EP0943397A2 - Poliervorrichtungsscheibe und Verfahren zum Aufkleben eines Polierkissens - Google Patents

Poliervorrichtungsscheibe und Verfahren zum Aufkleben eines Polierkissens Download PDF

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Publication number
EP0943397A2
EP0943397A2 EP19990103955 EP99103955A EP0943397A2 EP 0943397 A2 EP0943397 A2 EP 0943397A2 EP 19990103955 EP19990103955 EP 19990103955 EP 99103955 A EP99103955 A EP 99103955A EP 0943397 A2 EP0943397 A2 EP 0943397A2
Authority
EP
European Patent Office
Prior art keywords
pad
platen
adhesion
polishing
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19990103955
Other languages
English (en)
French (fr)
Inventor
Shunji Hakomori
Masafumi Ohnishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of EP0943397A2 publication Critical patent/EP0943397A2/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing

Definitions

  • the present invention relates to a platen of a polishing apparatus used for a polishing apparatus for polishing a wafer or other workpiece to a mirror surface and to a method of adhesion of a polishing pad.
  • a polishing apparatus presses a wafer or other workpiece on to a platen on which a polishing pad is adhered and makes the platen and workpiece rotate relative to each other so as to polish the workpiece to a mirror surface by the polishing pad.
  • acidic or alkaline slurry is used to chemically and mechanically polish the workpiece.
  • a weakly alkaline slurry is supplied on to a cast platen, the rotation of the platen will cause the slurry to flow to the peripheral surface of the platen, the peripheral surface will rust, and the workpiece will be scratched or contaminated by that rust.
  • the slurry when supplying an acidic slurry to a stainless steel platen, the slurry will react with the stainless steel and cause nickel etc. to dissolve out at the peripheral surface of the platen again causing contamination of the workpiece. Further, the nickel etc. may enter into the workpiece and cause the workpiece to become unusable.
  • the technique has been adopted of painting the surface of the platen or giving it a polytetrafluoroethylene on coating except at the surface where the polishing pad is to be adhered to prevent in advance any chemical reaction between the slurry and the platen at the time of the polishing work.
  • FIGS. 6A and 6B are cross-sectional views illustrating the method of adhesion of a polishing pad of the related art.
  • FIG. 6A shows the state of adhesion of an original sheet of a polishing pad to a platen
  • FIG. 6B shows the state of cutting the polishing pad along the shape of the platen.
  • reference numeral 1 indicates a platen.
  • the platen 1 is a platen used for a double side polishing apparatus and forms a donut shape as a whole.
  • a protective film 2 comprised of a paint or polytetrafluoroethylene coating.
  • the polishing pad 3 is cut while pressing the blade portion 40 of the cutter 4 against the pad adhesion surface 10 or upper outer edge 11 of the platen 1, so the protective film 2 may be scratched by the blade portion 40 of the cutter 4 and the platen 1 may become exposed.
  • cutting the polishing pad 3 requires considerable skill and time and a general worker finds it difficult to perform the adhesion and cutting work of the polishing pad 3 easily and in a short time.
  • An object of the present invention is to provide a platen of a polishing apparatus and a method of adhesion of a polishing pad which enables the adhesion of a polishing pad to a platen and the cutting of the same to be handled easily and in a short time even by an unskilled worker.
  • a disk-shaped or donut-shaped platen of a polishing apparatus having a polishing pad adhered to a pad adhesion surface of the platen comprising: a protective film covering surfaces of the platen other than the pad adhesion surface; and a protective ring having a pad abutting surface parallel with the pad adhesion surface and made of a material nonreactive with a slurry, the pad abutting surface being fit on a peripheral surface of the platen from the outside of the protective film so as to be substantially level with the pad adhesion surface.
  • the protective ring is formed by a synthetic resin.
  • the protective ring has to be made of a material which does not chemically react with the slurry. Any material may be used so long as it has this property.
  • the synthetic resin is a resin selected from the group consisting of a polytetrafluoroethylene, fluoroplastics, an epoxy resin, unsaturated polyester resin, melamine resin, polyvinyl chloride, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylate resin, and polyvinylidene chloride.
  • a slanted surface contiguous with the pad abutting surface of the protective ring and inclined outward by a predetermined angle is formed at the peripheral surface of the protective ring.
  • the invention may be grasped as a method of adhesion of a polishing pad using a protective ring.
  • a method of adhesion of a polishing pad comprising: a first step of fitting on a peripheral surface of a platen, covered with a protective film over its entire surface other than a pad adhesion surface, a protective ring having a pad abutting surface parallel with the pad adhesion surface and made of a material nonreactive with a slurry in a manner so that the pad abutting surface becomes level with the pad adhesion surface; a second step of adhering an original sheet of a polishing pad larger than the platen after the first step to the pad adhesion surface and the pad abutting surface; and a third step of cutting the polishing pad along the peripheral surface of the protective ring.
  • the protective ring at the first step has at its peripheral surface a slanted surface contiguous with the pad abutting surface of the protective ring and inclined outward by a predetermined angle and the third step is cutting the polishing pad along the slanted surface of the protective ring.
  • FIG. 1 is a perspective view of the state of the platen of a polishing apparatus according to an embodiment of the present invention without adhesion of a polishing pad; while FIG. 2 is a sectional view along a line A-A of FIG. 1. Note that members the same as those shown in FIGS. 6A and 6B are given the same reference numerals in the explanation.
  • the platen 1 is a large sized platen of for example an outer diameter of 2190 mm used for a double side polishing apparatus and is formed in a donut shape.
  • a protective film 2 is coated on the surface of the platen 1.
  • the outer peripheral surface 13, inner peripheral surface 14, and bottom surface of the platen 1 are coated completely by a protective film 2. Only the pad adhesion surface 10 is left exposed.
  • a large diameter protective ring 5 and small diameter protective ring 6 are fit over the outer peripheral surface 13 and inner peripheral surface 14 of the platen 1 covered by the protective film 2 in this way.
  • the protective rings 5 and 6 are both formed by Teflon (Du Pont's trade name, polytetrafluoroethylene, fluoroplastics), which is a material which will not react with the slurry.
  • Teflon Du Pont's trade name, polytetrafluoroethylene, fluoroplastics
  • the inside diameter of the protective ring 5 is set to be substantially equal to the diameter of the outer peripheral surface 13, while the outside diameter of the protective ring 6 is set to be substantially equal to the diameter of the inner peripheral surface 14 of the platen 1.
  • These protective rings 5 and 6 have pad abutting surfaces 50 and 60 parallel to the pad adhesion surface 10 of the platen 1. These pad abutting surfaces 50 and 60 are affixed to the platen 1 by screws 51 and 61 in a state positioned to be level with the pad adhesion surface 10.
  • outer peripheral surface side of the protective ring 5 and the inner peripheral surface side of the protective ring 6 are formed with slanted surfaces 52 and 62 which are respectively contiguous with the pad abutting surfaces 50 and 60 and incline outward by about 30°.
  • FIGS. 3A to 3C are views of the steps of the method of adhesion of a polishing pad to a platen 1.
  • a worker adheres an original sheet of the polishing pad 3 larger than the platen 1 on the pad adhesion surface 10 by an adhesive.
  • the worker cuts into the polishing pad 3 with the blade portion 40 of a cutter 4.
  • the worker then tilts the blade portion 40 and makes it abut against the slanted surface 52 of the protective ring 5.
  • the outer edge of the polishing pad 3 is cut to a shape corresponding to the outer shape of the platen 1 as shown in FIG. 3C.
  • the protective rings 5 and 6 are formed with slanted surfaces 52 and 62, the worker need only cut the polishing pad 3 using as a guide the slanted surfaces 52 and 62 of the protective rings 5 and 6 so as to accurately cut the polishing pad. The cutting work therefore becomes extremely easy.
  • FIG. 5 is a cross-sectional view of a double side polishing apparatus.
  • One platen 1 (1-1) of two platens 1 each adhered with the polishing pad 3 shown in FIG. 3C is turned upward and attached to on a platen rotary member 70 as shown in FIG. 5.
  • the other platen 1 (1-2) is turned downward and connected to a shaft 71.
  • a carrier 72 carrying a wafer W is placed on the polishing pad 3 of the platen 1-1.
  • the carrier 72 is made to revolve around the sun gear 73 while rotating.
  • the wafer W is pressed against by the platen 1-2 and slurry is supplied while making the platens 1-1 and 1-2 rotate in opposite directions to each other, whereby the two surfaces of the wafer W are polished to a mirror surface by the polishing pads 3 of the platens 1-1 and 1-2.
  • the rotation of the platens 1-1 and 1-2 causes the slurry to flow out to the outer peripheral surfaces 13 and inner peripheral surfaces 14 of the platens 1-1 and 1-2 and to deposit on the surfaces of the protective rings 5 and 6. If the slurry were to continue to remain deposited on the protective rings 5 and 6 in that state for a long period of time, the slurry would dry and abrasive S would become affixed to the protective rings 5 and 6 as shown in FIG. 5. In particular, if abrasive S became affixed to the protective rings 5 and 6 of the upper platen 1-2, vibration might cause clumps of abrasive to peel off and fall between the platens 1-1 and 1-2 and scratch the wafer W.
  • the protective rings 5 and 6 are formed by polytetrafluoroethylene, which has a smooth surface, even if depositing on the protective rings 5 and 6, the slurry will fall off from the protective rings 5 and 6 in a short time. Therefore, the problem of the slurry drying and abrasive affixing to the protective rings 5 and 6 will not occur.
  • the present invention was applied to a donut-shaped platen 1, but of course it may also be applied to a platen with a disk-shaped center hole.
  • the platen 1 was a large sized platen of about 2190 mm
  • the protective film 2 was formed by paint, but in the case of a small sized platen, the protective film 2 may also be formed by a polytetrafluoroethylene coating.
  • the protective rings 5 and 6 were formed by polytetrafluoroethylene, but when using the platen 1 for an apparatus having only a single platen at the bottom, the problem of abrasive of the slurry becoming affixed to the platen does not occur, so the protective rings 5 and 6 may also be formed by another synthetic resin, for example, fluoroplastics, an epoxy resin, unsaturated polyester resin, melamine resin, polyvinyl chloride, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylate resin, and polyvinylidene chloride. These resins can also be used to the above-mentioned embodiment.
  • fluoroplastics for example, fluoroplastics, an epoxy resin, unsaturated polyester resin, melamine resin, polyvinyl chloride, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylate resin, and polyvinylidene chloride. These resins can also be used
  • protective rings 5 and 6 were provided with slanted surfaces 52 and 62, the invention does not exclude protective rings 5 and 6 of rectangular cross-sections without the slanted surfaces 52 and 62.
  • the cutter etc. will only scratch the protective rings, made of a material nonreacting with the slurry, at the time of cutting and will not scratch the protective film, so there is the superior advantageous effects that even an unskilled general worker can perform the work of cutting a polishing pad easily and in a short time.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP19990103955 1998-03-16 1999-03-09 Poliervorrichtungsscheibe und Verfahren zum Aufkleben eines Polierkissens Withdrawn EP0943397A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8491898A JP4041577B2 (ja) 1998-03-16 1998-03-16 ポリッシング装置の定盤及び研磨パッド貼着方法
JP8491898 1998-03-16

Publications (1)

Publication Number Publication Date
EP0943397A2 true EP0943397A2 (de) 1999-09-22

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Application Number Title Priority Date Filing Date
EP19990103955 Withdrawn EP0943397A2 (de) 1998-03-16 1999-03-09 Poliervorrichtungsscheibe und Verfahren zum Aufkleben eines Polierkissens

Country Status (2)

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EP (1) EP0943397A2 (de)
JP (1) JP4041577B2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643703B (zh) * 2015-07-20 2018-12-11 聯華電子股份有限公司 一種用於化學機械研磨的研磨墊載具
KR20210006325A (ko) * 2018-05-08 2021-01-18 마루이시 산교 가부시키가이샤 연마 패드 및 그 연마 패드에 의한 연마방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4584755B2 (ja) * 2005-04-06 2010-11-24 スピードファム株式会社 両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法
JP4614851B2 (ja) * 2005-09-21 2011-01-19 スピードファム株式会社 平面研磨装置
CN107584346A (zh) * 2017-08-30 2018-01-16 浙江凯文磁钢有限公司 提高双端面磨削稀土永磁铁氧体圆环磁体外圆面质量合格率的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643703B (zh) * 2015-07-20 2018-12-11 聯華電子股份有限公司 一種用於化學機械研磨的研磨墊載具
KR20210006325A (ko) * 2018-05-08 2021-01-18 마루이시 산교 가부시키가이샤 연마 패드 및 그 연마 패드에 의한 연마방법

Also Published As

Publication number Publication date
JPH11262855A (ja) 1999-09-28
JP4041577B2 (ja) 2008-01-30

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