EP0783830B1 - Electric heating element - Google Patents

Electric heating element Download PDF

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Publication number
EP0783830B1
EP0783830B1 EP95930361A EP95930361A EP0783830B1 EP 0783830 B1 EP0783830 B1 EP 0783830B1 EP 95930361 A EP95930361 A EP 95930361A EP 95930361 A EP95930361 A EP 95930361A EP 0783830 B1 EP0783830 B1 EP 0783830B1
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EP
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Prior art keywords
heating element
electrical heating
element according
heat
support
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German (de)
French (fr)
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EP0783830A1 (en
Inventor
Dusko Maravic
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Ecowatt Produktions AG
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Ecowatt Produktions AG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds

Definitions

  • the invention relates to an electric heating element with the Features of the preamble of claim 1.
  • the inventive Heating element is used in particular as Thermal shock resistant plate heat exchanger, especially as Hot plate.
  • WO 91/10336 describes an electrical heating element, which has an electrically insulating support and one attached to it comprises electrically conductive layer, wherein at the electrically conductive layer attached electrical contacts are. Amorphous or polycrystalline is used as the conductive layer Silicon used. The conductive layer, when energized, Heat that is given off directly to the wearer.
  • the support although electrically insulating, must have good heat-conducting properties.
  • beryllium oxide or aluminum nitride is used as the carrier in this publication.
  • both materials have the required properties, they are not very resistant to thermal shock, so that cracks can occur in the carrier.
  • These carriers must therefore be dimensioned relatively small. They typically have a thickness of 1 mm and a cross-sectional area of 2-5 cm 2 .
  • they must be arranged on a heat-conducting, preferably metallic body which absorbs the heat generated and thus acts as a so-called heat sink. This body is generally formed by a solid plate. Since the carrier and the metallic heat sink have very different coefficients of thermal expansion, a complicated mounting of the carrier plates on the heat sink is required.
  • the bracket must ensure that the support plates move relative to the heat sink when the temperature changes and still be in good contact with it.
  • beryllium oxide or aluminum nitride as Carrier platelets have other disadvantages. So is Beryllium oxide is highly toxic and therefore needs a protective layer be covered. Just the use of such Heating elements in the household is because of their toxic Properties unthinkable. However, aluminum nitride is not hot water resistant. This heating element would at least have to be covered with a protective layer in the household area. Both materials also have low impact resistance are easily damaged.
  • EP-A-069'298 discloses a hotplate with a hotplate body made of a thin ceramic substrate, on the underside of which a thin layer of resistance material is printed.
  • US-A-4'652'727 describes a heating element which consists of a sintered body made of a mixture of an electrically conductive material such as titanium carbide and an electrically insulating material such as silicon nitride.
  • US-A-4,804,823 discloses a heating element which consists of a carrier element and a heat source arranged therein. The carrier element is formed by a sintered body and the heat source consists of titanium nitride.
  • JP-A-3'025'880 describes a heating element which is used as an infrared miniature heating source.
  • the heating element according to the invention has the advantage that it no longer with another serving as a heat sink massive carrier must be coupled, but that it is the generated heat can give directly to the object to be heated.
  • the heating element is structurally simplified on the one hand and technically more feasible, on the other hand, the efficiency elevated.
  • the electrically insulating carrier consists of silicon nitride (Si 3 N 4 ). This material has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant. In addition, silicon nitride exhibits optimal behavior of the change in electrical resistance in relation to the change in temperature.
  • the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties. The specific electrical resistance is approximately 10 13 ohm cm. A method for producing such a silicon carbide carrier is known.
  • the silicon carbide is produced by means of a liquid phase sintering process in which aluminum oxide and yttrium oxide are added as sintering additives.
  • the carrier can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (Al 2 O 3 ). These ceramics can also be used at higher temperatures if the heating and cooling of the heating element is controlled and slow, so that thermal shock can hardly occur.
  • the layer or foil serving as a heat source is preferably meandering and can be made from a wide variety Materials exist. Depending on the material, the layer becomes direct applied to the carrier by means of sputtering process or them is evaporated. In other embodiments, one is first Produced film and then using a Pressing means pressed against the carrier.
  • the heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1.
  • This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (Si 3 N 4 ).
  • This plate typically has a cross-sectional area of 100-500 cm 2 and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.
  • An electrically conductive layer 2 is applied to the carrier 1. It preferably runs to optimize the electrical resistance meandering over the entire surface of the carrier 2.
  • This electrically conductive layer consists of this example from amorphous or polycrystalline doped Silicon, as already known from publication WO 91/10336.
  • Other electrically conductive layers are also suitable, such as for example metallic layers, especially of chrome, Nickel, chrome-nickel alloys, titanium or titanium nitride.
  • the Choice of the material of the electrically conductive layer depends on the specified boundary conditions, which vary depending on the area of application from.
  • the electrically conductive layer 2 is preferably on the Carrier 1 applied by means of sputtering or it is evaporated. In typical areas of application it is Thickness between a few tenths and a few micrometers.
  • the electrically conductive layer 2 forms the heat source.
  • she is provided with electrical contacts 3 that connect to enable a voltage source. Attaching the electrical contacts 3 is especially when using Silicon nitride as carrier 1 simplified, since it is then directly on the carrier can be soldered, whereby due to the heat resistance of Silicon nitride even brazing processes can be used.
  • the carrier 1 in particular if it is made of silicon nitride, typically up to a temperature of 650 ° C without long-term damage occur on the material. However, it is peak temperatures up to 1650 ° C possible.
  • the heating element according to the invention is particularly suitable for Use as a heat exchanger, the direct environmental influences, especially water.
  • a special area of application is the use as a hotplate.
  • Figure 2 is one such hotplate shown in the use position.
  • Layer 2 serving as a heat source is located on the underside of the carrier 1.
  • the carrier 1 itself forms the hotplate.
  • the carrier is made of silicon nitride, that can heating object, here a pan P, directly on the support be put.
  • the carrier 1 needs because of its good Material properties not even a protective layer. On the Plate can hardly burn anything, and the carrier can also conventional cleaning agents can be cleaned, also abrasive rags can be used.
  • the object to be heated is directly on the Carrier placed and the electrically conductive layer is located itself on the bottom of the carrier.
  • the Carriers are not necessarily made of silicon nitride, but also the use of other ceramics like Alumina is possible.
  • the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, for example, without another solid, heat-conducting carrier being arranged in between.
  • the electrically conductive layer 2 is covered with a further layer of silicon oxide (SiO 2 ) or silicon nitride (Si 3 N 4 ) in order to prevent oxidation.
  • the electrically conductive layer can also be coated with a thermally insulating layer.
  • the Invention consists of the meandering heat source from a Foil 2 'made of metal or a metal alloy is.
  • Preferred materials are Constantan, Aluchrom, Nickel silver, copper-nickel alloys and steel.
  • the choice of Material depends on the desired temperature, which with this heat source is to be achieved.
  • This slide 2 ' is itself in Maander form self-supporting, so that it is separated from the carrier 1 can be manufactured. In a simple manufacturing process it is punched. This will reduce the manufacturing costs significantly reduced and the production of the heating element simplified.
  • This film 2 ' is completely on by means of a pressing means 4 Carrier 1 pressed.
  • This pressing means 4 is like the carrier 1 plate-shaped and here has at least approximately the same Diameter on.
  • the mechanical and thermal properties of the pressure medium must be such that a complete Pressing the film 2 'over the entire temperature range is guaranteed.
  • the pressing means 4 is preferably made made of a heat insulating material, in particular quartz or Glass with a thermal conductivity of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 be electrical has insulating properties. If the pressure medium is out electrically conductive material is located between Film 2 'and pressing means 4 a not shown here electrical insulation layer in the form of insulation paper or an insulation plate.
  • Another advantage of this embodiment is besides its inexpensive and easy manufacture that at Damage to the heat source, i.e. the film 2 ', this is easy can be removed and the more expensive component, the carrier 1, can be reused.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Cookers (AREA)

Abstract

An electrically conductive heating element consists of an electrically insulated, heat-conductive base (1) and an electrically conductive coating (2) applied thereto to act as a heat source. The plate (1) is plate-shaped and solid, thus being suitable as a heat sink, and can transfer the heat generated directly to the object to be heated. The base (1) preferably consists of silicon nitride or silicon carbide and the electrically conductive layer consists of polycrystalline or amorphous doped silicon or a metal coating.

Description

Die Erfindung betrifft ein elektrisches Heizelement mit den Merkmalen des Oberbegriffs des Patentanspruches 1. Das erfindungsgemässe Heizelement findet insbesondere Anwendung als thermoschockresistenter Plattenwärmetauscher, insbesondere als Kochplatte.The invention relates to an electric heating element with the Features of the preamble of claim 1. The inventive Heating element is used in particular as Thermal shock resistant plate heat exchanger, especially as Hot plate.

Bekannte konventionelle elektrische Heizelemente weisen stromdurchflossene Widerstandsdrähte auf, bei denen die erzeugte Wärme mittels Wärmestrahlung abgegeben wird. Der Wirkungsgrad ist klein, da ein beträchtlicher Teil der Energie frei abgestrahlt wird und nicht zu dem zu erwärmenden Objekt gelangt. Zudem ist eine derartige Wärmeübertragung träge.Known conventional electrical heating elements have current-carrying ones Resistance wires where the one created Heat is emitted by means of heat radiation. The efficiency is small because a significant part of the energy is radiated freely and does not reach the object to be heated. In addition, such heat transfer is sluggish.

Es sind deshalb bereits elektrische Heizelemente entwickelt worden, die eine Wärmeübertragung mittels Wärmeleitung ermöglichen. So beschreibt WO 91/10336 ein elektrisches Heizelement, das einen elektrisch isolierenden Träger und eine darauf angebrachte elektrisch leitende Schicht umfasst, wobei an der elektrisch leitenden Schicht elektrische Kontakte angebracht sind. Als leitende Schicht wird amorphes oder polykristallines Silizium verwendet. Die leitende Schicht erzeugt, wenn stromdurchflossen, Wärme, die direkt an den Träger abgegeben wird. Electric heating elements have therefore already been developed that allow heat transfer by means of heat conduction. Thus WO 91/10336 describes an electrical heating element, which has an electrically insulating support and one attached to it comprises electrically conductive layer, wherein at the electrically conductive layer attached electrical contacts are. Amorphous or polycrystalline is used as the conductive layer Silicon used. The conductive layer, when energized, Heat that is given off directly to the wearer.

Damit die Wärme jedoch zu dem effektiv zu erwärmenden Objekt gelangt, muss der Träger, obwohl elektrisch isolierend, gute wärmeleitende Eigenschaften aufweisen. Deshalb wird in dieser Publikation als Träger Berylliumoxid oder Aluminium-Nitrid verwendet. Beide Materialien weisen zwar die geforderten Eigenschaften auf, sie sind jedoch nicht sehr thermoschockresistent, so dass Risse im Träger entstehen können. Diese Träger müssen deshalb relativ klein bemessen werden. Typischerweise besitzen sie eine Dicke von 1 mm und eine Querschnittsfläche von 2-5 cm2. Zudem müssen sie, damit sie durch Temperaturschwankungen nicht zerstört werden, auf einem gut wärmeleitenden, vorzugsweise metallischen Körper angeordnet werden, der die erzeugte Warme aufnimmt und somit als sogenannte Wärmesenke wirkt. Dieser Körper wird im allgemeinen durch eine massive Platte gebildet.
Da der Träger und die metallische Wärmesenke sehr unterschiedliche Warmeausdehnungskoeffizienten aufweisen, ist eine komplizierte Halterung der Trägerplättchen auf der Wärmesenke erforderlich. Die Halterung muss nämlich gewährleisten, dass sich die Tragerplättchen gegenüber der Wärmesenke Bei Temperaturveränderungen verschieben und trotzdem stets in gutem Beruhrungskontakt mit ihr stehen können.However, in order for the heat to reach the object to be heated effectively, the support, although electrically insulating, must have good heat-conducting properties. For this reason, beryllium oxide or aluminum nitride is used as the carrier in this publication. Although both materials have the required properties, they are not very resistant to thermal shock, so that cracks can occur in the carrier. These carriers must therefore be dimensioned relatively small. They typically have a thickness of 1 mm and a cross-sectional area of 2-5 cm 2 . In addition, so that they are not destroyed by temperature fluctuations, they must be arranged on a heat-conducting, preferably metallic body which absorbs the heat generated and thus acts as a so-called heat sink. This body is generally formed by a solid plate.
Since the carrier and the metallic heat sink have very different coefficients of thermal expansion, a complicated mounting of the carrier plates on the heat sink is required. The bracket must ensure that the support plates move relative to the heat sink when the temperature changes and still be in good contact with it.

Die Verwendung von Berylliumoxid oder Aluminiumnitrid als Trägerplättchen weist noch weitere Nachteile auf. So ist Berylliumoxid stark toxisch und muss deshalb mit einer Schutzschicht überzogen werden. Gerade die Verwendung derartiger Heizelemente im Haushaltsbereich ist wegen ihrer toxischen Eigenschaften undenkbar. Aluminiumnitrid hingegen ist nicht heisswasserresistent. Auch dieses Heizelement müsste zumindest im Haushaltsbereich mit einer Schutzschicht überzogen werden. Beide Materialien weisen zudem eine geringe Schlagfestigkeit auf, sind also leicht beschädigbar.The use of beryllium oxide or aluminum nitride as Carrier platelets have other disadvantages. So is Beryllium oxide is highly toxic and therefore needs a protective layer be covered. Just the use of such Heating elements in the household is because of their toxic Properties unthinkable. However, aluminum nitride is not hot water resistant. This heating element would at least have to be covered with a protective layer in the household area. Both materials also have low impact resistance are easily damaged.

Diese Nachteile führen dazu, dass derartige Heizelemente klein ausgebildet sein müssen und stets mit einem massiven, gut wärmeleitenden und somit als Wärmesenke dienenden Träger gekoppelt werden müssen.These disadvantages make such heating elements small must be trained and always with a solid, good heat-conducting and thus serving as a heat sink must be coupled.

Ferner offenbart EP-A-069'298 eine Kochplatte mit einem Kochplattenkörper aus einem dünnen Substrat aus Keramik, auf deren Unterseite eine dünne Schicht aus Widerstandsmaterial aufgedruckt ist.
US-A-4'652'727 beschreibt ein Heizelement, welches einen gesinterten Körper aus einer Mischung einem elektrisch leitenden Material wie Titaniumkarbid und einem elektrisch isolierendem Material wie Siliziumnitrid besteht.
US-A-4'804'823 offenbart ein Heizelement, welches aus einem Trägerelement und einer darin angeordneten Wärmequelle besteht. Das Trägerelement ist durch einen gesinterten Körper gebildet und die Wärmequelle besteht aus Titaniumnitrid.
In JP-A-3'025'880 ist ein Heizelement beschrieben, welches als Infrarot-Miniaturheizquelle eingesetzt wird.Furthermore, EP-A-069'298 discloses a hotplate with a hotplate body made of a thin ceramic substrate, on the underside of which a thin layer of resistance material is printed.
US-A-4'652'727 describes a heating element which consists of a sintered body made of a mixture of an electrically conductive material such as titanium carbide and an electrically insulating material such as silicon nitride.
US-A-4,804,823 discloses a heating element which consists of a carrier element and a heat source arranged therein. The carrier element is formed by a sintered body and the heat source consists of titanium nitride.
JP-A-3'025'880 describes a heating element which is used as an infrared miniature heating source.

Es ist deshalb Aufgabe der Erfindung, ein elektrisches Heizelement zu schaffen, das obengenannte Nachteile behebt und das insbesondere als Wärmetauscher eingesetzt werden kann, der direkten Umwelteinflüssen ausgesetzbar ist. It is therefore an object of the invention to provide an electrical heating element to create that eliminates the above disadvantages and that can be used in particular as a heat exchanger is directly exposed to environmental influences.

Diese Aufgabe löst ein elektrisches Heizelement mit den Merkmalen einer der Patentansprüche 1,2,3 oder 4.This task is solved by an electric heating element with the features one of the claims 1, 2, 3 or 4.

Weitere Ausführungsformen gehen aus den abhängigen Patentansprüchen hervor.Further embodiments emerge from the dependent patent claims forth.

Das erfindungsgemässe Heizelement weist den Vorteil auf, dass es nicht mehr mit einem weiteren als Wärmesenke dienenden massiven Träger gekoppelt werden muss, sondern dass es die erzeugte Wärme direkt an das zu erwärmende Objekt abgeben kann. Dadurch ist das Heizelement einerseits baulich vereinfacht und technisch besser realisierbar, andererseits ist der Wirkungsgrad erhöht. Zudem ist die Heizflächenbelastung für das erfindungsgemässe Heizelement in Bezug auf den plattenförmigen und massiven Träger zu betrachten und nicht wie bei den aus WO 91/10336 bekannten Heizelementen in Bezug auf die kleinen Trägerplättchen.The heating element according to the invention has the advantage that it no longer with another serving as a heat sink massive carrier must be coupled, but that it is the generated heat can give directly to the object to be heated. As a result, the heating element is structurally simplified on the one hand and technically more feasible, on the other hand, the efficiency elevated. In addition, the heating surface load for the invention Heating element in relation to the plate-shaped and massive bearers and not like those from WO 91/10336 known heating elements in relation to the small Carrier plates.

In einer bevorzugten Ausführungsform besteht der elektrisch isolierende Träger aus Siliziumnitirid (Si3N4). Dieses Material weist eine hohe Wärmeschockresistenz, eine hohe Schlagfestigkeit und eine gute Heisswasserresistenz auf, ist gesundheitlich unbedenklich, geht kaum chemische Reaktionen ein und ist kratzfest. Zudem weist Siliziumnitrid ein optimales Verhalten der Veränderung des elektrischen Widerstandes im Verhältnis der Temperaturveränderung auf.
In einer anderen bevorzugten Ausführungsform besteht der elektrisch isolierende Träger aus hochohmigen Siliziumkarbid (SiC), das ebenfalls sehr gute mechanische, thermomechanische wie auch chemische Eigenschaften aufweist. Der spezifische elektrische Widerstand beträgt annähernd 1013 Ohm cm. Ein Verfahren zur Herstellung eines derartigen Siliziumkarbid-Trägers ist bekannt. Das Siliziumkarbid wird mittels einem Flüssigphasensinter-Verfahren hergestellt, bei dem Aluminiumoxyd und Yttriumoxyd als Sinteradditive zugegeben werden. Wird das Heizelement jedoch lediglich für tiefe Temperaturen im Bereich von 250°C eingesetzt, so kann der Träger auch aus anderen elektrisch isolierenden Keramiken oder beispielsweise aus Aluminiumoxid (Al2O3) bestehen. Diese Keramiken können bei höheren Temperaturen auch eingesetzt werden, wenn die Erhitzung und Abkühlung des Heizelementes kontrolliert und langsam erfolgt, so dass kaum ein Thermoschock entstehen kann. In a preferred embodiment, the electrically insulating carrier consists of silicon nitride (Si 3 N 4 ). This material has high thermal shock resistance, high impact resistance and good hot water resistance, is harmless to health, hardly undergoes chemical reactions and is scratch-resistant. In addition, silicon nitride exhibits optimal behavior of the change in electrical resistance in relation to the change in temperature.
In another preferred embodiment, the electrically insulating carrier consists of high-resistance silicon carbide (SiC), which also has very good mechanical, thermomechanical and chemical properties. The specific electrical resistance is approximately 10 13 ohm cm. A method for producing such a silicon carbide carrier is known. The silicon carbide is produced by means of a liquid phase sintering process in which aluminum oxide and yttrium oxide are added as sintering additives. However, if the heating element is only used for low temperatures in the range of 250 ° C., the carrier can also consist of other electrically insulating ceramics or, for example, of aluminum oxide (Al 2 O 3 ). These ceramics can also be used at higher temperatures if the heating and cooling of the heating element is controlled and slow, so that thermal shock can hardly occur.

Die als Wärmequelle dienende Schicht oder Folie ist bevorzugterweise mäanderförmig und kann aus verschiedensten Materialien bestehen. Je nach Material wird die Schicht direkt auf den Träger mittels Sputterverfahren aufgebracht oder sie wird aufgedampft. In anderen Ausführungsformen wird zuerst eine Folie hergestellt und diese anschliessend mittels einem Anpressmittel an den Träger gepresst.The layer or foil serving as a heat source is preferably meandering and can be made from a wide variety Materials exist. Depending on the material, the layer becomes direct applied to the carrier by means of sputtering process or them is evaporated. In other embodiments, one is first Produced film and then using a Pressing means pressed against the carrier.

In den Figuren sind Ausführungsbeispiele des erfindungsgemässen Heizelementes dargestellt, die in der nachfolgenden Beschreibung erläutert werden. Es zeigen

Figur 1
ein beschichtetes Heizelement gemass der Erfindung in der Ansicht von unten dargestellt;
Figur 2
dasselbe Heizelement in Gebrauchslage als Kochplatte im Schnitt dargestellt und
Figur 3
eine Explosionsdarstellung eines Heizelementes mit einer Folie und einer Gegendruckplatte.
The figures show exemplary embodiments of the heating element according to the invention, which are explained in the following description. Show it
Figure 1
a coated heating element according to the invention shown in the view from below;
Figure 2
the same heating element shown in use as a hotplate in section and
Figure 3
an exploded view of a heating element with a film and a pressure plate.

Das hier schematisch dargestellte Heizelement weist die Form einer kreisrunden Platte auf, wobei die Form durch einen massiven Träger 1 bestimmt wird. Dieser Träger besteht aus einer elektrisch isolierenden, jedoch wärmeleitenden Keramik, bevorzugterweise aus Siliziumnitrid (Si3N4). Diese Platte weist typischerweise eine Querschnittsfläche von 100 - 500 cm2 und eine Dicke von 1 - 5 mm auf. Die Abmessungen variieren jedoch je nach Anwendungsbereich, auf den später noch eingegangen wird.The heating element shown schematically here has the shape of a circular plate, the shape being determined by a solid support 1. This carrier consists of an electrically insulating but heat-conducting ceramic, preferably of silicon nitride (Si 3 N 4 ). This plate typically has a cross-sectional area of 100-500 cm 2 and a thickness of 1-5 mm. However, the dimensions vary depending on the area of application, which will be discussed later.

Auf dem Träger 1 ist eine elektrisch leitende Schicht 2 aufgebracht. Sie verläuft bevorzugterweise zur Optimierung des elektrischen Widerstandes mäanderförmig über die gesamte Fläche des Trägers 2. Diese elektrisch leitende Schicht besteht in diesem Beispiel aus amorphem oder polykristallinen dotiertem Silizium, wie bereits aus der Publikation WO 91/10336 bekannt. Auch andere elektrisch leitende Schichten sind geeignet, wie beispielsweise metallische Schichten, insbesondere aus Chrom, Nickel, Chrom-Nickellegierungen, Titan oder Titannitrid. Die Wahl des Materials der elektrisch leitenden Schicht hängt von den vorgegebenen, je nach Anwendungsbereich verschiedenen Randbedingungen ab.An electrically conductive layer 2 is applied to the carrier 1. It preferably runs to optimize the electrical resistance meandering over the entire surface of the carrier 2. This electrically conductive layer consists of this example from amorphous or polycrystalline doped Silicon, as already known from publication WO 91/10336. Other electrically conductive layers are also suitable, such as for example metallic layers, especially of chrome, Nickel, chrome-nickel alloys, titanium or titanium nitride. The Choice of the material of the electrically conductive layer depends on the specified boundary conditions, which vary depending on the area of application from.

Die elektrisch leitende Schicht 2 wird bevorzugterweise auf den Träger 1 mittels Sputterverfahren aufgebracht oder sie wird aufgedampft. In typischen Anwendungsbereichen beträgt ihre Dicke zwischen einigen Zehntel und einigen Mikrometern. Die elektrisch leitende Schicht 2 bildet die Wärmequelle. Sie ist mit elektrischen Kontakten 3 versehen, die eine Verbindung zu einer Spannungsquelle ermöglichen. Das Anbringen der elektrischen Kontakte 3 ist vorallem bei Verwendung von Siliziumnitrid als Träger 1 vereinfacht, da sie dann direkt auf den Träger lötbar sind, wobei wegen der Hitzebeständigkeit von Siliziumnitrid sogar Hartlötverfahren eingesetzt werden können. The electrically conductive layer 2 is preferably on the Carrier 1 applied by means of sputtering or it is evaporated. In typical areas of application it is Thickness between a few tenths and a few micrometers. The electrically conductive layer 2 forms the heat source. she is provided with electrical contacts 3 that connect to enable a voltage source. Attaching the electrical contacts 3 is especially when using Silicon nitride as carrier 1 simplified, since it is then directly on the carrier can be soldered, whereby due to the heat resistance of Silicon nitride even brazing processes can be used.

Wird eine Spannung angelegt, so erzeugt die stromdurchflossene Schicht 2 Wärme, die sogleich an den Träger 1 abgegeben wird. Da dieser massiv ausgebildet ist und eine gute Wärmeschockresistenz aufweist, kann er als Wärmesenke eingesetzt werden. Dieser Träger nimmt nun die erzeugte Wärme auf und gibt sie an das zu erwärmende Objekt weiter. Der Träger 1, insbesondere wenn er aus Siliziumnitrid besteht, kann typischerweise bis zu einer Temperatur von 650 °C erwärmt werden, ohne dass Langzeitschäden am Material auftreten. Es sind jedoch Spitzentemperaturen bis zu 1650°C möglich.If a voltage is applied, the current flows through it Layer 2 heat, which is immediately released to the carrier 1. Since this is solid and has good thermal shock resistance has, it can be used as a heat sink. This carrier now absorbs the heat generated and gives it the object to be heated further. The carrier 1, in particular if it is made of silicon nitride, typically up to a temperature of 650 ° C without long-term damage occur on the material. However, it is peak temperatures up to 1650 ° C possible.

Das erfindungsgemässe Heizelement eignet sich vorallem zur Verwendung als Wärmetauscher, der direkten Umwelteinflüssen, insbesondere Wasser, ausgesetzt ist. Ein spezieller Anwendungsbereich ist die Verwendung als Kochplatte. In Figur 2 ist eine derartige Kochplatte in Gebrauchslage dargestellt. Die als Warmequelle dienende Schicht 2 befindet sich auf der Unterseite des Trägers 1. Der Träger 1 selber bildet die Kochplatte. Da der Träger aus Siliziumnitrid gefertigt ist, kann das zu erwarmende Objekt, hier eine Pfanne P, direkt auf den Träger gestellt werden. Der Träger 1 benötigt wegen seiner guten Materialeigenschaften nicht einmal eine Schutzschicht. Auf der Platte kann kaum etwas anbrennen, zudem kann der Träger mit herkömmlichen Putzmitteln gereinigt werden, wobei auch scheuernde Lappen eingesetzt werden können. Im Vergleich zu den heute bekannten Glaskeramikherden weist die erfindungsgemässe Kochplatte somit wesentliche Vorteile auf, nicht nur im täglichen Gebrauch sondern auch in der Energiebilanz. Testversuche haben gezeigt, dass bei Verwendung des erfindungsgemässen Heizelementes zum Erhitzen von 1.5 Liter Wasser bis zum Siedepunkt der Energieverbrauch bis zu 40% reduziert wird.The heating element according to the invention is particularly suitable for Use as a heat exchanger, the direct environmental influences, especially water. A special area of application is the use as a hotplate. In Figure 2 is one such hotplate shown in the use position. As Layer 2 serving as a heat source is located on the underside of the carrier 1. The carrier 1 itself forms the hotplate. There the carrier is made of silicon nitride, that can heating object, here a pan P, directly on the support be put. The carrier 1 needs because of its good Material properties not even a protective layer. On the Plate can hardly burn anything, and the carrier can also conventional cleaning agents can be cleaned, also abrasive rags can be used. Compared to the Glass ceramic cookers known today have the inventive Hotplate therefore has significant advantages, not only in daily use but also in the energy balance. Tests have shown that when using the Heating element according to the invention for heating 1.5 liters Water up to the boiling point of energy consumption up to 40% is reduced.

Ein weiterer Anwendungsbereich ist die Verwendung als Wärmeplatte. Auch hier wird das zu erwärmende Objekt direkt auf den Träger gestellt und die elektrisch leitende Schicht befindet sich auf der Unterseite des Trägers. Da jedoch hier meistens in einem tieferen Temperaturbereich gearbeitet wird, muss der Träger nicht zwingend aus Siliziumnitrid gefertigt sein, sondern auch die Verwendung von anderen Keramiken wie Aluminiumoxid ist möglich.Another area of application is the use as a hot plate. Here, too, the object to be heated is directly on the Carrier placed and the electrically conductive layer is located itself on the bottom of the carrier. However, since here mostly in working in a lower temperature range, the Carriers are not necessarily made of silicon nitride, but also the use of other ceramics like Alumina is possible.

Je nach Anwendungsbereich können die Heizelemente auch sandwichartig gestapelt werden. Wesentlich ist stets, dass der Träger die Wärme direkt an das zu erwärmende Objekt, wie beispielsweise eine Pfanne, weitergibt, ohne dass ein weiterer massiver, wärmeleitender Träger dazwischen angeordnet ist. In einer Ausführungsform ist die elektrisch leitende Schicht 2 mit einer weiteren Schicht aus Siliziumoxid (SiO2) oder Siliziumnitrid (Si3N4) bedeckt sein, um Oxidationen zu verhindern.
Um Wärmeverluste auf der nicht dem Träger zugewandten Seite zu verhindern, kann die elektrisch leitende Schicht zudem mit einer thermisch isolierenden Schicht überzogen sein.Depending on the application, the heating elements can also be stacked in a sandwich. It is always essential that the carrier transfers the heat directly to the object to be heated, such as a pan, for example, without another solid, heat-conducting carrier being arranged in between. In one embodiment, the electrically conductive layer 2 is covered with a further layer of silicon oxide (SiO 2 ) or silicon nitride (Si 3 N 4 ) in order to prevent oxidation.
In order to prevent heat losses on the side not facing the carrier, the electrically conductive layer can also be coated with a thermally insulating layer.

In einer weiteren in Figur 3 dargestellten Ausführungsform der Erfindung besteht die mäanderförmige Heizquelle aus einer Folie 2', die aus Metall oder einer Metallegierung gefertigt ist. Bevorzugte Materialien sind Konstantan, Aluchrom, Neusilber, Kupfer-Nickel-Legierungen und Stahl. Die Wahl des Materiales hängt von der gewünschten Temperatur ab, die mit dieser Heizquelle erzielt werden soll. Die Folie 2' weist je nach Material und gewünschtes Temperaturverhalten eine Dicke von 1 bis 100 Mikrometer auf. Diese Folie 2' ist selbst in Maanderform selbsttragend, so dass sie getrennt vom Träger 1 hergestellt werden kann. In einem einfachen Herstellungsverfahren wird sie gestanzt. Dadurch werden die Herstellungskosten wesentlich gesenkt und die Produktion des Heizelementes vereinfacht.In a further embodiment of the Invention consists of the meandering heat source from a Foil 2 'made of metal or a metal alloy is. Preferred materials are Constantan, Aluchrom, Nickel silver, copper-nickel alloys and steel. The choice of Material depends on the desired temperature, which with this heat source is to be achieved. The film 2 'each a thickness depending on the material and the desired temperature behavior from 1 to 100 microns. This slide 2 'is itself in Maander form self-supporting, so that it is separated from the carrier 1 can be manufactured. In a simple manufacturing process it is punched. This will reduce the manufacturing costs significantly reduced and the production of the heating element simplified.

Diese Folie 2' ist mittels einem Anpressmittel 4 vollständig am Träger 1 angepresst. Dieses Anpressmittel 4 ist wie der Träger 1 plattenförmig und weist hier mindestens annähernd denselben Durchmesser auf. Die mechanischen und thermischen Eigenschaften des Anpressmittels müssen derart sein, dass eine vollständige Anpressung der Folie 2' über den gesamten Temperaturbereich gewährleistet ist. Das Anpressmittel 4 besteht bevorzugterweise aus einem warmeisolierenden Material, insbesondere Quarz oder Glas mit einem Warmeleitkoeffizienten von annähernd 1 W/mK. Dadurch dient das Anpressmittel zugleich als Thermoisolation. Es ist nicht zwingend, dass das Anpressmittel 4 elektrisch isolierende Eigenschaften aufweist. Falls das Anpressmittel aus elektrisch leitendem Material besteht, befindet sich zwischen Folie 2' und Anpressmittel 4 eine hier nicht dargestellte elektrische Isolationsschicht in Form von Isolationspapier oder einer Isolationsplatte. This film 2 'is completely on by means of a pressing means 4 Carrier 1 pressed. This pressing means 4 is like the carrier 1 plate-shaped and here has at least approximately the same Diameter on. The mechanical and thermal properties of the pressure medium must be such that a complete Pressing the film 2 'over the entire temperature range is guaranteed. The pressing means 4 is preferably made made of a heat insulating material, in particular quartz or Glass with a thermal conductivity of approximately 1 W / mK. As a result, the pressure medium also serves as thermal insulation. It is not imperative that the pressing means 4 be electrical has insulating properties. If the pressure medium is out electrically conductive material is located between Film 2 'and pressing means 4 a not shown here electrical insulation layer in the form of insulation paper or an insulation plate.

Ein weiterer Vorteil dieser Ausführungsform ist neben seiner kostengünstigen und einfachen Herstellung, dass bei Beschädigung der Heizquelle, also der Folie 2', diese einfach entfernt werden kann und das teurere Bauteil, der Träger 1, wiederverwendet werden kann.Another advantage of this embodiment is besides its inexpensive and easy manufacture that at Damage to the heat source, i.e. the film 2 ', this is easy can be removed and the more expensive component, the carrier 1, can be reused.

Claims (14)

  1. Electrical heating element having an electrically insulating, heat-conducting, plate-shaped support (1) made of ceramic material having an area of 100 to 500 cm2 and a thickness of 1 to 5 mm and a heat source in the shape of an electrically-conducting layer attached to the support and provided with electrical contacts, characterized in that the support (1) consists of high-resistance silicon carbide (SiC).
  2. Electrical heating element configured as a boiling plate having an electrically insulating, heat-conducting, plate-shaped support (1) made of ceramic material having an area of 100 to 500 cm2 and a thickness of 1 to 5 mm and a heat source in the shape of an electrically-conducting layer (2) attached to the support and provided with electrical contacts, characterized in that the support (1) consists of silicon nitride (Si3n4) except reaction-bound silicon nitride.
  3. Electrical heating element according to one of claims 1 to 2, characterized in that the heat source is an electrically-conducting self-supporting foil (2') provided with electrical contacts.
  4. Electrical heating element according to one of claims 1 to 3, characterized in that the conducting layer (2) or foil (2') extends meander-like on the support (1).
  5. Electrical heating element according to one of claims 1 to 4, characterized in that the thickness of the conducting layer (2) is 0.1 to 10 µm.
  6. Electrical heating element according to one of claims 1 to 5, characterized in that the conducting layer (2) consists of polycrystalline or amorphous doped silicon or of metal, preferably from the group containing chromium, nickel, titanium, titanium nitride or a chromium nickel alloy.
  7. Electrical heating element according to one of claims 1 to 6, characterized in that the conducting layer (2) is sputtered or evaporated onto the support (1).
  8. Electrical heating element according to one of claims 1 to 5, characterized in that the conducting foil (2') consists of metal or a metal alloy preferably of constantan, aluchrome, nickel silver or steel.
  9. Electrical heating element according to claim 8, characterized in that the thickness of the foil (2') is 1 to 100 µm.
  10. Electrical heating element according to claim 8, characterized in that the foil (2') is pressed against the support (1) by a pressure means (4).
  11. Electrical heating element according to claim 10, characterized in that the pressure means (4) consists of heat-insulating material, particularly quartz or glass, and is plate-shaped.
  12. Use of an electrical heating element according to one of claims 1 to 11 as a heat exchanger which is exposed to direct environmental influence, particularly to water.
  13. Use of an electrical heating element according to claim 1 as a boiling plate.
  14. Use of an electrical heating element according to claim 1 as a hot plate.
EP95930361A 1994-09-20 1995-09-19 Electric heating element Revoked EP0783830B1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
CH285494 1994-09-20
CH2854/94 1994-09-20
CH285494 1994-09-20
CH41495 1995-02-13
CH414/95 1995-02-13
CH41495 1995-02-13
CH2069/95 1995-07-13
CH206995 1995-07-13
CH206995 1995-07-13
PCT/CH1995/000208 WO1996009738A1 (en) 1994-09-20 1995-09-19 Electric heating element

Publications (2)

Publication Number Publication Date
EP0783830A1 EP0783830A1 (en) 1997-07-16
EP0783830B1 true EP0783830B1 (en) 1999-06-09

Family

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Application Number Title Priority Date Filing Date
EP95930361A Revoked EP0783830B1 (en) 1994-09-20 1995-09-19 Electric heating element

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EP (1) EP0783830B1 (en)
AT (1) ATE181199T1 (en)
AU (1) AU3378695A (en)
DE (1) DE59506182D1 (en)
DK (1) DK0783830T3 (en)
ES (1) ES2135084T3 (en)
WO (1) WO1996009738A1 (en)

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EP1130006A1 (en) 2000-02-24 2001-09-05 Wacker-Chemie GmbH Coated silicon nitride article

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DE29702813U1 (en) 1997-01-10 1997-05-22 E.G.O. Elektro-Gerätebau Gmbh, 75038 Oberderdingen Contact heat transferring cooking system with an electric hotplate
EP0853444B1 (en) * 1997-01-10 2005-11-23 E.G.O. ELEKTRO-GERÄTEBAU GmbH Cooking system with an electric cooking-plate, transferring heat by conduction
DE19814949C2 (en) * 1997-05-07 2002-04-18 Aeg Hausgeraete Gmbh Cooking equipment with induction heating and resistance heating
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US8481896B2 (en) * 2009-12-08 2013-07-09 Phillip G. Quinton, Jr. Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
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AU3378695A (en) 1996-04-09
ATE181199T1 (en) 1999-06-15
ES2135084T3 (en) 1999-10-16
EP0783830A1 (en) 1997-07-16
WO1996009738A1 (en) 1996-03-28
DE59506182D1 (en) 1999-07-15
DK0783830T3 (en) 1999-12-27

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