Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
  • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
  • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22C—FOUNDRY MOULDING
  • B22C9/00—Moulds or cores; Moulding processes
  • B22C9/22—Moulds for peculiarly-shaped castings
  • B22C9/24—Moulds for peculiarly-shaped castings for hollow articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D19/00—Casting in, on, or around objects which form part of the product
  • B22D19/0063—Casting in, on, or around objects which form part of the product finned exchangers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D25/00—Special casting characterised by the nature of the product
  • B22D25/02—Special casting characterised by the nature of the product by its peculiarity of shape; of works of art
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
  • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device
  • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the heat sink may be adapted for cooperation with means for generating an air current to the features; in a preferred embodiment the means may be arranged to direct the air current in the first direction (for example, axially of the pins if present) and the air flow may be redirected outwardly transverse of said first direction. In a particularly preferred embodiment, the air flow is directed towards the connecting means, and the air is then redirected to flow turbulently through said features transverse to the first direction.
• Such heat sink or heat exchange structures could in principle be fabricated by individual machining and assembly of parts, and for some structures investment casting could also be used.
• Cheaper methods such as die casting techniques used in the prior art, cannot be used to fabricate the labyrinthine assemblies of extending parallel features (e.g. closely packed arrays of pins) because since these features are surrounded by others (e.g. plates) a conventional mould cannot be employed to cast them together as one piece.
• Even investment casting is unsuitable where the pins are densely packed, or need to be parallel, because the ceramic moulding produced in investment casting would be trapped by the dense array of pins and containing plates and could not be removed.
• Investment casting normally requires tapered features which limits pin length.
• this embodiment of the invention provides a heat sink including a first set of heat dissipating features 22a and a second set of heat dissipating features 22b spaced along the heat sink further from the fan 4, with a connecting duct 30 bringing air directly to the second set 22b bypassing the first set 22a, and an exit path or duct 30a bypassing the second set 22b with heated air from the first set 22a.
• the embodiment shown in Fig. 10 can be produced by the method shown in Fig. 2, by placing the resistance coil in the die casting mould before pouring die casting metal in.
• the heating element 70 has a higher melting point than the temperature of the die casting alloy, the heating element is cast in place in the plate 1. It is therefore possible to cast a simple one part heater enabling precise temperature control and high efficiency, providing an effective heater at a low price. Furthermore, the characteristic that the temperature of the fluid (e.g. air) drawn through the heater is almost the same as that of the heater is useful in simplifying control of the heater.
• any of the other structures of, for example, Figs. 3 and 4 may be employed. The latter may be preferred where it is desired to provide a directional air or other fluid flow. This embodiment may for example be used to advantage in electric shower heating units, providing a more safe system.
• the modulated beams from each of the three spatial light modulator devices 220a-220c are recombined at the colour selective surfaces 218a, 218b to form a single colour image which is projected, by a projection lens 240, onto a screen 210 for, for example, cinema display.
• the light source is necessarily of very high power; for example several kilowatts, and a considerable proportion of the total energy from the light source 216 may be at infra-red wavelengths.
• the structure and method above described are only examples, which may be modified in many ways.
• the dimensions of the structure may be varied; the structure may be used for applications other than heat sinks; the structure may be produced by other methods; and the method may be used for structures other than heat sinks.
• the pins need not, of course, have a constant cross section or a circular cross section; more complex cross sectional shapes may be preferable as providing greater surface areas for heat loss and/or more turbulence. Pins could, of course, have differing sizes and shapes if required.
• the invention can, as mentioned above, be applied to heat exchanging structures in general, for exchanging heat with fluids, for heating, cooling, refrigeration or other purposes.
• an array of pins may be provided within the (cast iron) cooling jacket surrounding a piston in an internal combustion engine, the jacket comprising a pair of coaxial cylinders, the pins running radially between the cylinders to form a cylindrical array; this structure corresponds to that of Fig. 1 with the two plates 1, 3 transformed to cylindrical surfaces.
• the invention extends to such arrays of aligned (e.g. radially aligned) connected features.
• the method aspect of the invention can be employed for making similar structures for purposes unconnected with heat exchanging.
• this invention relates to a device to aid heat transfer to/from a fluid. This may be from one fluid to another, such a device typically being called a heat exchanger, or from a solid object (e.g. a transistor) to a fluid, the device then being typically called a heatsink.
• a device typically being called a heat exchanger, or from a solid object (e.g. a transistor) to a fluid, the device then being typically called a heatsink.
• the principle in any such system is that means must be provided to effectively transfer heat between the fluid(s) and the device.
• the laws of physics dictate that large surface areas, rough surfaces and turbulent fluid flow are needed for efficient heat transfer.
• This invention relates to a method of making a heat exchange structure in a simple and cost effective way, including fluid guides, mountings, etc. Practically, any version described may simply be adapted for heatsink or heat exchanger use and so the distinctions made in the description are for clarity only. Similarly, while air is normally referred to, any

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• General Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (3)

Publications (1)

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• 1992
  • 1992-06-15 GB GB9212674A patent/GB9212674D0/en active Pending
• 1993
  • 1993-06-14 WO PCT/GB1993/001265 patent/WO1993025332A1/en not_active Application Discontinuation
  • 1993-06-14 JP JP6501296A patent/JPH07507726A/ja active Pending
  • 1993-06-14 EP EP93913366A patent/EP0644806A1/en not_active Withdrawn
  • 1993-06-14 AU AU43469/93A patent/AU4346993A/en not_active Abandoned

Non-Patent Citations (1)

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