EP0914957A2 - Tête thermique et son procédé de fabrication - Google Patents

Tête thermique et son procédé de fabrication Download PDF

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Publication number
EP0914957A2
EP0914957A2 EP98204412A EP98204412A EP0914957A2 EP 0914957 A2 EP0914957 A2 EP 0914957A2 EP 98204412 A EP98204412 A EP 98204412A EP 98204412 A EP98204412 A EP 98204412A EP 0914957 A2 EP0914957 A2 EP 0914957A2
Authority
EP
European Patent Office
Prior art keywords
wiring electrode
protective film
heat generating
electrode
generating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98204412A
Other languages
German (de)
English (en)
Other versions
EP0914957A3 (fr
Inventor
Yuji c/o Seiko Instruments Inc. Nakamura
Yoshinori C/O Seiko Instruments Inc. Sato
Yoshiaki C/O Seiko Instruments Inc. Saita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority claimed from EP95935562A external-priority patent/EP0737588B1/fr
Publication of EP0914957A2 publication Critical patent/EP0914957A2/fr
Publication of EP0914957A3 publication Critical patent/EP0914957A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3359—Manufacturing processes

Definitions

  • the present invention relates to a thermal head which is used in heat sensitive recording of facsimile, printer or the like and a method for manufacturing the same.
  • a glaze layer 2 is provided as a heat accumulation layer on an insulative substrate 1 such as that made of ceramic material. Then, film formations are performed by sputtering or deposition from a heat generating resistor material such as that of Ta system, silicide system, Ni-Cr system or the like and an electrode mateial such as that of Al, Cr-Cu or Au, whereupon a heat generating resistor 3 and wiring electrodes 12 composed of a common electrode and individual electrodes are formed through performance of patterning in the photolithographing step.
  • a heat generating resistor material such as that of Ta system, silicide system, Ni-Cr system or the like
  • an electrode mateial such as that of Al, Cr-Cu or Au
  • a protective film 9 such as that made of SiO 2 , Ta 2 O 5 , SiAlON, Si 3 N 4 or SiC is formed by sputtering, ion plating or CVD (Chemical Vapor Deposition) to thereby manufacture a thermal head.
  • the thermal head that had been manufactured by the above-mentioned manufacturing method had its resistance value increased early in its use, with the result that when printing was performed using this thermal head, such increase in resistance value became a cause of dotting failures, which resulted in that the printing run service life of the thermal head became shorter. Also, it is considered that during printing run, ions in the thermosensible paper, moisture, Na + ion and Cl - ion in the atmosphere, and the like enter into the thermal head due to the faults 10 of the protective film thereof, with the result that there was the problem that the heat generating resistor 3 and wiring electrodes 12 were corroded and as a result the thermal head had inferior corrosion resistance.
  • a manufacturing method wherein a forward end portion of each wiring electrode 12 connected to a heat generating resistor 3 is tapered to thereby decrease the fault and level difference of the protective film e.g., Published Unexamined Japanese Patent Application No. S-56-129184
  • a manufacturing method wherein a photo-step and etching step are performed twice or so with respect to a forward end portion of each wiring electrode 12 connected to a heat generating resistor 3 to thereby form this forward end portion into a two-stepped configuration and thereby decrease the level difference of the protective film e.g., Published Examined Japanese Patent Application No.
  • the protective film 9 is likely to be partly broken off or exfoliated from faults 10 thereof due to mechanical stress that is applied to the level difference portion thereof by sliding movement of the thermosensible paper and pressing force of a platen roller or due to thermal stress that results from a difference in thermal coefficient of expansion between the heat generating resistor portion and the electrode portion. Accordingly, the effect of the sliding movement of the thermosensible paper and pressing force of the platen roller is exerted not only upon the heat generating resistor but also upon the surrounding areas thereof, with the result that the protective film is likely to be broken off or exfoliated also by way of the peripheral edge portion of the wiring electrode other than the forward end portion thereof.
  • the protective film was broken off or exfoliated not only from the forward end portion of the electrode but also from the peripheral edge thereof, whereby the printing run service life of the thermal head was caused to become shorter.
  • thermosensible paper moisture, Na + ion and Cl - ion in the atmosphere, and the like may enter into the thermal head due to the level difference of the peripheral edge of the electrode.
  • this entry corroded the heat generating resistor and electrode, with the result that the thermal head became inferior in terms of the corrosion resistance particularly during standby for printing.
  • an object of the present invention is to provide a thermal head which is arranged such that, in order to solve the above-mentioned conventional problems, the peripheral edge portion of the electrode thereof is tapered and the level difference on the surface of the protective film is thereby lessened to thereby have no fault therein while having wear resistance, on the other hand.
  • a method for manufacturing a thermal head comprising a step of forming a heat generating resistor, a step of forming a wiring electrode that is electrically connected to the heat generating resistor, and a step of forming a protective film for clothing the heat generating resistor and the wiring electrode in the vicinity thereof, characterised in that
  • Fig. 1(a) is an enlarged sectional view illustrating a heat generating resistor and its ambient area of a thermal head according to the present invention
  • Fig. 1(b) is a sectional view illustrating peripheral edge portions of electrodes thereof.
  • a glaze 2 is formed on the surface of an insulative substrate 1 and wiring electrodes 4 are formed thereon so as to be electrically connected to a heat generating resistor 3.
  • a reference numeral 5 denotes a taper portion of each wiring electrode 4. This taper portion is formed with respect to a periphery thereof that opposes the heat generating resistor 3 and with respect to a peripheral edge portion of every wiring electrode 4.
  • a reference numeral 9 denotes a protective film which is formed so as to clothe the heat generating resistor 3 and the peripheral edge portions of the wiring electrodes 4.
  • the protective film 9 is made to have no level difference resulting from the level difference of the wiring electrode 4 and have, by the resulting removal of the difference between the growth process thereof on the heat generating resistor 3 and the growth process thereof on the wiring electrodes 4, no fault resulting therefrom.
  • a glaze 2 is formed on the surface of the insulative substrate 1.
  • the heat generating resistor 3 on which the wiring electrodes 4 are formed so as to be electrically connected thereto.
  • a reference numeral 6 denotes a multistage portion which is formed with respect to a periphery thereof that opposes the heat generating resistor 3 and with respect to a peripheral edge portion of every wiring electrode 4.
  • the reference numeral 9 denotes the protective film which is formed so as to cover this multistage portion as a whole.
  • the protective film 9 By the peripheral edge portion of the wiring electrode 4 being formed into a multistage configuration, when the protective film 9 has been formed, the protective film is made to have no level difference resulting from the level difference of the wiring electrode 4 and have, by the resulting removal of the difference between the growth process thereof on the heat generating resistor 3 and the growth process thereof on the wiring electrodes 4, no fault resulting therefrom.
  • the glaze 2 is formed on the insulative substrate 1 that consists of, for example, alumina ceramics.
  • a film that is made of material Ta-N, Ta-SiO 2 or the like that has Ta as a main component and that serves as material of the heat generating resistor is formed by sputtering to a thickness of approximately 0. 1 ⁇ m or so, after which the heat generating resistor 3 is formed by photolithography.
  • a film that is made of material Al, Al-Si, Al-Si-Cu or the like that has Al as a main component and that serves as material of the electrode for supplying power to the heat generating resistor 3 is formed by sputtering or the like to a thickness of approximately 1 to 2 ⁇ m or so, after which a photo-resist is coated on the resulting film and then is exposure developed using a photo-mask to thereby form a resist 8 that has a configuration of wiring electrode.
  • the resist 8 is removed using an exfoliation solution such as organic solvent to thereby form the wiring electrodes and taper portion 5.
  • a film that is made of, for example, a mixture of Si 3 N 4 and SiO 2 is clad by sputtering or the like to a thickness of approximately 3 to 6 ⁇ m or so to thereby form the protective film 9.
  • the glaze 2 is formed on the insulative substrate 1 such as that made of alumina ceramics or the like and on this glaze 2 there is formed the heat generating resistor 3.
  • an Al electrode 4b film that has Al as a main component and that serves as an electrode material for supplying power to the heat generating resistor 3 is formed as a first layer by sputtering to a thickness of approximately 0. 3 to 0. 8 ⁇ m or so and then an Al alloy electrode 4c film which has Al as a main component and has Si, Cu, Ti and the like added thereto is formed as a second layer by sputtering to a thickness of approximately 0. 3 to 0. 6 ⁇ m or so to thereby form an electrode film having a total thickness of approximately 1 to 2 ⁇ m.
  • the resist 8 is formed as in the case of the first embodiment.
  • etching when etching is performed of the first and second layers by use of an etching solution that consists of an acidic water mixed solution composed of phosphoric acid, acetic acid, nitric acid, pure water, etc., since as compared to the Al electrode 4b film as the first layer having Al as a main component the Al alloy electrode 4c film as the second layer wherein Si, Cu, Ti and the like has been added to Al has its crystal grain size made to be very small, the etching rate for this second layer becomes faster. For this reason, etching as viewed in both the plane and thickness directions proceeds, whereby at the etch completion time the peripheral edge portion of the electrode exhibits a tapered configuration. Thereafter, in Fig. 4(c), the resist 8 is removed using an exfoliation solution such as organic solvent to thereby form the wiring electrode and taper portion 5. Thereafter, as in the case of the above-mentioned embodiment, in Fig. 4(d), the protective film 9 is formed.
  • an exfoliation solution such as organic solvent
  • the glaze 2 is formed on the insulative substrate 1 such as that made of alumina ceramics or the like and on the upper surface of this glaze 2 there is formed the heat generating resistor 3.
  • the insulative substrate 1 such as that made of alumina ceramics or the like
  • the heat generating resistor 3 On the upper surface of the resulting structure there is further formed by sputtering to a thickness of from 1 to 2 ⁇ m a film that has Al as a main component and that serves as an electrode material for supplying power to the heat generating resistor 3.
  • the crystal grain size of Al varies due to sputter DC power, substrate temperature, sputter pressure, etc.
  • the crystal grain size of an ordinary Al sputter film is in a range of from 2 to 4 ⁇ m.
  • the crystal grain size thereof was varied to thereby form an Al electrode 4d film whose crystal grain size varied.
  • film formation was performed under ordinary conditions and, as the time lapsed, film formation was performed while the sputter DC power was being gradually decreased. Since the film forming rate was decreased by the sputter power being decreased, the substrate temperature was decreased.
  • the crystal grain size in the vicinity of the upper surface of Al was 0. 5 ⁇ m whereas that in the vicinity of the lower surface thereof was approximately 2 ⁇ m or so. Then, on the upper surface of the resulting structure there was formed the resist 8.
  • etching solution that consists of, for example, a mixed solution of phosphoric acid, acetic acid, nitric acid and pure water
  • the etching rate varies due to the variations in crystal grain size in the thicknesswise direction of the film. Namely, the smaller the crystal grain size, the faster the etching rate. For this reason, since etching is performed in both the plane and thickness directions, the peripheral edge portion of the electrode exhibits a configuration of taper at the etch completion time.
  • the resist 8 is removed using an exfoliation solution such as organic solvent to thereby form the wiring electrode and taper portion 5.
  • the protective film 9 is formed.
  • the glaze 2 is formed on the insulative substrate 1 such as that made of alumina ceramics or the like and on the upper surface of this glaze 2 there is formed the heat generating resistor 3.
  • ordinary etching is performed using an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc.
  • the resist 8a is removed using an exfoliation solution such as organic solvent to thereby form the wiring electrode 4a.
  • This wiring electrode 4a thus formed is a first stage.
  • a photo-resist is coated again so as to form a second stage of the wiring electrode 4a, after which the photo-resist is exposure developed using a photo-mask whose exposure pattern contour has been reduced 5 ⁇ m or more compared to the contour of the wiring electrode 4a that has been formed as the first stage of the wiring electrode 4a, to thereby form a resist 8-2 whose configuration corresponds to that of the wiring electrode as the second stage.
  • etching is performed using an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc.
  • an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc.
  • the resist 8-2 is removed using an exfoliation solution such as organic solvent to thereby form the two staged wiring electrode 4a. It is also possible to form a three or more staged wiring electrode 4a by repeated performance of the above-mentioned steps.
  • the protective film 9 is formed. The structure illustrated in Fig.
  • the level difference of the protective film 9 is one that has been obtained by forming the protective film 9 on the wiring electrode 4a that has been obtained in this embodiment.
  • the fact that the level difference of the protective film 9 has been made smaller than in the prior art has been confirmed. It is to be noted that it is confirmed that the level difference of the protective film is smaller when the level difference of the wiring electrode 4a is three staged than when this level difference is two staged. That is, by the wiring electrode 4a being two or three staged, the same effect as that attainable with tapering of the electrode is obtained.
  • the glaze 2 is formed on the insulative substrate 1 such as that made of alumina ceramics or the like and on the resulting structure there is formed the heat generating resistor 3.
  • the resulting structure there is formed by sputtering to a thickness of from 1 to 2 ⁇ m a film that has Al as a main component and that serves as an electrode material for supplying power to the heat generating resistor 3.
  • a resist 8a is formed, and then, in Fig.
  • etching is performed 10 to 90% with respect to the film thickness by using an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc. and is finished as is.
  • an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc. and is finished as is.
  • the resist 8 is removed using an exfoliation solution such as organic solvent to thereby form the wiring electrode 4a.
  • an exfoliation solution such as organic solvent
  • a developing solution has a feature of causing a reduction in amount of the resist 8
  • ordinary etching is first performed and then the resulting structure is immersed again in the developing solution to thereby perform second-time development for causing a forced reduction in amount thereof and thereby retreat the resist 8 by a distance of 5 ⁇ m or more as illustrated in Fig. 8(c).
  • etching is performed using an etching solution that consists of, for example, an acidic water mixed solution of phosphoric acid, acetic acid, nitric acid, pure water, etc. and this etching is finished to thereby form a multistage portion 6 with respect to the wiring electrode.
  • the resist 8 is removed using an exfoliation solution such as organic solvent to thereby form the two staged wiring electrode 4a.
  • the structure illustrated in Fig. 9(b) is one that has been obtained by forming the protective film 9 on the wiring electrode 4a having been obtained in this embodiment.
  • the level difference of the protective film is made to be less sharp and in addition the fault thereof that corresponds to the peripheral edge of the wiring electrode is also suppressed.
  • the level difference of the wiring electrode 4a in each stage is smaller when this wiring electrode 4a is three staged than when it is two staged and that, accordingly, the clothability of the protective film is enhanced more in the former case than in the latter.
  • the clothability of the protective film over the level difference portion i.e., whether or not there occurs the fault of the protective film at the level difference portion, remarkably changed depending on whether or not the level difference constituting one stage was to an extent of 0. 2 to 0. 3 ⁇ m. Accordingly, it is preferable that each level difference be suppressed to a value of 0. 3 ⁇ m or less.
  • the “resistance to pulse” is an item of evaluation that is obtained by applying a voltage pulse to the heat generating resistor and determining the degree of change in the resistance value thereof with respect to the number of the pulses applied.
  • the “resistance to corrosion” is an item of evaluation that is obtained by causing the thermal head to contact with a thermosensible paper or chemicals at high temperature and under high humidity and determining whether or not the electrodes are corroded and whether or not the protective film is exfoliated.
  • the "resistance to scratch” is an item of evaluation that is obtained by scratching by use of, for example, sand paper the protective film that includes a portion thereof that is located on the wiring electrodes in the vicinity of the heat generating resistor and thereby evaluating the exfoliation of this protective film.
  • the "printing durability” was evaluated in the percentage of troubles that occurred when continuous printing was performed using a highly wearable poor thermosensible paper containing a large amount of corroding impurities.
  • the protective film whose hardness is high is advantageous and, given that the protective film has continuity as viewed in the plane direction, the resistance to scratch also becomes increased as a result. That is to say, when combined with the hardness of the protective film of Hv 1200 or more, the present invention can exhibit the greatest effect.
  • Fig. 11 shows the results of a printing run duration test that has been performed in the present invention.
  • Fig. 12 there are shown the results of continuous pulse application test in order to evaluate the resistance to pulse of the present invention.
  • the increase in the resistance value becomes 5% or so at a pulses number of 1 x 108 and becomes 15% or more at a pulses number of 6 x 108.
  • neither increase nor change in the resistance value is exhibited at even a pulses number of 1 x 108 and, at even a pulses number of 6 x 108, the increase in the resistance value is 3% or so, that is, the resistance to pulse is improved.
  • Fig. 13 shows the results of electrolytic etching test in order to evaluate the resistance to corrosion of the present invention.
  • the test was performed as a "leaving-to-stand test" under the conditions that the temperature was 85 °C, the humidity was 85%, the head voltage was 5 V and the thermosensible paper was kept applied.
  • unqualified dots generated were large in amount at an early point in time, were 5% or more in 48 hrs and, after lapse of 96 hrs, were approximately 15% whereas in the present embodiments no unqualified dots were admitted in 48 hrs and, even after lapse of 96 hrs, approximately 3% of unqualified dots were only admitted. Namely, in the present embodiments, it could be confirmed that by tapering of the electrode, moisture, ions of the thermosensible paper, etc. were prevened from easy entry into the thermal head, whereby corrosion of the electrode and the like could be prevented with the result that the resistance to corrosion was improved.
  • Fig. 14 there are shown the results of a print thickness test that has been performed in the present invention.
  • the present invention by the electrode of the thermal head in a region of the protective film thereof having been formed into a tapered configuration, the level difference of this protective film is made to be smaller or less sharp, whereby occurrence of faults therein is suppressed and, particularly by the tapering being combined with the hardness of the protective film that is Hv 1200 or more in terms of the Vickers hardness, the wear resistance is of course improved and further the scratch resistance is also remarkably improved.
  • the present invention has the advantage of making the printing durability very high and further of also improving the environmental reliability.
  • the manufacturing method of the present invention that is intended to cause tapering of the sectional configuration of the peripheral edge portion of the wiring electrodes is possible to execute with even no use of a special device such as a bias sputter device.
  • a special device such as a bias sputter device.
  • the section of the peripheral edge of the electrode can be tapered without causing an increase in the number of the steps.
EP98204412A 1994-10-31 1995-10-25 Tête thermique et son procédé de fabrication Withdrawn EP0914957A3 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP267474/94 1994-10-31
JP26747494A JP3376128B2 (ja) 1994-10-31 1994-10-31 火災感知器用作動試験装置
JP26747494 1994-10-31
EP95935562A EP0737588B1 (fr) 1994-10-31 1995-10-25 Tete thermique et procede de fabrication

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP95935562A Division EP0737588B1 (fr) 1994-10-31 1995-10-25 Tete thermique et procede de fabrication

Publications (2)

Publication Number Publication Date
EP0914957A2 true EP0914957A2 (fr) 1999-05-12
EP0914957A3 EP0914957A3 (fr) 1999-10-20

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Family Applications (1)

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EP98204412A Withdrawn EP0914957A3 (fr) 1994-10-31 1995-10-25 Tête thermique et son procédé de fabrication

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EP (1) EP0914957A3 (fr)
JP (1) JP3376128B2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176022A1 (fr) * 2000-07-25 2002-01-30 Seiko Instruments Inc. Tête thermique
US20120224015A1 (en) * 2011-03-04 2012-09-06 Norimitsu Sanbongi Thermal head and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530468A (en) 1978-08-28 1980-03-04 Teijin Ltd Production of high denier false twisted yarn
JPS56129184A (en) 1980-03-17 1981-10-09 Toshiba Corp Thermal head
JPS63135261A (ja) 1986-11-28 1988-06-07 Tdk Corp サ−マルヘツドの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096510A (en) * 1974-08-19 1978-06-20 Matsushita Electric Industrial Co., Ltd. Thermal printing head
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
KR920009583A (ko) * 1990-11-20 1992-06-25 정용문 감열기록소자의 제조방법
EP0925933B1 (fr) * 1991-04-20 2002-12-11 Canon Kabushiki Kaisha Couche de base pour tête d'enregistrement, tête d'enregistrement et méthode pour sa production
JP2959690B2 (ja) * 1992-06-10 1999-10-06 キヤノン株式会社 液体噴射記録ヘッドの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530468A (en) 1978-08-28 1980-03-04 Teijin Ltd Production of high denier false twisted yarn
JPS56129184A (en) 1980-03-17 1981-10-09 Toshiba Corp Thermal head
JPS63135261A (ja) 1986-11-28 1988-06-07 Tdk Corp サ−マルヘツドの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176022A1 (fr) * 2000-07-25 2002-01-30 Seiko Instruments Inc. Tête thermique
US20120224015A1 (en) * 2011-03-04 2012-09-06 Norimitsu Sanbongi Thermal head and method of manufacturing the same

Also Published As

Publication number Publication date
EP0914957A3 (fr) 1999-10-20
JPH08129685A (ja) 1996-05-21
JP3376128B2 (ja) 2003-02-10

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