the active faces of each stacked chip is produced by spraying drops of insulating material.
26. Procédé de fabrication selon l'une des revendications 1 ou 3, caractérisé en ce qu'un pont isolant, situé entre des pistes conductrices croisées, est réalisé par et de gouttes de matière isolante.26. The manufacturing method according to one of claims 1 or 3, characterized in that an insulating bridge, located between crossed conductive tracks, is produced by and drops of insulating material.
27. Procédé de fabrication selon l'une des revendication 1 à 2 ou 4 , un support diélectrique perforé portant des plages de contact d'un module électronique et des amenées de courant étant réalisées sur la opposée, caractérisé en ce que lesdites amenées sont réalisées par jet de gouttes de matière conductrice à travers les perforations.27. Manufacturing method according to one of claims 1 to 2 or 4, a perforated dielectric support carrying contact pads of an electronic module and current leads being made on the opposite, characterized in that said leads are made by spraying drops of conductive material through the perforations.
28. Dispositif électronique comportant un circuit électronique et/ou électrique, caractérisé en ce que tout ou partie dudit circuit se compose de points de matière obtenus par jet de gouttes de matière.28. Electronic device comprising an electronic and / or electrical circuit, characterized in that all or part of said circuit consists of points of material obtained by jet of material drops.
29. Dispositif électronique selon la revendication 28, caractérisé en ce que les points de matière présentent une résolution supérieure ou égale à 60 Dpi.29. Electronic device according to claim 28, characterized in that the material dots have a resolution greater than or equal to 60 Dpi.
30. Dispositif électronique selon l'une des revendications 28 ou 29, caractérisé en ce que ledit dispositif comporte des éléments conducteurs dont tout ou partie se compose de points de matière conductrice obtenus par jet de gouttes de matière.30. Electronic device according to one of claims 28 or 29, characterized in that said device comprises conductive elements, all of which or part consists of points of conductive material obtained by jet of material drops.
31. Dispositif électronique selon l'une des revendications 28 ou 29, caractérise en ce que le dispositif comporte des éléments isolants ou zones isolantes dont tout ou partie se compose de points de matière isolante obtenus par jet de gouttes de matière.31. Electronic device according to one of claims 28 or 29, characterized in that the device comprises insulating elements or insulating zones of which all or part consists of points of insulating material obtained by jet of material drops.
32. Dispositif électronique selon la revendication32. Electronic device according to claim
30, caractérise en ce que l'élément conducteur est choisi parmi une piste conductrice, un circuit conducteur, une connexion, un plot ou un point de connexion .30, characterized in that the conductive element is chosen from a conductive track, a conductive circuit, a connection, a pad or a connection point.
33. Dispositif électronique selon la revendication33. Electronic device according to claim
30, caractérise en ce que l'élément conducteur est un composant électronique et/ou électrique.30, characterized in that the conductive element is an electronic and / or electrical component.
34. Dispositif électronique selon la revendication34. Electronic device according to claim
33, caractérise en ce que le composant est choisi parmi une résistance, un fusible, une self, une capacité, une antenne .33, characterized in that the component is chosen from a resistor, a fuse, a choke, a capacitor, an antenna.
35. Dispositif électronique selon la revendication35. Electronic device according to claim
31, caractérise en ce que la matière isolante constitue une protection mécanique d'éléments conducteurs.31, characterized in that the insulating material constitutes mechanical protection of conductive elements.
36 Dispositif électronique selon la revendication 31, caractérise en ce que la matière isolante constitue une isolation électrique d'éléments conducteurs.36 Electronic device according to claim 31, characterized in that the insulating material constitutes an electrical insulation of conductive elements.
37. Dispositif électronique selon la revendication 36, caractérise en ce que la matière isolante est disposée entre les plans conducteurs d'une capacité ou d'un condensateur.37. Electronic device according to claim 36, characterized in that the insulating material is disposed between the conducting planes of a capacitor or a capacitor.
38. Dispositif électronique selon la revendication 31, caractérise en ce que la matière isolante constitue un support du dispositif tel qu'une carte, ou un film support, ou un enrobage.38. Electronic device according to claim 31, characterized in that the insulating material constitutes a support for the device such as a card, or a support film, or a coating.
39. Dispositif électronique selon l'une des revendications 28 ou 29, caractérise en ce que le circuit comporte au moins une puce de circuit intégré.39. Electronic device according to one of claims 28 or 29, characterized in that the circuit comprises at least one integrated circuit chip.
40. Dispositif électronique selon la revendication 39, caractérise en ce que le circuit comporte une pluralité de puce de circuit intègre empilées, les connexions entre lesdites puces se composant de points de matière conductrice obtenus par jet de matière.40. Electronic device according to claim 39, characterized in that the circuit comprises a plurality of stacked integrated circuit chips, the connections between said chips consisting of points of conductive material obtained by jet of material.
41. Dispositif électronique selon la revendication 40, caractérise en ce que le circuit comporte en outre une isolation entre les faces actives de chaque puce empilée, l'isolation se composant de points de matière isolante obtenus par jet de matière.41. Electronic device according to claim 40, characterized in that the circuit further comprises insulation between the active faces of each stacked chip, the insulation consisting of points of insulating material obtained by jet of material.
42. Module électronique biface comportant des plages de contact sur un support diélectrique, le support comportant des perforations respectivement au niveau de chaque plage de contact et comportant des amenées de courant sur la face opposée du support à travers lesdites perforations, caractérise en ce que les amenées de courant se composent de points de matière conductrice obtenus par jet de matière. 42. Two-sided electronic module comprising contact pads on a dielectric support, the support comprising perforations respectively at each contact pad and comprising current leads on the opposite face of the support through said perforations, characterized in that the current leads consist of points of conductive material obtained by material jet.
43. Elément conducteur tel qu'une antenne ou une résistance, caractérise en ce que tout ou partie dudit élément et sa connexion a des points de connexion se composent de points de matière conductrice obtenus par jet de matière.43. Conductive element such as an antenna or a resistor, characterized in that all or part of said element and its connection to connection points consist of points of conductive material obtained by jet of material.
44. Dispositif électronique portable tel qu'une carte à puce a contact, caractérisé en ce que les plages de contact (19) de la carte, se composent de points de matière conductrice obtenus par jet de matière .44. Portable electronic device such as a smart card with contact, characterized in that the contact areas (19) of the card, consist of points of conductive material obtained by jet of material.
45. Dispositif électronique portable tel qu'une carte à puce sans contact ou tel qu'une étiquette électronique, caractérisé en ce que l'antenne et la connexion des plots de contact (11) de la puce (10) à l'antenne se composent de points de matière conductrice obtenus par jet de matière.45. Portable electronic device such as a contactless smart card or such as an electronic label, characterized in that the antenna and the connection of the contact pads (11) of the chip (10) to the antenna consist of points of conductive material obtained by jet of material.
46. Circuit imprimé comprenant des pistes conductrices déposées sur un support, caractérise en ce que les pistes se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice .46. Printed circuit comprising conductive tracks deposited on a support, characterized in that the tracks consist of points of conductive material obtained by jet of drops of conductive material.
47. Carte de circuit imprimé comportant des composants électroniques et/ou électriques, des pistes conductrices, et des points de connexion disposés sur un support, caractérisé en ce que les pistes et les points de connexion se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice . 47. Printed circuit board comprising electronic and / or electrical components, conductive tracks, and connection points arranged on a support, characterized in that the tracks and connection points consist of points of conductive material obtained by jet drops of conductive material.
48. Carte selon la revendication 47, caractérisé en ce que les connexions des composants aux pistes conductrices ou points de connexion se composent de points de matière conductrice obtenus par jet de gouttes de matière conductrice.48. Card according to claim 47, characterized in that the connections of the components to the conductive tracks or connection points consist of points of conductive material obtained by jet of drops of conductive material.
49. Carte selon la revendication 47, caractérisé en ce que les composants sont protégés par une couche de matière isolante constituée de points de matière isolante obtenus par jet de gouttes de matière isolante . 49. Card according to claim 47, characterized in that the components are protected by a layer of insulating material consisting of dots of insulating material obtained by jet of drops of insulating material.
PCT/FR2000/001551 1999-06-15 2000-06-07 Method for making all or part of an electronic device by material jet spraying WO2000077854A1 (en)

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EP1346616A1 (en) * 2000-12-29 2003-09-24 Allgon Mobile Communications AB Production of antenna devices
US7480979B2 (en) 2000-12-29 2009-01-27 Amc Centurion Ab Production of antenna devices
DE10113497A1 (en) * 2001-03-20 2002-06-06 Infineon Technologies Ag Production of an integrated circuit used in the semiconductor industry comprises preparing a circuit substrate, forming bumps on the substrate, and providing metallized strips
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US7707713B2 (en) 2002-07-09 2010-05-04 Shinko Electric Industries Co., Ltd. Component-embedded circuit board fabrication method
US7793412B2 (en) 2002-07-09 2010-09-14 Shinko Electric Industries Co., Ltd. Component-embedded board fabrication method
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EP1855514A1 (en) * 2006-05-10 2007-11-14 AMC Centurion AB Production of antenna devices

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FR2795234A1 (en) 2000-12-22
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