EP0729834A2 - An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus - Google Patents
An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus Download PDFInfo
- Publication number
- EP0729834A2 EP0729834A2 EP96103179A EP96103179A EP0729834A2 EP 0729834 A2 EP0729834 A2 EP 0729834A2 EP 96103179 A EP96103179 A EP 96103179A EP 96103179 A EP96103179 A EP 96103179A EP 0729834 A2 EP0729834 A2 EP 0729834A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- ink
- heating
- electrodes
- jet head
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000010410 layer Substances 0.000 claims abstract description 167
- 238000010438 heat treatment Methods 0.000 claims abstract description 156
- 239000011241 protective layer Substances 0.000 claims abstract description 28
- 239000012212 insulator Substances 0.000 claims abstract description 24
- 238000007599 discharging Methods 0.000 claims description 28
- 238000007639 printing Methods 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 41
- 239000004020 conductor Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005587 bubbling Effects 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910003862 HfB2 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- -1 Ta and Fe Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
Abstract
Description
- This invention relates to an ink-jet head for performing printing by forming a very small droplet by discharging a printing liquid, such as ink or the like, utilizing thermal energy, and causing the droplet to adhere to a printing material, such as paper or the like. The invention also relates to a substrate for such an ink-jet head, and to an ink-jet apparatus.
- An ink-jet head used in an ink-jet printing method of utilizing thermal energy for forming a very small droplet to be discharged generally includes a heating resistive layer provided on a substrate, respective pairs of electrodes provided on the heating resistive layer and electrically connected thereto, and respective heating portions of the heating resistive layer provided between the pairs of electrodes. Thermal energy is generated from selected ones of the heating portions by passing current through the heating resistive layer from the corresponding pairs of electrodes. The state of ink in an ink channel is changed by the thermal energy, and printing is performed by discharging the ink onto a printing material by the pressure caused by volume expansion of bubbles in this changed state.
- The configurations of such ink-jet heads are disclosed, for example, in Japanese Patent Laid-Open Application (Kokai) Nos. 55-128467 (1980) and 59-194866 (1984).
- FIGS. 7(A) and 7(B) are schematic diagrams illustrating the general configuration of such an ink-jet head.
- In FIGS. 7(A) and 7(B),
reference numeral 1 represents a substrate for an ink-jet head on which a heatingresistive layer 2 and pairs ofelectrodes 3 are provided. The heatingresistive layer 2 for converting electric energy into thermal energy is provided on the surface of the insulating ink-jet-head substrate 1, and the pairs ofelectrodes 3 for passing current through the heatingresistive layer 2 are provided on the heatingresistive layer 2. The pairs ofelectrodes 3 comprise individual electrode portions for selectively driving segments of the heatingresistive layer 2, and a common electrode portion for distributing current. The thermal energy is generated from aheating portion 9 provided between the corresponding pair of electrodes. Aprotective layer 6, for preventing the heatingresistive layer 2 and theelectrodes 3 from galvanic corrosion, and destruction due to cavitation, is provided on the heatingresistive layer 2 including theheating portion 9 and theelectrodes 3. -
Reference numeral 8 represents discharging ports for discharging ink. Theheating portions 9 are provided in anink channel 7 communicating with thedischarging ports 8.Reference numeral 10 represents an ink chamber, communicating with theink channel 7, for supplying theink channel 7 with ink. Theink channel 7 and theink chamber 10 are configured by recesses provided in atop plate 11, and the ink-jet-head substrate 1. Anink supply port 12 for supplying theink chamber 10 with ink is formed in thetop plate 11. - In such a conventional ink-jet head, the thickness of the protective layer is about 1 - 3 µm in order to maintain its covering property in steps produced by the electrodes in the vicinity of the heating portions. However, when such a thick protective layer is present on the heating portions, loss of thermal energy due to the protective layer is unnegligible. Hence, in order to obtain a temperature necessary for bubbling ink on the surface of the protective layer, the temperature at the heating portion must be higher than the temperature on the surface of the protective layer. This is one of the reasons for accelerating degradation of the heating resistive layer. Furthermore, when the temperature at the heating portion is increased, bubbling of ink occurs in the midst of application of thermal energy. Hence, energy supplied after the bubbling causes a rapid increase in the surface temperature of the protective layer, to decompose organic components of the ink, thereby producing burnt deposits on the protective layer.
- In order to solve such problems, ink-jet heads in which a thinner protective layer is provided on heating portions have been devised. For example, in Japanese Patent Laid-Open Application (Kokai) No. 62-103148 (1987), a configuration is disclosed in which only portions of a protective layer, provided on electrothermal transducers, present on heating portions are thinned by performing half etching in dry etching. In Japanese Patent Laid-Open Application (Kokai) No. 63-191646 (1988), a configuration is disclosed in which an oxide film is formed by performing anodic oxidation of heating portions of a heating resistive layer, and an organic insulating film is formed on electrodes so that at least a part of the oxide film is exposed.
- However, in the first configuration, since the thickness of the protective layer on the heating portions is determined by the state of the etching, it is difficult to strictly control the thickness of the protective layer on the heating portions. As a result, discharging characteristics of respective ink-jet heads may slightly differ from one another. In the second configuration, in addition to the fact that it is difficult to control the thickness of the oxide film on the heating portions as in the first configuration, only materials having an excellent protective property obtained by performing anodic oxidation of the heating resistive layer can be used.
- The present invention has been made in consideration of the above-described problems.
- It is an object of the present invention to provide a substrate for an ink-jet head in which the thickness of a protective layer on heating portions can be strictly controlled to a desired value, and a desired material can be used as a heating resistive layer.
- It is another object of the present invention to provide a substrate for an ink-jet head which has an excellent protective property even if the thickness of a protective layer on heating portions is small.
- It is still another object of the present invention to provide a substrate for an ink-jet head in which the life of a heating resistive layer is long, and few burnt deposits are produced on a protective layer.
- In order to achieve these objectives, the inventors of the present invention propose a configuration in which a thin intermediate layer is provided between a heating resistive layer and electrodes, and the thin intermediate layer on heating portions comprises an insulator. According to this configuration, since-steps at portions where the thin intermediate layer is provided are small, an excellent film quality can be obtained even when the thickness of the layer is relatively small. Hence, an excellent protective property is obtained.
- Also proposed is a configuration in which a protective layer is provided so as to expose the insulator.
- Also proposed is a configuration in which the thin intermediate layer comprises an insulator, and the electrodes are electrically connected to the heating resistive layer through throughholes provided in the thin intermediate layer.
- Also proposed is a configuration in which the thin intermediate layer comprises a metal, and the thin intermediate layer on the heating portions is insulated.
- The present invention also includes an ink-jet head using the substrate for an ink-jet head according to the present invention.
- The present invention also includes an ink-jet apparatus which mounts an ink-jet head using the substrate for an ink-jet head according to the present invention.
- According to one aspect, the present invention which achieves these objectives relates to a substrate for an ink-jet head, the substrate comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes. Thermal energy is generated from the heating portions by passing current through the heating resistive layer from the electrodes. The substrate also comprises a thin intermediate layer between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
- According to another aspect, the present invention which achieves these objectives relates to an ink-jet head comprising a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from the heating portions by passing current through the heating resistive layer from the electrodes, discharging ports for discharging the liquid, an ink channel communicating with the discharging ports, an ink chamber for supplying the ink channel with ink, and a thin intermediate layer provided between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
- According to still another aspect, the present invention which achieves these objectives relates to an ink-jet apparatus comprising an ink-jet head, comprising a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from the heating portions by passing current through the heating resistive layer from the electrodes, discharging ports for discharging the liquid, an ink channel communicating with the discharging ports, an ink chamber for supplying the ink channel with ink, and conveying means for conveying a printing material onto which the liquid is discharged. The ink-jet apparatus also comprises a thin intermediate layer provided between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
- The foregoing and other objects, advantages and features of the present invention will become more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.
-
- FIG. 1 is a schematic diagram illustrating the surrounding structure of a heating portion of an ink-jet head according to a first embodiment of the present invention;
- FIGS. 2(A) and 2(B) are schematic diagrams illustrating a substrate for an ink-jet head according to a second embodiment of the present invention;
- FIG. 3 is a schematic diagram illustrating a substrate for an ink-jet head according to a third embodiment of the present invention;
- FIG. 4 is a schematic diagram illustrating a substrate for an ink-jet head according to a fourth embodiment of the present invention;
- FIGS. 5(A) through 5(C) are schematic diagrams illustrating production processes of the substrate for an ink-jet head according to the fourth embodiment;
- FIG. 6 is an external perspective view illustrating an ink-jet apparatus (IJA) which mounts an ink-jet head obtained according to the present invention as an ink-jet-head cartridge (IJC); and
- FIGS. 7(A) and 7(B) are schematic diagrams illustrating the configuration of a general ink-jet head.
- Preferred embodiments of the present invention will now be described in detail with reference to the drawings.
- FIG. 1 is a schematic diagram illustrating the surrounding structure of an ink-jet head according to a first embodiment of the present invention.
- The present invention provides the configuration of a protective layer which can assuredly cover electrothermal transducers even if the thickness of the layer is small. That is, a thin intermediate layer is provided between a heating resistive layer and electrodes, and the thin intermediate layer on heating portions comprises an insulator. According to this configuration, the life of the heating resistive layer is increased, and occurrence of burnt deposits is suppressed. Since steps at portions where the thin intermediate layer is provided are small, an excellent film quality is obtained even if the thickness of the layer is small, and therefore an excellent protective property is obtained.
- In FIG. 1,
reference numeral 2 represents a heating resistive layer for generating thermal energy utilized for discharging ink.Reference numeral 3 represents interconnection conductors, serving as electrodes, provided on the heatingresistive layer 2 and electrically connected thereto, for passing current through the heatingresistive layer 2.Reference numeral 9 represents a heating portion where theinterconnection conductor 3 is not provided on the heatingresistive layer 2. Thermal energy is generated from theheating portion 9. - An thin
intermediate layer 4 is provided between the heatingresistive layer 2 and theinterconnection conductor 3. In the present embodiment, Si3N4 is used for the thinintermediate layer 4. - The important point in the present embodiment is that the portion of the thin
intermediate layer 4 present on theheating portion 9 is an insulator. The thinintermediate layer 4 covers theheating portion 9 and contacts both of the heatingresistive layer 2 and theinterconnection conductors 3. Hence, if the portion of the thinintermediate layer 4 present on theheating portion 9 is a conductor, current flows through the thinintermediate layer 4, and therefore theheating portion 9 does not operate. The thinintermediate layer 4 may comprise an insulator, or a metal or the like whose portion on theheating portion 9 is processed to be an insulator. When using an insulator for the thinintermediate layer 4, it is necessary to providethroughholes 5 for electrically connecting the heatingresistive layer 2 to theinterconnection conductors 3. - Any insulating or metallic materials having cavitation-resistive property may be used for the thin
intermediate layer 4. For example, insulators, such as Si3N4 and SiC, and metals, such as Ta and Fe, may be used. - Since the thin
intermediate layer 4 is proived on the heatingresistive layer 2, it can be formed in a state in which substantially no steps are produced. Accordingly, a layer having an excellent film property can be formed even if the thickness of the layer is small. In consideration of the covering property and the effect of provision of a thin film, the thickness of the thinintermediate layer 4 is preferably 200 - 700 nm. - When using a metal for the thin
intermediate layer 4, it is preferable to perform heat treatment in an oxygen or nitrogen atmosphere for making a portion on theheating portion 9 an insulator. That is, particularly when using Al for theelectrodes 3, the growth of an oxide or nitride layer is prevented by Al2O3 or AlN formed on Al by the heat treatment, and nitriding or oxidation stops at a thickness of about 100 nm. On the other hand, the portion of the thinintermediate layer 4 on theheating portion 9 is completely subjected to nitriding or oxidized. Accordingly, by performing insulating processing by heat treatment in an oxygen or nitrogen atmosphere, a conductive portion having a substantially constant thickness can be obtained in an electrode portion even if the time period of the heat treatment is not controlled. It is, of course, possible to perform insulating processing according to anodic oxidation or the like by controlling the time period of the insulating processing. - When using an insulator for the thin
intermediate layer 4, aprotective layer 6 is provided on theinterconnection conductors 3. Theprotective layer 6 is formed, for example, by coating an organic resin. At that time, theprotective layer 6 is provided except on theheating portion 9. However, since no problem arises even if the resin is coated on a boundary portion between theinterconnection conductors 3 and theheating portion 9 because the temperature of the boundary portion is lower than the temperature at a central portion, it is preferable, from the viewpoint of reliability, to coat the resin on portions of theheating portion 9 in the proximity of the interconnection conductors 3 (boundary portions) in order to assuredly protect theinterconnection conductor 3. It is also possible to perform insulating processing only for theinterconnection conductor 3 as when using a metal for the thinintermediate layer 4. - Next, a description will be provided of a method of manufacturing an ink-jet head according to the first embodiment.
- A Ta/Ir layer having a thickness of 100 nm was formed on a
Si substrate 1 having a thermally oxidized film, serving as a heat storage layer, by sputtering. The formed layer was etched to a desired pattern, as shown in FIG. 1, to form the heatingresistive layer 2. - Thereafter, a Si3N4 film, serving as the thin
intermediate layer 4, having a thickness of 300 nm was formed on the heatingresistive layer 2 by sputtering, andthroughholes 5 for electrically connecting theinterconnection conductors 3, serving as the electrodes, to the heatingresistive layer 2 were formed by etching. - Then, an Al film having a thickness of 500 nm was formed on the thin
intermediate layer 4 by sputtering. The formed layer was etched to a desired pattern, as shown in FIG. 1, to form theinterconnection conductors 3. - Then, the
protective layer 6 was formed by coating Photoneece (trade name: made by Toray Industries, Inc.), serving as an organic resin, on theinterconnection conductor 3 to a thickness of 1 µm followed by provisional curing at 80 - 90 °C, patterning the cured film to a desired shape, and performing complete curing of the film at 350 - 450 °C. - A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
- Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
- In the first embodiment, the heating
resistive layer 2 is provided also under theinterconnection conductor 3, serving as the electrodes. In a second embodiment of the present invention, however, a heating resistive layer is provided only at portions which serve as heating portions. - FIGS. 2(A) and 2(B) are schematic diagrams illustrating a substrate for an ink-jet head according to the second embodiment. The ink-jet head is formed as in the first embodiment except that the pattern of the heating resistive layer is changed as shown in FIGS. 2(A) and 2(B). A thin intermediate layer may be provided only on a heating portion, as shown in FIG. 2(B). In this case, it is unnecessary to provide throughholes.
- Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
- A description will now be provided of a method for manufacturing an ink-jet head, in which a thin
intermediate layer 4 comprises two layers made of an insulator and a metal, according to a third embodiment of the present invention. - FIG. 3 is a schematic diagram illustrating the ink-jet head according to the third embodiment.
- A HfB2 film having a thickness of 100 nm was formed on an
Si substrate 1 having a thermally oxided film, serving as a heat storage layer, by sputtering. The formed film was etched to a desired pattern, as shown in FIG. 3, to form a heatingresistive layer 2. - Thereafter, a Si3N4 film having a thickness of 300 nm was formed on the heating
resistive layer 2 by sputtering as a first thinintermediate layer 4a. Then, throughholes 5 for electrically connecting theinterconnection conductors 3, serving as electrodes, to the heatingresistive layer 2 were formed by etching. - Then, a Ta film having a thickness of 200 nm was formed on the Si3N4 layer 4a by sputtering, and portions in the vicinity of boundaries between the formed film and the
interconnection conductors 3, and portions between the patterns of the heatingresistive layer 2 were etched, to form a second thinintermediate layer 4b. - Then, an Al film having a thickness of 500 nm was formed on the second thin
intermediate layer 4b by sputtering. The formed film was etched to a desired pattern, as shown in FIG. 3, to form theinterconnection conductors 3. - Then, a
protective layer 6 made of an organic resin was coated on theinterconnection conductors 3 to a thickness of 1 µm, and the organic resin present on the heating portions was removed. - A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
- Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
- Next, a description will be provided of a method for forming an ink-jet head, in which a metal is used for a thin intermediate layer, according to a fourth embodiment of the present invention.
- FIG. 4 is a schematic diagram illustrating a substrate for an ink-jet head according to the fourth embodiment.
- FIGS. 5(A) through 5(C) are diagrams illustrating production processes of the substrate for an ink-jet head according to the fourth embodiment.
- A Ta/Ir film having a thickness of 100 nm was formed on a
Si substrate 1 having a thermally oxided film, serving as a heat storage layer, by sputtering. The formed film was etched to a desired pattern to form a heating resistive layer 2 (FIG. 5(A)). Then, a Ta film having a thickness of 200 nm was formed on the heatingresistive layer 2 by sputtering, to form a thinintermediate layer 4. - Thereafter, an Al film having a thickness of 500 nm was formed by sputtering on the thin
intermediate layer 4. The formed film was etched to a desired pattern to form interconnection conductors 3 (FIG. 5(B)). - Then, the substrate was left in the atmosphere at 500 °C for 10 - 30 hours. The surface of the Ta film between the patterns of the
interconnection conductors 3 on theheating portions 9 and the surface of the Al film were oxidized to form oxide films (FIG. 5(C)). - The Ta film, serving as the thin
intermediate layer 4, is completely converted into a Ta2O5 film. However, since the growth of an oxide layer is prevented by an Al2O3 film formed on the Al film, serving as theinterconnection conductors 3, the oxidation stops when the thickness of the Al film becomes about 100 nm. - Thus, the Ta film between the patterns of the
interconnection conductors 3 on theheating portions 9 is oxidized. Hence, the Ta/Ir film of the heatingresistive layer 2 is not dissolved even if it is immersed in ink. - A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
- Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
- An ink-jet head was manufactured in the same manner as in the fourth embodiment except that the heating resistive layer and the thin intermediate layer were changed from the Ta/Ir film and the Ta film to a HfB2 film and a Fe film, respectively, and insulating processing was performed in a nitrogen atomsphere.
- Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
- A description will now be provided of an example of an ink-jet apparatus which can mount an ink-jet head according to the present invention.
- FIG. 6 is an external perspective view illustrating an example of an ink-jet apparatus (IJA) which mounts an ink-jet head obtained according to the present invention as an ink-jet-head cartridge (IJC).
- In FIG. 6,
reference number 20 represents an ink-jet-head cartridge including nozzles for discharging ink while facing a printing surface of printing paper, serving as a printing medium, fed onto aplaten 24.Reference numeral 16 represents acarriage 16 for holding theIJC 20. Thecarriage 16 is connected to a part of a drivingbelt 18 for transmitting the driving force of a drivingmotor 17, and is slidable along twoguide shafts IJC 20 can reciprocate over the entire width of the printing paper. - A
head recovery device 26 is disposed at one end of a moving path of theIJC 20, for example, at a position facing a home position. Capping of theIJC 20 is performed by the driving force of amotor 22 via atransmission mechanism 23. By performing capping when, for example, terminating printing, theIJC 20 is protected. - A
blade 30 made of a silicone rubber, serving as a wiping member, is disposed at a side of thehead recovery device 26. Theblade 30 is held by ablade holding member 30A in the form of a cantilever, and operates by themotor 22 and thetransmission mechanism 23, as thehead recovery device 26, so as to be engageable with a discharging surface of theIJC 20. At an appropriate timing during a printing operation of theIJC 20, or after discharge recovery processing using thehead recovery device 26, theblade 30 is protruded in the moving path of theIJC 20. Dew condensation, wetting, dust or the like on the discharging surface of theIJC 20 is wiped in accordance with the moving operation of theIJC 20. - The individual components shown in outline in the drawings are all well known in the ink-jet head, ink-jet-head substrate and ink-jet apparatus arts and their specific construction and operation are not critical to the operation or the best mode for carrying out the invention.
- While the present invention has been described with respect to what is presently considered to be the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, the present invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
- A substrate for an ink-jet head provides a protective layer which can assuredly cover electrothermal transducers even if the thickness of the layer is small. A thin intermediate layer is provided between a heating resistive layer and electrodes. The thin intermediate layer is an insulator on heating portions of the heating resistive layer. According to such a configuration, the life of the heating resistive layer becomes long, and occurrence of burnt deposits is suppressed. Since steps at portions where the thin intermediate layer is provided are small, an excellent film quality can be obtained even if the thickness of the protective layer is relatively small, and an excellent protective property is obtained.
Claims (19)
- A substrate for an ink-jet head, said substrate comprising:
a heating resistive layer for generating thermal energy utilized for discharging a liquid;
respective pairs of electrodes electrically connected to said heating resistive layer thereon; and
heating portions of said heating resistive layer provided between corresponding pairs of electrodes, thermal energy being generated from said heating portions by passing current through said heating resistive layer from the electrodes; and
a thin intermediate layer provided between said heating resistive layer and the electrodes, said thin intermediate layer at least on said heating portions comprising an insulator. - A substrate according to Claim 1, wherein said thin intermediate layer comprises an insulator, and wherein the electrodes are electrically connected to said heating resistive layer through throughholes provided in said thin intermediate layer.
- A substrate according to Claim 2, wherein said thin intermediate layer comprises Si3N4.
- A substrate according to Claim 1, wherein the surfaces of the electrodes are insulated.
- A substrate according to Claim 1, wherein a protective layer is provided on the electrodes except said heating portions.
- A substrate according to Claim 1, wherein said thin intermediate layer comprises a metal, and wherein said thin intermediate layer on said heating portions is insulated.
- A substrate according to Claim 6, wherein the insulator comprises an oxide or a nitride of the metal.
- A substrate according to Claim 6, wherein the metal comprises Ta or Fe.
- A substrate according to Claim 6, wherein the surfaces of the electrodes are insulated.
- An ink-jet head comprising:
a substrate for said ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to said heating resistive layer thereon, and heating portions of said heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from said heating portions by passing current through said heating resistive layer from the electrodes;
discharging ports for discharging the liquid;
an ink channel communicating with said discharging ports;
an ink chamber for supplying said ink channel with ink; and
a thin intermediate layer provided between said heating resistive layer and said electrodes, said thin intermediate layer comprising an insulator at least on said heating portions. - An ink-jet head according to Claim 10, wherein said thin intermediate layer comprises an insulator, and wherein the electrodes are electrically connected to said heating resistive layer through throughholes provided in said thin intermediate layer.
- An ink-jet head according to Claim 11, wherein said thin intermediate layer comprises Si3N4.
- An ink-jet head according to Claim 10, wherein the surfaces of the electrodes are insulated.
- An ink-jet head according to Claim 10, wherein a protective layer is provided on the electrodes except said heating portions.
- An ink-jet head according to Claim 10, wherein said thin intermediate layer comprises a metal, and wherein said thin intermediate layer on said heating portions is insulated.
- An ink-jet head according to Claim 15, wherein the insulator comprises an oxide or a nitride of the metal.
- An ink-jet head according to Claim 15, wherein the metal comprises Ta or Fe.
- An ink-jet head according to Claim 15, wherein the surfaces of the electrodes are insulated.
- An ink-jet apparatus comprising: an ink-jet head comprising:
a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to said heating resistive layer thereon, and heating portions of said heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from said heating portions by passing current through said heating resistive layer from the electrodes;
discharging ports for discharging the liquid;
an ink channel communicating with said discharging ports; and
an ink chamber for supplying said ink channel with ink;
conveying means for conveying a printing material onto which the liquid is discharged; and
a thin intermediate layer provided between said heating resistive layer and the electrodes, said thin intermediate layer at least on said heating portions comprising an insulator.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP70866/95 | 1995-03-03 | ||
JP7086695 | 1995-03-03 | ||
JP7086695 | 1995-03-03 | ||
JP72391/95 | 1995-03-06 | ||
JP7239195 | 1995-03-06 | ||
JP7239195 | 1995-03-06 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0729834A2 true EP0729834A2 (en) | 1996-09-04 |
EP0729834A3 EP0729834A3 (en) | 1997-05-21 |
EP0729834B1 EP0729834B1 (en) | 2002-06-12 |
Family
ID=26411992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19960103179 Expired - Lifetime EP0729834B1 (en) | 1995-03-03 | 1996-03-01 | An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0729834B1 (en) |
DE (1) | DE69621665T2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0951999A3 (en) * | 1998-04-22 | 2000-05-03 | Hewlett-Packard Company | Reduced drop volume ink jet print head |
US6331049B1 (en) | 1999-03-12 | 2001-12-18 | Hewlett-Packard Company | Printhead having varied thickness passivation layer and method of making same |
WO2002083424A1 (en) * | 2001-04-13 | 2002-10-24 | Sony Corporation | Liquid injection head, liquid injection device, and method of manufacturing liquid injection head |
US7025894B2 (en) | 2001-10-16 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Fluid-ejection devices and a deposition method for layers thereof |
EP1968797A2 (en) * | 2005-12-23 | 2008-09-17 | Lexmark International, Inc., Intellectual Property Law Dept. | Low energy, long life micro-fluid ejection device |
CN101125482B (en) * | 2001-10-30 | 2010-04-21 | 佳能株式会社 | Structure with through hole, production method thereof, and liquid discharge head |
US7838155B2 (en) | 2001-03-13 | 2010-11-23 | Sony Corporation | Aqueous electrolyte solution absorber and method for producing it |
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JPS5582678A (en) * | 1978-12-19 | 1980-06-21 | Toshiba Corp | Thermal head |
JPS5582677A (en) * | 1978-12-18 | 1980-06-21 | Toshiba Corp | Thermal head |
JPS62202754A (en) * | 1986-03-03 | 1987-09-07 | Tdk Corp | Thin film type thermal head |
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EP0596705A2 (en) * | 1992-11-05 | 1994-05-11 | Xerox Corporation | Heater element for a thermal ink jet printhead |
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1996
- 1996-03-01 DE DE1996621665 patent/DE69621665T2/en not_active Expired - Lifetime
- 1996-03-01 EP EP19960103179 patent/EP0729834B1/en not_active Expired - Lifetime
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JPS5582677A (en) * | 1978-12-18 | 1980-06-21 | Toshiba Corp | Thermal head |
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EP0396315A1 (en) * | 1989-05-01 | 1990-11-07 | Xerox Corporation | Thermal ink jet printhead with bubble generating heating elements |
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PATENT ABSTRACTS OF JAPAN vol. 012, no. 055 (M-669), 19 February 1988 & JP 62 202754 A (TDK CORP), 7 September 1987, * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0951999A3 (en) * | 1998-04-22 | 2000-05-03 | Hewlett-Packard Company | Reduced drop volume ink jet print head |
US6293654B1 (en) | 1998-04-22 | 2001-09-25 | Hewlett-Packard Company | Printhead apparatus |
KR100440109B1 (en) * | 1998-04-22 | 2004-07-15 | 휴렛-팩커드 컴퍼니(델라웨어주법인) | Printhead having a passivation layer with reduced thickness |
US6331049B1 (en) | 1999-03-12 | 2001-12-18 | Hewlett-Packard Company | Printhead having varied thickness passivation layer and method of making same |
US7838155B2 (en) | 2001-03-13 | 2010-11-23 | Sony Corporation | Aqueous electrolyte solution absorber and method for producing it |
US7182440B2 (en) | 2001-04-13 | 2007-02-27 | Sony Corporation | Liquid jet apparatus |
KR100866270B1 (en) * | 2001-04-13 | 2008-11-03 | 소니 가부시끼 가이샤 | Liquid injection head, liquid injection device, and method of manufacturing liquid injection head |
WO2002083424A1 (en) * | 2001-04-13 | 2002-10-24 | Sony Corporation | Liquid injection head, liquid injection device, and method of manufacturing liquid injection head |
US7836598B2 (en) | 2001-04-13 | 2010-11-23 | Sony Corporation | Method of manufacturing a thermal liquid jet head using an etching process |
US7025894B2 (en) | 2001-10-16 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Fluid-ejection devices and a deposition method for layers thereof |
US7517060B2 (en) | 2001-10-16 | 2009-04-14 | Hewlett-Packard Development Company, L.P. | Fluid-ejection devices and a deposition method for layers thereof |
CN101125482B (en) * | 2001-10-30 | 2010-04-21 | 佳能株式会社 | Structure with through hole, production method thereof, and liquid discharge head |
EP1968797A2 (en) * | 2005-12-23 | 2008-09-17 | Lexmark International, Inc., Intellectual Property Law Dept. | Low energy, long life micro-fluid ejection device |
EP1968797A4 (en) * | 2005-12-23 | 2010-08-11 | Lexmark International Inc Inte | Low energy, long life micro-fluid ejection device |
Also Published As
Publication number | Publication date |
---|---|
DE69621665D1 (en) | 2002-07-18 |
EP0729834A3 (en) | 1997-05-21 |
DE69621665T2 (en) | 2003-03-06 |
EP0729834B1 (en) | 2002-06-12 |
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