EP0599049B1 - Verwendung von Mikro-Carbonfasern - Google Patents
Verwendung von Mikro-Carbonfasern Download PDFInfo
- Publication number
- EP0599049B1 EP0599049B1 EP93116853A EP93116853A EP0599049B1 EP 0599049 B1 EP0599049 B1 EP 0599049B1 EP 93116853 A EP93116853 A EP 93116853A EP 93116853 A EP93116853 A EP 93116853A EP 0599049 B1 EP0599049 B1 EP 0599049B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- micro
- electrical
- carbon
- microstructured
- carbon fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
Definitions
- the invention relates to the use of micro-carbon fibers for checking the electrical conductivity of the structural base of microstructured bodies, in which on one electrically conductive structure from microstructure elements raise electrically non-conductive material.
- a metallic Carrier layer e.g. made of chrome-nickel steel, one for X-rays sensitive resist layer applied, the partially exposed to synchrotron radiation via an X-ray mask becomes. The exposed areas are covered with a liquid Developer detached, causing the microstructures corresponding cavities are created. With this procedure you can Microstructures with very high aspect ratios for the smallest, lateral dimensions in the ⁇ m range are generated.
- a method is known from EP 0 328 161 A2 in which Mold that carries microstructures on a base plate becomes. This is done on the end faces of the microstructures of the tool one after the other a release agent layer and an electrically conductive layer made of low molecular weight polymethyl methacrylate (PMMA) mixed with 20 to 50% by weight of carbon black applied. Then the tool is electrical insulating impression material, e.g. B. a resin, filled and overlaid. After thermosetting the impression material, in the the electrically conductive material with the hardening impression material the tool is connected to the hardened impression material separately. It remains electrical conductive material on the structural base of the microstructures be liable.
- PMMA low molecular weight polymethyl methacrylate
- DE 40 10 669 C1 is an alternative method to this for the production of micro-structured, plate-shaped bodies known, the structure of which is a coherent surface must form in the case of an electrically non-conductive
- Thermoplastic layer is a film of the electrically conductive material is applied, then a tool at a temperature, which is above the softening temperature of the thermoplastic lies through the film of the electrically conductive material is pressed into the thermoplastic layer, mold insert and thermoplastic layer to a temperature below the softening temperature of the thermoplastic are cooled and the Mold insert is removed.
- DE 39 37 308 C1 describes a process for the production of metallic microstructure bodies known in which on a electrically conductive base plate microstructures made of plastic are generated, in the course of generating the microstructures a residual layer of plastic on the electrical conductive base plate is left and only afterwards the remaining layer of the plastic by reactive Ion etching using perpendicular to the surface of the base plate accelerated ions is removed.
- microstructured Bodies are made that are based on an electrical conductive structure basic microstructure elements made of electrical raise non-conductive material. With all procedures should the microstructured body galvanically in subsequent steps be molded with a metal, either the Base plate or the electrically conductive structural base is switched as cathode.
- Such defects can occur, for example, in the former method arise from the fact that the exposed with X-rays Areas not completely removed from the developer be so that the electrically conductive carrier layer is not exposed.
- Sources of error in the second and Third-mentioned methods are, for example, that the electrically conductive layer is insufficient from the tool transferred to the microstructured body or in the Structural base is pressed.
- a control measurement procedure can be expedient with which it is determined whether the remaining layer is already is completely removed.
- microstructured To scan bodies it is problematic to determine the structural basis of microstructured To scan bodies. As mentioned, can with the above a high aspect ratio can be achieved; this means that the structural reason one or two Size restrictions are smaller than the height of the microstructure elements. For example, a few hundred micrometers high Microstructure elements through trenches that are only about 10 microns are wide, separate from each other. Should be on such microstructured Bodies of the structural base are scanned, so it is almost inevitable that the microstructure elements touched and destroyed.
- EP 0 483 579 A2 is a scanning needle with a size in the nanometer range for a scanning tunneling electron microscope known that ends in a spike.
- the stylus is there made of a carbon matrix structure with embedded Metal particles; it has one according to its use rigid structure.
- US-A-3 992 073 describes a stylus tip that is made of conductive elastomers existing longitudinal elements is assembled. From US-A-4 004 843 is the use of fabrics made of electrical conductive polymer fibers known as the contact surface of a stylus tip.
- Micro-carbon fibers are suitable because of their high elasticity, their stiffness and good electrical conductivity especially for checking the electrical conductivity of the structural reason. Even if with micro-carbon fibers, micro-structural elements are touched, there is no danger destruction because micro-carbon fibers bend elastically.
- carbon fibers are to be included among micro-carbon fibers a diameter of less than 100 microns can be understood. Their electrical conductivity should be as high as possible.
- Micro carbon fibers are commercially available.
- micro-carbon fibers with a thickness of approx. 5 - 10 ⁇ m as yarns with a filament number between 1000 and 24000 and a length up to several 1000 meters.
- Such filaments can be made from a section of a yarn pulled out and used.
- short cut fibers with a few millimeters in length, the are also useful.
- the electrical resistance of such fibers is in the range of 1.5 ⁇ 10 -3 ⁇ cm (about an order of magnitude below the conductivity of mercury).
- micro-carbon fibers which are smaller than the area of the structural base, the to be contacted. Their length must also be the height of the exceed neighboring microstructure elements.
- Micro-carbon fibers with a diameter of less than 20 microns, in particular from 10 microns to 5 microns are used. It is completely sufficient for the use according to the invention, if a micro-carbon fiber of a length that the height of the neighboring Microstructure elements exceeds 1.5 to 2 times, with the end of a usual electrical lead wire connected is. This lead wire and an electrical lead, with the contact point provided for the electroplating connected to a conventional electrical continuity tester connected.
- the micro-carbon fiber used is chosen so that at least the free fiber end under the microscope is visible. It should be noted that the electrical Line wire is generally several orders of magnitude thicker is called the micro-carbon fiber, so it has a view of the fiber covered.
- the fiber in electrical lead wires from about 1 mm diameter the fiber should be about 5 mm long so the fiber end even at higher magnifications and one correspondingly visible in the microscope remains.
- the fiber on the lead wire is not attached at right angles, but slightly angled, so that the angle between the lead wire and the fiber is somewhat larger than 90 °.
- connection between micro-carbon fibers and a conventional one Lead wire can be coated with conductive lacquers, e.g. B. by conductive silver lacquer getting produced. If necessary, the micro carbon fibers can be easily replaced.
- a continuity tester a conventional electroplating tester is suitable.
- micro-carbon fibers are that they through special treatment steps, e.g. B. by electrochemical Process, e.g. B. electrochemical etching of the tip, can be rejuvenated and tapered.
- electrochemical Process e.g. B. electrochemical etching of the tip
- the Micro-carbon fibers can be modified by chemical processes. Such treatment steps are when using Carbon fibers as microelectrodes in analytical electrochemistry known.
- the measurement setup is shown in the figure.
- the microstructured body 1 to be examined is on the electrically contacted contact surface 2 provided for the electroplating and on the work table of a microscope (not shown) fixed.
- the electrical derivative 3 from the microstructured Body 1 is equipped with an electronic (not shown) Conductivity tester with a continuity tester own power supply (UNITEST type V1X ohmic), connected.
- the other cable of the conductivity tester is with one Wire 4 connected by a micromanipulator (not shown) can be moved.
- a micro carbon fiber 6 At the free end of this Wire 4 is a micro carbon fiber 6 that is vertical adjusted to the base plate 5 of the microstructured body 1 is.
- the micro-carbon fiber 6 is approx. 5 mm long, 7 ⁇ m thick and became by sticking with silver conductive lacquer with the wire 4 connected.
- the micro carbon fiber is now 6 under the lens 7 and over the microstructured body 1 brought so that the micro-carbon fiber is visible.
- Raising the work table or lowering the fiber it is now possible with the fiber in the spaces 8 between the microstructure elements 9 of the microstructured body 1 go until the electrically conductive structure 10 of the microstructured body is contacted. Is the structural reason 10 at this point free of electrically insulating Residual layers, this is done by an optical or acoustic Signal displayed in the conductivity tester. Is against an electrically insulating residual layer is present, so flows between the micro-carbon fiber 6 and the contact surface 2 none or just a little current.
- micro-carbon fibers to be used according to the invention could microstructured bodies with different lateral Dimensions are examined. It became the structural reason contacted between 120 ⁇ m high microstructure elements, the structure base widths between 200 microns to down to 20 ⁇ m.
- microstructured bodies were partially in the shape of Gears, sometimes in the form of closely adjacent plastic columns on a metallic structural background.
Landscapes
- Measuring Leads Or Probes (AREA)
- Carbon And Carbon Compounds (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Materials For Medical Uses (AREA)
- Chemical Treatment Of Fibers During Manufacturing Processes (AREA)
- Inorganic Fibers (AREA)
Description
Claims (3)
- Verwendung einer Mikro-Carbonfaser (6) als Tasterspitze zum zerstörungsfreien Prüfen der elektrischen Leitfähigkeit des Strukturgrundes von mikrostrukturierten Körpern (1), bei denen sich auf einem elektrisch leitfähigen Strukturgrund (10) Mikrostrukturelemente (9) aus elektrisch nicht leitfähigem Material erheben.
- Verwendung nach Anspruch 1, wobei die Mikro-Carbonfaser in eine Spitze ausläuft.
- Durchgangsprüfer mit zwei Kontaktelektroden zum zerstörungsfreien Prüfen der elektrischen Leitfähigkeit des Strukturgrundes von mikrostrukturierten Körpern (1), bei denen sich auf einem elektrisch leitfähigen Strukturgrund (10) Mikrostrukturelemente (9) aus elektrisch nicht leitfähigem Material erheben, wobei mindestens eine der Kontaktelektroden eine Tasterspitze bestehend aus einer Mikro-Carbonfaser (6) darstellt.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4239532A DE4239532C1 (de) | 1992-11-25 | 1992-11-25 | Verwendung von Mikro-Carbonfasern |
DE4239532 | 1992-11-25 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0599049A2 EP0599049A2 (de) | 1994-06-01 |
EP0599049A3 EP0599049A3 (en) | 1995-08-16 |
EP0599049B1 true EP0599049B1 (de) | 2000-04-12 |
Family
ID=6473568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP93116853A Expired - Lifetime EP0599049B1 (de) | 1992-11-25 | 1993-10-19 | Verwendung von Mikro-Carbonfasern |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0599049B1 (de) |
AT (1) | ATE191794T1 (de) |
DE (2) | DE4239532C1 (de) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4004843A (en) * | 1975-09-25 | 1977-01-25 | Westinghouse Electric Corporation | Probe pin |
US3992073A (en) * | 1975-11-24 | 1976-11-16 | Technical Wire Products, Inc. | Multi-conductor probe |
DE3537483C1 (de) * | 1985-10-22 | 1986-12-04 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zum Herstellen einer Vielzahl plattenfoermiger Mikrostrukturkoerper aus Metall |
DE3712268C1 (de) * | 1987-04-10 | 1988-08-11 | Kernforschungsz Karlsruhe | Verfahren zur Herstellung von elektrischen Kontaktwerkstoffen |
JP2557523B2 (ja) * | 1989-03-28 | 1996-11-27 | 株式会社日立製作所 | プロービング装置 |
DE3937308C1 (de) * | 1989-11-09 | 1991-03-21 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
DE4010669C1 (de) * | 1990-04-03 | 1991-04-11 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
US5134364A (en) * | 1990-06-19 | 1992-07-28 | Prime Computer, Inc. | Elastomeric test probe |
JP3014055B2 (ja) * | 1990-08-10 | 2000-02-28 | イビデン株式会社 | プリント配線基板の電気チェック装置 |
JPH081382B2 (ja) * | 1990-10-31 | 1996-01-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ナノメートル・スケールのプローブ及びその製造方法 |
-
1992
- 1992-11-25 DE DE4239532A patent/DE4239532C1/de not_active Expired - Fee Related
-
1993
- 1993-10-19 AT AT93116853T patent/ATE191794T1/de active
- 1993-10-19 DE DE59310006T patent/DE59310006D1/de not_active Expired - Fee Related
- 1993-10-19 EP EP93116853A patent/EP0599049B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE4239532C1 (de) | 1994-02-10 |
EP0599049A2 (de) | 1994-06-01 |
DE59310006D1 (de) | 2000-05-18 |
EP0599049A3 (en) | 1995-08-16 |
ATE191794T1 (de) | 2000-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3856182T2 (de) | Elektroden zur Verwendung in elektrochemischen Verfahren | |
DE102008049200A1 (de) | Verfahren zur Herstellung von röntgenoptischen Gittern, röntgenoptisches Gitter und Röntgen-System | |
EP0116685A1 (de) | Optische Messanordnung zum Feststellen von Rissen | |
DE3612651A1 (de) | Verfahren und vorrichtung zum erfassen von rissen | |
EP0446742A2 (de) | Verfahren und Einrichtung zum Herstellen von Mikro-Schmelzstrukturen aus elektrisch leitendem Material auf Sondenspitzen sowie deren Verwendung | |
DE102019006282A1 (de) | Verfahren zur Prozessbewertung beim Laserstrahlschweißen | |
EP2663870B1 (de) | Schiene für die elektrische kontaktierung eines elektrisch leitfähigen substrates | |
DE69219088T2 (de) | Mechanische Sonde mit polymerer Membrane | |
WO2010040161A2 (de) | Schaltvorrichtung zur elektrischen kontaktprüfung | |
EP0599049B1 (de) | Verwendung von Mikro-Carbonfasern | |
DE4406674A1 (de) | Verfahren zum Prüfen einer zu prüfenden Elektrodenplatte | |
DE102006030224A1 (de) | Vorrichtung und Verfahren zum Überprüfen der Dichtigkeit von Feuchtigkeitsbarrieren für Implantate | |
DE2815062C2 (de) | Elektrochromische Anzeigevorrichtung | |
DE4328337C1 (de) | Verfahren zur Bestimmung der Temperatur an einer Punktschweißverbindung sowie Anwendung des Verfahrens zur Beurteilung der Qualität der Punktschweißverbindung | |
EP1380832B1 (de) | Verfahren zur Bestimmung der Hafteigenschaften von Materialien | |
DE102018103354B4 (de) | Verfahren zur dichtheitsprüfung eines bauteils mit niedriger leitfähigkeit | |
DE102007005657B3 (de) | Verfahren zur Visualisierung von einwandigen Kohlenstoff-Nanoröhrchen | |
DE3900040A1 (de) | Verfahren zur elektrischen pruefung von leiterbahnen auf kurzschluesse | |
DE102018119605A1 (de) | Positioniervorrichtung und Verfahren zum Herstellen einer Positioniervorrichtung | |
DE19855268A1 (de) | Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen metallischen Bauteils | |
DE102018218653A1 (de) | Vorrichtung zum Ermitteln eines Abnutzungsgrads eines Halteelements, Haltesystem, Halteelement und Verfahren zum Herstellen eines Halteelements | |
DE10342644A1 (de) | Sondeneinrichtung für die Rastersondentechnologie sowie Verfahren zu deren Herstellung | |
EP1233272A1 (de) | Verfahren zur Herstellung eines Vollmaterialadapters aus einem mit Licht aushärtbaren Photopolymer | |
DE102017222597A1 (de) | Leiterplatten-Panel, Verfahren zum Testen von elektrischen Bauteilen | |
DE102018206273B4 (de) | Messinstrument zur Messung einer auf einen elektrischen Kontakt wirkenden Normalkraft und ein Verfahren dazu |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH DE FR GB LI NL |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FORSCHUNGSZENTRUM KARLSRUHE GMBH |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE FR GB LI NL |
|
17P | Request for examination filed |
Effective date: 19950708 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
17Q | First examination report despatched |
Effective date: 19990716 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE FR GB LI NL |
|
REF | Corresponds to: |
Ref document number: 191794 Country of ref document: AT Date of ref document: 20000415 Kind code of ref document: T |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: ROTTMANN, ZIMMERMANN + PARTNER AG Ref country code: CH Ref legal event code: EP |
|
REF | Corresponds to: |
Ref document number: 59310006 Country of ref document: DE Date of ref document: 20000518 |
|
ET | Fr: translation filed | ||
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 20000707 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20001019 Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20001019 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20001031 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20001031 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20001031 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
BERE | Be: lapsed |
Owner name: FORSCHUNGSZENTRUM KARLSRUHE G.M.B.H. Effective date: 20001031 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20010501 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20001019 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20010629 |
|
NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 20010501 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20031017 Year of fee payment: 11 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050503 |