EP0899110A2 - Structure améliorée d'une tête d'impression et son procédé de fabrication - Google Patents

Structure améliorée d'une tête d'impression et son procédé de fabrication Download PDF

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Publication number
EP0899110A2
EP0899110A2 EP98306390A EP98306390A EP0899110A2 EP 0899110 A2 EP0899110 A2 EP 0899110A2 EP 98306390 A EP98306390 A EP 98306390A EP 98306390 A EP98306390 A EP 98306390A EP 0899110 A2 EP0899110 A2 EP 0899110A2
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EP
European Patent Office
Prior art keywords
orifice plate
substrate
plate member
printhead
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98306390A
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German (de)
English (en)
Other versions
EP0899110A3 (fr
EP0899110B1 (fr
Inventor
Lee Van Nice
Gerald E. Heppell
Neal W. Meyer
Donald L. Michael
Kit Baughman
Thach G. Truong
Rui Yang
Moses M. David
James R. White
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HP Inc
Original Assignee
Hewlett Packard Co
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Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Priority to EP03075328A priority Critical patent/EP1306215A1/fr
Priority to EP03075330A priority patent/EP1306217A1/fr
Publication of EP0899110A2 publication Critical patent/EP0899110A2/fr
Publication of EP0899110A3 publication Critical patent/EP0899110A3/fr
Application granted granted Critical
Publication of EP0899110B1 publication Critical patent/EP0899110B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used

Definitions

  • the present invention generally relates to printing technology, and more particularly involves an improved, high-durability printhead and orifice plate structure for use in an ink cartridge (e.g. a thermal inkjet system).
  • the present invention is related to U.S. Application No. (docket no. 10960551) "Printhead for an Inkjet Cartridge and Method for Producing the Same", filed on behalf of Neal W. Meyer et al. on the same date hereof and assigned to the same assignee.
  • Thermal inkjet systems are especially important in this regard.
  • Printing systems using thermal inkjet technology basically involve a cartridge which includes at least one ink reservoir chamber in fluid communication with a substrate having a plurality of resistors thereon. Selective activation of the resistors causes thermal excitation of the ink and expulsion of the ink from the cartridge.
  • Representative thermal inkjet systems are discussed in U.S. Patent No. 4,500,895 to Buck et al.; No. 4,771,295 to Baker et al.; No. 5,278,584 to Keefe et al.; and the Hewlett-Packard Journal, Vol. 39, No. 4 (August 1988), all of which are incorporated herein by reference.
  • thermal inkjet printheads typically include an outer plate member known as an "orifice plate” or “nozzle plate” which includes a plurality of ink ejection orifices (e.g. openings) therethrough.
  • an orifice plate or “nozzle plate” which includes a plurality of ink ejection orifices (e.g. openings) therethrough.
  • these orifice plates were manufactured from one or more metallic compositions including but not limited to gold-plated nickel and similar materials.
  • thermal inkjet printhead design have resulted in the production of orifice plates which are non-metallic in character, with the term “non-metallic” being defined to involve one or more material layers which are devoid of elemental metals, metal amalgams, or metal alloys.
  • these non-metallic orifice plates are produced from a variety of different organic polymers including but not limited to film products consisting of polytetrafluoroethylene (e.g. Teflon®), polyimide, polymethylmethacrylate, polycarbonate, polyester, polyamide, polyethylene-terephthalate, and mixtures thereof.
  • a representative polymeric (e.g. polyimide-based) composition which is suitable for this purpose is a commercial product sold under the trademark "KAPTON" by E.I. DuPont de Nemours and Company of Wilmington, DE (USA).
  • Orifice plate structures produced from the non-metallic compositions described above are typically uniform in thickness, with an average thickness range of about 1.0 - 2.0 mil.
  • durability shall encompass a wide variety of characteristics including but not limited to abrasion and deformation resistance. Both abrasion and deformation of the orifice plate can occur during contact between the orifice plate and a variety of structures encountered during the printing process including wiper-type structures (normally made of rubber and the like) which are typically incorporated within conventional printing systems.
  • Deformation and abrasion of the orifice plate not only decreases the overall life of the printhead and cartridge associated therewith, but can also cause a deterioration in print quality over time. Specifically, deformation of the orifice plate can result in the production of printed images which are distorted and indistinct with a corresponding loss of resolution.
  • the term "durability” also encompasses a situation in which the orifice plate is sufficiently rigid to avoid problems associated with "dimpling". Dimpling traditionally involves a situation in which orifice plates made of non-metallic, polymer-containing materials undergo deformation during assembly of the printhead or cartridge such that the orifice plate becomes essentially non-planar and the nozzle axis is misdirected.
  • Ruffling is typically caused by physical abrasion of the orifice plate such as with a printer wiper, and is likewise associated with of the nozzle exit. Ruffling and dimpling present substantial problems including misdirection of the ink droplets being expelled from the printhead which results in improperly-printed images. Accordingly, all of these factors are important in producing a completed thermal inkjet system which has a long life-span and is capable of producing clear and distinct images throughout the life-span of the system.
  • the present invention Prior to development of the present invention, a need existed for an inkjet orifice plate manufactured from non-metallic organic polymer compositions (as well as metallic compounds) having improved durability characteristics. Likewise, a need remained for a printhead having a high level of structural integrity.
  • the present invention satisfies these goals in a unique manner by providing a specialized printhead and orifice plate structure which are characterized by improved durability levels, with these components being applicable to both thermal inkjet and other types of inkjet printing systems. Accordingly, the claimed invention represents a substantial advance in inkjet printing technology as discussed in detail below.
  • It is an even further object of the invention to provide an improved inkjet printing system e.g. a thermal inkjet printing apparatus
  • a specialized printhead which includes a non-metallic, organic polymer-based orifice plate having an outer coating comprised of at least one or more material layers designed to protect the orifice plate from abrasion, deformation, dimpling, and the like.
  • a unique inkjet printhead system which includes a non-metallic orifice plate that is characterized by a high level of durability and strength.
  • the orifice plate is typically produced from a non-metallic organic polymer film of nomimal thickness (e.g. about 25 - 50 ⁇ m), it is abrasion resistant and likewise avoids problems associated with deformation and "dimpling" as defined above. As a result, the operating efficiency and life-span of the cartridge unit are substantially improved.
  • nomimal thickness e.g. about 25 - 50 ⁇ m
  • the present invention shall be discussed herein with primary reference to thermal inkjet systems, it is likewise applicable to other types of inkjet printing devices as listed below. Accordingly, the invention may be used in connection with any type of ink cartridge system which includes an orifice plate having multiple openings therethrough that is positioned above a substrate having one or more ink ejection devices ("ejectors") thereon. Thus, the claimed invention shall not be restricted to any particular type of inkjet printing technology.
  • an improved printhead structure which basically includes an ink expulsion system comprising two main components.
  • a substrate is employed which is typically made of silicon.
  • the substrate has an upper surface comprising at least one and preferably multiple ink ejectors thereon (e.g. devices which eject or expel ink from the printhead).
  • the substrate will include multiple thin-film heating resistors thereon (e.g. of a tantalum-aluminum type) which are used to selectively heat, vaporize, and expel ink materials from the completed printhead.
  • the substrate in a thermal inkjet system will likewise include a plurality of logic transistors and associated metallic traces (conductive pathways) thereon which electrically communicate with the resistors so that they may be heated on-demand.
  • the orifice plate is preferably comprised of a non-metallic, organic polymer film composition.
  • a non-metallic, organic polymer film composition many different materials may be used for this purpose, with the claimed invention not being limited to any particular organic polymers.
  • the following compositions involve representative organic polymers which may be employed to produce the orifice plate: polytetrafluoroethylene (e.g. Teflon®), polyimide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate, and mixtures thereof.
  • orifice plate provides numerous benefits compared with traditional metal orifice plates (e.g. gold-plated nickel) including a reduction in material costs and improved manufacturing efficiency.
  • orifice plates manufactured from organic polymer compositions are well-suited for use in connection with tape automated bonding ("TAB") production methods as discussed below.
  • the orifice plate also comprises a top surface, a bottom surface, and a plurality of openings (e.g. "orifices") passing entirely through the orifice plate, with each of the openings providing access to (and typically positioned on the same axis with) at least one of the ink ejectors (e.g. resistors) on the upper surface of the underlying substrate
  • a protective layer of coating material is positioned on at least one of the top surface and the bottom surface of the orifice plate (e.g. adjacent to and surrounding the openings through the orifice plate in a preferred embodiment).
  • compositions can be used to provide the protective layer of coating material on the polymeric orifice plate.
  • a selected dielectric composition can be employed, with the term “dielectric” being defined to involve materials which are electrically-insulating and substantially non-conductive.
  • Representative dielectric materials suitable for this purpose include but are not limited to silicon nitride (Si 3 N 4 ), boron nitride (BN), silicon dioxide (SiO 2 ), silicon carbide (SiC), and a composition known as "silicon carbon oxide” which is commercially available under the name Dylyn® from Advanced Refractory Technologies, Inc. of Buffalo, NY (USA).
  • the present invention may be used to deposit these materials onto the orifice plate, with the present invention not be restricted to any particular manufacturing techniques.
  • application of these materials may be achieved using a number of known procedures including plasma vapor deposition, chemical vapor deposition, sputtering, deposition processes, and others.
  • the protective layer of coating material may likewise be applied at any stage during the production process, although it is preferred this step be undertaken during manufacture of the thin-film polymeric orifice plate and before it is attached to any other printhead components.
  • the reaction sequence associated with this step can be varied in accordance with the particular materials being processed and the selected compositions used to produce the layer of coating material as determined by preliminary pilot testing.
  • DLC diamond-like carbon
  • amorphous carbon a composition known as “diamond-like carbon” or "amorphous carbon”.
  • Many different methods and processing sequences may be employed to deposit DLC onto the top and/or bottom surface of the orifice plate, with the claimed invention not being restricted to any particular manufacturing techniques.
  • the application of DLC to the orifice plate may again be accomplished using a number of known processes including plasma vapor deposition, chemical vapor deposition, sputtering, deposition processes, and others.
  • the protective layer of DLC may be applied at any stage during the production process, although it is again preferred that this step be accomplished during production of the polymeric orifice plate before it is secured to any other printhead components.
  • the reaction sequence associated with this step may be varied in accordance with the particular materials being processed.
  • dielectric composition e.g. DLC or others
  • the orifice plate e.g. DLC or others
  • the selected layer of dielectric material can be applied to (1) both the top and bottom surfaces of the orifice plate; and (2) only the bottom surface of the plate as discussed below.
  • application of the layer of dielectric coating material to "at least one" of the top and bottom surfaces of the orifice plate shall encompass both of the alternatives listed above as well as the initial embodiment in which the coating material is only applied to the top surface of the plate. It is also contemplated that the application of dielectric materials (e.g.
  • DLC or others to the orifice plate may also involve orifice plates of more conventional design including plates made of metal such as gold-plated nickel.
  • orifice plates of more conventional design including plates made of metal such as gold-plated nickel.
  • the invention shall be discussed below with primary reference to polymeric, non-metallic orifice plates, it is likewise applicable to metallic orifice plate systems in order to provide improved abrasion resistance and other benefits.
  • the use of DLC on the bottom surface of the orifice plate provides the additional benefit of enhanced adhesion between the orifice plate and the underlying layers of material in the printhead (e.g. the barrier layer discussed below). This enhanced level of adhesion is directly provided by the unique chemical character of DLC which will also be addressed in additional detail below.
  • a protective layer of coating material is positioned on at least one of the top surface and the bottom surface of the orifice plate, with the protective layer consisting of at least one metal composition.
  • metal composition as used herein is defined to involve an elemental metal, a metal alloy, or a metal amalgam.
  • one or more layers of a selected metal composition are applied to the top and/or bottom surface of the orifice plate using conventional techniques (e.g. chemical vapor deposition, plasma vapor deposition, sputtering, deposition processes, and the like).
  • This embodiment of present invention shall not be restricted to any particular deposition methods, any number of metal-containing layers, or any specific metal compositions.
  • Representative metals which may be applied in one or more discrete layers on the polymeric orifice plate include chromium (Cr), nickel (Ni), palladium (Pd), gold (Au), titanium (Ti), tantalum (Ta), aluminum (Al), rhodium (Rh), and mixtures (e.g. compounds) thereof.
  • the present invention may be employed to apply the selected metal compositions to the orifice plate, with the present invention not be limited to any particular manufacturing techniques.
  • the protective metallic composition may be applied at any stage during the production process, although it is again preferred that this step be accomplished during manufacture of the polymeric orifice plate and before it is attached to any other printhead components.
  • the reaction sequence associated with this step may be varied in accordance with the particular materials being processed and the selected compositions used to produce the metallic layer(s) of coating material as determined by preliminary testing.
  • this embodiment of the claimed invention involves the delivery of one or more layers of a selected metal composition to the polymeric orifice plate which is a unique development. While the delivery of one or more metal-containing layers to the orifice plate is encompassed within the broad concept of the invention, a representative, non-limiting example of this embodiment involves the delivery of three separate metal layers to the top surface of the orifice plate. Specifically, a first metallic coating layer is positioned on the upper surface of the orifice plate which consists of a first metal composition. The first metal composition is designed to function as a "seed" layer which enables proper adhesion of the other metal layers to the polymeric orifice plate.
  • a second metallic coating layer is positioned on the first metallic coating layer.
  • the second metallic coating layer is comprised of a second metal composition that is designed to provide added strength and rigidity.
  • Exemplary metals suitable for this purpose in the above-listed 3-layer embodiment are preferably different from the metals listed above in connection with the first metal composition, and will include nickel (Ni), titanium (Ti), and copper (Cu).
  • a third metallic coating layer is positioned on the second metallic coating layer.
  • the third metallic coating layer is comprised of a third metal composition that is designed to provide corrosion resistance and smoothness.
  • Representative metal compositions appropriate for this purpose are preferably different from the metals listed above in connection with the second metal composition, and will include gold (Au), platinum (Pt), and palladium (Pd).
  • the selected metallic layer(s) to be deposited onto the orifice plate in this embodiment it is preferred that these materials be delivered to at least the top surface of the orifice plate.
  • the selected layer(s) of metal can be applied to (1) both the top and bottom surfaces of the orifice plate; and (2) only the bottom surface of the plate as discussed below. Accordingly, application of the selected metallic layer to "at least one" of the top and bottom surfaces of the orifice plate shall encompass both of the alternatives listed above as well as the initial embodiment in which the metal composition is only applied to the top surface of the plate.
  • the completed printhead which includes the combined benefits of a non-metallic, polymeric orifice plate and an abrasion/deformation-resistant coating (e.g. made of metal or dielectric materials) may then be used to produce a thermal inkjet cartridge of improved design and efficiency.
  • a thermal inkjet cartridge of improved design and efficiency.
  • this is accomplished by providing a housing comprising an ink-retaining compartment therein.
  • the completed printhead is then affixed to the housing so that the printhead is in fluid communication with the compartment (and ink materials) within the housing.
  • the basic method associated with the invention represents an important development in inkjet technology which enables the orifice plate in the printhead to be suitably protected.
  • This method involves (1) providing an inkjet printhead as described above which includes a substrate having ink ejectors (e.g. multiple resistors) thereon and an orifice plate positioned over and above the substrate with a top surface and a plurality of openings therethrough; and (2) depositing a protective layer of coating material directly on at least one of the top surface and the bottom surface of the orifice plate.
  • the protective coating may again include (A) a selected dielectric composition; (B) diamond-like carbon which is a dielectric material with unique properties; and/or (C) one or more metal-containing layers.
  • Fig. 1 is a schematic illustration of a representative thermal inkjet cartridge unit which may be used in connection with the printhead and orifice plate of the present invention.
  • Fig. 2 is a schematic, enlarged cross-sectional view of the printhead associated with the thermal inkjet cartridge unit of Fig. 1.
  • Fig. 3 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with the invention which includes at least one protective coating layer of a dielectric composition positioned on the top surface of the orifice plate.
  • Fig. 4 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with an alternative embodiment of the invention which includes at least one protective coating layer of a dielectric composition positioned on both the top and bottom surfaces of the orifice plate.
  • Fig. 5 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with a further alternative embodiment of the invention which includes at least one protective coating layer of a dielectric composition positioned on only the bottom surface of the orifice plate.
  • Fig. 6 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with a still further alternative embodiment of the invention which includes at least one protective coating layer of a selected metal composition positioned on the top surface of the orifice plate.
  • Fig. 7 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with the embodiment of Fig. 6 in which a specific group of multiple metal-containing layers is used in connection with the protective metallic coating layer positioned on the top surface of the orifice plate.
  • Fig. 8 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with a still further alternative embodiment of the invention which includes at least one protective coating layer of a selected metal composition positioned on both the top surface and bottom surface of the orifice plate.
  • Fig. 9 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with the embodiment of Fig. 8 in which a specific group of multiple metal-containing layers is used in connection with the protective metallic coating layer positioned on the bottom surface of the orifice plate.
  • Fig. 10 is a schematic, enlarged cross-sectional view of a representative thermal inkjet printhead produced in accordance with an even further alternative embodiment of the invention which includes at least one protective coating layer of a selected metal composition positioned on only the bottom surface of the orifice plate.
  • the present invention involves a unique printhead for an inkjet printing system which includes a specialized orifice plate structure through which the ink passes.
  • the ink is then delivered to a selected print media material (e.g. paper) using conventional inkjet printing techniques.
  • Thermal inkjet printing systems are particularly suitable for this purpose.
  • the claimed printhead systems employ an orifice plate with multiple openings therethrough which is produced from a non-metallic, organic polymer film with specific examples being provided below.
  • one or more protective coating layers are applied to the top surface (and/or the bottom surface) of the orifice plate to prevent abrasion, deformation, and/or dimpling of the structure. All of these features cooperate to create a durable, long-life printhead in which a high level of print quality is maintained. Accordingly, as discussed below, the claimed invention and manufacturing processes represent a significant advance in inkjet printing technology.
  • the present invention is applicable to a wide variety of ink cartridge printheads which include (1) an upper plate member having one or more openings therethrough; and (2) a substrate beneath the plate member comprising at least one or more ink "ejectors" thereon or associated therewith.
  • ink ejector shall be defined to encompass any type of component or system which selectively ejects or expels ink materials from the printhead through the plate member.
  • Thermal inkjet printing systems which use multiple heating resistors as ink ejectors are preferred for this purpose.
  • the present invention shall not be restricted to any particular type of ink ejector or inkjet printing system as noted above.
  • inkjet devices may be encompassed within the invention including but not limited to piezoelectric drop systems of the general type disclosed in U.S. Patent No. 4,329,698 to Smith, dot matrix systems of the variety disclosed in U.S. Patent No. 4,749,291 to Kobayashi et al., as well as other comparable and functionally equivalent systems designed to deliver ink using one or more ink ejectors.
  • the specific ink-expulsion devices associated with these alternative systems e.g. the piezoelectric elements in the system of U.S. Patent No. 4,329,698 shall be encompassed within the term "ink ejectors" as discussed above. Accordingly, even though the present invention will be discussed herein with primary reference to thermal inkjet technology, it shall be understood that other systems are equally applicable and relevant to the claimed technology.
  • thermal inkjet technology which is the preferred system of primary interest
  • thermal inkjet technology which is the preferred system of primary interest
  • the claimed invention shall be not restricted to any particular type of thermal inkjet cartridge unit. Many different cartridge systems may be used in connection with the materials and processes of the invention.
  • the invention shall be prospectively applicable to any type of thermal inkjet system which uses a plurality of thin-film heating resistors mounted on a substrate as "ink ejectors" to selectively deliver ink materials, with the ink materials passing through an orifice plate having multiple openings therein.
  • the ink delivery systems schematically shown in the drawing figures listed above are provided for example purposes only and are non-limiting.
  • a representative thermal inkjet ink cartridge 10 is illustrated.
  • This cartridge is of a general type illustrated and described in U.S. Patent No. 5,278,584 to Keefe et al. and the Hewlett-Packard Journal, Vol. 39, No. 4 (August 1988), both of which are incorporated herein by reference.
  • cartridge 10 is shown in schematic format, with more detailed information regarding cartridge 10 being provided in U.S. Patent No. 5,278,584.
  • the cartridge 10 first includes a housing 12 which is preferably manufactured from plastic, metal, or a combination of both.
  • the housing 12 timber comprises a top wall 16, a bottom wall 18, a first side wall 20, and a second side wall 22.
  • the top wall 16 and the bottom wall 18 are substantially parallel to each other.
  • the first side wall 20 and the second side wall 22 are also substantially parallel to each other.
  • the housing 12 further includes a front wall 24 and a rear wall 26. Surrounded by the front wall 24, top wall 16, bottom wall 18, first side wall 20, second side wall 22, and rear wall 26 is an interior chamber or compartment 30 within the housing 12 (shown in phantom lines in Fig. 1) which is designed to retain a supply of ink therein as described below.
  • the front wall 24 further includes an externally-positioned, outwardly-extending printhead support structure 34 which comprises a substantially rectangular central cavity 50 therein.
  • the central cavity 50 includes a bottom wall 52 shown in Fig. 1 with an ink outlet port 54 therein.
  • the ink outlet port 54 passes entirely through the housing 12 and, as a result, communicates with the compartment 30 inside the housing 12 so that ink materials can flow outwardly from the compartment 30 through the ink outlet port 54.
  • a rectangular, upwardly-extending mounting frame 56 is positioned within the central cavity 50, the function of which will be discussed below. As schematically shown in Fig. 1, the mounting frame 56 is substantially even (flush) with the front face 60 of the printhead support structure 34.
  • the mounting frame 56 specifically includes dual, elongate side walls 62, 64 which will likewise be described in greater detail below.
  • a printhead fixedly secured to housing 12 of the ink cartridge unit 10 (e.g. attached to the outwardly-extending printhead support structure 34) is a printhead generally designated in Fig. 1 at reference number 80.
  • the printhead 80 actually comprises two main components fixedly secured together (with certain sub-components positioned therebetween). These components and additional information concerning the printhead 80 are provided in U.S. Patent No. 5,278,584 to Keefe et al. which again discusses the ink cartridge 10 in considerable detail and is incorporated herein by reference.
  • the first main component used to produce the printhead 80 consists of a substrate 82 preferably manufactured from silicon.
  • a plurality of individually energizable thin-film resistors 86 which function as "ink ejectors" and are preferably made from a tantalum-aluminum composition known in the art for resistor fabrication. Only a small number of resistors 86 are shown in the schematic representation of Fig. 1, with the resistors 86 being presented in enlarged format for the sake of clarity. Also provided on the upper surface 84 of the substrate 82 using conventional photolithographic techniques is a plurality of metallic conductive traces 90 which electrically communicate with the resistors 86.
  • the conductive traces 90 also communicate with multiple metallic pad-like contact regions 92 positioned at the ends 94, 95 of the substrate 82 on the upper surface 84.
  • the function of all these components which, in combination, are collectively designated herein as a resistor assembly 96 will be discussed further below.
  • Many different materials and design configurations may be used to construct the resistor assembly 96, with the present invention not being restricted to any particular elements, materials, and components for this purpose.
  • the resistor assembly 96 will be approximately 1.5 cm (0.5 inches) long, and will likewise contain 300 resistors 86 thus enabling a resolution of 600 dots per inch (“DPI").
  • the substrate 82 containing the resistors 86 thereon will preferably have a width "W 1 " (Fig. 1) which is less than the distance "D 1 " between the side walls 62, 64 of the mounting frame 56.
  • ink flow passageways 100, 102 (schematically shown in Fig. 2) are formed on both sides of the substrate 82 so that ink flowing from the ink outlet port 54 in the central cavity 50 can ultimately come in contact with the resistors 86 as discussed further below.
  • the substrate 82 may include a number of other components thereon (not shown) depending on the type of ink cartridge unit 10 under consideration.
  • the substrate 82 may likewise include a plurality of logic transistors for precisely controlling operation of the resistors 86, as well as a "demultiplexer" of conventional configuration as discussed in U.S. Patent No. 5,278,584.
  • the demultiplexer is used to demultiplex incoming multiplexed signals and thereafter distribute these signals to the various thin film resistors 86.
  • the use of a demultiplexer for this purpose enables a reduction in the complexity and quantity of the circuitry (e.g. contract regions 92 and traces 90) formed on the substrate 82.
  • Other features of the substrate 82 e.g. the resistor assembly 96
  • an orifice plate 104 is provided as shown in Fig. 1 which is used to distribute the selected ink compositions to a designated print media material (e.g. paper).
  • a rigid plate structure manufactured from an inert metal composition e.g. gold-plated nickel.
  • thermal inkjet technology has resulted in the use of non-metallic, organic polymer films to construct the orifice plate 104. As illustrated in Fig.
  • this type of orifice plate 104 will consist of a flexible film-type substrate 106 manufactured from a selected non-metallic organic polymer film having a nominal thickness of about 25 - 50 ⁇ m in a representative embodiment.
  • non-metallic shall involve a composition which does not contain any elemental metals, metal alloys, or metal amalgams.
  • organic polymer shall involve a long-chain carbon-containing structure of repeating chemical subunits.
  • the polymeric substrate 106 may be manufactured from the following compositions: polytetrafluoroethylene (e.g.
  • Teflon® polyimide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate, or mixtures thereof.
  • a representative commercial organic polymer (e.g. polyimide-based) composition which is suitable for constructing the substrate 106 is a product sold under the trademark "KAPTON” by DuPont of Wilmington, DE (USA).
  • the flexible orifice plate 104 is designed to "wrap around" the outwardly extending printhead support structure 34 in the completed ink cartridge 10.
  • the film-type substrate 106 (e.g. the orifice plate 104) further includes a top surface 110 and a bottom surface 112 (Figs. 1 and 2).
  • a top surface 110 and a bottom surface 112 Formed on the bottom surface 112 of the substrate 106 and shown in dashed lines in Fig. 1 is a plurality of metallic (e.g. copper) circuit traces 114 which are applied to the bottom surface 112 using known metal deposition and photolithographic techniques.
  • Many different circuit trace patterns may be employed on the bottom surface 112 of the film-type substrate 106 (orifice plate 104), with the specific pattern depending on the particular type of ink cartridge unit 10 and printing system under consideration.
  • a plurality of metallic e.g.
  • the contact pads 120 communicate with the underlying circuit traces 114 on the bottom surface 112 of the substrate via openings (not shown) through the substrate 106. During use of the ink cartridge 10 in a printer unit, the pads 120 come in contact with corresponding printer contacts in order to transmit electrical control signals from the printer to the contact pads 120 and circuit traces 114 on the orifice plate 104 for ultimate delivery to the resistor assembly 96. Electrical communication between the resistor assembly 96 and the orifice plate 104 will be discussed below.
  • a plurality of openings or orifices 124 Disposed within the middle region 122 of the substrate 106 used to produce the orifice plate 104 is a plurality of openings or orifices 124 which pass entirely through the substrate 104. These orifices 124 are shown in enlarged format in Fig 1. Each orifice 124 in a representative embodiment will have a diameter of about 0.01 - 0.05 mm. In the completed printhead 80, all of the components listed above are assembled (discussed below) so that each of the orifices 124 is aligned with at least one of the resistors 86 (e.g. "ink ejectors”) on the substrate 82.
  • the resistors 86 e.g. "ink ejectors
  • the claimed invention shall not be limited to any particular size, shape, or dimensional characteristics in connection with the orifice plate 104 and shall likewise not be restricted to any number or arrangement of orifices 124.
  • the orifices 124 are arranged in two rows 126, 130 on the substrate 106.
  • the resistors 86 on the resistor assembly 96 e.g. the substrate 82
  • dual rectangular windows 150, 152 are provided at each end of the rows 126, 130 of orifices 124.
  • beam-type leads 154 which, in a representative embodiment are gold-plated copper and constitute the terminal ends (e.g. the ends opposite the contact pads 120) of the circuit traces 114 positioned on the bottom surface 112 of the substrate 106/orifice plate 104.
  • the leads 154 are designed for electrical connection by soldering, thermocompression bonding, and the like to the contact regions 92 on the upper surface 84 of the substrate 82 associated with the resistor assembly 96.
  • Attachment of the leads 154 to the contact regions 92 on the substrate 82 is facilitated during mass production manufacturing processes by the windows 150, 152 which enable immediate access to these components.
  • electrical communication is established from the contact pads 120 to the resistor assembly 96 via the circuit traces 114 on the orifice plate 104.
  • Electrical signals from the printer unit can then travel via the conductive traces 90 on the substrate 82 to the resistors 86 so that on-demand heating (energization) of the resistors 86 can occur.
  • the above-listed openings e.g. orifices 1234 can be formed with a high degree of accuracy, precision, and control.
  • the claimed invention shall not be limited to any particular fabrication method, with other methods also being suitable for producing the completed orifice plate 104 including conventional ultraviolet ablation processes (e.g. using ultraviolet light in the range of about 150 - 400 nm), as well as standard chemical etching, stamping, reactive ion etching, ion beam milling, and other known processes.
  • the printhead 80 is completed by attaching the resistor assembly 96 (e.g. the substrate 82 having the resistors 86 thereon) to the orifice plate 104.
  • the resistor assembly 96 e.g. the substrate 82 having the resistors 86 thereon
  • fabrication of the printhead 80 is accomplished using tape automated bonding ("TAB") technology.
  • TAB tape automated bonding
  • the use of this particular process to produce the printhead 80 is again discussed in considerable detail in U.S. Patent No. 5,278,584.
  • background information concerning TAB technology is also generally provided in U.S. Patent No. 4,944,850 to Dion.
  • the processed substrate 106 e.g.
  • the completed orifice plate 104) which has already been ablated and patterned with the circuit traces 114 and contact pads 120 actually exists in the form of multiple, interconnected "frames" on an elongate "tape", with each "frame” representing one orifice plate 104.
  • the tape (not shown) is thereafter positioned (after cleaning in a conventional manner to remove impurities and other residual materials) in a TAB bonding apparatus having an optical alignment sub-system.
  • Such an apparatus is well-known in the art and commercially available from many different sources including but not limited to the Shinkawa Corporation of Japan (model no. IL-20).
  • the substrate 82 associated with the resistor assembly 96 and the orifice plate 104 are properly oriented so that (1) the orifices 124 are in precise alignment with the resistors 86 on the substrate 82; and (2) the beam-type leads 154 associated with the circuit traces 114 on the orifice plate 104 are in alignment with and positioned against the contact regions 92 on the substrate 82.
  • the TAB bonding apparatus then uses a "gang-bonding" method (or other similar procedures) to press the leads 154 onto the contact regions 92 (which is accomplished through the open windows 150, 152 in the orifice plate 104).
  • the TAB bonding apparatus thereafter applies heat in accordance with conventional bonding processes in order to secure these components together.
  • additional layers of material are typically present between the orifice plate 104 and resistor assembly 96 (e.g. substrate 82 with the resistors 86 thereon). These additional layers perform various functions including electrical insulation, adhesion of the orifice plate 104 to the resistor assembly 96, and the like.
  • the printhead 80 is illustrated in cross-section after attachment to the housing 12 of the cartridge unit 10, with attachment of these components being discussed in further detail below.
  • the upper surface 84 of the substrate 82 likewise includes an intermediate barrier layer 156 thereon which covers the conductive traces 90 (Fig. 1), but is positioned between and around the resistors 86 without covering them.
  • an ink vaporization chamber 160 (Fig. 2) is formed directly above each resistor 86. Within each chamber 160, ink materials are heated, vaporized, and subsequently expelled through the orifices 124 in the orifice plate 104 as indicated below.
  • the barrier layer 156 (which is traditionally produced from conventional organic polymers, photoresist materials, or similar compositions as outlined in U.S. Patent No. 5,278,584 to Keefe et al.) is applied to the substrate 82 using standard photolithographic techniques or other methods known in the art for this purpose. In addition to clearly defining the vaporization chambers 160, the barrier layer 156 also functions as a chemical and electrical insulating layer. Positioned on top of the barrier layer as shown in Fig. 2 is an adhesive layer 164 which may involve a number of different compositions including uncured poly-isoprene photoresist which is applied using conventional photolithographic and other known methods.
  • a separate adhesive layer 164 may, in fact, not be necessary if the top of the barrier layer 156 can be made adhesive in some manner (e.g. if it consists of a material which, when heated, becomes pliable with adhesive characteristics). However, in accordance with the conventional structures and materials shown in Figs. 1 - 2, a separate adhesive layer 164 is employed.
  • the printhead 80 (which includes the previously-described components) is ultimately subjected to heat and pressure within a heating/pressure-exerting station in the TAB bonding apparatus.
  • This step (which may likewise be accomplished using other heating methods including external heating of the printhead 80) causes thermal adhesion of the internal components together (e.g. using the adhesive layer 164 shown in the embodiment of Fig. 2).
  • the printhead assembly process is completed at this stage.
  • the only remaining step involves cutting and separating the individual "frames" on the TAB strip (with each "frame” comprising an individual, completed printhead 80), followed by attachment of the printhead 80 to the housing 12 of the ink cartridge unit 10. Attachment of the printhead 80 to the housing 12 may be accomplished in many different ways. However, in a preferred embodiment illustrated schematically in Fig. 2, a portion of adhesive material 166 may be applied to either the mounting frame 56 on the housing 12 and/or selected locations on the bottom surface 112 of the orifice plate 104. The orifice plate 104 is then adhesively affixed to the housing 12 (e.g. on the mounting frame 56 associated with the outwardly-extending printhead support structure 34 shown in Fig. 1).
  • adhesive materials suitable for this purpose include commercially available epoxy resin and cyanoacrylate adhesives known in the art.
  • the substrate 82 associated with the resistor assembly 96 is precisely positioned within the central cavity 50 as illustrated in Fig. 2 so that the substrate 82 is located within the center of the mounting frame 56 (discussed above and illustrated in Fig. 2).
  • the ink flow passageways 100, 102 are formed which enable ink materials to flow from the ink outlet port 54 within the central cavity 50 into the vaporization chambers 160 for expulsion from the cartridge unit 10 through the orifices 124 in the orifice plate 104.
  • a supply of a selected ink composition 174 (schematically illustrated in Fig. 1) which resides within the interior compartment 30 of the housing 12 passes into and through the ink outlet port 54 within the bottom wall 52 of the central cavity 50.
  • the ink composition 174 thereafter flows into and through the ink flow passageways 100, 102 in the direction of arrows 176, 180 toward the substrate 82 having the resistors 86 thereon (e.g. the resistor assembly 96).
  • the ink composition 174 then enters the vaporization chambers 160 directly above the resistors 86.
  • the ink composition 174 comes in contact with the resistors 86.
  • the printer system (not shown) which contains the cartridge unit 10 causes electrical signals to travel from the printer unit to the contact pads 120 on the top surface 110 of the substrate 106 of the orifice plate 104. The electrical signals then pass through vias (not shown) within the plate 104 and subsequently travel along the circuit traces 114 on the bottom surface 112 of the plate 104 to the resistor assembly 96 containing the resistors 86. In this manner, the resistors 86 can be selectively energized (e.g.
  • the ink composition 174 can then be delivered in a highly selective, on-demand basis to the selected image-receiving medium 172 to generate an image 170 thereon (fig. 1).
  • thermal inkjet cartridge of the type described above which may be used in connection with the claimed invention involves an inkjet cartridge sold by the Hewlett-Packard Company of Palo Alto, CA (USA) under the designation "51645A.”
  • inkjet cartridge sold by the Hewlett-Packard Company of Palo Alto, CA (USA) under the designation "51645A.”
  • further details concerning thermal inkjet processes in general are outlined in the Hewlett-Packard Journal , Vol. 39, No. 4 (March 1988), U.S. Patent No. 4,500,895 to Buck et al., and U.S. Patent No. 4,771,295 to Baker et al. Having discussed conventional thermal inkjet components and printing methods associated therewith, the claimed invention and its beneficial features will now be presented.
  • the claimed invention and its various embodiments enable the production of an orifice plate and a thermal inkjet printhead with an improved degree of durability.
  • durability again involves a variety of characteristics including abrasion and deformation-resistance, as well as enhanced structural integrity. Both abrasion and deformation of the orifice plate can occur during contact between the orifice plate and a variety of structures encountered during the printing process including wiper-type structures made of rubber and the like which are typically incorporated within conventional printer units. Deformation and abrasion of the orifice plate not only decreases the overall life of the printhead and ink cartridge, but likewise causes a deterioration in print quality over time.
  • deformation of the orifice plate can result in the generation of printed images which are distorted and indistinct with a loss of resolution.
  • the term "durability" also includes a situation in which the orifice plate is sufficiently rigid to avoid problems associated with "dimpling".
  • Ruffling traditionally involves a situation in which orifice plates made of non-metallic, polymeric materials undergo deformation or other deviations at the orifice exits which are caused by physical abrasion. Deformation of the polymeric material around the orifice exits may cause misdirected droplets of ink to be expelled. Dimpling is likewise associated with the non-planar orifice plate surface during assembly of the printhead or the non-planar mounting of the printhead to the cartridge unit.
  • the resultant orifices will exhibit trajectory errors due to the non-planar orifice plate. This is because the drops will assume trajectories that are roughly perpendicular to the surface of the orifice member immediately surrounding the orifice. Therefore ruffling and dimpling present a substantial number of problems including misdirection of the ink droplets expelled from the printhead which results in improperly-printed images. Accordingly, all of these factors are important in producing a completed inkjet printing system which has a long life-span and is capable of producing clear and distinct printed images.
  • FIG. 3 an enlarged, schematically-illustrated thermal inkjet printhead 200 produced in accordance with a first embodiment of the invention is illustrated
  • Reference numbers in Fig. 3 which correspond with those in Fig. 2 signify parts, components, and elements that are common to the printheads shown in both figures. Such common elements are discussed above in connection with the printhead 80 of Fig. 2, with the discussion of these elements being incorporated by reference with respect to the printhead 200 illustrated in Fig. 3.
  • the substrate 106 used to produce the orifice plate 104 in the embodiment of Fig. 3 is non-metallic (e.g. non-metal-containing) and consists of a selected organic polymer film.
  • non-metallic shall involve a composition which does not contain any elemental metals, metal alloys, or metal amalgams.
  • organic polymer shall encompass a long-chain carbon-containing structure of repeating chemical subunits.
  • Representative organic polymers suitable for producing the substrate 106 associated with the orifice plate 104 in the embodiment of Fig. 3 include polytetrafluoroethylene (e.g. Teflon®), polyimide, polymethylmethacrylate, polycarbonate, polyester, polyamide, polyethylene-terephthalate, or mixtures thereof.
  • a representative commercial organic polymer e.g.
  • polyimide-based composition which may be used for this purpose is a product sold under the trademark "KAPTON” by DuPont of Wilmington, DE (USA).
  • KAPTON a product sold under the trademark "KAPTON” by DuPont of Wilmington, DE (USA).
  • an additional material layer is provided on the top surface 110 of the substrate 106 used to produce the orifice plate 104 which provides considerable functional benefits (e.g. strength, durability, rigidity, dimple-avoidance, uniform wettability, and the like).
  • a protective layer of coating material 202 is deposited directly on at least a portion (e.g. all or part) of the top surface 110 of the substrate 106 associated with the orifice plate 104.
  • the coating material 202 will consist of at least one dielectric composition, with the term "dielectric" being defined to involve a material that is electrically-insulating and substantially non-conductive.
  • dielectric materials suitable for this purpose include but are not limited to silicon nitride (Si 3 N 4 ), silicon dioxide (SiO 2 ), boron nitride (BN), silicon carbide (SiC), and a composition known as "silicon carbon oxide" which is commercially available under the name Dylyn® from Advanced Refractory Technologies, Inc. of Buffalo, NY.
  • the layer of coating material 202 will be provided on the substrate 106 at or near the middle region 122 (Fig. 1) of the orifice plate 104 which is again defined to involve the region immediately adjacent to and surrounding the orifices 124 through the orifice plate 104.
  • the entire top surface 110 (or any other selected portion) of the substrate 106/orifice plate 104 could be covered with the protective layer of coating material 202, following by etching of the coating material 202 where needed (e.g. using conventional reactive ion etching, chemical etching, or other known etching techniques).
  • etching of the coating material 202 e.g. using conventional reactive ion etching, chemical etching, or other known etching techniques.
  • the substrate 106 used to produce the orifice plate 104 in the system of Fig. 3 is non-metallic (e.g. non-metal-containing) and consists of a selected organic polymeric film-type composition as discussed above.
  • the use of this particular material to manufacture an orifice plate represents a departure from conventional technology which involved the use of metallic (e.g. gold-plated nickel) structures. It is an important inventive development in this case to apply a selected dielectric composition directly onto a non-metallic organic polymer orifice plate 104.
  • the present invention shall not be limited to any particular process steps or techniques.
  • the following methods can be used to deliver (e.g. directly deposit) the selected dielectric coating material 202 onto the substrate 106: (1) plasma vapor deposition ("PVD”); (2) chemical vapor deposition (“CVD”); (3) sputtering; and (4) delivery systems.
  • PVD plasma vapor deposition
  • CVD chemical vapor deposition
  • Techniques (1) - (3) are well known in the art and described in a book by Elliott, D.J., entitled Integrated Circuit Fabrication Technology , McGraw-Hill Book Company, New York, 1982 (ISBN No. 0-07-019238-3), pp.
  • PVD processes involve a technique in which gaseous materials are altered to convert them into vaporized chemical compositions using an rf-based system, These reactive gaseous species are then employed to vapor-deposit the materials under consideration. Further information concerning plasma vapor deposition processes is presented in U.S. Patent No. 4,661,409 to Kieser et al.
  • CVD methods are similar to PVD techniques and involve a situation in which coatings of selected materials can be formed on a substrate in a system which thermally decomposes various gases to yield a desired product.
  • gaseous materials which may be employed to produce a coating of silicon nitride (Si 3 N 4 ) on a substrate include SiH 4 and NH 3 .
  • SiH 4 and CO may be used to yield a coating layer of silicon dioxide (SiO 2 ) on a substrate.
  • SiO 2 silicon dioxide
  • FIG. 4 Further information concerning CVD processes is presented in U.S. Patent No. 4,740,263 to Imai et al.
  • Sputtering techniques involve ionized gas materials which are produced using a high energy electromagnetic field and thereafter delivered to a supply of the material to be deposited. As a result, this material is dispersed onto a selected substrate.
  • Other conventional processes in addition to those listed above which may be employed to deposit the selected layer of dielectric coating material 202 include (A) ion beam deposition methods; (B) thermal evaporation techniques; and the like.
  • the selected dielectric composition as the protective layer of coating material 202 may be undertaken at any time during the printhead production process which, as noted above, makes extensive use of tape automated bonding (e.g. "TAB") methods generally disclosed in U.S. Patent No. 4,944,850 to Dion.
  • TAB tape automated bonding
  • the claimed invention and fabrication process shall not be limited to any particular sequence and order of steps.
  • the selected coating material 202 will be applied to the orifice plate 104 by one of the above-listed techniques during the fabrication process associated with the orifice plate 104.
  • coating will preferably occur prior to attachment of the substrate 106 to the resistor assembly 96 and before laser ablation of the substrate 106 to form the orifices 124 through the orifice plate 104.
  • the layer of dielectric coating material 202 After the layer of dielectric coating material 202 is applied, conventional laser ablation processes can then be performed to create the orifices 124 in the orifice plate 104 as discussed above. However, in certain cases as determined by preliminary testing, the layer of coating material 202 can be applied after the orifices 124 have been formed in the substrate 106.
  • FIG. 4 A further modification of the printhead 200 is illustrated in Fig. 4 with reference to printhead 300.
  • a protective layer of coating material 302 may also be applied to the bottom surface 112 of the substrate 106 used to produce the orifice plate 104, along with the layer of coating material 202 deposited on the top surface 110 of the substrate 106.
  • This additional layer of coating material 302 will optimally involve the same dielectric materials listed above in connection with the primary layer of coating material 202.
  • all of the other information provided above in connection with the coating material 202 is equally applicable to the additional layer of coating material 302. The only difference between the embodiments of Fig.
  • Fig. 4 is the presence of the layer of coating material 302 which is optimally applied to the bottom surface 112 of the substrate 106 at the same time that the layer of coating material 202 is deposited onto the top surface 110 of the substrate 106.
  • an orifice plate 104 is produced in which both the top and bottom surfaces 110, 112 are coated with a strength-imparting, dimple-resisting dielectric material which further enhances the structural integrity of the entire printhead 300.
  • the printhead 300 shown in Fig. 4 may be further modified to eliminate the layer of coating material 202 from the top surface 110 of the orifice plate 104.
  • This "modified" printhead is designated at reference number 400 in Fig. 5.
  • the modified orifice plate 104 discussed above and shown in Fig. 5 which only includes the layer of coating material 302 on the bottom surface 112 may be useful in connection with lower-stress situations where only one layer of strength-imparting material on the orifice plate 104 is necessary.
  • a specific dielectric material which may be employed as the protective layer of coating material 202 and/or coating material 302 on the orifice plate 104 in the embodiments of Figs. 3- 5 is a composition known as "diamond-like carbon" or "DLC".
  • This material is particularly well-suited for this purpose in view of its strength, flexibility, resilience, high modulus for stiffness, favorable adhesion characteristics, and inert character.
  • DLC is discussed specifically in U.S. Patent No. 4,698,256 to Giglia, and particularly involves a very hard and durable carbon-based material with diamond-like characteristics.
  • DLC On an atomic level, DLC (which is also characterized as "amorphous carbon") consists of carbon atoms molecularly attached using sp 3 bonding although sp 2 bonds may also be present. As a result, DLC exhibits many traits of conventional diamond materials (e.g. hardness, inertness, and the like) while also having certain characteristics associated with graphite (which is dominated by sp 2 bonding). It also adheres in a strong and secure manner to the overlying and underlying materials (e.g. polymeric barrier layers and the like) which are typically present in thermal inkjet printheads. When applied to a substrate, DLC is very smooth with considerable hardness and abrasion resistance.
  • the completed printheads 200, 300, 400 shown in Figs. 3 - 5 which include the combined benefits of a non-metallic polymer-containing orifice plate 104 and an abrasion resistant, highly durable dielectric coating material 202, 302 thereon may then bemused to produce a thermal inkjet cartridge unit of improved design and effectiveness.
  • This is accomplished by securing the completed printhead 200 (or printheads 300, 400) to the housing 12 of the inkjet cartridge 10 shown in Fig. 1 in the same manner discussed above in connection with attachment of the printhead 80 to the housing 12.
  • the printhead 200 (or printheads 300, 400) will be in fluid communication with the internal chamber 30 inside the housing 12 which contains the selected ink composition 174.
  • This basic method involves: (1) providing an inkjet printhead which includes a substrate having multiple ink ejectors (e.g. resistors) thereon and an orifice plate positioned over the substrate with a top surface, a bottom surface, and a plurality of orifices therethrough; and (2) depositing a protective, strength-imparting layer of coating material directly onto any portion of the top and/or bottom surfaces of the orifice plate.
  • the protective coating in the embodiments of Fig. 3 - 5 (which are related by the use of common coating materials) again involves a selected dielectric composition, with DLC providing excellent results.
  • This method for protecting an orifice plate on a printhead may be accomplished in accordance with the techniques discussed above or through the use of routine modifications to the listed processes. Regardless of which steps are actually employed to manufacture the improved printheads 200, 300, 400 of Figs. 3 - 5, the claimed method in its broadest sense (which involves applying a protective dielectric coating to an orifice plate in a printhead) represents an advance in the art of thermal inkjet technology.
  • FIG. 6 Another alternative printhead design is illustrated schematically and in enlarged format in Fig. 6 at reference number 500.
  • This embodiment likewise provides the same benefits listed above, namely, improved durability (e.g. abrasion and deformation-resistance). However, as discussed in detail below, it involves the deposition of at least one layer of a selected metal composition directly onto the top surface 110 of the substrate 106 used to produce the orifice plate 104.
  • the claimed invention shown in Fig. 6 shall not be restricted to any particular metal materials for this purpose, with a wide variety of metals being suitable for use including chromium (Cr), nickel (Ni), palladium (Pd), gold (Au), titanium (Ti), tantalum (Ta), aluminum (Al), and mixtures (e.g.
  • the term "metal composition” shall be defined to encompass an elemental metal, a metal alloy, or a metal amalgam.
  • the phrase "at least one" in connection with the metal-containing layer shown in Fig. 6 shall signify a situation in which one or multiple layers of a selected metal composition can be employed, with the final structure associated with the printhead 500 being determined by preliminary pilot testing. Accordingly, this embodiment of the present invention shall not be restricted to any particular number or arrangement of metal-containing layers on the orifice plate 104, wherein one or more layers will function effectively.
  • Fig. 6 a cross-sectional, schematic, and enlarged view of the printhead 500 is provided.
  • Reference numbers in Fig. 6 which correspond with those in Fig. 2 signify parts, components, and elements that are common to the printheads shown in both figures. Such common elements are described above in connection with the printhead 80 of Fig. 2, with the discussion of these elements being incorporated by reference with respect to the printhead 500 illustrated in Fig. 6.
  • the substrate 106 used to produce the orifice plate 104 in the embodiment of Fig. 6 is preferably non-metallic (e.g. non-metal-containing) and consists of a selected organic polymer film.
  • non-metallic shall involve a composition which does not contain any elemental metals, metal alloys, or metal amalgams.
  • organic polymer shall encompass a long-chain carbon-containing structure of repeating chemical subunits.
  • a representative commercial organic polymer e.g.
  • polyimide-based composition which may be used for this purpose is a product sold under the trademark "KAPTON” by DuPont of Wilmington, DE (USA).
  • KAPTON a product sold under the trademark "KAPTON” by DuPont of Wilmington, DE (USA).
  • the metallic layer of coating material is designated at reference number 502.
  • the metallic composition associated with the layer of coating material 502 shall not be restricted to any particular metal materials for this purpose, with a wide variety of metals being suitable for use including chromium (Cr), nickel (Ni), palladium (Pd), gold (Au), titanium (Ti), tantalum (Ta), aluminum (Al), and mixtures (e.g. compounds) thereof as previously noted.
  • Deposition of the metallic coating material 502 is accomplished using conventional techniques which are known in the art for this purpose including all of those listed above in the embodiments of Figs. 3 - 5. These methods include (1) plasma vapor deposition ("PVD”); (2) chemical vapor deposition (“CVD”); (3) sputtering; (4) ion beam deposition methods; and (5) thermal evaporation techniques. Definitions, information, and supporting background references regarding these techniques are discussed above and incorporated by reference in this section of the present disclosure. The selection of any given deposition method will be determined by preliminary pilot studies in accordance with the specific materials selected for use in the printhead 500. Likewise, to achieve optimum results, the metallic layer of coating material 502 will have a thickness of about 200 - 5000 angstroms, with the exact thickness level for a given situation again being determined by preliminary analysis.
  • Fig. 6 incorporates a single layer of coating material 502.
  • the term "at least one" as it applies to the metallic coating layer(s) delivered to the top surface 110 of the orifice plate 104 shall again be defined to involve one or more individual layers of material.
  • Fig. 7 involves a modification of printhead 500 shown at reference number 600 in which the basic layer of coating material 502 actually consists of three separate metal-containing sub-layers which each function as individual layers of coating material.
  • the protective layer of metallic coating material 502 initially consists of a first layer (e.g.
  • the first layer of metal 604 is designed to function as a "seed" layer which effectively bonds the other metal sub-layers 606, 610 to the orifice plate 104 as shown in Fig. 7.
  • Metal compositions selected for this purpose should be capable of strong adhesion to the organic polymers used in connection with the orifice plate 104.
  • Representative metals suitable for use in the first layer of metal 604 in the three-layer embodiment of Fig. 7 involve a first metal composition selected from the group consisting of chromium (Cr), nichrome, tantalum nitride, tantalum-aluminum, and mixtures thereof.
  • the first layer of metal 604 is deposited directly on the top surface 110 of the substrate 106/orifice plate 104 using one or more of the deposition techniques listed above in connection with the basic layer of coating material 502.
  • the top surface 110 of the substrate 106 is pre-treated to remove adsorbed species and contaminants therefrom. Pre-treatment may be accomplished using known techniques including but not limited to conventional ion bombardment processes.
  • the first layer of "seed" metal 604 will have a uniform thickness of about 25 - 600 angstroms.
  • a second layer (e.g. sub-layer) of metal 606 is deposited directly on top of the first layer of metal 604 using one or more of the previously-described deposition techniques.
  • the second layer of metal 606 is designed to impart strength, rigidity, anti-dimpling characteristics, and deformation-resistance to the orifice plate 104.
  • Representative metals suitable for this purpose involve a second metal composition selected from the group consisting of titanium (Ti), nickel (Ni), copper (Cu) and mixtures thereof, with the second layer of metal 606 having a preferred thickness of about 1000 - 3000 angstroms.
  • Application of the third layer of metal 610 is again accomplished using one or more of the above-described deposition techniques.
  • the third layer of metal 610 is designed to impart both corrosion resistance and reduced friction to the completed orifice plate 104 (especially with respect to the first and second layers of metal 604, 606 which are positioned beneath the third layer of metal 610).
  • the third layer of metal 610 will be about 100 - 300 angstroms thick.
  • the resulting protective layer of metallic coating material 502 shown in Figs. 6 - 7 (which, in the non-limiting embodiment of Fig. 7, involves a composite of multiple (e.g. three) metal layers 604, 606, 610) provides the benefits listed above, namely, improved abrasion resistance, dimpling control, and uniform wettability.
  • any number of metal-containing layers e.g. one or more may be deposited on the top surface 110 of the substrate 106 associated with the orifice plate 104.
  • titanium (Ti) has excellent "seed" and strength-imparting characteristics.
  • a single increased-thickness layer of titanium may therefore be used instead of the dual layers 604, 606 listed above, followed by application of the final layer 610 onto the titanium layer.
  • the layer of coating material 502 have a total (combined) thickness level of about 200 - 5000 angstroms. Again, this value may be varied in accordance with preliminary tests involving the specific printhead components of interest.
  • the protective layer of metallic coating material 502 to the substrate 106 associated with the orifice plate 104 may be undertaken at any time during the printhead production process which, as noted above, makes extensive use of tape automated bonding (e.g. "TAB") methods disclosed in U.S. Patent No. 4,944,850 to Dion.
  • TAB tape automated bonding
  • the claimed invention and fabrication process shall not be restricted to any particular processing steps and order in which these steps are taken.
  • the metal composition(s) used to produce the protective layer of coating material 502 (whether one or more layers are involved) will be applied to the polymeric substrate 106/orifice plate 104 prior to attachment of the substrate 106 to the resistor assembly 96.
  • laser ablation will optimally occur after deposition of the first or "seed" layer of metal 604 and before delivery of the second and third layers of metal 606, 610 onto the first layer of metal 604.
  • laser ablation will take place after metal delivery in situations where the deposited metal to be ablated has a thickness of less than about 400 angstroms.
  • the claimed invention shall not be restricted to any specific production methods which shall be determined in accordance with a routine preliminary analysis.
  • a protective layer of metallic coating material 702 is applied to the bottom surface 112 of the substrate 106 used to produce the orifice plate 104.
  • This additional layer of coating material 702 will involve the same metal compositions previously described in connection with the primary layer of coating material 502 (e.g. one or more individual layers of the representative metals listed above).
  • all of the other information provided above in connection with the layer of coating material 502 is equally applicable to the additional layer of coating material 702. The only difference of consequence between the embodiments of Fig. 6 and Fig.
  • the layer of metallic coating material 502 on the top surface 110 of the orifice plate 104 in the embodiment of Fig. 8 may also involve the multi-layer coating configuration illustrated in Fig. 7 wherein three separate metal "sub-layers" 604, 606, 610 are employed for this purpose.
  • a modified printhead 800 which involves the use of sequentially-applied multiple metallic layers in connection with the layer of coating material 702. Specifically a primary layer (e.g. sub-layer) of metal 804 is deposited directly on the bottom surface 112 of the substrate 106/orifice plate 104. The primary layer of metal 804 is designed to function as a "seed" layer which effectively bonds the other metal sub-layers 806, 810 (discussed below) to the orifice plate 104 as shown in Fig. 9.
  • a primary layer e.g. sub-layer
  • the primary layer of metal 804 is designed to function as a "seed" layer which effectively bonds the other metal sub-layers 806, 810 (discussed below) to the orifice plate 104 as shown in Fig. 9.
  • Metal compositions selected for this purpose should be capable of strong adhesion to the organic polymers used to form the orifice plate 104.
  • Representative metals suitable for use in the primary layer of "seed" metal 804 preferably involve the same compositions listed above in connection with the first layer of metal 604 in the embodiment of Fig. 7.
  • the primary layer of metal 804 will optimally consist of a first metal composition selected from the group consisting of chromium (Cr), nichrome, tantalum nitride, tantalum-aluminum, and mixtures thereof.
  • the primary layer of metal 804 is deposited directly on the bottom surface 112 of the substrate 106 using one or more of the deposition techniques listed above.
  • the primary layer of metal 804 Prior to deposition of the primary layer of metal 804 onto the substrate 106, ideal results will be achieved if the bottom surface 112 of the substrate 106 is pre-treated to remove adsorbed species and contaminants. Pre-treatment may be accomplished using known techniques including but not limited to conventional ion bombardment processes. In a preferred embodiment, the primary layer of metal 804 will have a uniform thickness of about 25 - 600 angstroms.
  • a secondary layer (e.g. sub-layer) of metal 806 (Fig. 9) is deposited directly onto the primary layer of metal 804 using one of the previously-described deposition techniques.
  • the secondary layer of metal 806 is designed to impart additional strength, rigidity, anti-dimpling characteristics, and deformation-resistance to the orifice plate 104.
  • Representative metals suitable for this purpose are preferably the same as those listed above in connection with the second layer of metal 606 in the embodiment of Fig. 7.
  • the secondary layer of metal 806 in Fig. 9 will optimally consist of a second metal composition selected from the group consisting of nickel (Ni), titanium (Ti), copper (Cu), and mixtures thereof, with the secondary layer of metal 806 having a preferred thickness of about 1000 - 3000 angstroms.
  • Application of the tertiary layer of metal 810 is again accomplished using one or more of the above-described deposition techniques.
  • the tertiary layer of metal 810 is primarily designed to impart corrosion resistance to the completed orifice plate 104 (especially with respect to the first and second layers of metal 804, 806 which are positioned above the tertiary layer of metal 810).
  • the tertiary layer of metal 810 will be about 100 - 300 angstroms thick.
  • any number of metal-containing layers e.g.
  • one or more) may be deposited on the bottom surface 112 of the substrate 106 associated with the orifice plate 104.
  • titanium Ti
  • Ti has excellent "seed" and strength-imparting characteristics.
  • a single increased-thickness layer of titanium may therefore be used instead of the dual layers 804, 806 listed above, followed by application of the final layer 810 onto the titanium layer.
  • the metallic coating material 502 on the top surface 110 of the orifice plate 104 in the embodiment of Fig. 9 may also involve the multi-layer coating configuration shown in Fig. 7 in which three separate metal "sub-layers" 604, 606, 610 are employed for this purpose .
  • the printheads 700, 800 of Figs. 8 - 9 may be further modified to produce an additional printhead 900 illustrated in Fig. 10.
  • printhead 900 the main layer of metallic coating material 502 on the top surface 110 of the orifice plate 104 is eliminated.
  • the additional layer of coating material 702 on the bottom surface 112 of the substrate 106/orifice plate 104 will be present as shown in Fig. 10.
  • the modified orifice plate 104 discussed above and shown in Fig. 10 which only includes the coating material 702 on the bottom surface 112 may be useful in connection with lower-stress situations in which only one layer of strength-imparting material on the orifice plate 104 is necessary.
  • the completed printheads 500, 600, 700, 800, 900 shown in Figs. 6 - 10 which include the combined benefits of a non-metallic polymer-containing orifice plate 104 and an abrasion resistant, metal-containing layer of coating material 502, 702 thereon may then be used to produce a thermal inkjet cartridge unit of improved design and effectiveness. This is accomplished by securing the completed printhead 500 (or printheads 600 - 900) to the housing 12 of the inkjet cartridge 10 shown in Fig. 1 in the same manner discussed above in connection with attachment of the printhead 80 to the housing 12.
  • the printhead 500 (or the other printheads 600 - 900 listed above) will be in fluid communication with the internal chamber 30 inside the housing 12 which contains the selected ink composition 174. Accordingly, the discussion provided above regarding attachment of the printhead 80 to the housing 12 is equally applicable to attachment of the printhead 500 (or printheads 600 - 900) in position to produce a completed thermal inkjet cartridge 10 with improved durability characteristics. It is again important to emphasize that the claimed printheads 500 - 900 and the benefits associated therewith are applicable to a wide variety of different thermal inkjet cartridge systems (or other types of inkjet delivery units), with the present invention not being restricted to any particular cartridge designs or configurations.
  • a representative cartridge system which may be employed in combination with the printheads 500 - 900 is disclosed in U.S. Patent No. 5,278,584 to Keefe et al. and is commercially available from the Hewlett-Packard Company of Palo Alto, CA (USA) - product no. 51645A. It is also important to note that the previously-discussed metal compositions may be applied to all or part of the selected orifice plate structure at any location on the top or bottom surfaces thereof for the above-described purposes and additional benefits. Thus, the claimed invention shall not be restricted to any locations or portions of the orifice plate on which the selected metal compositions are applied.
  • the basic method associated with the embodiments of Figs. 6 - 10 represents an important development in inkjet printing technology.
  • This basic method involves: (1) providing an inkjet printhead which includes a substrate having multiple ink ejectors (e.g. resistors) thereon and an orifice plate positioned over the substrate with a top surface, a bottom surface, and a plurality of orifices therethrough; and (2) depositing a protective layer of coating material directly on at least one of the top surface and bottom surface of the orifice plate.
  • the protective coating in the embodiments of Figs. 6 - 10 (which are related by the use of common coating materials) again involves a selected metal composition.
  • This method for protecting a non-metallic, polymer-containing orifice plate on a printhead may be accomplished in accordance with the techniques discussed above or through the use of routine modifications to the listed processes. Regardless of which steps are actually employed to manufacture the improved printheads 500 - 900 of Figs. 6 - 10, the claimed method in its broadest sense (which, in a preferred embodiment, involves applying a protective metallic coating to a non-metallic, organic polymer-containing orifice plate) represents an advance in the art of inkjet technology.
  • the printheads and orifice plates of the present invention are: (1) dimensionally stable; (2) dimpling and abrasion-resistant; (3) resistant to deformation; and (4) have desirable [uniform] ink wetting characteristics. These goals are accomplished by the unique printhead designs discussed above which represent a significant advance in the art of inkjet technology. Having herein described preferred and optimum embodiments of the present invention, it is anticipated that modifications may be made thereto which nonetheless remain within the scope of the invention. For example, the invention shall not be limited to any particular manufacturing methods, dimensions, and other production parameters in connection with the claimed printheads, orifice plates, ink cartridges, and methods. Accordingly, the present invention shall only be construed in connection with the following claims:

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US08/921,678 US6155675A (en) 1997-08-28 1997-08-28 Printhead structure and method for producing the same

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1493570A1 (fr) * 2002-04-10 2005-01-05 Sony Corporation Tete d'injection de liquide, dispositif d'injection de liquide et procede de fabrication de tete d'injection de liquide
EP1493570A4 (fr) * 2002-04-10 2007-03-14 Sony Corp Tete d'injection de liquide, dispositif d'injection de liquide et procede de fabrication de tete d'injection de liquide
US7461451B2 (en) 2002-04-10 2008-12-09 Sony Corporation Method for manufacturing liquid discharge head
EP1525983A1 (fr) * 2003-10-23 2005-04-27 Hewlett-Packard Development Company, L.P. Plaque à orifices et procédé de fabrication d'une plaque à orifices pour dispositif d'éjection de liquide
US7807079B2 (en) 2003-10-23 2010-10-05 Hewlett-Packard Development Company, L.P. Method of forming orifice plate for fluid ejection device
EP1940626B1 (fr) * 2005-10-28 2015-01-14 Sicpa Holding Sa Procédé d impression à jet d encre pour utilisation dans des systèmes de point de vente
WO2013171978A1 (fr) * 2012-05-16 2013-11-21 Canon Kabushiki Kaisha Tête de rejet de liquide
CN104284780A (zh) * 2012-05-16 2015-01-14 佳能株式会社 液体排出头
WO2014042625A1 (fr) * 2012-09-12 2014-03-20 Hewlett-Packard Development Company, L.P. Revêtement de protection de tête d'imprimante
US9597873B2 (en) 2012-09-12 2017-03-21 Hewlett-Packard Development Company, L.P. Printhead protective coating

Also Published As

Publication number Publication date
EP1306217A1 (fr) 2003-05-02
DE69814267D1 (de) 2003-06-12
EP0899110A3 (fr) 2000-07-12
KR100556008B1 (ko) 2006-06-21
DE69814267T2 (de) 2004-03-25
EP1306215A1 (fr) 2003-05-02
US6155675A (en) 2000-12-05
KR19990023940A (ko) 1999-03-25
EP0899110B1 (fr) 2003-05-07

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