EP0811310A1 - Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür - Google Patents

Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür

Info

Publication number
EP0811310A1
EP0811310A1 EP96937479A EP96937479A EP0811310A1 EP 0811310 A1 EP0811310 A1 EP 0811310A1 EP 96937479 A EP96937479 A EP 96937479A EP 96937479 A EP96937479 A EP 96937479A EP 0811310 A1 EP0811310 A1 EP 0811310A1
Authority
EP
European Patent Office
Prior art keywords
component
carrier
imaging device
placement
placing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96937479A
Other languages
English (en)
French (fr)
Inventor
Johannes Theodorus Antonius Van De Ven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to EP96937479A priority Critical patent/EP0811310A1/de
Publication of EP0811310A1 publication Critical patent/EP0811310A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the invention relates to a method of placing a component on a carrier, by which method the carrier is subjected to an optical detection by means of an imaging device fixedly connected to a placement head and designed for determining the position where the component is to be placed on the carrier, and by which method the component is also subjected to an optical detection for determining the position of the component after the latter has been picked up by the placement head.
  • the invention is for this purpose characterized in that the optical detection of the component is carried out by means of said imaging device.
  • the advantage of this method is that the imaging device for the component and the placement head are fastened to the same arm of the robot, so that placement inaccuracies caused by the robot movement are eliminated.
  • the calibration of the placement head, usually the centreline of the placement head, relative to the imaging device is much simpler now.
  • the image of the component is obtained by means of an optical deflection system.
  • the invention also relates to a component placement machine with a frame, a robot, a transport system for transporting carriers, a placement head for placing components which is fastened to an arm of the robot, and an imaging device also fastened to the arm of the robot for detecting marks on the carrier.
  • an optical deflection system for making an image of the component by means of said imaging device.
  • the placement machine now has only one imaging device by which an image of both the marks and the carrier can be made for determining the exact position where the component is to be placed on the carrier, and for making an image of the component for determining the component's position.
  • a simple optical system only is necessary for the latter function. For example, two mirrors and a lens are used as the optical system.
  • Fig. 1 shows a component placement machine for carrying out the method
  • Fig. 2 shows an optical deflection system formed by two reflecting surfaces of a prism and a lens for use in the placement machine of Fig. 1.
  • a transport system for the transport of printed circuit boards 3 is present on the frame 1 of a component placement machine, of which system only the transport rails 2 are shown.
  • a component placement unit 4 formed by a U- shaped frame 5 to which an X-Y robot 6 is fastened.
  • the X-Y movement of the robot 6 is shown with arrows.
  • the robot movement may be a ⁇ , ⁇ movement.
  • a placement head 8 capable of placing components on the carrier is fastened to an arm 7 of the robot.
  • the placement head has a suction nozzle 9 with which components 10 can be taken up from a feeder and placed on the carrier 3.
  • a component imaging device 11 is also fastened to the arm 7.
  • the exact position of the location 12 where the component is to be placed on the carrier should be known. This is achieved in that an image is taken of certain marks (fiducials) 13 present on the carrier. The relative position of the location where the component is to be placed on the carrier with respect to such marks is known in advance. The data of the image taken of the marks' position are passed on to the image processor 15, where they are compared with data stored in the processor so that any deviations can be calculated. The imaging device 1 1 is also used for determining the relative position of the component 10 with respect to the suction nozzie 9.
  • the arm 7 with the placement head 8 and the imaging device 1 1 is positioned above an optical system .14 such that an image can be taken of the component held by the suction nozzle via this system.
  • Said system has two mirrors 16, 17 for this purpose, between which a lens 18 is arranged. The correct position of the component can be determined thereby.
  • the position data are sent to the image processor 15 again and compared with data stored in the processor. These data in conjunction with the data on the position where the component is to be placed on the carrier now render it possible to control the robot 6 with the placement head 8 such that the component will occupy the desired position.
  • Only one imaging device with a simple optical deflection system is accordingly necessary for an accurate placement of a component.
  • the mirrors may alternatively be formed, for example, by two reflecting surfaces of a prism 19 (see Fig. 2).
  • the lens 38 serves for adapting the image field and for a correct adjustment of the focal distance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
EP96937479A 1995-12-14 1996-11-27 Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür Withdrawn EP0811310A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP96937479A EP0811310A1 (de) 1995-12-14 1996-11-27 Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP95203479 1995-12-14
EP95203479 1995-12-14
EP96937479A EP0811310A1 (de) 1995-12-14 1996-11-27 Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür
PCT/IB1996/001318 WO1997022237A1 (en) 1995-12-14 1996-11-27 Method of placing a component on a carrier, and component placement machine for implementing said method

Publications (1)

Publication Number Publication Date
EP0811310A1 true EP0811310A1 (de) 1997-12-10

Family

ID=8220944

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96937479A Withdrawn EP0811310A1 (de) 1995-12-14 1996-11-27 Verfahren zum aufbringen eines bauteiles auf einem träger und vorrichtung dafür

Country Status (3)

Country Link
EP (1) EP0811310A1 (de)
JP (1) JPH11502310A (de)
WO (1) WO1997022237A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111096103A (zh) * 2017-09-22 2020-05-01 株式会社富士 电子元件安装方法及电子元件安装机

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705507B2 (en) * 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
US7523848B2 (en) 2001-07-24 2009-04-28 Kulicke And Soffa Industries, Inc. Method and apparatus for measuring the size of free air balls on a wire bonder
US7527186B2 (en) 2001-07-24 2009-05-05 Kulicke And Soffa Industries, Inc. Method and apparatus for mapping a position of a capillary tool tip using a prism

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ic実装装置及びその方法
EP0449481B1 (de) * 1990-03-19 1996-01-31 Hitachi, Ltd. Vorrichtung und Verfahren zum Transport von Bauteilen
JPH04291795A (ja) * 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5216804A (en) * 1991-05-21 1993-06-08 U.S. Philips Corp. Method and device for placing a component on a printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9722237A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111096103A (zh) * 2017-09-22 2020-05-01 株式会社富士 电子元件安装方法及电子元件安装机

Also Published As

Publication number Publication date
WO1997022237A1 (en) 1997-06-19
JPH11502310A (ja) 1999-02-23

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V.

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