EP0785296B1 - Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen - Google Patents

Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen Download PDF

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Publication number
EP0785296B1
EP0785296B1 EP19960309396 EP96309396A EP0785296B1 EP 0785296 B1 EP0785296 B1 EP 0785296B1 EP 19960309396 EP19960309396 EP 19960309396 EP 96309396 A EP96309396 A EP 96309396A EP 0785296 B1 EP0785296 B1 EP 0785296B1
Authority
EP
European Patent Office
Prior art keywords
nickel
acid
ferrite
conductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19960309396
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English (en)
French (fr)
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EP0785296A1 (de
Inventor
Henry Hon Law
Te-Sung Wu
Lynn Frances Schneemeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
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AT&T Corp
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Filing date
Publication date
Priority claimed from US08/769,189 external-priority patent/US5779873A/en
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of EP0785296A1 publication Critical patent/EP0785296A1/de
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Publication of EP0785296B1 publication Critical patent/EP0785296B1/de
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Definitions

  • This invention relates to electroplating and, in particular, to electroplating a nickel layer on a nickel ferrite device.
  • nickel layer on conductors disposed on a nickel ferrite substrate In the manufacture of circuits containing magnetic components, it is sometimes necessary to electroplate a nickel layer on conductors disposed on a nickel ferrite substrate. For example, in the fabrication of integrated power modules it is desirable to electroplate nickel onto copper conductors disposed on nickel zinc ferrite substrates.
  • the nickel-plated conductors provide a surface that is wire-bondable with aluminum wire so that additional components can be directly connected to circuit components on the ferrite substrate.
  • U.S. 3,960,674 discloses a process of electroplating nickel on to conductive metal patterns formed on a non-conductive ferrite substrate.
  • boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.
  • FIG. 1 is a schematic cross section of a nickel ferrite substrate 10, such as nickel zinc ferrite, bearing a conductor 11, such as copper.
  • a coating of nickel 12 has been coated on the conductor using a conventional nickel plating bath.
  • the plated nickel on either side of the conductor 11 extends substantially farther than the thickness of the nickel on top of the conductor. This lateral extension illustrates excessive lateral growth, and one can readily see that such growth limits the close spacing of conductors.
  • boric acid contributed to the lateral growth
  • samples were plated with nickel using nickel sulfamate baths containing various amounts of boric acid ranging from 30 g/L to below 2 g/L. It was found that at a boric acid concentration of 2 g/L or lower, lateral growth was not observed. However, the resulting nickel coating was not wire-bondable to aluminum.
  • FIG. 2 is a schematic cross section of a nickel ferrite substrate 20 bearing a metal conductor 21 electroplated with nickel 22 from a buffered nickel plating bath free of boric acid. As illustrated, the lateral growth of nickel is substantially the same as the vertical growth, so the plating is isotropic.
  • the nickel ferrite substrate 20 can comprise any nickel-containing ferrite, but is preferably a ferrite of the form Ni 1-x Zn x Fe 2 O 4 , NiFe 2-x Al x O 4 and Ni 1-x Cd x Fe x O 4 where x can vary from zero to nearly 1.
  • the metal conductor 21 can be any metal which can be adhered to the nickel-ferrite substrate as by co-firing (silver-palladium) or by electroplating to a co-fired metal (e.g., copper electroplated to silver-palladium alloy).
  • the nickel plating bath comprises a solution of nickel salt in an acidic buffer having a pH of about 3 or less which contains less than 2 g/L of boric acid.
  • Preferred nickel salts include nickel sulfate, nickel sulfamate, nickel chloride and nickel fluoroborate.
  • Preferred acidic buffers include citric acid, acetic acid, phosphoric acid, succinic acid, glycolic acid, and tartaric acid.
  • a nickel plating bath was made of the following composition: Compound Amount (g/L) Ni(SO 3 NH 2 ) 2 ⁇ 4H 2 O 383 NiCl 2 ⁇ 6H 2 O 11 Citric Acid 10
  • Nickel ferrite samples with copper conductors were plated at (22mA/cm 2 ) with a pH of about 1.9 and a temperature in the range 35-45°C. No lateral growth was observed. The sample was plated to a thickness of 20 ⁇ m. Lateral growth was measured to be about 20 ⁇ m, which means that plating was isotropic. The appearance was acceptable, and the coating was wire-bondable to aluminum wire.
  • Nickel plating baths having the same type and concentration of nickel salts as Example 1, but with the buffers indicated below, were prepared.
  • Nickel ferrite samples with copper conductors pre-plated for IS minutes at 27mA/cm 2 ) were also prepared and plated with nickel in the baths at 35°C.
  • Table I below indicates the concentration of buffer, the plating current, the pH of the bath, whether the nickel exhibited excessive lateral growth (i.e., anisotropic growth), and whether the nickel coating was wire-bondable to aluminum. Buffer Buffer Concen.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Claims (6)

  1. Verfahren zum Elektroplattieren von Nickel auf eine Nickel-Ferrit-Vorrichtung mit folgenden Schritten:
    ein Substrat mit Ferrit, welches Nickel umfaßt, wird bereitgestellt;
    ein metallischer Leiter wird an das Substrat anhaften lassen;
    das Substrat und der Leiter werden in ein Nickel-Plattierungsbad eingetaucht, welches Nickel-Salz und eine Puffersäure, die im wesentlichen frei von Borsäure ist, umfaßt, um das Bad auf einen pH-Wert von etwa 3 oder weniger zu puffern;
    ein elektrischer Strom wird durch den Leiter fließen lassen, um eine gewünschte Dicke des Nickels an dem Leiter isotropisch zu elektroplattieren.
  2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Ferrit, welches Nickel aufweist, ein Ferrit umfaßt, das aus einer Gruppe gewählt wird, die aus Ni1-xZnxFe2O4, NiFe2-xAlxO4 und Ni1-xCdxFe2O4 besteht, wobei 0<X<1.
  3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Metall Kupfer umfaßt.
  4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Metall eine Silber-Palladium-Legierung umfaßt.
  5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Nickel-Salz ein Nickel-Salz umfaßt, das aus der Gruppe gewählt wird, die Nickelsulfat, Nickelsulfamat, Nickelchlorid und Nickelfluroprochat umfaßt.
  6. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Puffersäure einen Puffer umfaßt, der aus der Gruppe gewählt wird, die Zitronensäure, Essigsäure, Phosphorsäure, Bernsteinsäure, Glycolsäure und Weinsäure umfaßt.
EP19960309396 1995-12-29 1996-12-23 Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen Expired - Lifetime EP0785296B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58107995A 1995-12-29 1995-12-29
US769189 1996-12-18
US581079 1996-12-18
US08/769,189 US5779873A (en) 1995-12-29 1996-12-18 Electroplating of nickel on nickel ferrite devices

Publications (2)

Publication Number Publication Date
EP0785296A1 EP0785296A1 (de) 1997-07-23
EP0785296B1 true EP0785296B1 (de) 2000-03-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960309396 Expired - Lifetime EP0785296B1 (de) 1995-12-29 1996-12-23 Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen

Country Status (4)

Country Link
EP (1) EP0785296B1 (de)
JP (1) JPH09310194A (de)
DE (1) DE69607130T2 (de)
MX (1) MX9700180A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11835307B2 (en) 2019-04-12 2023-12-05 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737790B2 (ja) * 1999-10-01 2011-08-03 株式会社シミズ ほう酸を含まないニッケルめっき浴
JP2012162786A (ja) * 2011-02-09 2012-08-30 Kanto Gakuin 電気ニッケルめっき浴、電気ニッケルめっき方法及び電気ニッケルめっき製品
KR101823194B1 (ko) 2014-10-16 2018-01-29 삼성전기주식회사 칩 전자부품 및 그 제조방법
CN121538691A (zh) * 2017-06-23 2026-02-17 德国艾托特克公司 用于在衬底上沉积装饰用镍涂层的镍电镀浴
CN111636077A (zh) * 2020-06-05 2020-09-08 成都宏明双新科技股份有限公司 一种防陶瓷芯片镀镍或金爬镀的工艺
CN116180169B (zh) * 2022-12-15 2026-03-13 厦门大学 一种电子电镀添加剂组合物及其在抑制银-铁氧体界面镍横向电沉积中的应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1447970A (fr) * 1964-10-12 1966-08-05 Renault Dépôts de chrome décoratif résistant à la corrosion
US3960674A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of depositing a metal on a surface comprising an electrically non-conductive ferrite
US4375390A (en) * 1982-03-15 1983-03-01 Anderson Nathaniel C Thin film techniques for fabricating narrow track ferrite heads
JPS62278293A (ja) * 1986-05-26 1987-12-03 C Uyemura & Co Ltd 電子部品の製造方法
JPH0760769B2 (ja) * 1987-12-18 1995-06-28 松下電器産業株式会社 複合インダクタンス素子
JP2794311B2 (ja) * 1989-11-21 1998-09-03 ティーディーケイ株式会社 インピーダンス素子
JP3251370B2 (ja) * 1992-03-31 2002-01-28 ティーディーケイ株式会社 複合積層部品用非磁性フェライトおよび複合積層部品とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11835307B2 (en) 2019-04-12 2023-12-05 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers

Also Published As

Publication number Publication date
DE69607130T2 (de) 2000-10-19
EP0785296A1 (de) 1997-07-23
DE69607130D1 (de) 2000-04-20
MX9700180A (es) 1997-12-31
JPH09310194A (ja) 1997-12-02

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