EP0506552A1 - Verfahren zur Behandlung zum Beispiel einer Substratoberfläche durch Spritzen eines Plasmaflusses und Vorrichtung zur Durchführung des Verfahrens - Google Patents

Verfahren zur Behandlung zum Beispiel einer Substratoberfläche durch Spritzen eines Plasmaflusses und Vorrichtung zur Durchführung des Verfahrens Download PDF

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Publication number
EP0506552A1
EP0506552A1 EP92400803A EP92400803A EP0506552A1 EP 0506552 A1 EP0506552 A1 EP 0506552A1 EP 92400803 A EP92400803 A EP 92400803A EP 92400803 A EP92400803 A EP 92400803A EP 0506552 A1 EP0506552 A1 EP 0506552A1
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EP
European Patent Office
Prior art keywords
chamber
ejection nozzle
coating
electric arc
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92400803A
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English (en)
French (fr)
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EP0506552B1 (de
Inventor
Martin Hermann Lang
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Agence Spatiale Europeenne
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Agence Spatiale Europeenne
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • B05B7/22Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc
    • B05B7/222Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc using an arc
    • B05B7/226Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc using an arc the material being originally a particulate material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/26Plasma torches
    • H05H1/32Plasma torches using an arc
    • H05H1/34Details, e.g. electrodes, nozzles

Definitions

  • the present invention relates to a method for treating for example the surface of a substrate by projection of a plasma flow, of the type consisting in creating an electric arc in a chamber between a cathode and an anode, in introducing an inert gas into the chamber so that it is ionized as it passes through the electric arc to form a plasma at high temperature, and to eject the plasma outside the chamber through an ejection nozzle whose orifice outlet is slotted.
  • the material constituting this coating is generally in powder form, and the particles of the material are mixed with the plasma flow to pass in the molten state before be projected onto the substrate.
  • the aforementioned technique by plasma spraying offers certain advantages, in particular that of being able to reach high temperatures (of the order of 5,000 to 15,000 ° C ) and to obtain specific energy densities which make it possible to melt any material which has a stable melting phase. It is thus possible to apply in particular this technique to ceramics which have high melting points.
  • the plasma projection devices currently used have limited possibilities due to the constraints inherent in the principle of their operation, which allow only certain forms of projection, essentially conical, to be obtained between the outlet of the nozzle and the substrate to be put on.
  • the surface projected onto the substrate cannot have a polygonal, in particular rectangular, shape.
  • this article proposes a compromise which consists in giving a form of slit to the outlet orifice of the ejection nozzle and in providing two diametrically opposite inlets for injecting the pulverulent material inside the nozzle.
  • the invention aims in particular to improve such a plasma spraying process in order to overcome the aforementioned drawbacks while providing other advantages.
  • the invention provides a method of the aforementioned type which is characterized in that it consists in creating an electric arc between the anode and the cathode along an axis substantially parallel to the axis of the outlet slot of the ejection nozzle.
  • the inert gas is introduced into the chamber in several radial directions relative to the axis of the electric arc.
  • the material constituting the coating to be deposited on the substrate is conveyed by a carrier gas, and it is either injected with the inside the ejection nozzle, or ejected at the outlet of the nozzle in a direction substantially parallel to the direction of the plasma flow at the outlet of the ejection nozzle.
  • the invention also relates to a device for implementing the method according to the invention of the type comprising at least one chamber with a cathode and an anode, means for creating an electric arc inside the chamber between the cathode and the anode, at least one inlet duct for an inert gas ionizable by the electric arc to form a high temperature plasma, an ejection nozzle with a slit-shaped outlet orifice and an inlet orifice which communicates with the room, device characterized in that the room is elongated with two end surfaces by which the cathode and the anode respectively protrude axially aligned with each other to create an electric arc along an axis substantially parallel to the axis of the exit slot of the ejection nozzle.
  • inert gas inlet conduits open into the interior of the chamber in several radial directions relative to the axis of the electric arc created between the cathode and the anode, these conduits opening into the chamber through orifices which are distributed over several rows aligned along the axis of the electric arc.
  • the chamber extends parallel to the outlet slot of the ejection nozzle and substantially over the entire length of the latter, the nozzle comprising an inlet orifice also in the form of a slot which communicates with the chamber along its entire length.
  • At least one inlet duct for the material in powder form opens either inside the ejection nozzle or outside of the latter in a direction substantially parallel to the direction of the plasma flow at the outlet of the ejection nozzle.
  • the coatings thus produced most often provide a function of protecting the substrate against the ambient environment.
  • a good number of applications in most of the domines of industry (aerospace, automotive, electronics, ...) requires the manufacture of equipment and / or components which must operate in a protected environment.
  • the improvements brought by the invention are of a nature to improve in particular this protective function, in particular thanks to the possibility which is offered to apply this spraying technique to materials with a high melting point.
  • the spraying technique as perfected by the invention is not limited to depositing a coating on a substrate, but it can also be used to modify the surface properties of various materials, such as for example to remove a layer of oxide on the surface of a material by a hot treatment of this surface.
  • the device for implementing the method as a heat source in welding devices or in plasma blowers for example.
  • the device as schematically represented in FIG. 1 makes it possible to implement a conventional spraying process for depositing a coating on a substrate by plasma spraying.
  • a copper anode 1 delimits a chamber 2, the two end surfaces of which form the inlet and the outlet of the chamber respectively.
  • the inlet of chamber 2 is flared outwards, and its outlet is extended by an ejection nozzle 3 with an outlet orifice 4 of circular section.
  • a cathode 5 in the form of a stick generally made of thoriated tungsten is axially aligned with the anode 1, with a free end which penetrates into the flared part forming the entrance to chamber 2.
  • a conduit 10 opens in the vicinity of the cathode 5 to introduce along the axis of chamber 2 an ionizable inert gas, such as Argon for example.
  • a conduit 12 opens radially into the ejection nozzle 3 to inject inside of it a material in powder form conveyed by a carrier gas.
  • the device is supplemented by a direct current source 14 connected to the electrodes 1 and 5, cooling means (not shown) of the anode 1, and additional means for satisfying and optimizing the operating conditions necessary for the implementation.
  • a direct current source 14 connected to the electrodes 1 and 5, cooling means (not shown) of the anode 1, and additional means for satisfying and optimizing the operating conditions necessary for the implementation.
  • additional means for satisfying and optimizing the operating conditions necessary for the implementation such as the presence of a magnetic field to position, stabilize and tighten the plasma jet inside the chamber 2, this magnetic field being for example obtained by means of a coil 15 mounted around anode 1.
  • an electric arc is created between the cathode 5 and the anode 1
  • the inert gas is introduced coaxially with the electric arc and its passage through the latter causes its ionization thus creating a high temperature plasma inside the chamber 2.
  • This plasma flows inside the chamber 2 and is accelerated through the ejection nozzle 3.
  • the particles of the pulverulent material brought in through the conduit 12 are injected into the plasma jet flowing inside the nozzle 3, and they melt under the action of the high temperature of the plasma jet. The particles thus melted are ejected through the outlet orifice of the nozzle and projected onto the substrate 17 to form a coating layer 18.
  • FIGS. 2 and 3 The improvements made according to the invention are schematically illustrated in FIGS. 2 and 3.
  • the chamber 2 and the ejection nozzle 3 are no longer coaxially aligned as before, and the outlet orifice 4 of the nozzle is in the form of a slot. More specifically, the chamber 2 extends parallel to the outlet slot 4 of the ejection nozzle 3 and over a length substantially equal to that of the slot.
  • the ejection nozzle 3 is divergent and has in cross section a frusto-conical shape, with an inlet slit 6 which opens into the chamber 2 over the entire length thereof.
  • the chamber has two end surfaces or walls 2a and 2b respectively crossed by the anode 1 and the cathode 5. These two electrodes 1 and 5 are each in the form of a stick, and they are axially aligned with each other . In a similar manner to the device represented in FIG. 1, the electrodes 1 and 5 are connected to a source of direct current, the chamber 2 is surrounded by a coil 15 and cooling means (not shown) surround the chamber 2.
  • the inert gas is introduced into the chamber 2 through a set of orifices 20 distributed around and along the chamber. More specifically, in the example considered here, at least three rows 20a, 20b and 20c of holes 20 are provided.
  • the rows 20a and 20b are diametrically opposite and located respectively on either side of the inlet slot 6 of the ejection nozzle 3, while the row 20c is diametrically opposite this inlet slot.
  • the directions of introduction F1 of the inert gas into the chamber 2 and the direction F2 of the plasma outlet generally form a Greek cross with four branches (FIG. 3).
  • Each orifice 20 of the same row 20a, 20b and 20c is connected by a connecting conduit 21 to an intermediate conduit 22 which communicates with a main conduit 23 connected to a supply source (not shown) of inert gas.
  • tubular electrodes 1 and 5 so as to also introduce the inert gas through these electrodes.
  • conduits 12 which open into the ejection nozzle 3 to inject the pulverulent material therein.
  • These conduits 12 are for example aligned in two opposite rows 12a and 12b which extend parallel to the outlet slot 4 of the ejection nozzle 4 (FIG. 2).
  • the device according to the invention generally uses all of the means necessary for implementing a conventional spraying process by plasma spraying, but according to different arrangements and forms.
  • the electric arc created between the electrodes 1 and 5 extends substantially along the axis of the chamber 2, that is to say parallel to the outlet slot 4 of the nozzle, and the inert gas is introduced into the chamber in several directions distributed in particular along and around the chamber and which converge radially and not coaxially towards the axis of the electric arc and along it.
  • the material intended to form the coating 18 on the substrate 17 is not injected inside the ejection nozzle 3.
  • the body 3a of the ejection nozzle 3 comprises two additional outlet slots 4 ′ which extend substantially over the entire length of the outlet slot 4.
  • These two slots 4 ′ are located on either side of the slot 4, and they each form the outlet orifice of a cavity 12 formed inside the body 3a of the ejection nozzle 3.
  • In these two cavities 13 open respectively two rows 12a and 12b of conduits 12 of arrival of the material to be projected onto the substrate, so as to eject the material through these slots 4 ′ in a direction F3 substantially parallel to the direction F2 of the plasma flow at the outlet of the slot 4 of the ejection nozzle 3.
  • the particles of the material are no longer mixed with the plasma inside the ejection nozzle 3, but at the outlet of the latter, that is to say in an area where the temperature of the plasma is lower. This avoids subjecting the materials intended to form the coating to very high plasma temperatures inside the ejection nozzle 3. It is then possible to be able to use materials, such as plastics and polymers by example, that is to say materials which are not sufficiently heat resistant to be introduced inside the nozzle 3.
  • the invention is in no way limited to the embodiment described above and given only by way of example in the case of the deposition of a coating on a substrate.
  • the plasma flow at the outlet of the ejection nozzle constitutes a heat source which can be used to carry out surface treatments without necessarily projecting a material onto the surfaces to be treated.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
EP92400803A 1991-03-26 1992-03-25 Verfahren zur Behandlung zum Beispiel einer Substratoberfläche durch Spritzen eines Plasmaflusses und Vorrichtung zur Durchführung des Verfahrens Expired - Lifetime EP0506552B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9103621A FR2674450B1 (fr) 1991-03-26 1991-03-26 Procede pour deposer un revetement sur un substrat par projection au plasma, et dispositif pour la mise en óoeuvre du procede.
FR9103621 1991-03-26

Publications (2)

Publication Number Publication Date
EP0506552A1 true EP0506552A1 (de) 1992-09-30
EP0506552B1 EP0506552B1 (de) 1995-06-28

Family

ID=9411110

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92400803A Expired - Lifetime EP0506552B1 (de) 1991-03-26 1992-03-25 Verfahren zur Behandlung zum Beispiel einer Substratoberfläche durch Spritzen eines Plasmaflusses und Vorrichtung zur Durchführung des Verfahrens

Country Status (8)

Country Link
US (1) US5239161A (de)
EP (1) EP0506552B1 (de)
JP (1) JPH0657397A (de)
CA (1) CA2063899A1 (de)
DE (1) DE69203127T2 (de)
DK (1) DK0506552T3 (de)
ES (1) ES2076703T3 (de)
FR (1) FR2674450B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0851720A1 (de) * 1996-12-23 1998-07-01 Sulzer Metco AG Indirektes Plasmatron

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679167A (en) * 1994-08-18 1997-10-21 Sulzer Metco Ag Plasma gun apparatus for forming dense, uniform coatings on large substrates
DE19820240C2 (de) 1998-05-06 2002-07-11 Erbe Elektromedizin Elektrochirurgisches Instrument
DE10011274A1 (de) * 2000-03-08 2001-09-13 Wolff Walsrode Ag Plasmabehandelte bahnförmige Werkstoffe
US6476342B1 (en) * 2000-11-24 2002-11-05 Creo Srl Method of surface preparation using plasma in air
TWI274622B (en) * 2003-04-28 2007-03-01 Air Prod & Chem Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US7521653B2 (en) * 2004-08-03 2009-04-21 Exatec Llc Plasma arc coating system
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
EP2100485B1 (de) 2006-12-28 2013-05-29 Exatec, LLC. Vorrichtung und verfahren für lichtbogen-plasmabeschichtung
KR101588174B1 (ko) * 2007-05-17 2016-01-27 엑사테크 엘.엘.씨. 공통 플라즈마 코팅 구역에서 복수의 코팅 재료를 침착시키기 위한 장치 및 방법
JP5710185B2 (ja) * 2010-09-10 2015-04-30 株式会社Cmc総合研究所 微小コイルの製造方法及び製造装置
EP2431995A1 (de) * 2010-09-17 2012-03-21 Asociacion de la Industria Navarra (AIN) Ionisierungsvorrichtung
US11684995B2 (en) 2013-11-13 2023-06-27 Hypertherm, Inc. Cost effective cartridge for a plasma arc torch
US9981335B2 (en) 2013-11-13 2018-05-29 Hypertherm, Inc. Consumable cartridge for a plasma arc cutting system
US10456855B2 (en) 2013-11-13 2019-10-29 Hypertherm, Inc. Consumable cartridge for a plasma arc cutting system
US11432393B2 (en) 2013-11-13 2022-08-30 Hypertherm, Inc. Cost effective cartridge for a plasma arc torch
US11278983B2 (en) 2013-11-13 2022-03-22 Hypertherm, Inc. Consumable cartridge for a plasma arc cutting system
EP3958654A1 (de) 2014-08-12 2022-02-23 Hypertherm, Inc. Kostengünstige kartusche für einen plasmalichtbogenbrenner
RU2018107295A (ru) 2015-08-04 2019-09-05 Гипертерм, Инк. Картридж для плазменной горелки с жидкостным охлаждением
CN108257906B (zh) * 2018-01-16 2021-05-04 京东方科技集团股份有限公司 吹气装置、吸附机台和柔性基板承载系统

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Publication number Priority date Publication date Assignee Title
GB1177941A (en) * 1965-12-22 1970-01-14 Tetronics Res And Dev Company Improvements in or relating to High Temperature Apparatus
US3573090A (en) * 1968-12-09 1971-03-30 Avco Corp Method of applying a plasma spray coating

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FR2039566A5 (de) * 1969-03-31 1971-01-15 Soudure Autogene Elect
BE763709A (fr) * 1971-03-03 1971-08-02 Soudure Autogene Elect Plasma en rideau.
CA1272661A (en) * 1985-05-11 1990-08-14 Yuji Chiba Reaction apparatus
US4916273A (en) * 1987-03-11 1990-04-10 Browning James A High-velocity controlled-temperature plasma spray method
US5090482A (en) * 1990-01-03 1992-02-25 Spectronix Ltd. Method and apparatus for extinguishing fires

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1177941A (en) * 1965-12-22 1970-01-14 Tetronics Res And Dev Company Improvements in or relating to High Temperature Apparatus
US3573090A (en) * 1968-12-09 1971-03-30 Avco Corp Method of applying a plasma spray coating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WELDING PRODUCTION vol. 26, no. 12, 1979, pages 35 - 37; P.I. BYAKIN, V.I. NECHAEV & V.V. STEPANOV: 'A PLASMA NOZZLE WITH A SLIT-LIKE OUTLET' *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0851720A1 (de) * 1996-12-23 1998-07-01 Sulzer Metco AG Indirektes Plasmatron

Also Published As

Publication number Publication date
DE69203127D1 (de) 1995-08-03
US5239161A (en) 1993-08-24
DE69203127T2 (de) 1995-11-30
EP0506552B1 (de) 1995-06-28
CA2063899A1 (fr) 1992-09-27
JPH0657397A (ja) 1994-03-01
FR2674450B1 (fr) 1994-01-21
ES2076703T3 (es) 1995-11-01
FR2674450A1 (fr) 1992-10-02
DK0506552T3 (da) 1995-11-06

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