EP0768021A1 - Procede de traitement des cartes a circuit imprime et dispositif a cet effet - Google Patents

Procede de traitement des cartes a circuit imprime et dispositif a cet effet

Info

Publication number
EP0768021A1
EP0768021A1 EP96907613A EP96907613A EP0768021A1 EP 0768021 A1 EP0768021 A1 EP 0768021A1 EP 96907613 A EP96907613 A EP 96907613A EP 96907613 A EP96907613 A EP 96907613A EP 0768021 A1 EP0768021 A1 EP 0768021A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
circuit boards
components
row
placement machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96907613A
Other languages
German (de)
English (en)
Inventor
Adrianus Van Der Pol
Klaus Otto Willi Gerken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Philips Norden AB
Original Assignee
Philips Patentverwaltung GmbH
Koninklijke Philips Electronics NV
Philips Electronics NV
Philips Norden AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH, Koninklijke Philips Electronics NV, Philips Electronics NV, Philips Norden AB filed Critical Philips Patentverwaltung GmbH
Priority to EP96907613A priority Critical patent/EP0768021A1/fr
Publication of EP0768021A1 publication Critical patent/EP0768021A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Definitions

  • the invention relates to a method of processing printed circuit boards which are transported consecutively through a number of processing stations, among which a component placement machine in which components are placed on a first side of a printed circuit board, after which the printed circuit board is turned over in a further processing station and is returned to said component placement machine for the placement of components on the other, second side of the printed circuit board.
  • EP-A-0 504 656 discloses a method of turning over a printed circuit board after a treatment of one side of this board in a processing machine and of returning it to that same processing machine for a treatment of the other side of the printed circuit board. This relates to a treatment with a liquid. It is also known, however, to apply such a method to the placement of components on both sides of a printed circuit board. In this method, a number of printed circuit boards is first transported through a component placement machine and provided with components at a first side, whereupon said printed circuit boards are stored, and are subsequently turned over in a later stage and supplied to the relevant placement machine again in order to be provided with components at the other, second side.
  • the supply of printed circuit boards for the placement of components on the first side is interrupted during the placement of components on the second sides of the printed circuit boards.
  • An advantage of this method is that only one placement machine is necessary.
  • a disadvantage is, however, that it leads to a comparatively long cycle time for each printed circuit board, i.e. the time required for providing both sides of a printed circuit board with components, because there is no continuous flow of printed circuit boards, but the printed circuit boards are fed in batches. There is no efficient use of the machines in the process.
  • - 2 - two placement machines are necessary now, which has a cost raising effect.
  • the invention is for this purpose characterized in that the printed circuit boards are transported simultaneously in two rows next to one another through the placement machine, the printed circuit boards in a first row lying with a first side facing upward and the printed circuit bq&rds in the second row situated next to the first lying with the second sides facing upward, and components are placed on the printed circuit boards in both rows.
  • a continuous flow of printed circuit boards now takes place in only one placement machine, so that components can be placed on the printed circuit boards in the first row with the first sides facing upward as well as on the printed circuit boards in the second row next to the first with the second sides facing upward.
  • the waiting times for the robots which are to place the components can be minimized.
  • EP-A-0 413 098 whereby printed circuit boards undergo an operation in a number of processing machines in series, the printed circuit boards being transported in parallel rows through one of the processing machines and being processed simultaneously. This is done when the operation on a printed circuit board in such a machine takes a considerably longer time than in the other machines, so that the waiting times of the other machines are reduced. This applies, however, to an operation on one side of the printed circuit boards.
  • a robot first places components on printed circuit boards in the first row and subsequently the same type of components on printed circuit boards in the second row next to the first.
  • the advantage of this is that only one magazine and one feed system for the components is necessary.
  • a robot places components on printed circuit boards in the first row while simultaneously another robot places components on printed circuit boards in the second row next to the first. This offers the possibility of reducing the cycle time as compared with the preferred embodiment mentioned earlier. This is dependent, however, on the distribution of the number of components to be placed on the one and the other side of the printed circuit board, and also on the type of components.
  • the invention also relates to a placement system for the implementation of the method mentioned above, comprising a component placement machine and a transport mechanism for transporting printed circuit boards in the placement machine, which transport mechanism is capable of transporting two rows of printed circuit boards situated next to one another through the placement machine, while the placement machine has a first and a second transport inlet and a first and a second transport outlet for the first and the second row of printed circuit boards, respectively, and is further provided with at least one robot for placing the components on printed circuit boards in both rows.
  • this placement system is characterized in that it is provided with a turning device for turning over the printed circuit boards, the first transport outlet of the placement machine being connected to a transport inlet of the turning device and a transport outlet of the turning device being connected to the second transport inlet of the placement machine.
  • Fig. 1 diagrammatically shows a process sequence according to the invention
  • Fig. 2 diagrammatically shows a placement system in which a component placement machine with dual transport is used in the process sequence as depicted in Fig. 1.
  • Unprocessed boards 2 are taken one by one from a magazine 1 by a transferrer 3 and placed on a transport belt, and subsequently transported to a silk-screen printing machine 4.
  • One side of the printed circuit board, the T side (Top side) is provided with soldering paste 5 in the desired locations by the silk-screen printing machine.
  • the printed circuit boards are then transported to a component placement machine 6.
  • the placement machine has a transport mechanism capable of transporting two rows 7, 8 of printed circuit boards situated next to one another simultaneously. All printed circuit boards coming from the silk-screen printing machine are placed in a first row 7 and provided with components 9 in the placement machine.
  • the next processing station is an oven 10 in which the solder is made to flow, whereupon the components 9 are fixed with solder through cooling-down.
  • wire components 12 are provided on the T side of the printed circuit board in station 11, and the printed circuit board is turned over in a turning device 13 so that the B side (Bottom side) faces upward now.
  • glue droplets 15 are provided for components yet to be placed.
  • the printed circuit boards are returned with their B sides up to the placement machine 6 and arranged in the second row 8, next to the first row 7.
  • a first row 7 with printed circuit boards with their T sides up and next to that a second row 8 of printed circuit boards with their B sides up are accordingly present in the placement machine now.
  • Components 16 are placed on the B side, i.e. at the areas of the glue droplets.
  • the printed circuit boards in the second row are subsequently transported to a curing oven 17 for curing the glue, turned over again in a turning device 18, and the components 16 and the wire components 12 are soldered to the B side in a wave soldering machine 19.
  • the essence of the process sequence here is that a transport of two rows of printed circuit boards next to one another takes place in the component placement machine, the boards lying with their T sides up in one row and with their B sides up in the row next to it, and that both rows of printed circuit boards are simultaneously transported through the placement machine, during which components are placed on the printed circuit boards in both rows.
  • the printed circuit boards coming from the placement machine may or may not undergo various treatments before they are turned over and fed back to the placement machine.
  • the placement machine shown in Fig. 2 for the placement of components on printed circuit boards 2 comprises a component placement machine 6 with a transport mechanism 20 for transporting the printed circuit boards in the placement machine, and a turning device 13 for turning over the printed circuit boards 2.
  • Two rows 7, 8 of printed circuit boards situated next to one another can be transported in the placement machine.
  • the placement machine is for this purpose provided with a first transport inlet 21 and a first transport outlet 22 for the first row 7 of printed circuit boards, and a second transport inlet 23 and a second transport outlet 24 for the second row 8 of printed circuit boards.
  • the first transport outlet 22 of the placement machine is connected to a transport inlet 26 of the turning device 13, while a transport outlet 27 of the turning device is connected to the second transport inlet 23 of the placement machine.
  • Two rows of printed circuit boards are transported through the placement machine in this manner, the printed circuit boards in the first row 7 lying with their T sides up and the printed circuit boards in the second row 8 lying with their B sides up.
  • Components for example SMDs (Surface Mounting Devices), are placed on the printed circuit boards by the robots. A large number of robots is present in the placement machine shown.
  • One robot can here first place components on the T side of a printed circuit board i the first row 7 and subsequently the same type of component on the B side of a printed circuit board in the second row 8. It is also possible for the one robot to place components on printed circuit boards in the one row while simultaneously another robot places components on printed circuit boards in the other row. It will be obvious that many differen possibilities exist in such an arrangement as to the sequence according to which components can be placed.
  • the transport line 25 will usually comprise a number of processing stations is already indicated, for example, in Fig. 1.

Abstract

L'invention concerne un procédé de traitement des cartes à circuit imprimé qui consiste à faire passer les cartes par une série de postes de traitements successifs, notamment par un dispositif de mise en place des composants (6). A ce dispositif, l'opération consiste à transporter deux rangées (7, 8) de cartes à circuit imprimé situées l'une à côté de l'autre, lesdites cartes (2) étant disposées face supérieure vers le haut dans une rangée (7) et face inférieure vers le haut dans la rangée parallèle (8), de sorte que les deux rangées de cartes passent simultanément par le dispositif de mise en place. Au cours du processus en question, les composants sont disposés sur les cartes en deux rangées. Celles qui viennent de la première rangée (7) sont retournées avant d'être réinjectées dans la rangée adjacente (8).
EP96907613A 1995-04-28 1996-04-10 Procede de traitement des cartes a circuit imprime et dispositif a cet effet Withdrawn EP0768021A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP96907613A EP0768021A1 (fr) 1995-04-28 1996-04-10 Procede de traitement des cartes a circuit imprime et dispositif a cet effet

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP95201099 1995-04-28
EP95201099 1995-04-28
PCT/IB1996/000304 WO1996035321A1 (fr) 1995-04-28 1996-04-10 Procede de traitement des cartes a circuit imprime et dispositif a cet effet
EP96907613A EP0768021A1 (fr) 1995-04-28 1996-04-10 Procede de traitement des cartes a circuit imprime et dispositif a cet effet

Publications (1)

Publication Number Publication Date
EP0768021A1 true EP0768021A1 (fr) 1997-04-16

Family

ID=8220230

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96907613A Withdrawn EP0768021A1 (fr) 1995-04-28 1996-04-10 Procede de traitement des cartes a circuit imprime et dispositif a cet effet

Country Status (3)

Country Link
EP (1) EP0768021A1 (fr)
JP (1) JPH10503060A (fr)
WO (1) WO1996035321A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005045161A1 (de) * 2005-09-21 2007-04-05 Endress + Hauser Gmbh + Co. Kg Vorrichtung zum Wenden und Bestücken von Leiterplatten
DE102015115934A1 (de) * 2015-09-21 2017-03-23 Viscom Ag Verfahren zur Werkstückerfassung sowie Erfassungsvorrichtung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413098B1 (fr) * 1989-06-16 1994-08-10 ATOTECH Deutschland GmbH Procédé pour le traitement d'articles dans une installation en continu et dispositif pour la mise en oeuvre de ce procédé
DE4107464A1 (de) * 1991-03-08 1992-09-10 Schmid Gmbh & Co Geb Verfahren und vorrichtung zum einseitigen behandeln von plattenfoermigen gegenstaenden

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9635321A1 *

Also Published As

Publication number Publication date
JPH10503060A (ja) 1998-03-17
WO1996035321A1 (fr) 1996-11-07

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