EP0729834A2 - An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus - Google Patents

An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus Download PDF

Info

Publication number
EP0729834A2
EP0729834A2 EP96103179A EP96103179A EP0729834A2 EP 0729834 A2 EP0729834 A2 EP 0729834A2 EP 96103179 A EP96103179 A EP 96103179A EP 96103179 A EP96103179 A EP 96103179A EP 0729834 A2 EP0729834 A2 EP 0729834A2
Authority
EP
European Patent Office
Prior art keywords
ink
heating
electrodes
jet head
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96103179A
Other languages
German (de)
French (fr)
Other versions
EP0729834A3 (en
EP0729834B1 (en
Inventor
Takumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0729834A2 publication Critical patent/EP0729834A2/en
Publication of EP0729834A3 publication Critical patent/EP0729834A3/en
Application granted granted Critical
Publication of EP0729834B1 publication Critical patent/EP0729834B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14088Structure of heating means
    • B41J2/14112Resistive element
    • B41J2/14129Layer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching

Abstract

A substrate for an ink-jet head provides a protective layer which can assuredly cover electrothermal transducers even if the thickness of the layer is small. A thin intermediate layer is provided between a heating resistive layer and electrodes. The thin intermediate layer is an insulator on heating portions of the heating resistive layer. According to such a configuration, the life of the heating resistive layer becomes long, and occurrence of burnt deposits is suppressed. Since steps at portions where the thin intermediate layer is provided are small, an excellent film quality can be obtained even if the thickness of the protective layer is relatively small, and an excellent protective property is obtained.

Description

    BACKGROUND OF THE INVENTION Field of the Invention
  • This invention relates to an ink-jet head for performing printing by forming a very small droplet by discharging a printing liquid, such as ink or the like, utilizing thermal energy, and causing the droplet to adhere to a printing material, such as paper or the like. The invention also relates to a substrate for such an ink-jet head, and to an ink-jet apparatus.
  • Description of the Related Art
  • An ink-jet head used in an ink-jet printing method of utilizing thermal energy for forming a very small droplet to be discharged generally includes a heating resistive layer provided on a substrate, respective pairs of electrodes provided on the heating resistive layer and electrically connected thereto, and respective heating portions of the heating resistive layer provided between the pairs of electrodes. Thermal energy is generated from selected ones of the heating portions by passing current through the heating resistive layer from the corresponding pairs of electrodes. The state of ink in an ink channel is changed by the thermal energy, and printing is performed by discharging the ink onto a printing material by the pressure caused by volume expansion of bubbles in this changed state.
  • The configurations of such ink-jet heads are disclosed, for example, in Japanese Patent Laid-Open Application (Kokai) Nos. 55-128467 (1980) and 59-194866 (1984).
  • FIGS. 7(A) and 7(B) are schematic diagrams illustrating the general configuration of such an ink-jet head.
  • In FIGS. 7(A) and 7(B), reference numeral 1 represents a substrate for an ink-jet head on which a heating resistive layer 2 and pairs of electrodes 3 are provided. The heating resistive layer 2 for converting electric energy into thermal energy is provided on the surface of the insulating ink-jet-head substrate 1, and the pairs of electrodes 3 for passing current through the heating resistive layer 2 are provided on the heating resistive layer 2. The pairs of electrodes 3 comprise individual electrode portions for selectively driving segments of the heating resistive layer 2, and a common electrode portion for distributing current. The thermal energy is generated from a heating portion 9 provided between the corresponding pair of electrodes. A protective layer 6, for preventing the heating resistive layer 2 and the electrodes 3 from galvanic corrosion, and destruction due to cavitation, is provided on the heating resistive layer 2 including the heating portion 9 and the electrodes 3.
  • Reference numeral 8 represents discharging ports for discharging ink. The heating portions 9 are provided in an ink channel 7 communicating with the discharging ports 8. Reference numeral 10 represents an ink chamber, communicating with the ink channel 7, for supplying the ink channel 7 with ink. The ink channel 7 and the ink chamber 10 are configured by recesses provided in a top plate 11, and the ink-jet-head substrate 1. An ink supply port 12 for supplying the ink chamber 10 with ink is formed in the top plate 11.
  • In such a conventional ink-jet head, the thickness of the protective layer is about 1 - 3 µm in order to maintain its covering property in steps produced by the electrodes in the vicinity of the heating portions. However, when such a thick protective layer is present on the heating portions, loss of thermal energy due to the protective layer is unnegligible. Hence, in order to obtain a temperature necessary for bubbling ink on the surface of the protective layer, the temperature at the heating portion must be higher than the temperature on the surface of the protective layer. This is one of the reasons for accelerating degradation of the heating resistive layer. Furthermore, when the temperature at the heating portion is increased, bubbling of ink occurs in the midst of application of thermal energy. Hence, energy supplied after the bubbling causes a rapid increase in the surface temperature of the protective layer, to decompose organic components of the ink, thereby producing burnt deposits on the protective layer.
  • In order to solve such problems, ink-jet heads in which a thinner protective layer is provided on heating portions have been devised. For example, in Japanese Patent Laid-Open Application (Kokai) No. 62-103148 (1987), a configuration is disclosed in which only portions of a protective layer, provided on electrothermal transducers, present on heating portions are thinned by performing half etching in dry etching. In Japanese Patent Laid-Open Application (Kokai) No. 63-191646 (1988), a configuration is disclosed in which an oxide film is formed by performing anodic oxidation of heating portions of a heating resistive layer, and an organic insulating film is formed on electrodes so that at least a part of the oxide film is exposed.
  • However, in the first configuration, since the thickness of the protective layer on the heating portions is determined by the state of the etching, it is difficult to strictly control the thickness of the protective layer on the heating portions. As a result, discharging characteristics of respective ink-jet heads may slightly differ from one another. In the second configuration, in addition to the fact that it is difficult to control the thickness of the oxide film on the heating portions as in the first configuration, only materials having an excellent protective property obtained by performing anodic oxidation of the heating resistive layer can be used.
  • SUMMARY OF THE INVENTION
  • The present invention has been made in consideration of the above-described problems.
  • It is an object of the present invention to provide a substrate for an ink-jet head in which the thickness of a protective layer on heating portions can be strictly controlled to a desired value, and a desired material can be used as a heating resistive layer.
  • It is another object of the present invention to provide a substrate for an ink-jet head which has an excellent protective property even if the thickness of a protective layer on heating portions is small.
  • It is still another object of the present invention to provide a substrate for an ink-jet head in which the life of a heating resistive layer is long, and few burnt deposits are produced on a protective layer.
  • In order to achieve these objectives, the inventors of the present invention propose a configuration in which a thin intermediate layer is provided between a heating resistive layer and electrodes, and the thin intermediate layer on heating portions comprises an insulator. According to this configuration, since-steps at portions where the thin intermediate layer is provided are small, an excellent film quality can be obtained even when the thickness of the layer is relatively small. Hence, an excellent protective property is obtained.
  • Also proposed is a configuration in which a protective layer is provided so as to expose the insulator.
  • Also proposed is a configuration in which the thin intermediate layer comprises an insulator, and the electrodes are electrically connected to the heating resistive layer through throughholes provided in the thin intermediate layer.
  • Also proposed is a configuration in which the thin intermediate layer comprises a metal, and the thin intermediate layer on the heating portions is insulated.
  • The present invention also includes an ink-jet head using the substrate for an ink-jet head according to the present invention.
  • The present invention also includes an ink-jet apparatus which mounts an ink-jet head using the substrate for an ink-jet head according to the present invention.
  • According to one aspect, the present invention which achieves these objectives relates to a substrate for an ink-jet head, the substrate comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes. Thermal energy is generated from the heating portions by passing current through the heating resistive layer from the electrodes. The substrate also comprises a thin intermediate layer between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
  • According to another aspect, the present invention which achieves these objectives relates to an ink-jet head comprising a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from the heating portions by passing current through the heating resistive layer from the electrodes, discharging ports for discharging the liquid, an ink channel communicating with the discharging ports, an ink chamber for supplying the ink channel with ink, and a thin intermediate layer provided between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
  • According to still another aspect, the present invention which achieves these objectives relates to an ink-jet apparatus comprising an ink-jet head, comprising a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to the heating resistive layer thereon, and heating portions of the heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from the heating portions by passing current through the heating resistive layer from the electrodes, discharging ports for discharging the liquid, an ink channel communicating with the discharging ports, an ink chamber for supplying the ink channel with ink, and conveying means for conveying a printing material onto which the liquid is discharged. The ink-jet apparatus also comprises a thin intermediate layer provided between the heating resistive layer and the electrodes. The thin intermediate layer comprises an insulator at least on the heating portions.
  • The foregoing and other objects, advantages and features of the present invention will become more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
    • FIG. 1 is a schematic diagram illustrating the surrounding structure of a heating portion of an ink-jet head according to a first embodiment of the present invention;
    • FIGS. 2(A) and 2(B) are schematic diagrams illustrating a substrate for an ink-jet head according to a second embodiment of the present invention;
    • FIG. 3 is a schematic diagram illustrating a substrate for an ink-jet head according to a third embodiment of the present invention;
    • FIG. 4 is a schematic diagram illustrating a substrate for an ink-jet head according to a fourth embodiment of the present invention;
    • FIGS. 5(A) through 5(C) are schematic diagrams illustrating production processes of the substrate for an ink-jet head according to the fourth embodiment;
    • FIG. 6 is an external perspective view illustrating an ink-jet apparatus (IJA) which mounts an ink-jet head obtained according to the present invention as an ink-jet-head cartridge (IJC); and
    • FIGS. 7(A) and 7(B) are schematic diagrams illustrating the configuration of a general ink-jet head.
    DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Preferred embodiments of the present invention will now be described in detail with reference to the drawings.
  • First Embodiment
  • FIG. 1 is a schematic diagram illustrating the surrounding structure of an ink-jet head according to a first embodiment of the present invention.
  • The present invention provides the configuration of a protective layer which can assuredly cover electrothermal transducers even if the thickness of the layer is small. That is, a thin intermediate layer is provided between a heating resistive layer and electrodes, and the thin intermediate layer on heating portions comprises an insulator. According to this configuration, the life of the heating resistive layer is increased, and occurrence of burnt deposits is suppressed. Since steps at portions where the thin intermediate layer is provided are small, an excellent film quality is obtained even if the thickness of the layer is small, and therefore an excellent protective property is obtained.
  • In FIG. 1, reference numeral 2 represents a heating resistive layer for generating thermal energy utilized for discharging ink. Reference numeral 3 represents interconnection conductors, serving as electrodes, provided on the heating resistive layer 2 and electrically connected thereto, for passing current through the heating resistive layer 2. Reference numeral 9 represents a heating portion where the interconnection conductor 3 is not provided on the heating resistive layer 2. Thermal energy is generated from the heating portion 9.
  • An thin intermediate layer 4 is provided between the heating resistive layer 2 and the interconnection conductor 3. In the present embodiment, Si3N4 is used for the thin intermediate layer 4.
  • The important point in the present embodiment is that the portion of the thin intermediate layer 4 present on the heating portion 9 is an insulator. The thin intermediate layer 4 covers the heating portion 9 and contacts both of the heating resistive layer 2 and the interconnection conductors 3. Hence, if the portion of the thin intermediate layer 4 present on the heating portion 9 is a conductor, current flows through the thin intermediate layer 4, and therefore the heating portion 9 does not operate. The thin intermediate layer 4 may comprise an insulator, or a metal or the like whose portion on the heating portion 9 is processed to be an insulator. When using an insulator for the thin intermediate layer 4, it is necessary to provide throughholes 5 for electrically connecting the heating resistive layer 2 to the interconnection conductors 3.
  • Any insulating or metallic materials having cavitation-resistive property may be used for the thin intermediate layer 4. For example, insulators, such as Si3N4 and SiC, and metals, such as Ta and Fe, may be used.
  • Since the thin intermediate layer 4 is proived on the heating resistive layer 2, it can be formed in a state in which substantially no steps are produced. Accordingly, a layer having an excellent film property can be formed even if the thickness of the layer is small. In consideration of the covering property and the effect of provision of a thin film, the thickness of the thin intermediate layer 4 is preferably 200 - 700 nm.
  • When using a metal for the thin intermediate layer 4, it is preferable to perform heat treatment in an oxygen or nitrogen atmosphere for making a portion on the heating portion 9 an insulator. That is, particularly when using Al for the electrodes 3, the growth of an oxide or nitride layer is prevented by Al2O3 or AlN formed on Al by the heat treatment, and nitriding or oxidation stops at a thickness of about 100 nm. On the other hand, the portion of the thin intermediate layer 4 on the heating portion 9 is completely subjected to nitriding or oxidized. Accordingly, by performing insulating processing by heat treatment in an oxygen or nitrogen atmosphere, a conductive portion having a substantially constant thickness can be obtained in an electrode portion even if the time period of the heat treatment is not controlled. It is, of course, possible to perform insulating processing according to anodic oxidation or the like by controlling the time period of the insulating processing.
  • When using an insulator for the thin intermediate layer 4, a protective layer 6 is provided on the interconnection conductors 3. The protective layer 6 is formed, for example, by coating an organic resin. At that time, the protective layer 6 is provided except on the heating portion 9. However, since no problem arises even if the resin is coated on a boundary portion between the interconnection conductors 3 and the heating portion 9 because the temperature of the boundary portion is lower than the temperature at a central portion, it is preferable, from the viewpoint of reliability, to coat the resin on portions of the heating portion 9 in the proximity of the interconnection conductors 3 (boundary portions) in order to assuredly protect the interconnection conductor 3. It is also possible to perform insulating processing only for the interconnection conductor 3 as when using a metal for the thin intermediate layer 4.
  • Next, a description will be provided of a method of manufacturing an ink-jet head according to the first embodiment.
  • A Ta/Ir layer having a thickness of 100 nm was formed on a Si substrate 1 having a thermally oxidized film, serving as a heat storage layer, by sputtering. The formed layer was etched to a desired pattern, as shown in FIG. 1, to form the heating resistive layer 2.
  • Thereafter, a Si3N4 film, serving as the thin intermediate layer 4, having a thickness of 300 nm was formed on the heating resistive layer 2 by sputtering, and throughholes 5 for electrically connecting the interconnection conductors 3, serving as the electrodes, to the heating resistive layer 2 were formed by etching.
  • Then, an Al film having a thickness of 500 nm was formed on the thin intermediate layer 4 by sputtering. The formed layer was etched to a desired pattern, as shown in FIG. 1, to form the interconnection conductors 3.
  • Then, the protective layer 6 was formed by coating Photoneece (trade name: made by Toray Industries, Inc.), serving as an organic resin, on the interconnection conductor 3 to a thickness of 1 µm followed by provisional curing at 80 - 90 °C, patterning the cured film to a desired shape, and performing complete curing of the film at 350 - 450 °C.
  • A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
  • Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
  • Second Embodiment
  • In the first embodiment, the heating resistive layer 2 is provided also under the interconnection conductor 3, serving as the electrodes. In a second embodiment of the present invention, however, a heating resistive layer is provided only at portions which serve as heating portions.
  • FIGS. 2(A) and 2(B) are schematic diagrams illustrating a substrate for an ink-jet head according to the second embodiment. The ink-jet head is formed as in the first embodiment except that the pattern of the heating resistive layer is changed as shown in FIGS. 2(A) and 2(B). A thin intermediate layer may be provided only on a heating portion, as shown in FIG. 2(B). In this case, it is unnecessary to provide throughholes.
  • Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
  • Third Embodiment
  • A description will now be provided of a method for manufacturing an ink-jet head, in which a thin intermediate layer 4 comprises two layers made of an insulator and a metal, according to a third embodiment of the present invention.
  • FIG. 3 is a schematic diagram illustrating the ink-jet head according to the third embodiment.
  • A HfB2 film having a thickness of 100 nm was formed on an Si substrate 1 having a thermally oxided film, serving as a heat storage layer, by sputtering. The formed film was etched to a desired pattern, as shown in FIG. 3, to form a heating resistive layer 2.
  • Thereafter, a Si3N4 film having a thickness of 300 nm was formed on the heating resistive layer 2 by sputtering as a first thin intermediate layer 4a. Then, throughholes 5 for electrically connecting the interconnection conductors 3, serving as electrodes, to the heating resistive layer 2 were formed by etching.
  • Then, a Ta film having a thickness of 200 nm was formed on the Si3N4 layer 4a by sputtering, and portions in the vicinity of boundaries between the formed film and the interconnection conductors 3, and portions between the patterns of the heating resistive layer 2 were etched, to form a second thin intermediate layer 4b.
  • Then, an Al film having a thickness of 500 nm was formed on the second thin intermediate layer 4b by sputtering. The formed film was etched to a desired pattern, as shown in FIG. 3, to form the interconnection conductors 3.
  • Then, a protective layer 6 made of an organic resin was coated on the interconnection conductors 3 to a thickness of 1 µm, and the organic resin present on the heating portions was removed.
  • A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
  • Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
  • Fourth Embodiment
  • Next, a description will be provided of a method for forming an ink-jet head, in which a metal is used for a thin intermediate layer, according to a fourth embodiment of the present invention.
  • FIG. 4 is a schematic diagram illustrating a substrate for an ink-jet head according to the fourth embodiment.
  • FIGS. 5(A) through 5(C) are diagrams illustrating production processes of the substrate for an ink-jet head according to the fourth embodiment.
  • A Ta/Ir film having a thickness of 100 nm was formed on a Si substrate 1 having a thermally oxided film, serving as a heat storage layer, by sputtering. The formed film was etched to a desired pattern to form a heating resistive layer 2 (FIG. 5(A)). Then, a Ta film having a thickness of 200 nm was formed on the heating resistive layer 2 by sputtering, to form a thin intermediate layer 4.
  • Thereafter, an Al film having a thickness of 500 nm was formed by sputtering on the thin intermediate layer 4. The formed film was etched to a desired pattern to form interconnection conductors 3 (FIG. 5(B)).
  • Then, the substrate was left in the atmosphere at 500 °C for 10 - 30 hours. The surface of the Ta film between the patterns of the interconnection conductors 3 on the heating portions 9 and the surface of the Al film were oxidized to form oxide films (FIG. 5(C)).
  • The Ta film, serving as the thin intermediate layer 4, is completely converted into a Ta2O5 film. However, since the growth of an oxide layer is prevented by an Al2O3 film formed on the Al film, serving as the interconnection conductors 3, the oxidation stops when the thickness of the Al film becomes about 100 nm.
  • Thus, the Ta film between the patterns of the interconnection conductors 3 on the heating portions 9 is oxidized. Hence, the Ta/Ir film of the heating resistive layer 2 is not dissolved even if it is immersed in ink.
  • A top plate having recesses for an ink channel and an ink chamber was connected onto the ink-jet-head substrate obtained in the above-described manner, and thus the ink-jet head of the present embodiment was obtained.
  • Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
  • Fifth Embodiment
  • An ink-jet head was manufactured in the same manner as in the fourth embodiment except that the heating resistive layer and the thin intermediate layer were changed from the Ta/Ir film and the Ta film to a HfB2 film and a Fe film, respectively, and insulating processing was performed in a nitrogen atomsphere.
  • Printing was performed using the ink-jet head of the present embodiment. No disconnection due to galvanic corrosion or the like of the heating resistive layer was observed. The same degree of reliability as in conventinal heads was obtained, and occurrence of burnt deposits on the heating portions could be reduced.
  • A description will now be provided of an example of an ink-jet apparatus which can mount an ink-jet head according to the present invention.
  • FIG. 6 is an external perspective view illustrating an example of an ink-jet apparatus (IJA) which mounts an ink-jet head obtained according to the present invention as an ink-jet-head cartridge (IJC).
  • In FIG. 6, reference number 20 represents an ink-jet-head cartridge including nozzles for discharging ink while facing a printing surface of printing paper, serving as a printing medium, fed onto a platen 24. Reference numeral 16 represents a carriage 16 for holding the IJC 20. The carriage 16 is connected to a part of a driving belt 18 for transmitting the driving force of a driving motor 17, and is slidable along two guide shafts 19A and 19B disposed in parallel with each other. Hence, the IJC 20 can reciprocate over the entire width of the printing paper.
  • A head recovery device 26 is disposed at one end of a moving path of the IJC 20, for example, at a position facing a home position. Capping of the IJC 20 is performed by the driving force of a motor 22 via a transmission mechanism 23. By performing capping when, for example, terminating printing, the IJC 20 is protected.
  • A blade 30 made of a silicone rubber, serving as a wiping member, is disposed at a side of the head recovery device 26. The blade 30 is held by a blade holding member 30A in the form of a cantilever, and operates by the motor 22 and the transmission mechanism 23, as the head recovery device 26, so as to be engageable with a discharging surface of the IJC 20. At an appropriate timing during a printing operation of the IJC 20, or after discharge recovery processing using the head recovery device 26, the blade 30 is protruded in the moving path of the IJC 20. Dew condensation, wetting, dust or the like on the discharging surface of the IJC 20 is wiped in accordance with the moving operation of the IJC 20.
  • The individual components shown in outline in the drawings are all well known in the ink-jet head, ink-jet-head substrate and ink-jet apparatus arts and their specific construction and operation are not critical to the operation or the best mode for carrying out the invention.
  • While the present invention has been described with respect to what is presently considered to be the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, the present invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
  • A substrate for an ink-jet head provides a protective layer which can assuredly cover electrothermal transducers even if the thickness of the layer is small. A thin intermediate layer is provided between a heating resistive layer and electrodes. The thin intermediate layer is an insulator on heating portions of the heating resistive layer. According to such a configuration, the life of the heating resistive layer becomes long, and occurrence of burnt deposits is suppressed. Since steps at portions where the thin intermediate layer is provided are small, an excellent film quality can be obtained even if the thickness of the protective layer is relatively small, and an excellent protective property is obtained.

Claims (19)

  1. A substrate for an ink-jet head, said substrate comprising:
       a heating resistive layer for generating thermal energy utilized for discharging a liquid;
       respective pairs of electrodes electrically connected to said heating resistive layer thereon; and
       heating portions of said heating resistive layer provided between corresponding pairs of electrodes, thermal energy being generated from said heating portions by passing current through said heating resistive layer from the electrodes; and
       a thin intermediate layer provided between said heating resistive layer and the electrodes, said thin intermediate layer at least on said heating portions comprising an insulator.
  2. A substrate according to Claim 1, wherein said thin intermediate layer comprises an insulator, and wherein the electrodes are electrically connected to said heating resistive layer through throughholes provided in said thin intermediate layer.
  3. A substrate according to Claim 2, wherein said thin intermediate layer comprises Si3N4.
  4. A substrate according to Claim 1, wherein the surfaces of the electrodes are insulated.
  5. A substrate according to Claim 1, wherein a protective layer is provided on the electrodes except said heating portions.
  6. A substrate according to Claim 1, wherein said thin intermediate layer comprises a metal, and wherein said thin intermediate layer on said heating portions is insulated.
  7. A substrate according to Claim 6, wherein the insulator comprises an oxide or a nitride of the metal.
  8. A substrate according to Claim 6, wherein the metal comprises Ta or Fe.
  9. A substrate according to Claim 6, wherein the surfaces of the electrodes are insulated.
  10. An ink-jet head comprising:
       a substrate for said ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to said heating resistive layer thereon, and heating portions of said heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from said heating portions by passing current through said heating resistive layer from the electrodes;
       discharging ports for discharging the liquid;
       an ink channel communicating with said discharging ports;
       an ink chamber for supplying said ink channel with ink; and
       a thin intermediate layer provided between said heating resistive layer and said electrodes, said thin intermediate layer comprising an insulator at least on said heating portions.
  11. An ink-jet head according to Claim 10, wherein said thin intermediate layer comprises an insulator, and wherein the electrodes are electrically connected to said heating resistive layer through throughholes provided in said thin intermediate layer.
  12. An ink-jet head according to Claim 11, wherein said thin intermediate layer comprises Si3N4.
  13. An ink-jet head according to Claim 10, wherein the surfaces of the electrodes are insulated.
  14. An ink-jet head according to Claim 10, wherein a protective layer is provided on the electrodes except said heating portions.
  15. An ink-jet head according to Claim 10, wherein said thin intermediate layer comprises a metal, and wherein said thin intermediate layer on said heating portions is insulated.
  16. An ink-jet head according to Claim 15, wherein the insulator comprises an oxide or a nitride of the metal.
  17. An ink-jet head according to Claim 15, wherein the metal comprises Ta or Fe.
  18. An ink-jet head according to Claim 15, wherein the surfaces of the electrodes are insulated.
  19. An ink-jet apparatus comprising: an ink-jet head comprising:
       a substrate for the ink-jet head, comprising a heating resistive layer for generating thermal energy utilized for discharging a liquid, respective pairs of electrodes electrically connected to said heating resistive layer thereon, and heating portions of said heating resistive layer provided between corresponding pairs of electrodes, for generating thermal energy from said heating portions by passing current through said heating resistive layer from the electrodes;
       discharging ports for discharging the liquid;
       an ink channel communicating with said discharging ports; and
       an ink chamber for supplying said ink channel with ink;
       conveying means for conveying a printing material onto which the liquid is discharged; and
       a thin intermediate layer provided between said heating resistive layer and the electrodes, said thin intermediate layer at least on said heating portions comprising an insulator.
EP19960103179 1995-03-03 1996-03-01 An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus Expired - Lifetime EP0729834B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP70866/95 1995-03-03
JP7086695 1995-03-03
JP7086695 1995-03-03
JP72391/95 1995-03-06
JP7239195 1995-03-06
JP7239195 1995-03-06

Publications (3)

Publication Number Publication Date
EP0729834A2 true EP0729834A2 (en) 1996-09-04
EP0729834A3 EP0729834A3 (en) 1997-05-21
EP0729834B1 EP0729834B1 (en) 2002-06-12

Family

ID=26411992

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960103179 Expired - Lifetime EP0729834B1 (en) 1995-03-03 1996-03-01 An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus

Country Status (2)

Country Link
EP (1) EP0729834B1 (en)
DE (1) DE69621665T2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0951999A3 (en) * 1998-04-22 2000-05-03 Hewlett-Packard Company Reduced drop volume ink jet print head
US6331049B1 (en) 1999-03-12 2001-12-18 Hewlett-Packard Company Printhead having varied thickness passivation layer and method of making same
WO2002083424A1 (en) * 2001-04-13 2002-10-24 Sony Corporation Liquid injection head, liquid injection device, and method of manufacturing liquid injection head
US7025894B2 (en) 2001-10-16 2006-04-11 Hewlett-Packard Development Company, L.P. Fluid-ejection devices and a deposition method for layers thereof
EP1968797A2 (en) * 2005-12-23 2008-09-17 Lexmark International, Inc., Intellectual Property Law Dept. Low energy, long life micro-fluid ejection device
CN101125482B (en) * 2001-10-30 2010-04-21 佳能株式会社 Structure with through hole, production method thereof, and liquid discharge head
US7838155B2 (en) 2001-03-13 2010-11-23 Sony Corporation Aqueous electrolyte solution absorber and method for producing it

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582678A (en) * 1978-12-19 1980-06-21 Toshiba Corp Thermal head
JPS5582677A (en) * 1978-12-18 1980-06-21 Toshiba Corp Thermal head
JPS62202754A (en) * 1986-03-03 1987-09-07 Tdk Corp Thin film type thermal head
US4951063A (en) * 1989-05-22 1990-08-21 Xerox Corporation Heating elements for thermal ink jet devices
EP0396315A1 (en) * 1989-05-01 1990-11-07 Xerox Corporation Thermal ink jet printhead with bubble generating heating elements
EP0596705A2 (en) * 1992-11-05 1994-05-11 Xerox Corporation Heater element for a thermal ink jet printhead

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582677A (en) * 1978-12-18 1980-06-21 Toshiba Corp Thermal head
JPS5582678A (en) * 1978-12-19 1980-06-21 Toshiba Corp Thermal head
JPS62202754A (en) * 1986-03-03 1987-09-07 Tdk Corp Thin film type thermal head
EP0396315A1 (en) * 1989-05-01 1990-11-07 Xerox Corporation Thermal ink jet printhead with bubble generating heating elements
US4951063A (en) * 1989-05-22 1990-08-21 Xerox Corporation Heating elements for thermal ink jet devices
EP0596705A2 (en) * 1992-11-05 1994-05-11 Xerox Corporation Heater element for a thermal ink jet printhead

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 004, no. 125 (M-030), 3 September 1980 & JP 55 082677 A (TOSHIBA CORP), 21 June 1980, *
PATENT ABSTRACTS OF JAPAN vol. 004, no. 125 (M-030), 3 September 1980 & JP 55 082678 A (TOSHIBA CORP), 21 June 1980, *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 055 (M-669), 19 February 1988 & JP 62 202754 A (TDK CORP), 7 September 1987, *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0951999A3 (en) * 1998-04-22 2000-05-03 Hewlett-Packard Company Reduced drop volume ink jet print head
US6293654B1 (en) 1998-04-22 2001-09-25 Hewlett-Packard Company Printhead apparatus
KR100440109B1 (en) * 1998-04-22 2004-07-15 휴렛-팩커드 컴퍼니(델라웨어주법인) Printhead having a passivation layer with reduced thickness
US6331049B1 (en) 1999-03-12 2001-12-18 Hewlett-Packard Company Printhead having varied thickness passivation layer and method of making same
US7838155B2 (en) 2001-03-13 2010-11-23 Sony Corporation Aqueous electrolyte solution absorber and method for producing it
US7182440B2 (en) 2001-04-13 2007-02-27 Sony Corporation Liquid jet apparatus
KR100866270B1 (en) * 2001-04-13 2008-11-03 소니 가부시끼 가이샤 Liquid injection head, liquid injection device, and method of manufacturing liquid injection head
WO2002083424A1 (en) * 2001-04-13 2002-10-24 Sony Corporation Liquid injection head, liquid injection device, and method of manufacturing liquid injection head
US7836598B2 (en) 2001-04-13 2010-11-23 Sony Corporation Method of manufacturing a thermal liquid jet head using an etching process
US7025894B2 (en) 2001-10-16 2006-04-11 Hewlett-Packard Development Company, L.P. Fluid-ejection devices and a deposition method for layers thereof
US7517060B2 (en) 2001-10-16 2009-04-14 Hewlett-Packard Development Company, L.P. Fluid-ejection devices and a deposition method for layers thereof
CN101125482B (en) * 2001-10-30 2010-04-21 佳能株式会社 Structure with through hole, production method thereof, and liquid discharge head
EP1968797A2 (en) * 2005-12-23 2008-09-17 Lexmark International, Inc., Intellectual Property Law Dept. Low energy, long life micro-fluid ejection device
EP1968797A4 (en) * 2005-12-23 2010-08-11 Lexmark International Inc Inte Low energy, long life micro-fluid ejection device

Also Published As

Publication number Publication date
DE69621665D1 (en) 2002-07-18
EP0729834A3 (en) 1997-05-21
DE69621665T2 (en) 2003-03-06
EP0729834B1 (en) 2002-06-12

Similar Documents

Publication Publication Date Title
US20040032466A1 (en) Method for producing organic insulating coating and ink-jet printhead produced according to the method
WO2001074592A1 (en) Multiple-nozzle ink-jet head and method of manufacture thereof
EP1717036B1 (en) Process of manufacturing nozzle plate for ink-jet print head
WO2001074591A1 (en) Multinozzle ink-jet head
EP0729834A2 (en) An ink-jet head, a substrate for an ink-jet head, and an ink-jet apparatus
EP0539993B1 (en) Ink jet print head and method of manufacturing the same
KR19990023939A (en) Ink-jet printheads and their manufacturing method
US5612724A (en) Ink jet recording head with enhanced bonding force between a heat storing layer and substrate, a method of forming the same and a recording apparatus having said recording head
EP0885723B1 (en) Recording element unit, ink jet recording element unit, ink jet cartdridge and ink jet recording apparatus
JP4078295B2 (en) Ink-jet head substrate, ink-jet head using the same, and method for producing the same
US6352338B1 (en) Ink-jet print head, production method thereof, and printing apparatus with the ink-jet print head
KR100828362B1 (en) Heater of inkjet printhead, inkjet printhead having the heater
JP3454490B2 (en) Inkjet head, substrate for inkjet head, and inkjet device
JP3563960B2 (en) Substrate for inkjet head, inkjet head, inkjet apparatus, and method of manufacturing substrate for inkjet head
JP2727989B2 (en) Manufacturing method of thermal head
JP3705652B2 (en) Inkjet recording apparatus and manufacturing method thereof
JP2002011886A (en) Substrate for ink jet recording head, ink jet recording head, and method of making the substrate
JP3149316B2 (en) Thermal head and method of manufacturing the same
JPH07125208A (en) Ink jet head and ink jet recording apparatus
JP3061935B2 (en) Method of manufacturing inkjet recording head and inkjet recording apparatus
JP2000006414A (en) Ink-jet recording head and ink-jet recording apparatus using the head
JP2000006411A (en) Ink jet recording element and ink jet recorder employing it
JPH0577415A (en) Ink jet head
JP2007180249A (en) Method for manufacturing actuator device, and liquid injection device
JP2004306315A (en) Ink jet recording head, recorder employing it, and process for manufacturing ink jet recording head

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19971007

17Q First examination report despatched

Effective date: 19990521

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69621665

Country of ref document: DE

Date of ref document: 20020718

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20030313

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20140331

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20140304

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20140318

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20140326

Year of fee payment: 19

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 69621665

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20150301

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150301

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20151130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151001

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150301

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150331