EP0783830B1 - Elektrisches heizelement - Google Patents
Elektrisches heizelement Download PDFInfo
- Publication number
- EP0783830B1 EP0783830B1 EP95930361A EP95930361A EP0783830B1 EP 0783830 B1 EP0783830 B1 EP 0783830B1 EP 95930361 A EP95930361 A EP 95930361A EP 95930361 A EP95930361 A EP 95930361A EP 0783830 B1 EP0783830 B1 EP 0783830B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating element
- electrical heating
- element according
- heat
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Revoked
Links
- 238000005485 electric heating Methods 0.000 title description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 13
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 229910001006 Constantan Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010956 nickel silver Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000007787 solid Substances 0.000 abstract description 6
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000012799 electrically-conductive coating Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 12
- 238000003825 pressing Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 231100000563 toxic property Toxicity 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
Definitions
- the invention relates to an electric heating element with the Features of the preamble of claim 1.
- the inventive Heating element is used in particular as Thermal shock resistant plate heat exchanger, especially as Hot plate.
- WO 91/10336 describes an electrical heating element, which has an electrically insulating support and one attached to it comprises electrically conductive layer, wherein at the electrically conductive layer attached electrical contacts are. Amorphous or polycrystalline is used as the conductive layer Silicon used. The conductive layer, when energized, Heat that is given off directly to the wearer.
- the support although electrically insulating, must have good heat-conducting properties.
- beryllium oxide or aluminum nitride is used as the carrier in this publication.
- both materials have the required properties, they are not very resistant to thermal shock, so that cracks can occur in the carrier.
- These carriers must therefore be dimensioned relatively small. They typically have a thickness of 1 mm and a cross-sectional area of 2-5 cm 2 .
- they must be arranged on a heat-conducting, preferably metallic body which absorbs the heat generated and thus acts as a so-called heat sink. This body is generally formed by a solid plate. Since the carrier and the metallic heat sink have very different coefficients of thermal expansion, a complicated mounting of the carrier plates on the heat sink is required.
- the bracket must ensure that the support plates move relative to the heat sink when the temperature changes and still be in good contact with it.
- beryllium oxide or aluminum nitride as Carrier platelets have other disadvantages. So is Beryllium oxide is highly toxic and therefore needs a protective layer be covered. Just the use of such Heating elements in the household is because of their toxic Properties unthinkable. However, aluminum nitride is not hot water resistant. This heating element would at least have to be covered with a protective layer in the household area. Both materials also have low impact resistance are easily damaged.
- EP-A-069'298 discloses a hotplate with a hotplate body made of a thin ceramic substrate, on the underside of which a thin layer of resistance material is printed.
- US-A-4'652'727 describes a heating element which consists of a sintered body made of a mixture of an electrically conductive material such as titanium carbide and an electrically insulating material such as silicon nitride.
- US-A-4,804,823 discloses a heating element which consists of a carrier element and a heat source arranged therein. The carrier element is formed by a sintered body and the heat source consists of titanium nitride.
- JP-A-3'025'880 describes a heating element which is used as an infrared miniature heating source.
- the heating element according to the invention has the advantage that it no longer with another serving as a heat sink massive carrier must be coupled, but that it is the generated heat can give directly to the object to be heated.
- the heating element is structurally simplified on the one hand and technically more feasible, on the other hand, the efficiency elevated.
- the electrically insulating carrier consists of silicon nitride (Si 3 N 4 ). This material has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant. In addition, silicon nitride exhibits optimal behavior of the change in electrical resistance in relation to the change in temperature.
- the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties. The specific electrical resistance is approximately 10 13 ohm cm. A method for producing such a silicon carbide carrier is known.
- the silicon carbide is produced by means of a liquid phase sintering process in which aluminum oxide and yttrium oxide are added as sintering additives.
- the carrier can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (Al 2 O 3 ). These ceramics can also be used at higher temperatures if the heating and cooling of the heating element is controlled and slow, so that thermal shock can hardly occur.
- the layer or foil serving as a heat source is preferably meandering and can be made from a wide variety Materials exist. Depending on the material, the layer becomes direct applied to the carrier by means of sputtering process or them is evaporated. In other embodiments, one is first Produced film and then using a Pressing means pressed against the carrier.
- the heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1.
- This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (Si 3 N 4 ).
- This plate typically has a cross-sectional area of 100-500 cm 2 and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.
- An electrically conductive layer 2 is applied to the carrier 1. It preferably runs to optimize the electrical resistance meandering over the entire surface of the carrier 2.
- This electrically conductive layer consists of this example from amorphous or polycrystalline doped Silicon, as already known from publication WO 91/10336.
- Other electrically conductive layers are also suitable, such as for example metallic layers, especially of chrome, Nickel, chrome-nickel alloys, titanium or titanium nitride.
- the Choice of the material of the electrically conductive layer depends on the specified boundary conditions, which vary depending on the area of application from.
- the electrically conductive layer 2 is preferably on the Carrier 1 applied by means of sputtering or it is evaporated. In typical areas of application it is Thickness between a few tenths and a few micrometers.
- the electrically conductive layer 2 forms the heat source.
- she is provided with electrical contacts 3 that connect to enable a voltage source. Attaching the electrical contacts 3 is especially when using Silicon nitride as carrier 1 simplified, since it is then directly on the carrier can be soldered, whereby due to the heat resistance of Silicon nitride even brazing processes can be used.
- the carrier 1 in particular if it is made of silicon nitride, typically up to a temperature of 650 ° C without long-term damage occur on the material. However, it is peak temperatures up to 1650 ° C possible.
- the heating element according to the invention is particularly suitable for Use as a heat exchanger, the direct environmental influences, especially water.
- a special area of application is the use as a hotplate.
- Figure 2 is one such hotplate shown in the use position.
- Layer 2 serving as a heat source is located on the underside of the carrier 1.
- the carrier 1 itself forms the hotplate.
- the carrier is made of silicon nitride, that can heating object, here a pan P, directly on the support be put.
- the carrier 1 needs because of its good Material properties not even a protective layer. On the Plate can hardly burn anything, and the carrier can also conventional cleaning agents can be cleaned, also abrasive rags can be used.
- the object to be heated is directly on the Carrier placed and the electrically conductive layer is located itself on the bottom of the carrier.
- the Carriers are not necessarily made of silicon nitride, but also the use of other ceramics like Alumina is possible.
- the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, for example, without another solid, heat-conducting carrier being arranged in between.
- the electrically conductive layer 2 is covered with a further layer of silicon oxide (SiO 2 ) or silicon nitride (Si 3 N 4 ) in order to prevent oxidation.
- the electrically conductive layer can also be coated with a thermally insulating layer.
- the Invention consists of the meandering heat source from a Foil 2 'made of metal or a metal alloy is.
- Preferred materials are Constantan, Aluchrom, Nickel silver, copper-nickel alloys and steel.
- the choice of Material depends on the desired temperature, which with this heat source is to be achieved.
- This slide 2 ' is itself in Maander form self-supporting, so that it is separated from the carrier 1 can be manufactured. In a simple manufacturing process it is punched. This will reduce the manufacturing costs significantly reduced and the production of the heating element simplified.
- This film 2 ' is completely on by means of a pressing means 4 Carrier 1 pressed.
- This pressing means 4 is like the carrier 1 plate-shaped and here has at least approximately the same Diameter on.
- the mechanical and thermal properties of the pressure medium must be such that a complete Pressing the film 2 'over the entire temperature range is guaranteed.
- the pressing means 4 is preferably made made of a heat insulating material, in particular quartz or Glass with a thermal conductivity of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 be electrical has insulating properties. If the pressure medium is out electrically conductive material is located between Film 2 'and pressing means 4 a not shown here electrical insulation layer in the form of insulation paper or an insulation plate.
- Another advantage of this embodiment is besides its inexpensive and easy manufacture that at Damage to the heat source, i.e. the film 2 ', this is easy can be removed and the more expensive component, the carrier 1, can be reused.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Cookers (AREA)
Description
Da der Träger und die metallische Wärmesenke sehr unterschiedliche Warmeausdehnungskoeffizienten aufweisen, ist eine komplizierte Halterung der Trägerplättchen auf der Wärmesenke erforderlich. Die Halterung muss nämlich gewährleisten, dass sich die Tragerplättchen gegenüber der Wärmesenke Bei Temperaturveränderungen verschieben und trotzdem stets in gutem Beruhrungskontakt mit ihr stehen können.
US-A-4'652'727 beschreibt ein Heizelement, welches einen gesinterten Körper aus einer Mischung einem elektrisch leitenden Material wie Titaniumkarbid und einem elektrisch isolierendem Material wie Siliziumnitrid besteht.
US-A-4'804'823 offenbart ein Heizelement, welches aus einem Trägerelement und einer darin angeordneten Wärmequelle besteht. Das Trägerelement ist durch einen gesinterten Körper gebildet und die Wärmequelle besteht aus Titaniumnitrid.
In JP-A-3'025'880 ist ein Heizelement beschrieben, welches als Infrarot-Miniaturheizquelle eingesetzt wird.
In einer anderen bevorzugten Ausführungsform besteht der elektrisch isolierende Träger aus hochohmigen Siliziumkarbid (SiC), das ebenfalls sehr gute mechanische, thermomechanische wie auch chemische Eigenschaften aufweist. Der spezifische elektrische Widerstand beträgt annähernd 1013 Ohm cm. Ein Verfahren zur Herstellung eines derartigen Siliziumkarbid-Trägers ist bekannt. Das Siliziumkarbid wird mittels einem Flüssigphasensinter-Verfahren hergestellt, bei dem Aluminiumoxyd und Yttriumoxyd als Sinteradditive zugegeben werden. Wird das Heizelement jedoch lediglich für tiefe Temperaturen im Bereich von 250°C eingesetzt, so kann der Träger auch aus anderen elektrisch isolierenden Keramiken oder beispielsweise aus Aluminiumoxid (Al2O3) bestehen. Diese Keramiken können bei höheren Temperaturen auch eingesetzt werden, wenn die Erhitzung und Abkühlung des Heizelementes kontrolliert und langsam erfolgt, so dass kaum ein Thermoschock entstehen kann.
- Figur 1
- ein beschichtetes Heizelement gemass der Erfindung in der Ansicht von unten dargestellt;
- Figur 2
- dasselbe Heizelement in Gebrauchslage als Kochplatte im Schnitt dargestellt und
- Figur 3
- eine Explosionsdarstellung eines Heizelementes mit einer Folie und einer Gegendruckplatte.
Um Wärmeverluste auf der nicht dem Träger zugewandten Seite zu verhindern, kann die elektrisch leitende Schicht zudem mit einer thermisch isolierenden Schicht überzogen sein.
Claims (14)
- Elektrisches Heizelement mit einem elektrisch isolierenden, wärmeleitenden, plattenförmigen Träger (1) aus Keramik mit einer Fläche von 100 bis 500 cm2 und einer Dicke von 1 bis 5 mm und mit einer auf dem Träger angebrachten Wärmequelle in Form einer elektrisch leitenden, mit elektrischen Kontakten versehenen Schicht, dadurch gekennzeichnet, dass der Träger (1) aus hochohmigem Siliziumkarbid (SiC)besteht.
- Elektrisches, als Kochplatte ausgebildetes Heizelement, mit einem elektrisch isolierenden, wärmeleitenden, plattenförmigen Träger (1) aus Keramik mit einer Fläche von 100 bis 500 cm2 und einer Dicke von 1 bis 5 mm und mit einer auf dem Träger angebrachten elektrisch leitenden, mit elektrischen Kontakten versehenen Schicht (2), dadurch gekennzeichnet, dass der Träger (1) aus Siliziumnitrid (Si3N4) außer reaktionsgebundenem Siliziumnitrid besteht.
- Elektrisches Heizelement nach einem der Ansprüche 1 bis 2, dadurch gekennzeichnet, dass die Wärmequelle eine elektrisch leitende, mit elektrischen Kontakten versehene, selbsttragende Folie (2') ist.
- Elektrisches Heizelement nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die leitende Schicht (2) oder Folie (2') mäanderförmig auf dem Träger (1) verläuft.
- Elektrisches Heizelement nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Dicke der leitenden Schicht (2) 0.1 bis 10 Mikrometer beträgt.
- Elektrisches Heizelement nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die leitende Schicht (2) aus polykristallinem oder amorphem, dotiertem Silizium oder aus einem Metall, bevorzugterweise aus der Gruppe Chrom, Nickel, Titan, Titannitrid oder einer Chrom-Nickel-Legierung, besteht.
- Elektrisches Heizelement nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die leitende Schicht (2) auf den Träger (1) gesputtert und aufgedampft ist.
- Elektrisches Heizelement nach einem der Ansprüche 3 bis 5, dadurch gekennzeichnet, dass die leitende Folie (2') aus einem Metall oder einer Metalllegierung, insbesondere Konstantan, Aluchrom, Neusilber oder Stahl, besteht.
- Elektrisches Heizelement nach Anspruch 8, dadurch gekennzeichnet, dass die Dicke der Folie (2') 1 bis 100 Mikrometer beträgt.
- Elektrisches Heizelement, nach Anspruch 8, dadurch gekennzeichnet, dass die Folie (2') mittels eines Anpressmittels (4) an den Träger (1) angepresst ist.
- Elektrisches Heizelement nach Anspruch 10, dadurch gekennzeichnet, dass das Anpressmittel (4) aus wärmeisolierendem Material, insbesondere aus Quarz oder Glas, besteht und plattenförmig ausgebildet ist.
- Verwendung des elektrischen Heizelementes nach einem der Ansprüche 1 bis 11 als direkten Umwelteinflüssen, insbesondere Wasser, ausgesetzter Wärmetauscher.
- Verwendung des elektrischen Heizelementes nach Anspruch 1 als Kochplatte.
- Verwendung des elektrischen Heizelementes nach Anspruch 1 als Wärmeplatte.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH2854/94 | 1994-09-20 | ||
CH285494 | 1994-09-20 | ||
CH285494 | 1994-09-20 | ||
CH414/95 | 1995-02-13 | ||
CH41495 | 1995-02-13 | ||
CH41495 | 1995-02-13 | ||
CH2069/95 | 1995-07-13 | ||
CH206995 | 1995-07-13 | ||
CH206995 | 1995-07-13 | ||
PCT/CH1995/000208 WO1996009738A1 (de) | 1994-09-20 | 1995-09-19 | Elektrisches heizelement |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0783830A1 EP0783830A1 (de) | 1997-07-16 |
EP0783830B1 true EP0783830B1 (de) | 1999-06-09 |
Family
ID=27172084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95930361A Revoked EP0783830B1 (de) | 1994-09-20 | 1995-09-19 | Elektrisches heizelement |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0783830B1 (de) |
AT (1) | ATE181199T1 (de) |
AU (1) | AU3378695A (de) |
DE (1) | DE59506182D1 (de) |
DK (1) | DK0783830T3 (de) |
ES (1) | ES2135084T3 (de) |
WO (1) | WO1996009738A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1130006A1 (de) | 2000-02-24 | 2001-09-05 | Wacker-Chemie GmbH | Beschichteter Formkörper aus Siliciumnitrid |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19617319A1 (de) * | 1996-04-19 | 1997-10-23 | Inter Control Koehler Hermann | Verfahren sowie Einrichtung zur Regelung der Heizenergie einer Heizeinheit |
SE506968C2 (sv) * | 1996-07-25 | 1998-03-09 | Electrolux Ab | Keramisk spishäll och förfarande för framställning av filmskiktsbeläggning |
EP0853444B1 (de) * | 1997-01-10 | 2005-11-23 | E.G.O. ELEKTRO-GERÄTEBAU GmbH | Kochsystem mit einer Kontaktwärme übertragenden Elektro-Kochplatte |
DE29702813U1 (de) | 1997-01-10 | 1997-05-22 | E.G.O. Elektro-Gerätebau Gmbh, 75038 Oberderdingen | Kontaktwärmeübertragendes Kochsystem mit einer Elektro-Kochplatte |
DE19814949C2 (de) * | 1997-05-07 | 2002-04-18 | Aeg Hausgeraete Gmbh | Gareinrichtung mit Induktionsbeheizung und Widerstandsbeheizung |
DE19746845C1 (de) * | 1997-10-23 | 1998-12-03 | Schott Glas | Anordnung eines keramischen Heizelementes als Kochzone in einer Aussparung einer Fläche |
DE19746844C1 (de) * | 1997-10-23 | 1998-12-03 | Schott Glas | Anordnung eines keramischen Heizelementes als Kochzone in einer Aussparung einer Kochfläche |
US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
DE19813996A1 (de) * | 1998-03-28 | 1999-10-07 | Aeg Hausgeraete Gmbh | Gareinrichtung mit einer Struktur zur Induktionsbeheizung und Widerstandsbeheizung |
DE19820108C2 (de) * | 1998-05-06 | 2001-03-15 | Schott Glas | Anordnung eines wärmeleitenden keramischen Trägers mit einem Heizkörper als Kochzone in einer Aussparung einer Kochfläche |
US8481896B2 (en) * | 2009-12-08 | 2013-07-09 | Phillip G. Quinton, Jr. | Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity |
CN105509488B (zh) * | 2015-12-23 | 2017-09-12 | 西安超码科技有限公司 | 一种浸入式陶瓷电阻内加热装置 |
DE102016113815A1 (de) * | 2016-07-27 | 2018-02-01 | Heraeus Noblelight Gmbh | Infrarotflächenstrahler und Verfahren zur Herstellung des Infrarotflächenstrahlers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3126989A1 (de) * | 1981-07-08 | 1983-01-27 | E.G.O. Elektro-Geräte Blanc u. Fischer, 7519 Oberderdingen | Kochplatte |
JPH0628248B2 (ja) * | 1984-04-20 | 1994-04-13 | 富士通株式会社 | 二段拡散炉 |
JPH0719643B2 (ja) * | 1984-10-26 | 1995-03-06 | 日本電装株式会社 | セラミツクスヒ−タおよびその製造方法 |
JPS60166469A (ja) * | 1985-01-21 | 1985-08-29 | Tdk Corp | 発熱ヘツド |
US4804823A (en) * | 1986-07-31 | 1989-02-14 | Kyocera Corporation | Ceramic heater |
JPS63278203A (ja) * | 1987-05-09 | 1988-11-15 | Oki Electric Ind Co Ltd | 発熱抵抗体 |
JPS63278201A (ja) * | 1987-05-09 | 1988-11-15 | Oki Electric Ind Co Ltd | 発熱抵抗体 |
JP2778598B2 (ja) * | 1989-06-23 | 1998-07-23 | 東京エレクトロン株式会社 | 加熱方法及び加熱装置 |
-
1995
- 1995-09-19 WO PCT/CH1995/000208 patent/WO1996009738A1/de active IP Right Grant
- 1995-09-19 EP EP95930361A patent/EP0783830B1/de not_active Revoked
- 1995-09-19 DE DE59506182T patent/DE59506182D1/de not_active Revoked
- 1995-09-19 AT AT95930361T patent/ATE181199T1/de not_active IP Right Cessation
- 1995-09-19 DK DK95930361T patent/DK0783830T3/da active
- 1995-09-19 AU AU33786/95A patent/AU3378695A/en not_active Abandoned
- 1995-09-19 ES ES95930361T patent/ES2135084T3/es not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1130006A1 (de) | 2000-02-24 | 2001-09-05 | Wacker-Chemie GmbH | Beschichteter Formkörper aus Siliciumnitrid |
Also Published As
Publication number | Publication date |
---|---|
EP0783830A1 (de) | 1997-07-16 |
WO1996009738A1 (de) | 1996-03-28 |
AU3378695A (en) | 1996-04-09 |
ES2135084T3 (es) | 1999-10-16 |
DE59506182D1 (de) | 1999-07-15 |
DK0783830T3 (da) | 1999-12-27 |
ATE181199T1 (de) | 1999-06-15 |
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