EP0882108A1 - Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur - Google Patents

Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur

Info

Publication number
EP0882108A1
EP0882108A1 EP97907743A EP97907743A EP0882108A1 EP 0882108 A1 EP0882108 A1 EP 0882108A1 EP 97907743 A EP97907743 A EP 97907743A EP 97907743 A EP97907743 A EP 97907743A EP 0882108 A1 EP0882108 A1 EP 0882108A1
Authority
EP
European Patent Office
Prior art keywords
adhesive
polyester
polyamide
epoxy
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97907743A
Other languages
German (de)
English (en)
Inventor
Thomas F. Gardeski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeneca Inc
Original Assignee
ICI Americas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ICI Americas Inc filed Critical ICI Americas Inc
Publication of EP0882108A1 publication Critical patent/EP0882108A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the present invention surprisingly and unexpectedly provides an adhesive which addresses the above-described problems and shortcomings in the art.
  • an adhesive which is a reaction product as described hereinafter.
  • the initial reaction provides for linking the acid terminating groups of a high molecular weight thermoplastic polyamide to those of a high molecular weight thermoplastic polyester with an aziridine component to provide for amide linkage sites between the two components in addition to those already present in the polyamide.
  • a second reaction is carried out by reacting the polyamide/aziridine/polyester sites and the already inco ⁇ orated polyamide sites ofthe polyamide component with an epoxy, such as bis epi epoxy, thus forming a block copolymer of long segments of polyamide polyester/polyamide in which the polyamide and polyamide/polyester sites are reacted with epoxy in a parallel fashion.
  • a third reaction carried out is that of a glycidoxyalkoxysilane, which is inco ⁇ orated as a bond enhancer, with the amide and formed polyamide aziridine/polyester linkages to provide for the adhesive ofthe present invention.
  • the first reaction is accomplished at room temperature, while the second and third steps are carried out at temperatures of 300° to 350°F to achieve full cure.
  • a cast or coated film, to which the adhesive ofthe present invention has been applied can be stored at room temperature while awaiting processing into the final desired laminate or coverlay configuration.
  • another aspect ofthe present invention is directed to a process of making the adhesive ofthe present invention which comprises linking a high molecular weight acid terminated thermoplastic polyamide resin with a high molecular weight polyester resin via an aziridine which forms polyamide and polyamide/aziridine/polyester linkages, then reacting with an epoxy and a silane via the amide groups in the polyamide and the formed polyamide/aziridine/polyester linkage.
  • a further aspect ofthe present invention is an article having at least two surfaces bonded together by applying to said surfaces the adhesive ofthe present invention. Accordingly, the invention also encompasses composite or laminate articles having surfaces bonded together by the present adhesive.
  • the adhesive ofthe present invention advantageously possesses excellent encapsulating properties with regard to circuit conductors while also unexpectedly providing virtually unmeasurable flow onto metal pads. Flow of adhesives onto pads requires manual cleaning with solvents which is very time consuming.
  • the present adhesive advantageously avoids this costly step and thus advantageously speeds up the process of flexible circuit manufacturing.
  • the adhesive ofthe present invention is thus su ⁇ risingly vastly superior to any other adhesive currently available for use in circuitry processing.
  • An extremely high temperature resistant, flexible, and high bond strength adhesive is su ⁇ risingly provided by way ofthe present invention.
  • the adhesive can be advantageously used to enhance the properties of polyester films such as polyethylene terephthalate and polyethylene naphthalate films for use in flexible and rigid board circuitry applications.
  • the present invention also provides an excellent adhesive for films such as polyimide for the same applications. This allows the films to be used at temperatures which are capable of withstanding high temperatures, which to date has been limited by currently available adhesives. Along with being useful as a laminating adhesive, the adhesive is stable at room temperature and thus can be advantageously stored as a free film bond ply adhesive or coated on a film for future conversion into a laminate or coverlaying of electronic circuitry.
  • the present invention provides an adhesive having excellent encapsulating and dimensional stability properties, which adhesive comprises a reaction product of a block copolymer of polyamide and polyamide/aziridine/polyester linkages with an epoxy and a silane.
  • Dimensional Stability denotes the amount of shrinkage in the Machine and Transverse Direction of a film or substrate after being exposed to a given temperature for a given period of time, e.g., measurement ofthe film in both directions before and after exposure to 150°C for 30 minutes with log results in % change.
  • a process of making the adhesive ofthe present invention comprises linking a high molecular weight polyamide component with a high molecular weight polyester component via aziridine as follows: H H
  • a second step comprises reacting the polyamide linkage and the formed polyamide/aziridine/polyester linkage with an epoxy as follows:
  • the third step for the process of making the present adhesive comprises reacting a silane, such as a glycidoxyalkoxysilane, e.g., glycidoxypropyltrimethoxysilane, with the high molecular weight polyamide and the formed linkage between the high molecular weight polyamide and the high molecular weight polyester by result ofthe aziridine reaction.
  • a silane such as a glycidoxyalkoxysilane, e.g., glycidoxypropyltrimethoxysilane
  • minor repeating unit constitutes from about 1% to about 5% ofthe total weight ofthe copolymer and the major repeating unit constitutes from about 95 to about 99% ofthe weight ofthe adhesive copolymer.
  • R, R ⁇ X and Y are also defined as described previously.
  • high molecular weight polyamide is meant a polyamide having a molecular weight of at least 5,000; particularly from about 5,000 to about 100,000; and more particularly from about 20,000 to about 50,000.
  • high molecular weight polyester is meant a polyester having a molecular weight of at least 10,000; particularly from about 10,000 to about 200,000; and more particularly from about 20,000 to about 50,000.
  • silanes examples include glycidoxyalkoxysilanes such as glycidoxypropylmethyldiethoxysilane and glycidoxypropyldimethylethoxysilane.
  • Heptafluoroisopropoxyproplymethylcidhlorosilane is also suitable.
  • Glycidoxypropyltrimethoxysilane is especially preferred.
  • Non-limiting examples of suitable types of polyamides include: Versamid 744 Softening point of 125°C, Versamid 744 Softening point of
  • the novel adhesive ofthe present invention preferably comprises a reaction product of an acid terminated thermoplastic polyamide component such as that sold by Henkel under the name of Versamid 972, a polyester/epoxy composition containing a glycidoxypropyltrimethoxysilane sold by Morton under the trade name of Adcote 76PI, and an aziridine component, such as that sold by EIT, Inc. under the trade name of XAMA 7.
  • an acid terminated thermoplastic polyamide component such as that sold by Henkel under the name of Versamid 972
  • an aziridine component such as that sold by EIT, Inc. under the trade name of XAMA 7.
  • the adhesive ofthe present invention provides a fully crosslinked network without the evolution of volatile by-products to provide an advanced laminating, coverlay, and bond ply adhesive for film to film, foil to film, foil to foil, and hardboard to hardboard applications.
  • the adhesive has excellent flexibility, superior bond strength, solder resistance, moisture and chemical resistance and superior Z-axis stability along with continuous and/or deferred processing capability.
  • the adhesive can be stored for long periods of time, e.g., up to one year, prior to the implementation ofthe above-described curing process.
  • the adhesive can be coated on an insulating film or release substrate by a continuous process and stored at room temperature indefinitely prior to further processing, or laminated in-line to various foils or films.
  • the adhesive ofthe present invention can be advantageously cured without the evolution of volatile by-products to provide a flexible bond-ply with superior overall properties to any currently available system with the added advantage of excellent Z-axis stability.
  • a mixture was prepared from the following components: A high molecular weight acid terminated thermoplastic polyamide resin at 20% solids in n-Propanol sold by Henkel under the trade name of Versamid 972, a mixture of high molecular weight polyester with residual acid functionality, bis-epi flexible epoxy, and glycidoxypropyltrimethoxysilane at 51% solids in methyl ethyl ketone sold by Morton under the trade name of Adcote 76P1 and a polyfunctional aziridine sold by EIT. Inc. under the trade name of XAMA 7. The mixture was then made by combining 88 parts by solids ofthe polyester/epoxy component to 9 parts by solids ofthe polyamide component.
  • the mixture was then allowed to stand for 30 minutes at room temperature to assure a homogeneous solution.
  • 3 parts by solids ofthe aziridine component was then allowed to stand for 30 minutes to allow for the onset ofthe aziridine reaction with both the acid groups of the polyamide and polyester components.
  • the mixture was then bar coated to yield a one mil dry coat onto a sheet of 5 mil thick polyethylene-naphthalate film sold under the trade name of KALADEX by ICI Films, then dried for 10 minutes at 225°F to remove the solvents and allow for the onset ofthe epoxy and glycidoxypropyltrimethoxysilane reaction with the polyamide linkage and the formed linkage between the polyamide and polyester components by the aziridine component.
  • the adhesive coated film was then placed over a sheet of 1 oz rolled annealed copper, placed between two 2 mil thick skived TFE press pads, then placed between two one-quarter inch thick stainless steel caul plates.
  • the entire lay-up was then placed in a press at room temperature under 50 psi of pressure.
  • the press was then heated to 350° F over a period of 14 minutes, allowed to remain at 350°F for 1 hour, then cooled to 200°F by running air through the press platens followed by water to cool the press to 150°F at which point the lay-up was removed.
  • the subsequently formed laminate of polyethylenenaphthalate film/adhesive/copper was removed and allowed to condition at room temperature for 24 hours.
  • the formed laminate was then tested in accordance with IPC-FC-241 procedures to yield the following properties: Initial Peel ⁇ to lO PLI
  • EXAMPLE 2 The mixture from Example 1 was coated onto 2 mil thick polyimide film sold by UBE Industries of Japan under the trade name of UPILEX S, then dried and pressed under the same process as described in Example 1.
  • EXAMPLE 4 A mixture was prepared consisting of 88 parts by solids of Morton 76 Pl and 9 parts by solids of Versamid 972 and allowed to stand at room temperature for 30 minutes. Three parts by solids of XAMA 7 was then added to the mixture and allowed to sit at room temperature for 30 minutes.
  • Riston Lamination Processed normally when the Riston (photo-resist) was laminated to the copper side ofthe laminate at 140° to 145°F.
  • Photo-exposure Processed normally Development: Processed normally Etching: The resulting circuit pattern was etched with cupric chloride at 130° to 135°F. Both the KALADEX and adhesive showed no attack in exposure to this etching process.
  • the formed circuitry pattern was then coverlayed with a sheet of 50 micron KALADEX coated with the same mix of adhesive at 25 micron dry thickness in a press under 100 psi for 1 hour at 350°F.
  • the coverlayed circuit was then critically examined under 100X magnification to determine how well the adhesive encapsulated the etched circuit conductors and to determine the amount of flow of adhesive onto exposed copper pads used for solder interconnects.
  • the encapsulation was deemed exceptional and the flow onto the pads virtually unmeasurable, which was vastly superior to any other adhesive system used in circuitry processing currently available.
  • the coverlayed circuitry was then exposed to hot oil leveling by submersion in hot oil for 20 seconds at 460°F. Upon removal from the hot oil, the circuitry was examined and determined to process as well as polyimide-based circuitry constructions from the criteria of lay-flat characteristics and other critical parameters.
  • the circuitry was then punched from the laminate. Dimensional stability was deemed as excellent, as the pre-drilled registration holes fit very nicely onto the pins on the fixture used to hold the circuit in place during the punching process. In addition, the film and adhesive punched very cleanly, leaving no debris on the tool or in the punched holes.
  • the circuitry was hand soldered using a solder iron with a tip temperature of 650°F with a Tin/Lead based solder composition. Neither the hot solder or direct contact with the solder iron tip had any adverse effect on the adhesive system.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Cette invention concerne un adhésif de complexage, de couches de revêtement et de couches de liaison à haute performance qui comporte une résine de polyamide thermoplastique, à terminaison acide et à poids moléculaire élevé, une résine époxy et un composant polyester à poids moléculaire élevé qui peut être durci par la chaleur avec des agents de durcissement de silane et d'aziridine, de façon à former un adhésif résistant à des températures extrêmement élevées, flexible et doté d'un fort pouvoir d'adhésion. Cet adhésif peut servir à renforcer les caractéristiques des films de polyester et de polyéthylène naphtalate utilisés dans les applications de fabrication de plaquettes de circuits souples et rigides; il s'avère être un excellent adhésif pour les films tels que les films de polyimide utilisés dans ces mêmes applications et il permet de ce fait l'utilisation de ces films dans des environnements où ceux-ci sont capables de résister à des températures élevées. En plus de son utilité en tant qu'adhésif de complexage, ledit système est stable à température ambiante et peut donc être stocké en tant qu'adhésif de couches de liaison sous forme de film libre ou enduit sur un film en vue de sa conversion ultérieure en stratifié ou en couche de revêtement de circuits électroniques.
EP97907743A 1996-02-23 1997-02-21 Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur Withdrawn EP0882108A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1216496P 1996-02-23 1996-02-23
US12164P 1996-02-23
PCT/US1997/002701 WO1997031078A1 (fr) 1996-02-23 1997-02-21 Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur

Publications (1)

Publication Number Publication Date
EP0882108A1 true EP0882108A1 (fr) 1998-12-09

Family

ID=21753679

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97907743A Withdrawn EP0882108A1 (fr) 1996-02-23 1997-02-21 Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur

Country Status (5)

Country Link
EP (1) EP0882108A1 (fr)
JP (1) JP2001513115A (fr)
KR (1) KR19990087191A (fr)
AU (1) AU1966297A (fr)
WO (1) WO1997031078A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239049B1 (en) 1998-12-22 2001-05-29 3M Innovative Properties Company Aminoplast resin/thermoplastic polyamide presize coatings for abrasive article backings
JP4645170B2 (ja) * 2004-11-25 2011-03-09 東洋紡績株式会社 接着剤およびそれを用いたフレキシブル印刷回路基板
EP2315663B1 (fr) * 2008-08-12 2020-09-23 3M Innovative Properties Company Adhésifs compatibles avec des couches sensibles à la corrosion
EP3632964B1 (fr) 2018-10-03 2022-09-28 3M Innovative Properties Company Précurseur durcissable d'une composition adhésive structurale
JP2022551695A (ja) * 2019-10-09 2022-12-13 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツング カルボキシル官能性樹脂用シラン官能性硬化剤、バインダー及びその２ｋコーティング組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194307A (en) * 1988-02-08 1993-03-16 Martin Processing, Inc. High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism
US5095077A (en) * 1990-02-15 1992-03-10 Martin Processing, Inc. High performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism using polyester-aziridine reaction products

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9731078A1 *

Also Published As

Publication number Publication date
JP2001513115A (ja) 2001-08-28
KR19990087191A (ko) 1999-12-15
AU1966297A (en) 1997-09-10
WO1997031078A1 (fr) 1997-08-28

Similar Documents

Publication Publication Date Title
US6620513B2 (en) Base sheet for flexible printed circuit board
US20070277375A1 (en) Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Printed Wiring Board, and, Method for Manufacturing Multi-Layer Printed Wiring Board
TW200908822A (en) Adhesive sheet
WO1997031078A1 (fr) Adhesif de complexage, de couches de revetement et de couches de liaison a base de polyamide ayant un composant a durcissement active par la chaleur
JP2002020714A (ja) 両面金属箔張り積層板の製法
JP2002187937A (ja) エポキシ樹脂組成物、プリプレグ及び金属箔張り積層板
JPH08157621A (ja) プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム
JP2722402B2 (ja) フレキシブル印刷回路基板用の接着剤組成物
CA2004131C (fr) Revetement epoxydique, a haut rendement, et colle de lamellation thermodurcissable
JP3531082B2 (ja) フレキシブル銅張積層板
JP2009132780A (ja) 回路板用樹脂組成物、支持基材付き絶縁層、積層板及び回路板
US5250347A (en) Mechanically enhanced, high impact strength triazine resins, and method of preparing same
JP2000169605A (ja) 積層板用プリプレグシ―トおよびその製造法
JPH0573157B2 (fr)
JPS61183373A (ja) フレキシブル印刷配線板用接着剤組成物
EP0436745B1 (fr) Couche de revêtement à haute tenue à base d'époxy et adhésif réticulable à la chaleur pour collage de matériaux en couches
JPS61183374A (ja) フレキシブル印刷配線板用接着剤組成物
JPS6146026B2 (fr)
JPH01173687A (ja) フレキシブルプリント回路用基板
JPS63311747A (ja) Ｉｃチップ搭載用プリント配線板の製造法
JPS6381999A (ja) Ｉｃチツプ搭載用多層板の製造法
JP2005281488A (ja) 樹脂組成物、プリプレグ及び積層板
JP2002084050A (ja) フレキシブル印刷配線用基板
JP2903660B2 (ja) 接着剤組成物
JPH08151554A (ja) 接着剤シートの製造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19980824

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT NL

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Withdrawal date: 19990706