EP0907882A1 - Halbleiter-bauelement - Google Patents
Halbleiter-bauelementInfo
- Publication number
- EP0907882A1 EP0907882A1 EP97931627A EP97931627A EP0907882A1 EP 0907882 A1 EP0907882 A1 EP 0907882A1 EP 97931627 A EP97931627 A EP 97931627A EP 97931627 A EP97931627 A EP 97931627A EP 0907882 A1 EP0907882 A1 EP 0907882A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chip carrier
- protective cap
- chip
- semiconductor
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Definitions
- the invention relates to a semiconductor component consisting of a chip carrier having an approximately flat chip carrier surface, which consists in particular of electrically insulating material, on which chip carrier surface a semiconductor chip is fastened with a pressure sensor, and electrode connections passing through the chip carrier and electrically connected to the semiconductor chip , especially with a surface mountable arrangement.
- the medium to be measured must be brought up to the sensor or the pressure prevailing in the medium must be transmitted to the sensor.
- the pressure sensor is arranged in a component housing which is open on one side, so that the sensitive chip area of the pressure sensor can come into direct contact with the medium to be measured.
- This arrangement has the disadvantage that during the assembly process of the semiconductor component that is open on one side, the chemicals used can reach the sensitive chip surface of the pressure sensor, with the result that the risk of corrosion on the component is accelerated or the component is completely accelerated can be destroyed. Processes using chemicals that can result in contamination of the component with aggressive ions are particularly critical here, for example so-called deflash processes or also electroplating processes immediately after the pressure sensor chip is attached to the chip carrier.
- the casting compound residues or burrs which have remained after the plastic molding of the chip carrier are generally removed by using a high-pressure water jet.
- the electrode connections protruding from the housing are provided with a solderable coating layer by means of lead tins in order to ensure that the half To allow conductor component on the assembly surface of a circuit board.
- a semiconductor pressure sensor is known in which the pressure sensor chip is partially covered with a gel material. However, the pressure sensor chip is directly exposed to the influences of the atmosphere surrounding it via a pressure supply tube.
- the invention is based on the object of providing a semiconductor component with a semiconductor pressure sensor having a sensitive chip area, in particular for mounting on the component surface of a printed circuit board, the semiconductor component preferably having a housing with a chip carrier which is open on one side and which Semiconductor component is designed in such a way that destruction of the sensitive chip area of the pressure sensor can be avoided in processes in which harmful chemicals are used.
- the chip carrier can be temporarily closed by means of a protective cap overlapping the pressure sensor.
- the invention proposes to close the chip carrier, which is open on one side, by means of a protective cap while the critical assembly processes are being carried out.
- the protective cap can also be used as a transport protection at the same time, removal of the protective cap only being opened or removed after the semiconductor component has been installed or before the component is used as a pressure sensor.
- the protective cap is designed to be removable from the chip carrier.
- the protective cap has an opening which can be closed by means of a self-adhesive film or a stopper.
- the protective cap is preferably manufactured and designed as an independently designed component, in particular made of plastic material
- the protective cap has a holding means for a form-fitting mechanical connection with a support means of the chip carrier, such that when the protective cap is placed on the chip carrier, the holding means and the support means engage alternately with one another reach.
- the chip carrier is advantageously designed in such a way that the support means of the chip carrier has a circumferential abutment surface on its outer periphery and supports the holding means of the protective cap.
- the holding means of the protective cap is provided with a resilient projection, which is provided with a catch provided in the support means of the chip carrier for the automatic fixing of the protective cap and the chip carrier in an assembly position assigned.
- the chip carrier and the protective cap are made of a plastic material which is resistant to the chemicals used in the assembly of the component.
- the protective cap is replaced by a connector for the variable coupling of a feed containing the medium to be measured after the semiconductor component has been put into use.
- the invention relates to a semiconductor component for surface mounting on the component surface of a printed circuit board.
- the component connections are no longer inserted into holes in the printed circuit board as in plug-in assembly, but instead are placed on connection spots on the printed circuit board and soldered there.
- Components for surface mounting can be smaller than for plug-in mounting, since no more hole and soldering eye diameters determine the grid dimension of the connections.
- the holes that are only required for assembly are eliminated on the printed circuit board, and the holes that are only required for through-plating can be made as small as technologically possible. Since double-sided assembly of the printed circuit board is also possible, the surface mounting can result in considerable space savings and considerable cost reductions.
- a particularly low overall height of the semiconductor component results if the electrode connections passing through the chip carrier and electrically connected to the semiconductor chip are designed in the form of connecting legs which are led out to at least two sides of the chip carrier and which are bent and cut into short, rocker-shaped connection stubs .
- FIG. 1 shows a schematic sectional view of a semiconductor component according to an exemplary embodiment of the invention.
- Figure 2 is a schematic overall view of the chip carrier of a semiconductor device according to the embodiment.
- the figures show an exemplary embodiment of a semiconductor component 1 according to the invention for surface mounting on the component surface 2 of a printed circuit board 3.
- the semiconductor component 1 has an approximately flat chip carrier surface 4 having a chip carrier 5 made of electrically insulating plastic material, on which chip carrier surface
- a semiconductor chip 6 is fastened with an integrated pressure sensor and associated electronic circuit, the pressure sensor and the circuit not being shown in the figures, and the electrode terminals 7 penetrating the chip carrier 5 and electrically connected to the semiconductor chip 6, the ends 8 of which are open Terminal pads (not shown) are placed on the mounting surface 2 of the circuit board 3 and soldered there.
- the in particular in one piece, manufactured by means of a plastic casting method known per se, comprises a lower part 9 which is raised relative to the mounting surface 2 and on which the semiconductor chip 6 is supported, and side parts 10, 10a and 11, 11a arranged on the sides of the lower part 9, which form the laterally closing housing walls of the pressure sensor housing.
- the chip carrier in one piece, manufactured by means of a plastic casting method known per se, comprises a lower part 9 which is raised relative to the mounting surface 2 and on which the semiconductor chip 6 is supported, and side parts 10, 10a and 11, 11a arranged on the sides of the lower part 9, which form the laterally closing housing walls of the pressure sensor housing.
- the electrode connections 7 passing through the chip carrier 5 and electrically connected to the semiconductor chip 6 are designed in the form of lead pins which are led out to at least two sides of the chip carrier 5 and which are bent and cut into short, rocker-shaped connection stubs 17.
- Such an arrangement ensures the lowest overall height of the sensor component.
- the bends 18 of the connection pins are completely accommodated within the side parts 10, 11 of the chip carrier 5, which has the advantage that the dimensions of the housing are further reduced, the size of the lead frame is reduced, and the creepage distances for corrosive media are otherwise reduced considerably extended and thus enforcement with chemicals is reduced.
- such an arrangement enables the leadframe or the electrode connections 7 to be mechanically anchored within the housing of the component and thus an additional increase in the overall mechanical stability.
- the ends 8 of the leads protruding from the side parts 10, 11 of the chip carrier 5 have a slight inclination relative to the component surface 2 of the printed circuit board 3 such that the outermost edge 19 of the end 8 of the leads 8 facing the component surface 2 is at a distance of approximately 0 , 1 mm to the auxiliary plane 20 shown in broken lines. This arrangement ensures that contact of the component with the placement surface 2 of the printed circuit board 3 only through the outermost
- Ends 8 of the connecting legs are given, which together with the illustrated, favorable housing arrangement, in which the lower part is lifted off the printed circuit board and the housing is designed as shown in the shape of a roof, the possible deflections of the printed circuit board 3 are taken into account, as well as problems when assembling the component on the printed circuit board 3, as well as during later use the circuit board 3 can be avoided.
- a setting by means of so-called trim and shaping tools which was previously required for the assembly, can be dispensed with, and at the same time the specified requirements for the ground clearance to be maintained can be taken into account.
- the assembly can be carried out more cheaply since good adhesion of the assembly adhesive is guaranteed, and in addition possible tolerances of the printed circuit board 3 with regard to deflections are compensated for and thermal and / or mechanical stresses are counteracted as a result
- a wire contacting method can be used for the electrical connection of the pressure sensor integrated on the semiconductor chip 6 or the electronic circuit associated therewith with the electrode connections 7, in which bonding wires 21 are attached to metallic chip connection points 21a on the chip and connected to the corresponding one Electrode legs are pulled.
- a so-called spider contacting can also be used for this electrical connection, in which an electrically conductive system carrier plate or a so-called lead frame is used instead of bond wires.
- the silicon integrated on the semiconductor chip 6 pressure sensor represents a so-called piezoresistive sensor, in which a thin silicon membrane is provided in the surface of the chip 6 by methods of micromechanics, which is electrically coupled with pressure-dependent resistors, which is also in the silicon Are formed substrate and are connected in a conventional manner in a bridge circuit. Also integrated in the semiconductor chip 6 is a circuit assigned to the sensor, which serves for signal processing (amplification and correction), but also for adjustment and compensation of the sensor.
- such semiconductor pressure sensors on which the invention is based are primarily suitable for those applications in which the smallest structural size is important, for example in the case of pressure measurements in the motor vehicle sector, for example in the measurement of brake pressures, tire pressures, combustion chamber pressures and the like.
- semiconductor pressure sensors that work on the principle of piezoresistive pressure measurement, it is also possible to use those that work with capacitive measuring principles.
- the chip carrier 5 is designed to be open on one side on its side 22 facing away from the mounting surface 2 of the printed circuit board 3, and has a support means 26 on the upper edge regions 24, 25 delimiting the opening 23 for a positive mechanical, play-free Connection to a holding means 27 of a protective cap 28 which can be placed on the chip carrier 5 such that when the protective cap 28 is placed on the chip carrier 5, the holding means 27 and the supporting means 26 engage alternately.
- the support means 26 of the chip carrier 5 has a circumferential abutment surface 29 on its outer circumference and supports the holding means 27 of the protective cap 28 The outer circumference of the protective cap 28 shaped spring 31 engages at least partially.
- the protective cap 28 has an opening 34 which can be temporarily closed by means of an adhesive film 37.
- the chip carrier 5 is filled with a flowable filler 32 which completely covers the semiconductor chip 6 and which in particular represents a gel which transmits pressures to the semiconductor pressure sensor almost without delay and without errors.
- the gel serves on the one hand to protect the sensitive pressure sensor chip 6 and the further, in particular metallic components of the semiconductor component, in particular re to protect the bonding wires 21, the lead pins 7 or the lead frame from contact with the medium 33 to be measured, and in this way contamination of the component by ions or other harmful components of the medium 33, or the risk of corrosion due to the To prevent medium 33.
- the side walls 24, 25 of the chip carrier 5, which is open on one side, are furthermore equipped with a flow stop edge 36 arranged continuously on the inside, the inside of the chip carrier 5 being filled with the gel 32 only up to the height of the flow stop edge 36.
- This flow stop edge 36 enables a defined stop of the capillary forces of the adhesive gel 32 and thus prevents an undesired rising of the gel 32 beyond the housing edges due to capillary forces.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19626081A DE19626081A1 (de) | 1996-06-28 | 1996-06-28 | Halbleiter-Bauelement |
DE19626081 | 1996-06-28 | ||
PCT/DE1997/001279 WO1998000691A1 (de) | 1996-06-28 | 1997-06-20 | Halbleiter-bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0907882A1 true EP0907882A1 (de) | 1999-04-14 |
Family
ID=7798362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97931627A Ceased EP0907882A1 (de) | 1996-06-28 | 1997-06-20 | Halbleiter-bauelement |
Country Status (4)
Country | Link |
---|---|
US (1) | US6313729B1 (de) |
EP (1) | EP0907882A1 (de) |
DE (1) | DE19626081A1 (de) |
WO (1) | WO1998000691A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19844461A1 (de) | 1998-09-28 | 2000-03-30 | Siemens Ag | Hanhabungs- und Montageschutz |
US20040011144A1 (en) * | 2000-11-15 | 2004-01-22 | Claudio Cavalloni | Resonator chip sensor for pressure and force with mechanically separate partial regions (slots) and a soft membrane |
US6790699B2 (en) | 2002-07-10 | 2004-09-14 | Robert Bosch Gmbh | Method for manufacturing a semiconductor device |
US20040073123A1 (en) * | 2002-10-11 | 2004-04-15 | Hessel Stephen R. | Apparatus and methods for non-invasively measuring hemodynamic parameters |
JP2004257950A (ja) * | 2003-02-27 | 2004-09-16 | Denso Corp | 半導体圧力センサ |
DE102004019428A1 (de) * | 2004-04-19 | 2005-08-04 | Infineon Technologies Ag | Halbleiterbauteil mit einem Hohlraumgehäuse und Verfahren zur Herstellung desselben |
JP5280609B2 (ja) * | 2004-10-01 | 2013-09-04 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US7946994B2 (en) | 2004-10-07 | 2011-05-24 | Tensys Medical, Inc. | Compact apparatus and methods for non-invasively measuring hemodynamic parameters |
DE102005053682A1 (de) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, Sensorbauelement und Verfahren zur Herstellung eines Sensors |
WO2007133759A2 (en) | 2006-05-13 | 2007-11-22 | Tensys Medical, Inc. | Continuous positioning apparatus and methods |
US20080021334A1 (en) * | 2006-07-19 | 2008-01-24 | Finburgh Simon E | Apparatus and methods for non-invasively measuring hemodynamic parameters |
TW200904159A (en) * | 2007-07-06 | 2009-01-16 | Kye Systems Corp | Thin type image capturing module |
CN101896117B (zh) | 2007-10-12 | 2015-03-04 | 坦西斯医药股份有限公司 | 用于非侵入式测量病人动脉血压的设备和方法 |
JP5055097B2 (ja) * | 2007-11-08 | 2012-10-24 | 日東電工株式会社 | 検査用粘着シート |
US9655530B2 (en) | 2011-04-29 | 2017-05-23 | Tensys Medical, Inc. | Apparatus and methods for non-invasively measuring physiologic parameters of one or more subjects |
JP6188237B2 (ja) * | 2014-06-16 | 2017-08-30 | アルプス電気株式会社 | 圧力検出装置及びその製造方法 |
JP6373110B2 (ja) * | 2014-07-25 | 2018-08-15 | 株式会社フジクラ | 半導体圧力センサ及びその製造方法 |
DE102014217552A1 (de) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3764950A (en) * | 1972-07-17 | 1973-10-09 | Fairchild Camera Instr Co | Methods for making semiconductor pressure transducers and the resulting structures |
JPS597234A (ja) * | 1982-07-05 | 1984-01-14 | Aisin Seiki Co Ltd | 圧力センサ |
JPS6117925A (ja) * | 1984-07-05 | 1986-01-25 | Hitachi Ltd | 圧力センサ |
US4656454A (en) * | 1985-04-24 | 1987-04-07 | Honeywell Inc. | Piezoresistive pressure transducer with elastomeric seals |
US5031462A (en) * | 1989-05-08 | 1991-07-16 | Honeywell Inc. | Snap-fit construction low cost pressure sensing device |
JPH04125438A (ja) * | 1990-09-17 | 1992-04-24 | Hitachi Ltd | 半導体式圧力センサ |
CA2058916C (en) | 1991-01-28 | 2000-03-21 | Dean Joseph Maurer | Piezoresistive pressure transducer with a conductive elastomeric seal |
US5184107A (en) * | 1991-01-28 | 1993-02-02 | Honeywell, Inc. | Piezoresistive pressure transducer with a conductive elastomeric seal |
JPH06207870A (ja) * | 1993-01-11 | 1994-07-26 | Mitsubishi Electric Corp | 半導体圧力センサ |
US5461922A (en) * | 1993-07-27 | 1995-10-31 | Lucas-Novasensor | Pressure sensor isolated within housing having integral diaphragm and method of making same |
JPH07113706A (ja) * | 1993-10-14 | 1995-05-02 | Fuji Electric Co Ltd | 半導体圧力センサのパッケージ構造 |
US5585554A (en) * | 1994-10-31 | 1996-12-17 | Handfield; Michael | System and method for monitoring a pneumatic tire |
US5581226A (en) * | 1994-11-02 | 1996-12-03 | Motorola, Inc. | High pressure sensor structure and method |
US5874679A (en) * | 1996-04-04 | 1999-02-23 | Ssi Technologies, Inc. | Pressure sensor package and method of making the same |
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
-
1996
- 1996-06-28 DE DE19626081A patent/DE19626081A1/de not_active Withdrawn
-
1997
- 1997-06-20 EP EP97931627A patent/EP0907882A1/de not_active Ceased
- 1997-06-20 WO PCT/DE1997/001279 patent/WO1998000691A1/de not_active Application Discontinuation
- 1997-06-20 US US09/180,128 patent/US6313729B1/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO9800691A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE19626081A1 (de) | 1998-01-02 |
US6313729B1 (en) | 2001-11-06 |
WO1998000691A1 (de) | 1998-01-08 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 19981217 |
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Kind code of ref document: A1 Designated state(s): DE FR GB |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: INFINEON TECHNOLOGIES AG |
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GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
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GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
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17Q | First examination report despatched |
Effective date: 20020510 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
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18R | Application refused |
Effective date: 20021108 |