WO2000031686A1 - Method for making a flush chip card using a laser engraving step and resulting chip card - Google Patents

Method for making a flush chip card using a laser engraving step and resulting chip card Download PDF

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Publication number
WO2000031686A1
WO2000031686A1 PCT/FR1999/002865 FR9902865W WO0031686A1 WO 2000031686 A1 WO2000031686 A1 WO 2000031686A1 FR 9902865 W FR9902865 W FR 9902865W WO 0031686 A1 WO0031686 A1 WO 0031686A1
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WO
WIPO (PCT)
Prior art keywords
chip
manufacturing
smart card
metal strip
cavity
Prior art date
Application number
PCT/FR1999/002865
Other languages
French (fr)
Inventor
Jean-Christophe Fidalgo
Didier Elbaz
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU12784/00A priority Critical patent/AU1278400A/en
Publication of WO2000031686A1 publication Critical patent/WO2000031686A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Definitions

  • the present invention relates to a method of manufacturing a smart card with flush contact comprising a step of laser engraving on a continuous electrically conductive substrate to form the contact pads of the connection terminal block.
  • the present invention also relates to the flush contact smart card obtained by this process.
  • Chip cards are intended for carrying out various operations, such as, for example, banking operations, telephone communications, various identification operations, or teleticketing operations.
  • smart cards with flush contact consist of an electrically insulating card body provided with a cavity for receiving an integrated circuit, the latter being electrically connected by its contact pads to an interface element of the card constituted by a connection terminal block -
  • the majority of manufacturing processes for smart cards is based on the assembly of the integrated circuit in a sub-assembly called a micromodule which is then inserted using conventional methods.
  • the traditional technology consists in sticking an integrated circuit chip by placing its active face with its contact pads upwards, and by sticking the opposite face on a dielectric support sheet.
  • the dielectric sheet is itself arranged on a contact grid of a metallic plate of nickel-plated and gilded copper. Connection wells are made in the dielectric sheet and connection wires connect the contact pads of the chip to the contact pads of the grid via the connection wells.
  • An encapsulation resin then protects the chip and the soldered connection wires.
  • the module is then cut and then inserted into the cavity of a card body previously decorated.
  • This technology has a major drawback which is that of the high cost of the single-sided printed circuit.
  • the micromodule is manufactured separately from the card holder, the steps for manufacturing a smart card are very numerous and contribute to increasing the manufacturing cost.
  • the metal support plate in itself remains an expensive element because the connection by wires requires metallizations nickel and gold, or silver.
  • the application of the conductive tracks in the housing can be carried out in three different ways.
  • a first way is to carry out hot stamping.
  • a copper sheet coated with nickel and possibly with gold and provided with a hot-activatable adhesive is hot pressed using a tool having a raised pattern facing the zones to be transferred.
  • a second way consists in applying, by means of a pad, a lacquer containing a palladium catalyst to the places intended to be metallized; heating the lacquer; then to carry out a metallization by depositing copper and / or nickel and / or gold by an electrochemical process of autocatalysis.
  • a third way is to make a lithogravure from laser holograms. This lithography allows three-dimensional metallization deposits to be produced with very high precision and high resolution.
  • the invention provides a method of manufacturing a smart card using a laser engraving step.
  • the invention uses a continuous electrically conductive substrate and produces, by laser engraving, a pattern integrating the standardized contact pads intended to constitute the connection terminal block of the card and to be connected to the output pads of the chip.
  • An advantage of the method of the invention is to make it possible to dispense with the use of a support film, or of a conductive frame ensuring the cohesion of the contact pads after pre-cutting thereof by punching on a metal tape as in the prior art.
  • the pattern can be plan or three-dimensional; the chip can be assembled before or after this engraving.
  • the invention more particularly relates to a method of manufacturing an electronic device, such as a smart card with flush contact, comprising at least one chip whose output pads are electrically connected to contact pads of a connection terminal block, characterized in that the contact areas of the connection terminal block are obtained by laser engraving on an electrically conductive substrate.
  • the invention also relates to a smart card with flush contact, comprising at least one chip, the output pads of which are electrically connected to the contact pads of a connection terminal block, characterized in that it is obtained by - the manufacturing method of the present invention.
  • the laser engraving operation makes it easier to obtain a high resolution for a three-dimensional pattern in comparison with a mechanical grid cutting process (stamping) or a printing process.
  • the method according to the invention also has the advantage of being rapid and inexpensive. Indeed, the etching operation can be specific for each type of chip without adjustment time or additional cost linked to a particular tool. In addition, the operations upstream of the engraving are greatly simplified by the use of a solid support.
  • FIG. 1A to 1D schematically illustrate the steps of manufacturing a smart card according to a first variant of the method according to the invention
  • - Figure 2 is a sectional diagram of the transfer of a chip on a metal strip according to a known process of the "flip chip"type
  • - Figure 3 is a sectional diagram of the transfer of a chip on a metal strip according to a known method of transfer of unreturned chip
  • FIG. 4A to 4G schematically illustrate the steps for manufacturing a smart card according to a second variant of the method according to the invention
  • FIG. 5A to 5C schematically illustrate the steps for manufacturing a smart card according to a fourth variant of the method according to the invention
  • FIG. 6A to 6G schematically illustrate the steps of manufacturing a smart card according to a fifth variant of the method according to the invention
  • FIG. 7 is a top view of the connecting tracks and contact areas of the chip card according to the fifth variant of the method according to the invention.
  • FIGS. 1A to 1D schematize the main steps of the method for manufacturing a smart card using a laser engraving step.
  • the chip 100 is transferred onto an electrically conductive substrate.
  • this substrate consists of a continuous metallic strip 102.
  • This transfer and the electrical connection of the chip 100 on the metal strip 102 can be done either by any of the known methods of the “flip chip” type or by transfer of non-returned chip.
  • Figures 2 and 3 illustrate these two different methods of transferring a chip onto a metal strip.
  • the first mounting method consists in transferring the chip according to a “flip chip” type of mounting.
  • This guy mounting is already well known and is shown in section in Figure 2.
  • the chip 100 is connected to the metal strip 102 by means of an adhesive 350 with anisotropic electrical conduction well known and often used for mounting passive components on a surface.
  • This adhesive holds the whole of the active face of the chip, including output pads 120, on the metal strip 102.
  • This adhesive 350 actually contains conductive particles which are deformable which make it possible to establish an electrical conduction according to the z axis (that is to say along the thickness) when they are pressed between the output pads 120 and the metal strip 102, while ensuring insulation in the other directions (x, y).
  • the electrical connection between the chip 100 and the metal strip 102 can be established by producing, on the output pads 120 of the chip 100, bosses of hot-melt alloy of Sn / Pb type or of conductive polymer, to improve electrical contact and activated when hot to 'report the chip 100 on the metal strip 102.
  • the electrical connection can also be established by means of protrusions formed by a conductive adhesive, previously deposited on the output pads 120 of the chip and hot reactivated when the chip 100 is transferred onto the metal strip 102.
  • the micromodule 110 is transferred into the cavity 108 of the card body 106 by a "flip chip” process using a drop of electrically conductive glue 350 which holds the whole of the active face of the chip , 120 output pads included, on the metal strip 102.
  • the second method for carrying out the chip transfer is shown in section in FIG. 3, and consists in gluing the chip in place with its active face facing upwards.
  • the chip 100 is bonded to the metal strip 102 by the face opposite to the active face with an insulating adhesive 500.
  • This adhesive can be, for example, a crosslinking adhesive under the effect of exposure to ultra radiation. -purple.
  • the electrical connection is made between the output pads 120 of the chip 100 and the metal strip 102.
  • This connection can be made by dispensing a conductive resin 400 on the output pads 120 of the chip and the metallic tape 102.
  • This conductive resin 400 can be, for example, a polymerizable adhesive loaded with conductive particles.
  • the electrical connection can also be carried out by traditional wired cabling of the "bail bonding” or “wedge bonding” type which connects the pads 120 of the chip 100 to the metal strip 102.
  • the second step of the manufacturing process according to the invention can consist in protecting the chip 100 by coating with a protective resin 104 of very low viscosity, or by laminating an adhesive film on the chip 100 and the tape metallic 102. If a protective resin 104 is used, it must be chosen to be compatible with the various adhesives or resins used during the transfer of the chip 100 onto the metallic tape 102.
  • This protection step is optional when the chip 100 is transferred onto the metal strip 102 according to a “flip chip” type process or according to a non-returned chip transfer method with dispensing of conductive resin.
  • the resin will have to fill the space remaining between the chip and the substrate according to a known process known as "underfill"("underfill” in English).
  • This step is however recommended in the case of a transfer with wired wiring in order to protect the contacts between the output pads of the chip and the metal tape.
  • the third step of the method according to the invention, FIG. 1C consists in cutting a micromodule 110 and transferring it into a cavity 108 formed in a card body 106.
  • the micromodule 110 consists of the chip 100 transferred onto the metal strip 102, and preferably protected by resin 104. Cutting is carried out by conventional means to the dimensions of the cavity 108
  • the cutting tool can also produce test patterns 91, 92 in the metal strip 102 in order to facilitate indexing during the laser engraving step of the contact pads.
  • the test patterns 91, 92 are markers, such as perforations for example, placed on a support film, such as a metallic tape, and which can be identified by a computer-aided vision system, VAO.
  • the card body 106 is obtained according to a conventional manufacturing process, for example by injecting plastic material into a mold, then decorated by printing or by gluing pre-printed labels.
  • the cavity is made either by milling or by molding during the injection of the card. It can either have a circular, rectangular, diamond or octagonal shape, summer, with inclined, vertical or machined walls.
  • the micromodule 110 is transferred into the cavity 108 of the card body 106, metal strip 102 upwards.
  • the transfer can be carried out by bonding with an adhesive of the cyanoacrylate type or else with a heat-activated adhesive. After transfer, the metal strip 102 is found in the same plane as the top of the card body 106 so as to form a flat surface.
  • FIG. 1D illustrates the laser engraving step which makes it possible to form the connection terminal block of the micromodule 110.
  • the studs 120 of the chip 100 were connected on a continuous metallic strip 102. Notches 115 in the metallic tape 102 is therefore necessary to establish the standardized contact pads of the connection terminal block connected to the output pads 120 of. chip 100.
  • the positioning in x and in y of the contours of the chip 100 relative to the edges of the cut micromodule 110 must first be memorized.
  • VAO vision assisted by computer
  • the computer identifies the position of the chip 100 with respect to the contours of the micromodule 110 using the test patterns 91, 92 produced in the metal strip 102 during the step of cutting the micromodule.
  • the position of the output pads 120 of the chip 100 relative to the outline of the micromodule 110 being thus known, the trajectories necessary for producing the standardized contact pads of the connection terminal block of the card 106 can be traced.
  • the laser engraving step therefore makes it possible to create the contact pads of the connection terminal block.
  • the etching step of the terminal block coming at the end of manipulation, the upstream operations are greatly facilitated by the use of a solid support.
  • the step of transferring the chip 100 to the metal strip 102 is greatly simplified since no connection track yet exists, and this step can therefore be carried out by standard transfer equipment which does not require high precision.
  • the manufacturing method according to the invention presents alternative embodiments.
  • FIGS. 4A to 4G schematically illustrate the main steps of a second embodiment of the method for manufacturing a smart card using a step of laser engraving.
  • this variant involves a step of cutting a window 135 from a strip of heat-activated adhesive 130 to the dimensions of the chip 100, followed by a step of fixing the strip of heat-activated adhesive 130 to a continuous metal strip 102.
  • This fixing can be carried out by laminating the adhesive tape 130 on the metal tape 102, or by cold gluing the tapes to one another.
  • the chip 100 is then transferred to the window 135 of the heat-activatable adhesive tape 130 so as to have its active face in contact with the continuous metallic tape 102.
  • the transfer can be carried out either according to any of the methods described above of " flip chip "or carry over unreturned chip.
  • the chip 100 is optionally protected by coating with a protective resin 104 of very low viscosity, or by lamination of an adhesive film on the chip 100 and the adhesive tapes 130 and metallic 102.
  • the next step, FIG. 4F, consists in cutting the micromodule 110 and transferring it, metal strip 102 upwards, in a cavity 108 formed in the card body 106.
  • the strip of heat-activated adhesive 130 is turned towards the bottom. of the cavity 108. It is therefore possible to use this heat-activated adhesive 130 to fix the micromodule 110 in the cavity 108.
  • a laser etching step, illustrated in FIG. 4G forms the standardized contact pads of the connection terminal according to the same process as that described above.
  • a third variant of the manufacturing method according to the invention is very close to the previous one in that it comprises the same steps of cutting a window 135 in a strip of heat-activated adhesive 130; fixing the heat-activatable adhesive to a continuous metal strip 102; for transferring the chip 100 to the metal strip 102 inside the window 135 and for protecting the chip 100.
  • the difference between this variant and the previous one lies in the inversion of the etching and transfer steps of the micromodule 110 in the cavity 108 of the card body 106.
  • the laser etching of the connection terminal block is carried out on the metal tape 102 before the transfer of the micromodule 110 into the cavity 108.
  • the advantage of an engraving at this stage is to be able to increase the rate of the operation in the unwinding of the metal strip. Indeed, several micromodules 110 can be engraved with the same indexing.
  • a mask incorporating the pattern of the terminal block can also be affixed to the continuous metal strip 102. In this case, the laser beam is less focused and makes it possible to expose the entire surface covered by the mask.
  • the same mask having a repeating pattern can cover several spaces of the metallic strip 102 intended for the formation of several micromodules 110.
  • the cutting is then carried out as previously and the micromodule (s) 110 are transferred (s) into the cavity (s) 108 of the card bodies 106.
  • the connection terminal having been previously etched, the transfer of the micromodule 110 is slightly more delicate than in the previous variants because it requires more precision.
  • the micromodule 110 is fixed, as before, by heating the thermo-activatable adhesive 130.
  • FIGS. 5A to 5C schematically illustrate a fourth variant of the method for manufacturing a smart card using a laser engraving step.
  • the micromodule 110 is preferably shaped so as to create anchoring zones 140.
  • the micromodule 110 is then positioned in a mold to be overmolded with a thermoplastic material so as to form the card body 106.
  • Such an overmolding process is well known to those skilled in the art.
  • the anchoring zones 140 allow the mechanical fixing of the micromodule 110 in the card body 106 during overmolding in ther oplastic material.
  • the micromodule 110 is not transferred into the cavity 108 of a card body 106, but directly molded into the card body with the metal strip 102 flush with the surface of the card.
  • the micromodule 110 is then etched with a laser beam so as to form the standardized contact pads of the connection terminal block as previously described.
  • This variant has the advantage of producing, in a single operation, the card body 106, the transfer of the micromodule 110 therein and the decoration of the card body.
  • pre-printed labels can also be positioned and molded in the mold at the same time as the micromodule. However, it is also possible to produce an impression of the card body after molding with the micromodule already integrated in the card body.
  • FIGS. 6A to 6G schematically illustrate a fifth variant of the method for manufacturing a smart card using a laser engraving step.
  • a card body 106 having a cavity 108 with inclined edges is used as illustrated in FIG. 6A.
  • This cavity 108 was produced at the same time as the molding of the card body 106, or by machining in a card body previously obtained by injection, for example.
  • the walls of the cavity 108 are delimited by two planes.
  • the foreground 160 defines the bottom of the cavity 108 and the second plane 165 defines the end of the inclined walls.
  • FIG. 6B to 6D a strip of heat-activatable adhesive 130 is fixed by lamination or by gluing on a continuous metallic strip 102, then cut to form a module 150.
  • This module 150 is furthermore shaped to adopt the same three-dimensional geometry as the cavity 108 of the card body 106, then transferred to the cavity 108 using the heat-activatable adhesive 130 for fixing it. It can be noted at this point that the shaping of the module 150 can be carried out either at the same time as its cutting, or at the same time as the transfer of the latter into the cavity 108 by hot pressing.
  • FIG. 6B to 6D a strip of heat-activatable adhesive 130 is fixed by lamination or by gluing on a continuous metallic strip 102, then cut to form a module 150.
  • This module 150 is furthermore shaped to adopt the same three-dimensional geometry as the cavity 108 of the card body 106, then transferred to the cavity 108 using the heat-activatable adhesive 130 for fixing it. It can be noted at this point that the shaping of the module
  • connection tracks 170 make it possible to provide the electrical connection between the output pads 120 of the chip 100 and the contact pads 180 of the connection terminal block.
  • the chip 100 is then transferred, FIG. 6F, onto the metal strip 102 according to any of the methods described of the “flip chip” type or of transfer of non-returned and correctly positioned chip relative to the bonding tracks 170 already engraved.
  • FIG. 7 represents a top view of the transfer of the chip 100 according to a “flip chip” type method and clearly shows the connecting tracks 170 in the bottom and on the walls of the cavity 108, as well as the contact pads 180 of the connection terminal flush with the surface of the card body 106.
  • a drop of insulating resin 200 is dispensed to fill the cavity 108 in order to protect the chip 100 and its connections to the connecting tracks 170.
  • a UV crosslinking resin is preferably used for this purpose.
  • connection tracks 170 in the cavity 108 of the card body 106 and of the contact pads 180 of the terminal block, before the transfer of the chip 100 makes it possible to easily obtain a high resolution with a pattern. three-dimensional, in comparison with conventional methods of mechanically cutting a grid or printing with conductive ink.
  • Another variant of the method for manufacturing a smart card according to the invention consists in using a metallized dielectric film as an electrically conductive continuous substrate in place of the metal strip described above.
  • the advantage of this variant is the reduction in cost associated with this substitution.
  • the metallized dielectric film is thin and flexible and the thin layer of metal of a few microns is etched much more easily than the metal strip which can reach 35 to 65 microns thick.
  • this variant can have drawbacks when cutting the micromodule or when handling it due to the lack of rigidity of the metallized dielectric film.

Abstract

The invention concerns a method for making an electronic device, such as a chip card, comprising at least a chip whereof the output pads are electrically connected to a connection terminal strip contact pads. The invention is characterised in that the terminal strip contact pads are obtained by laser engraving on a continuous electrically conductive substrate; the laser engraving capable of being produced on a planar or perforated substrate. The method mainly comprises the following steps: transferring the chip (100) onto a continuous metal strip (102) to form a micromodule (110); cutting out and transferring the micromodule (110) into a cavity (108) provided in the card body (106) such that the metal strip (102) is flush with the card surface; engraving the contact pads on the metal strip (102) to form the connection terminal strip (115).

Description

PROCEDE DE FABRICATION DE CARTE A PUCE A CONTACT METHOD FOR MANUFACTURING CONTACT CHIP CARD
AFFLEURANT UTILISANT UNE ÉTAPE DE GRAVURE AU LASER ETFLUSHER USING A LASER ETCHING STEP AND
CARTE A PUCE OBTENUE PAR LE PROCEDECHIP CARD OBTAINED BY THE PROCESS
La présente invention concerne un procédé de fabrication de carte à puce à contact affleurant comprenant une étape de gravure au laser sur un substrat électriquement conducteur continu pour former les plages de contact du bornier de connexion.The present invention relates to a method of manufacturing a smart card with flush contact comprising a step of laser engraving on a continuous electrically conductive substrate to form the contact pads of the connection terminal block.
La présente invention concerne également la carte à puce à contact affleurant obtenue par ce procédé.The present invention also relates to the flush contact smart card obtained by this process.
Les cartes à puce sont destinées à la réalisation de diverses opérations, telles que, par exemple, des opérations bancaires, des communications téléphoniques, diverses opérations d'identification, ou des opérations de type télébillétique.Chip cards are intended for carrying out various operations, such as, for example, banking operations, telephone communications, various identification operations, or teleticketing operations.
Généralement, les cartes à puce à contact affleurant sont constituées d'un corps de carte électriquement isolant muni d'une cavité pour recevoir un circuit intégré, ce dernier étant électriquement relié par ses plots de contact à un élément d'interface de la carte constitué par un bornier de connexion- La majorité des procédés de fabrication des cartes à puce est basée sur l'assemblage du circuit intégré dans un sous-ensemble appelé micromodule qui est ensuite encarté en utilisant des procédés classiques.Generally, smart cards with flush contact consist of an electrically insulating card body provided with a cavity for receiving an integrated circuit, the latter being electrically connected by its contact pads to an interface element of the card constituted by a connection terminal block - The majority of manufacturing processes for smart cards is based on the assembly of the integrated circuit in a sub-assembly called a micromodule which is then inserted using conventional methods.
La technologie traditionnelle consiste à coller une puce de circuit intégré en disposant sa face active avec ses plots de contact vers le haut, et en collant la face opposée sur une feuille support diélectrique. La feuille diélectrique est elle-même disposée sur une grille de contact d'une plaque métallique en cuivre nickelé et doré. Des puits de connexion sont pratiqués dans la feuille diélectrique et des fils de connexion relient les plots de contact de la puce aux plages de contact de la grille par l'intermédiaire des puits de connexion. Une résine d' encapsulation protège ensuite la puce et les fils de connexion soudés. Le module est alors découpé puis encarté dans la cavité d'un corps de carte préalablement décoré.The traditional technology consists in sticking an integrated circuit chip by placing its active face with its contact pads upwards, and by sticking the opposite face on a dielectric support sheet. The dielectric sheet is itself arranged on a contact grid of a metallic plate of nickel-plated and gilded copper. Connection wells are made in the dielectric sheet and connection wires connect the contact pads of the chip to the contact pads of the grid via the connection wells. An encapsulation resin then protects the chip and the soldered connection wires. The module is then cut and then inserted into the cavity of a card body previously decorated.
Cette technologie présente un inconvénient majeur qui est celui du coût important du circuit imprimé simple face. De plus, étant donné que le micromodule est fabriqué séparément du support de carte, les étapes de fabrication d'une carte à puce sont très nombreuses et contribuent à accroître le coût de fabrication. Notamment, la plaque de support métallique en elle-même reste un élément cher car la connexion par fils nécessite les métallisations nickel et or, ou argent.This technology has a major drawback which is that of the high cost of the single-sided printed circuit. In addition, since the micromodule is manufactured separately from the card holder, the steps for manufacturing a smart card are very numerous and contribute to increasing the manufacturing cost. In particular, the metal support plate in itself remains an expensive element because the connection by wires requires metallizations nickel and gold, or silver.
Il existe une autre technologie qui cherche à pallier aux inconvénients de cette technologie classique. Cette technologie est basée tout d'abord sur l'application de pistes électriquement conductrices par un procédé de type MID ("Moulded Interconnection Device" en anglais) . La puce de circuit intégré est ensuite reportée sur plages de contact des pistes conductrices selon l'un quelconque des procédés connus de type "flip chip" ou de report de puce non retournée. Plusieurs procédés associés à cette technologie ont déjà fait l'objet de dépôt de demande de brevet. Notamment, les demandes de brevet EP-A-0 753 827, EP-A- 0 688 050, EP-A-0 688 051, décrivent des procédés de fabrication et d'assemblage d'une carte à puce. Le corps de carte comporte une cavité pour recevoir le circuit intégré, et des pistes de liaison électriquement conductrices sont disposées contre le fond et les parois latérales de la cavité et sont reliées à des plages métalliques de contact formées sur la surface du corps de la carte pour constituer le bornier de connexion.There is another technology which seeks to overcome the drawbacks of this conventional technology. This technology is firstly based on the application of electrically conductive tracks by a MID type process ("Molded Interconnection Device" in English). The integrated circuit chip is then transferred to the contact pads of the conductive tracks according to any of the known methods of “flip chip” type or of transfer of non-returned chip. Several processes associated with this technology have already been the subject of a patent application. In particular, patent applications EP-A-0 753 827, EP-A- 0 688 050, EP-A-0 688 051, describe methods of manufacturing and assembling a smart card. The card body has a cavity for receiving the integrated circuit, and electrically conductive connecting tracks are arranged against the bottom and the side walls of the cavity and are connected to metallic contact pads formed on the surface of the card body to form the connection terminal block.
L'application des pistes conductrices dans le logement peut être effectuée de trois manières différentes.The application of the conductive tracks in the housing can be carried out in three different ways.
Une première manière consiste à réaliser de l'estampage à chaud. A cette fin, une feuille de cuivre recouverte de nickel et éventuellement d'or et munie d'une colle activable à chaud, est pressée à chaud au moyen d'un outil présentant un motif en relief en regard des zones à transférer.A first way is to carry out hot stamping. To this end, a copper sheet coated with nickel and possibly with gold and provided with a hot-activatable adhesive, is hot pressed using a tool having a raised pattern facing the zones to be transferred.
Une deuxième manière consiste à appliquer, au moyen d'un tampon, une laque contenant un catalyseur au palladium aux endroits destinés à être métallisés; à chauffer la laque; puis à réaliser une metallisation par dépôt de cuivre et/ou de nickel et/ou d'or par un procédé électrochimique d' autocatalyse .A second way consists in applying, by means of a pad, a lacquer containing a palladium catalyst to the places intended to be metallized; heating the lacquer; then to carry out a metallization by depositing copper and / or nickel and / or gold by an electrochemical process of autocatalysis.
Une troisième manière consiste à réaliser une lithogravure à partir d'hologrammes laser. Cette lithogravure permet de réaliser des dépôts de metallisation en trois dimensions avec une très grande précision et une haute résolution.A third way is to make a lithogravure from laser holograms. This lithography allows three-dimensional metallization deposits to be produced with very high precision and high resolution.
Tous ces procédés d'application de metallisation sont cependant complexes à mettre en oeuvre et par conséquent coûteux. Ils nécessitent souvent l'utilisation d'"un outillage spécifique et de plusieurs étapes supplémentaires. De plus, les métallisations étant réalisées en cuivre et/ou en nickel et/ou en or, cela reste une technologie coûteuses. L'inconvénient majeur de ce procédé est donc le coût important de l'opération nécessaire à la réalisation des pistes électriquement conductrices en trois dimensions en utilisant une des trois technologies décrites. En effet, par exemple, le deuxième procédé nécessite tout d'abord le dépôt d'un activateur palladium par tampographie, puis une metallisation par un procédé électrochimique d'autocatalyse. Ceci constitue un nombre d'opérations important et par conséquent coûteux. La troisième technologie implique une metallisation additive associée à une photolithogravie laser, ce qui est un procédé également coûteux.All these methods of applying metallization are however complex to implement and consequently expensive. They often require the use of "specific tools and several additional steps. In addition, the metallizations being made of copper and / or nickel and / or gold, this remains an expensive technology. The major drawback of this process is therefore the significant cost of the operation necessary for producing electrically conductive tracks in three dimensions using one of the three technologies described. second method first requires the deposition of a palladium activator by pad printing, then metallization by an electrochemical process of autocatalysis. This constitutes a large number of operations and therefore expensive. The third technology involves additive metallization associated with laser photolithography, which is also an expensive process.
Pour pallier aux inconvénient précités, l'invention propose un procédé de fabrication de carte à puce utilisant une étape de gravure au laser. A cette fin, l'invention utilise un substrat électriquement conducteur continu et réalise, par gravure laser, un motif intégrant les plages de contact normalisées destinées à constituer le bornier de connexion de la carte et à être connectées aux plots de sortie de la puce.To overcome the aforementioned drawback, the invention provides a method of manufacturing a smart card using a laser engraving step. To this end, the invention uses a continuous electrically conductive substrate and produces, by laser engraving, a pattern integrating the standardized contact pads intended to constitute the connection terminal block of the card and to be connected to the output pads of the chip.
Un avantage du procédé de l'invention est de permettre de s'affranchir de l'usage d'un film support, ou d'un cadre conducteur assurant la cohésion des plages de contact après pré-découpe de celles-ci par poinçonnage sur un ruban métallique comme dans l'état de la technique.An advantage of the method of the invention is to make it possible to dispense with the use of a support film, or of a conductive frame ensuring the cohesion of the contact pads after pre-cutting thereof by punching on a metal tape as in the prior art.
Selon les différentes variantes, le motif pourra être plan ou tridimensionnel; la puce pourra être assemblée avant ou après cette gravure.According to the different variants, the pattern can be plan or three-dimensional; the chip can be assembled before or after this engraving.
L'invention a plus particulièrement pour objet un procédé de fabrication d'un dispositif électronique, tel qu'une carte à puce à contact affleurant, comportant au moins une puce dont les plots de sorties sont électriquement reliés à des plages de contact d'un bornier de connexion, caractérisé en ce que les plages de contact du bornier de connexion sont obtenues par gravure laser sur un substrat électriquement conducteur.The invention more particularly relates to a method of manufacturing an electronic device, such as a smart card with flush contact, comprising at least one chip whose output pads are electrically connected to contact pads of a connection terminal block, characterized in that the contact areas of the connection terminal block are obtained by laser engraving on an electrically conductive substrate.
L'invention a également pour objet une carte à puce à contact affleurant, comportant au moins une puce dont les plots de sorties sont électriquement reliés aux plages de contact d'un bornier de connexion, caractérisée en ce qu'elle est obtenue par - le procédé de fabrication de la présente invention.The invention also relates to a smart card with flush contact, comprising at least one chip, the output pads of which are electrically connected to the contact pads of a connection terminal block, characterized in that it is obtained by - the manufacturing method of the present invention.
L'opération de gravure au laser permet d'obtenir plus facilement une grande résolution pour un motif tridimensionnel en comparaison avec un procédé de découpe mécanique d'une grille (estampage) ou un procédé d'impression.The laser engraving operation makes it easier to obtain a high resolution for a three-dimensional pattern in comparison with a mechanical grid cutting process (stamping) or a printing process.
Le procédé selon l'invention présente en outre l'avantage d'être rapide et peu coûteux. En effet, l'opération de gravure peut être spécifique pour chaque type de puce sans temps de réglage ni de surcoût lié à un outillage particulier. De plus, les opérations en amont de la gravure se trouvent grandement simplifiées par l'utilisation d'un support plein.The method according to the invention also has the advantage of being rapid and inexpensive. Indeed, the etching operation can be specific for each type of chip without adjustment time or additional cost linked to a particular tool. In addition, the operations upstream of the engraving are greatly simplified by the use of a solid support.
Ces avantages, ainsi que d'autres particularités de l'invention, apparaîtront plus clairement à la lecture de la description qui suit donnée à titre d'exemple illustratif et non limitatif, en faisant référence aux figures annexées dans lesquelles :These advantages, as well as other particularities of the invention, will appear more clearly on reading the following description given by way of illustrative and nonlimiting example, with reference to the appended figures in which:
- les figures 1A à 1D illustrent schématiquement les étapes de fabrication d'une carte à puce selon une première variante du procédé selon l'invention ;- Figures 1A to 1D schematically illustrate the steps of manufacturing a smart card according to a first variant of the method according to the invention;
- la figure Ibis illustre la réalisation de mires dans le micromodule pour faciliter son indexation.- Figure Ibis illustrates the creation of test patterns in the micromodule to facilitate its indexing.
- la figure 2 est un schéma en coupe du report d'un puce sur un ruban métallique selon un procédé connu de type "flip chip"; - la figure 3 est un schéma en coupe du report d'un puce sur un ruban métallique selon un procédé connu de report de puce non retournée ;- Figure 2 is a sectional diagram of the transfer of a chip on a metal strip according to a known process of the "flip chip"type; - Figure 3 is a sectional diagram of the transfer of a chip on a metal strip according to a known method of transfer of unreturned chip;
- les figures 4A à 4G illustrent schématiquement les étapes de fabrication d'une carte à puce selon une deuxième variante du procédé selon l'invention ;- Figures 4A to 4G schematically illustrate the steps for manufacturing a smart card according to a second variant of the method according to the invention;
- les figures 5A à 5C illustrent schématiquement les étapes de fabrication d'une carte à puce selon une quatrième variante du procédé selon l'invention ; - les figures 6A à 6G illustrent schématiquement les étapes de fabrication d'une carte à puce selon une cinquième variante du procédé selon l'invention ;- Figures 5A to 5C schematically illustrate the steps for manufacturing a smart card according to a fourth variant of the method according to the invention; - Figures 6A to 6G schematically illustrate the steps of manufacturing a smart card according to a fifth variant of the method according to the invention;
- la figure 7 est une vue de dessus des pistes de liaison et des plages de contact de la carte à puce selon la cinquième variante du procédé selon 1' invention.- Figure 7 is a top view of the connecting tracks and contact areas of the chip card according to the fifth variant of the method according to the invention.
Les figures 1A à 1D schématisent les principales étapes du procédé de fabrication d'une carte à puce utilisant une étape de gravure au laser.FIGS. 1A to 1D schematize the main steps of the method for manufacturing a smart card using a laser engraving step.
Dans un premier temps, figure 1A, la puce 100 est reportée sur un substrat électriquement conducteur. Préférentiellement , ce substrat est constitué par un ruban métallique 102 continu. Ce report et la connexion électrique de la puce 100 sur le ruban métallique 102 peut se faire indifféremment selon l'un quelconque des procédés connus de type "flip chip" ou de report de puce non retournée.Firstly, in FIG. 1A, the chip 100 is transferred onto an electrically conductive substrate. Preferably, this substrate consists of a continuous metallic strip 102. This transfer and the electrical connection of the chip 100 on the metal strip 102 can be done either by any of the known methods of the “flip chip” type or by transfer of non-returned chip.
Les figures 2 et 3 illustrent ces deux procédés différents de report d'une puce sur un ruban métallique.Figures 2 and 3 illustrate these two different methods of transferring a chip onto a metal strip.
La première méthode de montage consiste à reporter la puce selon un montage de type "flip chip". Ce type de montage est déjà bien connu et il est représenté en coupe sur la figure 2.The first mounting method consists in transferring the chip according to a “flip chip” type of mounting. This guy mounting is already well known and is shown in section in Figure 2.
Dans l'exemple illustré, la puce 100 est connectée au ruban métallique 102 au moyen d'une colle 350 à conduction électrique anisotrope bien connue et souvent utilisée pour le montage de composants passifs sur une surface. Cette colle maintient l'ensemble de la face active de la puce, plots de sortie 120 compris, sur le ruban métallique 102. Cette colle 350 contient en fait des particules conductrices élastique ent défor ables qui permettent d'établir une conduction électrique suivant l'axe z (c'est à dire suivant l'épaisseur) lorsqu'elles sont pressées entre les plots de sortie 120 et le ruban métallique 102, tout en assurant une isolation suivant les autres directions (x,y).In the example illustrated, the chip 100 is connected to the metal strip 102 by means of an adhesive 350 with anisotropic electrical conduction well known and often used for mounting passive components on a surface. This adhesive holds the whole of the active face of the chip, including output pads 120, on the metal strip 102. This adhesive 350 actually contains conductive particles which are deformable which make it possible to establish an electrical conduction according to the z axis (that is to say along the thickness) when they are pressed between the output pads 120 and the metal strip 102, while ensuring insulation in the other directions (x, y).
Dans une variante de réalisation, la connexion électrique entre la puce 100 et le ruban métallique 102 peut être établie en réalisant, sur les plots de sortie 120 de la puce 100, des bossages en alliage thermofusible de type Sn/Pb ou en polymère conducteur, destinés à améliorer le contact électrique et activés à chaud lors du ' report du puce 100 sur le ruban métallique 102. Selon une variante de réalisation, la connexion électrique peut également être établie au moyen de protubérances formées par un adhésif conducteur, préalablement déposé sur les plots de sortie 120 de la puce et réactivés à chaud lors du report du puce 100 sur le ruban métallique 102.In an alternative embodiment, the electrical connection between the chip 100 and the metal strip 102 can be established by producing, on the output pads 120 of the chip 100, bosses of hot-melt alloy of Sn / Pb type or of conductive polymer, to improve electrical contact and activated when hot to 'report the chip 100 on the metal strip 102. in one embodiment, the electrical connection can also be established by means of protrusions formed by a conductive adhesive, previously deposited on the output pads 120 of the chip and hot reactivated when the chip 100 is transferred onto the metal strip 102.
Selon un mode de réalisation préférentiel, le micromodule 110 est reporté dans la cavité 108 du corps de carte 106 par un procédé de "flip chip" en utilisant une goutte de colle électriquement conductrice 350 qui maintient l'ensemble de la face active de la puce, plots de sortie 120 compris, sur le ruban métallique 102.According to a preferred embodiment, the micromodule 110 is transferred into the cavity 108 of the card body 106 by a "flip chip" process using a drop of electrically conductive glue 350 which holds the whole of the active face of the chip , 120 output pads included, on the metal strip 102.
La deuxième méthode pour effectuer le report de la puce est représentée en coupe sur la figure 3 , et consiste à coller la puce à l'endroit avec sa face active orientée vers le haut.The second method for carrying out the chip transfer is shown in section in FIG. 3, and consists in gluing the chip in place with its active face facing upwards.
Dans ce cas la puce 100 est collée sur le ruban métallique 102 par la face opposée à la face active avec une colle isolante 500. Cette colle peut être, par exemple, un adhésif réticulant sous l'effet d'une exposition à un rayonnement ultra-violet. Dans une seconde étape, on réalise la connexion électrique entre les plots de sortie 120 de la puce 100 et le ruban métallique 102. Cette connexion peut être effectuée par dispense d'une résine conductrice 400 sur les plots de sortie 120 de la puce et le ruban métallique 102. Cette résine conductrice 400 peut être, par exemple, une colle polymérisable chargée en particules conductrices.In this case, the chip 100 is bonded to the metal strip 102 by the face opposite to the active face with an insulating adhesive 500. This adhesive can be, for example, a crosslinking adhesive under the effect of exposure to ultra radiation. -purple. In a second step, the electrical connection is made between the output pads 120 of the chip 100 and the metal strip 102. This connection can be made by dispensing a conductive resin 400 on the output pads 120 of the chip and the metallic tape 102. This conductive resin 400 can be, for example, a polymerizable adhesive loaded with conductive particles.
Dans une variante de cette méthode, la connexion électrique peut également être effectuée par un câblage filaire traditionnel de type "bail bonding" ou "wedge bonding" qui relie les plots 120 de la puce 100 au ruban métallique 102.In a variant of this method, the electrical connection can also be carried out by traditional wired cabling of the "bail bonding" or "wedge bonding" type which connects the pads 120 of the chip 100 to the metal strip 102.
La deuxième étape du procédé de fabrication selon l'invention, figure 1B, peut consister à protéger la puce 100 par enrobage avec une résine de protection 104 de très faible viscosité, ou par lamination d'un film adhésif sur la puce 100 et le ruban métallique 102. Si on utilise une résine de protection 104, elle doit être choisie pour être compatible avec les différentes colles ou résines utilisées lors du report du puce 100 sur le ruban métallique 102.The second step of the manufacturing process according to the invention, FIG. 1B, can consist in protecting the chip 100 by coating with a protective resin 104 of very low viscosity, or by laminating an adhesive film on the chip 100 and the tape metallic 102. If a protective resin 104 is used, it must be chosen to be compatible with the various adhesives or resins used during the transfer of the chip 100 onto the metallic tape 102.
Cette étape de protection est optionnelle lorsqu'on reporte la puce 100 sur le ruban métallique 102 selon un procédé de type "flip chip" ou selon un procédé de report de puce non retournée avec dispense de résine conductrice. Dans ce cas, la résine devra remplir l'espace restant entre la puce et le substrat suivant un procédé connu dit de "sous-remplissage" ("underfill" en anglais) . Cette étape est cependant recommandée dans le cas d'un report avec câblage filaire afin de protéger les contacts entre les plots de sortie de la puce et le ruban métallique. La troisième étape du procédé selon l'invention, figure 1C, consiste à découper un micromodule 110 et à le reporter dans une cavité 108 ménagée dans un corps de carte 106. Le micromodule 110 est constitué du puce 100 reporté sur le ruban métallique 102, et préférentiellement protégé par la résine 104. La découpe est effectuée par des moyens classiques aux dimensions de la cavité 108This protection step is optional when the chip 100 is transferred onto the metal strip 102 according to a “flip chip” type process or according to a non-returned chip transfer method with dispensing of conductive resin. In this case, the resin will have to fill the space remaining between the chip and the substrate according to a known process known as "underfill"("underfill" in English). This step is however recommended in the case of a transfer with wired wiring in order to protect the contacts between the output pads of the chip and the metal tape. The third step of the method according to the invention, FIG. 1C, consists in cutting a micromodule 110 and transferring it into a cavity 108 formed in a card body 106. The micromodule 110 consists of the chip 100 transferred onto the metal strip 102, and preferably protected by resin 104. Cutting is carried out by conventional means to the dimensions of the cavity 108
Comme illustré sur la figure Ibis, l'outil de découpe peut également réaliser des mires 91, 92 dans le ruban métallique 102 afin de faciliter l'indexation lors de l'étape de gravure au laser des plages de contact. Les mires 91, 92 sont des repères, comme des perforations par exemple, placés sur un film support, comme un ruban métallique, et qui sont repérables par un système de vision assistée par ordinateur, VAO.As illustrated in FIG. Ibis, the cutting tool can also produce test patterns 91, 92 in the metal strip 102 in order to facilitate indexing during the laser engraving step of the contact pads. The test patterns 91, 92 are markers, such as perforations for example, placed on a support film, such as a metallic tape, and which can be identified by a computer-aided vision system, VAO.
Le corps de carte 106 est obtenu selon un procédé classique de fabrication, par exemple par injection de matière plastique dans un moule, puis décoré par impression ou par collage d'étiquettes préimprimées. La cavité est pratiquée soit par fraisage, soit par moulage lors de l'injection de la carte. Elle peut indifféremment présenter une forme circulaire, rectangulaire, losange ou octogonale, ete, avec des parois inclinées, verticales ou usinées. Le micromodule 110 est reporté dans la cavité 108 du corps de carte 106, ruban métallique 102 vers le haut. Selon un mode de réalisation, le report peut être effectué par collage avec une colle de type cyanoacrylate ou bien avec un adhésif thermoactivable. Après report, le ruban métallique 102 se retrouve au même plan que le dessus du corps de carte 106 de manière à former une surface plane.The card body 106 is obtained according to a conventional manufacturing process, for example by injecting plastic material into a mold, then decorated by printing or by gluing pre-printed labels. The cavity is made either by milling or by molding during the injection of the card. It can either have a circular, rectangular, diamond or octagonal shape, summer, with inclined, vertical or machined walls. The micromodule 110 is transferred into the cavity 108 of the card body 106, metal strip 102 upwards. According to one embodiment, the transfer can be carried out by bonding with an adhesive of the cyanoacrylate type or else with a heat-activated adhesive. After transfer, the metal strip 102 is found in the same plane as the top of the card body 106 so as to form a flat surface.
Enfin, la figure 1D illustre l'étape de gravure au laser qui permet de former le bornier de connexion du micromodule 110. En effet, les plots 120 de la puce 100 ont été connectés sur un ruban métallique continu 102. Des entailles 115 dans le ruban métallique 102 sont donc nécessaires pour établir les plages de contact normalisées du bornier de connexion reliées aux plots de sortie 120 de. la puce 100.Finally, FIG. 1D illustrates the laser engraving step which makes it possible to form the connection terminal block of the micromodule 110. In fact, the studs 120 of the chip 100 were connected on a continuous metallic strip 102. Notches 115 in the metallic tape 102 is therefore necessary to establish the standardized contact pads of the connection terminal block connected to the output pads 120 of. chip 100.
Afin de positionner correctement la gravure 115, on doit préalablement mémoriser le positionnement en x et en y des contours de la puce 100 par rapport aux bords du micromodule découpé 110. Pour cela, on peut utiliser, par exemple, un dispositif de vision assistée par ordinateur (VAO) . L'ordinateur repère la position de la puce 100 par rapport au contours du micromodule 110 grâce aux mires 91, 92 réalisées dans le ruban métallique 102 lors de l'étape de découpe du micromodule. La position des plots de sortie 120 de la puce 100 par rapport au contour du micromodule 110 étant ainsi connue, les trajectoires nécessaire à la réalisation des plages de contact normalisées du bornier de connexion de la carte 106 peuvent être tracées .In order to correctly position the etching 115, the positioning in x and in y of the contours of the chip 100 relative to the edges of the cut micromodule 110 must first be memorized. For this, it is possible to use, for example, a device for vision assisted by computer (VAO). The computer identifies the position of the chip 100 with respect to the contours of the micromodule 110 using the test patterns 91, 92 produced in the metal strip 102 during the step of cutting the micromodule. The position of the output pads 120 of the chip 100 relative to the outline of the micromodule 110 being thus known, the trajectories necessary for producing the standardized contact pads of the connection terminal block of the card 106 can be traced.
L'étape de gravure au laser permet donc de créer les plages de contact du bornier de connexion. L'étape de gravure du bornier venant en fin de manipulation, les opérations en amont sont grandement facilitées par l'utilisation d'un support plein. En particulier, l'étape de report de la puce 100 sur le ruban métallique 102 est grandement simplifiée puisque aucune piste de connexion n'existe encore, et cette étape peut donc être réalisée par un équipement de report standard ne nécessitant pas une grande précision. Le procédé de fabrication selon l'invention présente des variantes de réalisation.The laser engraving step therefore makes it possible to create the contact pads of the connection terminal block. The etching step of the terminal block coming at the end of manipulation, the upstream operations are greatly facilitated by the use of a solid support. In particular, the step of transferring the chip 100 to the metal strip 102 is greatly simplified since no connection track yet exists, and this step can therefore be carried out by standard transfer equipment which does not require high precision. The manufacturing method according to the invention presents alternative embodiments.
Les figures 4A à 4G illustrent schématiquement les principales étapes d'un second mode de réalisation du procédé de fabrication d'une carte à puce utilisant une étape de gravure au laser.FIGS. 4A to 4G schematically illustrate the main steps of a second embodiment of the method for manufacturing a smart card using a step of laser engraving.
Comme illustré sur les figures 4A à 4C. cette variante implique une étape de découpage d'une fenêtre 135 dans un ruban d'adhésif thermoactivable 130 aux dimensions de la puce 100, suivi d'une étape de fixation du ruban d'adhésif thermoactivable 130 sur un ruban métallique continu 102. Cette fixation peut être effectuée par lamination du ruban d'adhésif 130 sur le ruban métallique 102, ou par collage à froid des rubans l'un sur l'autre. La puce 100 est ensuite reportée dans la fenêtre 135 du ruban d'adhésif thermoactivable 130 de manière à avoir sa face active en contact avec le ruban métallique continu 102. Le report peut être effectué indifféremment selon l'une quelconque des méthodes décrites précédemment de "flip chip" ou de report de puce non retournée. De la même manière que précédemment décrite, la puce 100 est optionnellement protégée par enrobage avec une résine de protection 104 de très faible viscosité, ou par lamination d'un film adhésif sur la puce 100 et les rubans adhésif 130 et métallique 102.As illustrated in Figures 4A to 4C. this variant involves a step of cutting a window 135 from a strip of heat-activated adhesive 130 to the dimensions of the chip 100, followed by a step of fixing the strip of heat-activated adhesive 130 to a continuous metal strip 102. This fixing can be carried out by laminating the adhesive tape 130 on the metal tape 102, or by cold gluing the tapes to one another. The chip 100 is then transferred to the window 135 of the heat-activatable adhesive tape 130 so as to have its active face in contact with the continuous metallic tape 102. The transfer can be carried out either according to any of the methods described above of " flip chip "or carry over unreturned chip. In the same manner as previously described, the chip 100 is optionally protected by coating with a protective resin 104 of very low viscosity, or by lamination of an adhesive film on the chip 100 and the adhesive tapes 130 and metallic 102.
L'étape suivante, figure 4F, consiste à découper le micromodule 110 et à le reporter, ruban métallique 102 vers le haut, dans une cavité 108 ménagée dans le corps de carte 106. Le ruban d'adhésif thermoactivable 130 est tourné vers le fond de la cavité 108. On peut donc utiliser cet adhésif thermoactivable 130 pour fixer le micromodule 110 dans la cavité 108. Enfin, une étape de gravure au laser, illustrée sur la figure 4G, vient former les plages de contact normalisées du bornier de connexion selon le même procédé que celui décrit précédemment.The next step, FIG. 4F, consists in cutting the micromodule 110 and transferring it, metal strip 102 upwards, in a cavity 108 formed in the card body 106. The strip of heat-activated adhesive 130 is turned towards the bottom. of the cavity 108. It is therefore possible to use this heat-activated adhesive 130 to fix the micromodule 110 in the cavity 108. Finally, a laser etching step, illustrated in FIG. 4G, forms the standardized contact pads of the connection terminal according to the same process as that described above.
La présence du ruban d'adhésif thermoactivable 130 simplifie l'opération de report du micromodule 110 dans la cavité 108 du corps de carte 106. De plus, le ruban thermoactivable 130 présente les caractéristiques d'un diélectrique, ce qui permet de mieux isoler la puce 100. Une troisième variante du procédé de fabrication selon l'invention est très proche de la précédente en ce qu'elle comprend les mêmes étapes de découpe d'une fenêtre 135 dans un ruban d'adhésif thermoactivable 130; de fixation de l'adhésif thermoactivable sur un ruban métallique continu 102; de report du puce 100 sur le ruban métallique 102 à l'intérieur de la fenêtre 135 et de protection du puce 100.The presence of the heat-activated adhesive tape 130 simplifies the operation of transferring the micromodule 110 into the cavity 108 of the card body 106. In addition, the heat-activated tape 130 has the characteristics of a dielectric, which makes it possible to better isolate the puce 100. A third variant of the manufacturing method according to the invention is very close to the previous one in that it comprises the same steps of cutting a window 135 in a strip of heat-activated adhesive 130; fixing the heat-activatable adhesive to a continuous metal strip 102; for transferring the chip 100 to the metal strip 102 inside the window 135 and for protecting the chip 100.
La différence entre cette variante et la précédente réside dans l'inversion des étapes de gravure et de report du micromodule 110 dans la cavité 108 du corps de carte 106. En effet, la gravure au laser du bornier de connexion est effectuée sur le ruban métallique 102 avant le report du micromodule 110 dans la cavité 108. L'avantage d'une gravure à cette étape est de pouvoir augmenter la cadence de l'opération dans le déroulement du ruban métallique. En effet, plusieurs micromodules 110 peuvent être gravés avec une même indexation. De plus, un masque intégrant le motif du bornier peut également être apposé sur le ruban métallique continu 102. Dans ce cas, le faisceau laser est moins focalisé et permet d'insoler toute la surface couverte par le masque. Selon une variante intéressante, un même masque présentant un motif répétitif peut couvrir plusieurs espaces du ruban métallique 102 destinés à la formation de plusieurs micromodules 110.The difference between this variant and the previous one lies in the inversion of the etching and transfer steps of the micromodule 110 in the cavity 108 of the card body 106. In fact, the laser etching of the connection terminal block is carried out on the metal tape 102 before the transfer of the micromodule 110 into the cavity 108. The advantage of an engraving at this stage is to be able to increase the rate of the operation in the unwinding of the metal strip. Indeed, several micromodules 110 can be engraved with the same indexing. In addition, a mask incorporating the pattern of the terminal block can also be affixed to the continuous metal strip 102. In this case, the laser beam is less focused and makes it possible to expose the entire surface covered by the mask. According to an advantageous variant, the same mask having a repeating pattern can cover several spaces of the metallic strip 102 intended for the formation of several micromodules 110.
La découpe est ensuite effectuée comme précédemment et le ou les micromodule (s) 110 sont reporté (s) dans la ou les cavité (s) 108 des corps de carte 106. Le bornier de connexion ayant été préalablement gravé, le report du micromodule 110 est légèrement plus délicat que dans les variantes précédentes car il nécessite plus de précision.The cutting is then carried out as previously and the micromodule (s) 110 are transferred (s) into the cavity (s) 108 of the card bodies 106. The connection terminal having been previously etched, the transfer of the micromodule 110 is slightly more delicate than in the previous variants because it requires more precision.
La fixation du micromodule 110 se fait, comme précédemment, par chauffage de l'adhésif thermoactivable 130.The micromodule 110 is fixed, as before, by heating the thermo-activatable adhesive 130.
Les figures 5A à 5C illustrent schématiquement une quatrième variante du procédé de fabrication d'une carte à puce utilisant une étape de gravure au laser.FIGS. 5A to 5C schematically illustrate a fourth variant of the method for manufacturing a smart card using a laser engraving step.
Selon ce quatrième mode de réalisation, après avoir reporté la puce 100 sur le ruban métallique continu 102 selon l'une quelconque des méthodes déjà exposées, et après avoir, le cas échéant, protégé la puce 100 par enrobage avec une résine 104 ou par lamination d'un film adhésif, le micromodule 110 est de préférence mis en forme de façon à créer des zones d'ancrage 140. Le micromodule 110 est ensuite positionné dans un moule pour être surmoulé d'un matériau thermoplastique de façon à former le corps de carte 106. Un tel procédé de surmoulage est bien connu de l'homme de l'art.According to this fourth embodiment, after having transferred the chip 100 onto the continuous metal strip 102 according to any of the methods already described, and after having, if necessary, protected the chip 100 by coating with a resin 104 or by lamination of an adhesive film, the micromodule 110 is preferably shaped so as to create anchoring zones 140. The micromodule 110 is then positioned in a mold to be overmolded with a thermoplastic material so as to form the card body 106. Such an overmolding process is well known to those skilled in the art.
Les zones d'ancrage 140 permettent la fixation mécanique du micromodule 110 dans le corps de carte 106 lors du surmoulage dans le matériau ther oplastique.The anchoring zones 140 allow the mechanical fixing of the micromodule 110 in the card body 106 during overmolding in ther oplastic material.
Dans cette variante, le micromodule 110 n'est pas reporté dans la cavité 108 d'un corps de carte 106, mais directement moulé dans le corps de carte avec le ruban métallique 102 affleurant la surface de la carte. Le micromodule 110 est ensuite gravé avec un faisceau laser de façon à former les plages de contact normalisées du bornier de connexion comme cela a précédemment été décrit. Cette variante présente l'avantage de réaliser, en une seule opération, le corps de carte 106, le report du micromodule 110 dans ce dernier et la décoration du corps de carte. En effet, des étiquettes préimprimées peuvent en outre être positionnées et moulées dans le moule en même temps que le micromodule. On peut cependant également réaliser une impression du corps de carte après moulage avec le micromodule déjà intégré dans le corps de carte.In this variant, the micromodule 110 is not transferred into the cavity 108 of a card body 106, but directly molded into the card body with the metal strip 102 flush with the surface of the card. The micromodule 110 is then etched with a laser beam so as to form the standardized contact pads of the connection terminal block as previously described. This variant has the advantage of producing, in a single operation, the card body 106, the transfer of the micromodule 110 therein and the decoration of the card body. Indeed, pre-printed labels can also be positioned and molded in the mold at the same time as the micromodule. However, it is also possible to produce an impression of the card body after molding with the micromodule already integrated in the card body.
Les figures 6A à 6G illustrent schématiquement une cinquième variante du procédé de fabrication d'une carte à puce utilisant une étape de gravure au laser.FIGS. 6A to 6G schematically illustrate a fifth variant of the method for manufacturing a smart card using a laser engraving step.
Selon ce cinquième mode de réalisation, un corps de carte 106 présentant une cavité 108 avec des bords inclinés est utilisé comme illustré sur la figure 6A. Cette cavité 108 a été réalisée en même temps que le moulage du corps de carte 106, ou par usinage dans un corps de carte préalablement obtenu par injection, par exemple. Les parois de la cavité 108 sont délimitée par deux plans. Le premier plan 160 défini le fond de la cavité 108 et le second plan 165 défini l'extrémité des parois inclinées.According to this fifth embodiment, a card body 106 having a cavity 108 with inclined edges is used as illustrated in FIG. 6A. This cavity 108 was produced at the same time as the molding of the card body 106, or by machining in a card body previously obtained by injection, for example. The walls of the cavity 108 are delimited by two planes. The foreground 160 defines the bottom of the cavity 108 and the second plane 165 defines the end of the inclined walls.
D'autre part, figure 6B à 6D, un ruban d'adhésif thermoactivable 130 est fixé par lamination ou par collage sur un ruban métallique continu 102, puis découpé pour former un module 150. Ce module 150 est en outre mis en f'orme pour adopter la même géométrie tridimensionnelle que la cavité 108 du corps de carte 106, puis reporté dans la cavité 108 en utilisant l'adhésif thermoactivable 130 pour sa fixation. On peut noter à ce point que la mise en forme du module 150 peut être effectuée soit en même temps que sa découpe, soit en même temps que le report de ce dernier dans la cavité 108 par pressaqe à chaud. L'étape suivante, figure 6E, consiste à graver, dans le ruban métallique 102, les pistes de liaison 170 au fond de la cavité 108 et se prolongeant sur ses parois; ainsi que les plages de contact 180 du bornier de connexion autour de la cavité 108 et affleurant la surface du corps de carte 106. Les pistes de liaison 170 permettent d'assurer la connexion électrique entre les plots de sortie 120 de la puce 100 et les plages de contact 180 du bornier de connexion.On the other hand, FIG. 6B to 6D, a strip of heat-activatable adhesive 130 is fixed by lamination or by gluing on a continuous metallic strip 102, then cut to form a module 150. This module 150 is furthermore shaped to adopt the same three-dimensional geometry as the cavity 108 of the card body 106, then transferred to the cavity 108 using the heat-activatable adhesive 130 for fixing it. It can be noted at this point that the shaping of the module 150 can be carried out either at the same time as its cutting, or at the same time as the transfer of the latter into the cavity 108 by hot pressing. The next step, FIG. 6E, consists in etching, in the metallic strip 102, the connecting tracks 170 at the bottom of the cavity 108 and extending on its walls; as well as the contact pads 180 of the connection terminal block around the cavity 108 and flush with the surface of the card body 106. The connection tracks 170 make it possible to provide the electrical connection between the output pads 120 of the chip 100 and the contact pads 180 of the connection terminal block.
La puce 100 est ensuite reportée, figure 6F, sur le ruban métallique 102 selon l'un quelconque des procédés décrits de type "flip chip" ou de report de puce non retournée et correctement positionnée par rapport aux pistes de liaison 170 déjà gravées.The chip 100 is then transferred, FIG. 6F, onto the metal strip 102 according to any of the methods described of the “flip chip” type or of transfer of non-returned and correctly positioned chip relative to the bonding tracks 170 already engraved.
La figure 7 représente une vue de dessus du report de la puce 100 selon un procédé de type "flip chip" et fait nettement apparaître les pistes de liaison 170 dans le fond et sur les parois de la cavité 108, ainsi que les plages de contact 180 du bornier de connexion affleurant la surface du corps de carte 106. Enfin, comme illustré sur la figure 6G, une goutte de résine isolante 200 est dispensée pour remplir la cavité 108 afin de protéger la puce 100 et ses connexions aux pistes de liaison 170. On utilise préférentiellement une résine à réticulation UV à cette fin.FIG. 7 represents a top view of the transfer of the chip 100 according to a “flip chip” type method and clearly shows the connecting tracks 170 in the bottom and on the walls of the cavity 108, as well as the contact pads 180 of the connection terminal flush with the surface of the card body 106. Finally, as illustrated in FIG. 6G, a drop of insulating resin 200 is dispensed to fill the cavity 108 in order to protect the chip 100 and its connections to the connecting tracks 170. A UV crosslinking resin is preferably used for this purpose.
Ce mode de réalisation avec gravure au laser des pistes de liaison 170 dans la cavité 108 du corps de carte 106 et des plages de contact 180 du bornier, avant le report de la puce 100, permet d'obtenir facilement une grande résolution avec un motif tridimensionnel, en comparaison avec les procédés classiques de découpe mécanique d'une grille ou d'impression à l'encre conductrice. Une autre variante du procédé de fabrication d'une carte à puce selon l'invention consiste à utiliser un film diélectrique métallisé comme substrat électriquement conducteur continu en lieu et place du ruban métallique décrit précédemment. On peut par exemple, utiliser un polyester, un polyéthylène ou un polypropylène recouvert d'une fine couche de quelques microns de nickel déposée par évaporation sous vide. L'avantage de cette variante est la réduction du coût associée à cette substitution. En effet, le film diélectrique métallisé est fin et souple et la fine couche de métal de quelques microns se grave beaucoup plus facilement que le ruban métallique pouvant atteindre 35 à 65 microns d'épaisseur.This embodiment with laser engraving of the connection tracks 170 in the cavity 108 of the card body 106 and of the contact pads 180 of the terminal block, before the transfer of the chip 100, makes it possible to easily obtain a high resolution with a pattern. three-dimensional, in comparison with conventional methods of mechanically cutting a grid or printing with conductive ink. Another variant of the method for manufacturing a smart card according to the invention consists in using a metallized dielectric film as an electrically conductive continuous substrate in place of the metal strip described above. One can for example use a polyester, a polyethylene or a polypropylene covered with a thin layer of a few microns of nickel deposited by vacuum evaporation. The advantage of this variant is the reduction in cost associated with this substitution. In fact, the metallized dielectric film is thin and flexible and the thin layer of metal of a few microns is etched much more easily than the metal strip which can reach 35 to 65 microns thick.
Néanmoins, cette variante peut présenter des inconvénients au moment de la découpe du micromodule ou lors de sa manipulation dus au manque de rigidité du film diélectrique métallisé. However, this variant can have drawbacks when cutting the micromodule or when handling it due to the lack of rigidity of the metallized dielectric film.

Claims

REVENDICATIONS
1. Procédé de fabrication d'un dispositif électronique, tel qu'une carte à puce à contact affleurant, comportant au moins une puce (100) dont les plots de sorties (120) sont électriquement reliés aux plages de contact d'un bornier de connexion, caractérisé er- ce qu'il comprend les étapes suivantes :1. Method for manufacturing an electronic device, such as a smart card with flush contact, comprising at least one chip (100), the output pads (120) of which are electrically connected to the contact pads of a terminal block connection, characterized in that it comprises the following stages:
- report de la puce (100) sur un ruban métallique continu (102) pour former un micromodule (110);- Transfer of the chip (100) on a continuous metal strip (102) to form a micromodule (110);
- découpe et report du micromodule (110) dans une cavité (108) ménagée dans un corps de carte (106) de telle sorte que le ruban métallique (102) affleure la surface de la carte; gravure des plages de contact sur le ruban métallique (102) pour former le bornier de connexion (115) .- Cutting and transfer of the micromodule (110) in a cavity (108) formed in a card body (106) so that the metal strip (102) is flush with the surface of the card; engraving of the contact pads on the metal strip (102) to form the connection terminal block (115).
2. Procédé de fabrication d'une carte à puce selon la revendication 1, caractérisé en ce que le report du micromodule (110) dans la cavité (108) du corps de carte (106) esc effectué par collage.2. Method of manufacturing a smart card according to claim 1, characterized in that the transfer of the micromodule (110) in the cavity (108) of the card body (106) esc effected by bonding.
3. Procédé de fabrication d'une carte à puce selon la revendication 1, caractérisé en ce la puce (100) est reportée sur un ruban métallique (102) fixé sur un ruban d'adhésif thermoactivable (130) dans lequel une fenêtre (130) a préalablement été découpée; le report du micromodule (110) dans la cavité (108) du corps de carte (106) étant effectué par chauffage de l'adhésif thermoactivable (130) . 3. Method of manufacturing a smart card according to claim 1, characterized in that the chip (100) is transferred onto a metal tape (102) fixed on a tape of heat-activated adhesive (130) in which a window (130 ) has been previously cut; the transfer of the micromodule (110) into the cavity (108) of the card body (106) being effected by heating the heat-activated adhesive (130).
4. Procédé de fabrication d'une carte à puce selon la revendication 3, caractérisé en ce que la fixation du ruban métallique continu (102) sur le ruban adhésif thermoactivable (130) est effectuée par lamination ou par collage.4. A method of manufacturing a smart card according to claim 3, characterized in that the fixing of the continuous metallic tape (102) on the heat-activated adhesive tape (130) is carried out by lamination or by bonding.
5. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications 1 à 4, caractérisé en ce que l'étape de gravure laser est effectuée avant la découpe et le report du micromodule (110) dans la cavité (108) du corps de carte (106) .5. A method of manufacturing a smart card according to any one of claims 1 to 4, characterized in that the laser engraving step is performed before cutting and transfer of the micromodule (110) into the cavity (108 ) of the card body (106).
6. Procédé de fabrication d'un dispositif électronique, tel qu'une carte à puce à contact affleurant, comportant au moins une puce (100) dont les plots de sorties (120) sont électriquement reliés aux plages de contact d'un bornier de connexion, caractérisé en ce qu'il comprend les étapes suivantes:6. Method of manufacturing an electronic device, such as a smart card with flush contact, comprising at least one chip (100) whose output pads (120) are electrically connected to the contact pads of a terminal block connection, characterized in that it comprises the following stages:
- report de la puce (100) sur un ruban métallique continu (102) pour former un micromodule (110);- Transfer of the chip (100) on a continuous metal strip (102) to form a micromodule (110);
- mise en forme du ruban (102) de façon à créer des zones d'ancrage (140) de part et d'autre de la puce (100) ;- shaping of the ribbon (102) so as to create anchoring zones (140) on either side of the chip (100);
- découpe et surmoulage du micromodule (110) dans un corps de carte (106) de telle sorte que le ruban métallique (102) affleure la surface de la carte,- gravure des plages de contact sur le ruban métallique (102) pour former le bornier de connexion (115) .- cutting and overmolding of the micromodule (110) in a card body (106) so that the metal strip (102) is flush with the surface of the card, - etching of the contact pads on the metal strip (102) to form the connection terminal block (115).
7. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comprend une étape de protection de la puce (100) après son report sur le ruban métallique (102) .7. A method of manufacturing a smart card according to any one of the preceding claims, characterized in that it comprises a step of protection of the chip (100) after its transfer to the metal strip (102).
8. Procédé de fabrication d'une carte à puce selon la revendication 7, caractérisé en ce que la protection de la puce (100) est assurée par enrobage avec une résine (104) ou par lamination d'un film adhésif.8. A method of manufacturing a smart card according to claim 7, characterized in that the protection of the chip (100) is ensured by coating with a resin (104) or by lamination of an adhesive film.
9. Procédé de fabrication d'un dispositif électronique, tel qu'une carte à puce à contact affleurant, comportant au moins une puce (100) dont les plots de sorties (120) sont électriquement reliés aux plages de contact d'un bornier de connexion, caractérisé en ce qu'il comprend les étapes suivantes : - fourniture d'un corps de carte comportant une cavité; fixation d'un ruban d'adhésif thermoactivable (130) sur un ruban métallique (102), -9. Method for manufacturing an electronic device, such as a smart card with flush contact, comprising at least one chip (100), the output pads (120) of which are electrically connected to the contact pads of a terminal block connection, characterized in that it comprises the following steps: - supply of a card body comprising a cavity; fixing a strip of heat-activated adhesive (130) to a metal strip (102), -
- découpe des rubans (102, 130) et mise en forme d'un module (150) de façon à adopter la forme géométrique de la cavité (108) du corps de carte (106) ;- Cutting the ribbons (102, 130) and shaping a module (150) so as to adopt the geometric shape of the cavity (108) of the card body (106);
- report du module (150) dans la cavité (108) ;- transfer of the module (150) into the cavity (108);
- gravure des pistes de liaison (170) et des plages de contact (180) du bornier de connexion affleurant la surface du corps de carte (106) , ledites pistes de liaison (170) étant situées dans le fond et sur les parois de la cavité (108) en épousant sa forme, et étant reliées aux plages de contact (180) du bornier;- engraving of the connection tracks (170) and of the contact pads (180) of the connection terminal flush with the surface of the card body (106), the said connection tracks (170) being located at the bottom and on the walls of the cavity (108) matching its shape, and being connected to the contact pads (180) of the terminal block;
- report de la puce (100) sur le ruban métallique (102) gravé de manière à connecter électriquement ses plots de sortie (120) aux pistes de liaison (170) ; - remplissage de la cavité (108) du corps de carte (106) par une résine isolante (200) .- Transfer of the chip (100) on the metal strip (102) engraved so as to electrically connect its output pads (120) to the connecting tracks (170); - filling the cavity (108) of the card body (106) with an insulating resin (200).
10. Procédé de fabrication d'une carte à puce selon la revendication 9, caractérisé en ce que la résine10. A method of manufacturing a smart card according to claim 9, characterized in that the resin
(200) est une résine à réticulation UV.(200) is a UV crosslinking resin.
11. Procédé de fabrication d'une carte à puce selon la revendication 9, caractérisé en ce que la fixation du ruban d'adhésif thermoactivable (130) sur le ruban métallique (102) est effectuée par lamination ou par collage .11. A method of manufacturing a smart card according to claim 9, characterized in that the fixing of the tape of heat-activated adhesive (130) on the metal tape (102) is carried out by lamination or by bonding.
12. Procédé de fabrication d'une carte à puce selon la revendication 9, caractérisé en ce que le report du module (150) dans la cavité (108) du corps de carte (106) est effectué par chauffage de l'adhésif thermoactivable (130) .12. A method of manufacturing a smart card according to claim 9, characterized in that the transfer of the module (150) in the cavity (108) of the card body (106) is carried out by heating the heat-activated adhesive ( 130).
13. Procédé de fabrication d'une carte à puce selon les revendications 1 à 8, caractérisé en ce que la gravure au laser des plages de contact du bornier de connexion (115) est réalisée sur un substrat plan.13. A method of manufacturing a smart card according to claims 1 to 8, characterized in that the laser etching of the contact pads of the connection terminal block (115) is carried out on a flat substrate.
15. Procédé de fabrication d'une carte à puce selon les revendications 11 à 14, caractérisé la gravure au laser des pistes de liaison (170) et des plages de contact du bornier de connexion (180) est réalisée en trois dimensions sur un substrat préformé.15. A method of manufacturing a smart card according to claims 11 to 14, characterized by laser engraving of the connection tracks (170) and of the contact pads of the connection terminal block (180) is carried out in three dimensions on a substrate. preformed.
16. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications précédentes, caractérisé en ce que le ruban métallique (102) est remplacé par un film diélectrique métallisé. 16. A method of manufacturing a smart card according to any one of the preceding claims, characterized in that the metal strip (102) is replaced by a metallized dielectric film.
17. Procédé de fabrication d'une carte à puce selon la revendication 15, caractérisé en ce que le film diélectrique est un film plastique de type polyester, polyéthylène, ou polypropylène .17. A method of manufacturing a smart card according to claim 15, characterized in that the dielectric film is a plastic film of polyester, polyethylene, or polypropylene type.
17. Procédé de fabrication d'une carte à puce selon la revendication 15, caractérisé en ce que la metallisation du film diélectrique est constituée d'une fine couche de nickel déposée par évaporation sous vide .17. A method of manufacturing a smart card according to claim 15, characterized in that the metallization of the dielectric film consists of a thin layer of nickel deposited by vacuum evaporation.
18. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que des mires (91, 92) sont utilisées pour indexer les plages de contact du bornier de connexion (115) , les mires (91, 92) étant réalisées au niveau de l'outil de découpe du micromodule (110) .18. Manufacturing method according to any one of the preceding claims, characterized in that test patterns (91, 92) are used to index the contact pads of the connection terminal block (115), the test patterns (91, 92) being produced at the micromodule cutting tool (110).
19. Carte à puce à contact affleurant, comportant au moins une puce (100) dont les plots de sorties (120) sont électriσuement reliés aux plages de contact d'un bornier de connexion (115), caractérisée en ce qu'elle est obtenue par un procédé de fabrication selon l'une quelconque des revendications précédentes. 19. Smart card with flush contact, comprising at least one chip (100) whose output pads (120) are electrically connected to the contact pads of a connection terminal block (115), characterized in that it is obtained by a manufacturing process according to any one of the preceding claims.
PCT/FR1999/002865 1998-11-24 1999-11-22 Method for making a flush chip card using a laser engraving step and resulting chip card WO2000031686A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU12784/00A AU1278400A (en) 1998-11-24 1999-11-22 Method for making a flush chip card using a laser engraving step and resulting chip card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9814802A FR2786317B1 (en) 1998-11-24 1998-11-24 METHOD FOR MANUFACTURING A FLUSHED CONTACT SMART CARD USING A LASER ENGRAVING STEP AND CHIP CARD OBTAINED BY THE PROCESS
FR98/14802 1998-11-24

Publications (1)

Publication Number Publication Date
WO2000031686A1 true WO2000031686A1 (en) 2000-06-02

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PCT/FR1999/002865 WO2000031686A1 (en) 1998-11-24 1999-11-22 Method for making a flush chip card using a laser engraving step and resulting chip card

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AU (1) AU1278400A (en)
FR (1) FR2786317B1 (en)
WO (1) WO2000031686A1 (en)

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EP1818851A1 (en) * 2006-02-09 2007-08-15 Axalto S.A. Portable object having a contact interface, and personalisation of contact interface
EP2073154A1 (en) 2007-12-20 2009-06-24 Gemalto SA Biometric micro-module
CN107195560A (en) * 2017-06-02 2017-09-22 深圳华创兆业科技股份有限公司 The laser package system and method for IC-card
US11191482B2 (en) 2006-01-10 2021-12-07 Accuvein, Inc. Scanned laser vein contrast enhancer imaging in an alternating frame mode

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EP2418609A1 (en) * 2010-07-23 2012-02-15 Gemalto SA Secure electronic module, device with secure electronic module and manufacturing method
CN113299561B (en) * 2021-05-21 2023-06-27 浙江集迈科微电子有限公司 Preparation method of cavity bottom glue overflow preventing structure

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EP0688051A1 (en) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Fabrication process and assembly of an integrated circuit card and such obtained card
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DE19502157A1 (en) * 1995-01-25 1996-08-01 Orga Kartensysteme Gmbh Electronic module carrier element for mfr. of smart cards
EP0753827A1 (en) * 1995-07-11 1997-01-15 Philips Cartes Et Systemes Method of producing and assembling chip cards and card obtained by this method
EP0791446A2 (en) * 1996-02-26 1997-08-27 HERBST, Richard Composite article, method and plastic injection mould for manufacturing the same
US5681491A (en) * 1992-08-23 1997-10-28 Gemplus Card International Chip card having information elements etched in a metal contact of a chip card connector

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US5681491A (en) * 1992-08-23 1997-10-28 Gemplus Card International Chip card having information elements etched in a metal contact of a chip card connector
EP0688050A1 (en) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Assembly method for integrated circuit card and such obtained card
EP0688051A1 (en) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Fabrication process and assembly of an integrated circuit card and such obtained card
DE4441052A1 (en) * 1994-11-18 1996-05-23 Orga Kartensysteme Gmbh Carrier element for electronic module for insertion into e.g. smart card
DE19502157A1 (en) * 1995-01-25 1996-08-01 Orga Kartensysteme Gmbh Electronic module carrier element for mfr. of smart cards
EP0753827A1 (en) * 1995-07-11 1997-01-15 Philips Cartes Et Systemes Method of producing and assembling chip cards and card obtained by this method
EP0791446A2 (en) * 1996-02-26 1997-08-27 HERBST, Richard Composite article, method and plastic injection mould for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11191482B2 (en) 2006-01-10 2021-12-07 Accuvein, Inc. Scanned laser vein contrast enhancer imaging in an alternating frame mode
EP1818851A1 (en) * 2006-02-09 2007-08-15 Axalto S.A. Portable object having a contact interface, and personalisation of contact interface
WO2007091158A1 (en) * 2006-02-09 2007-08-16 Axalto Sa Portable object having a contact interface, and coloration of contact interface
EP2073154A1 (en) 2007-12-20 2009-06-24 Gemalto SA Biometric micro-module
CN107195560A (en) * 2017-06-02 2017-09-22 深圳华创兆业科技股份有限公司 The laser package system and method for IC-card

Also Published As

Publication number Publication date
FR2786317A1 (en) 2000-05-26
FR2786317B1 (en) 2002-12-27
AU1278400A (en) 2000-06-13

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