Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59

Definitions

• the object of the invention was to provide molding compositions based on aromatic polyamides which do not have the disadvantages described for the products of the prior art.
• the compounds according to the invention are incorporated in a proportion such that they are present in the molding composition in an amount of 0.5 to 40% by weight, preferably 2 to 30% by weight.
• the mixture can be prepared by adding these compounds to the starting monomers (oligomers) at the start of the (poly) condensation.
• the compounds according to the invention can also be incorporated into the molten reaction product only after the polycondensation has ended.
• Aromatic dicarboxylic acids are isophthalic acid, terephthalic acid, 1.4-, 1.5-, 2.6-, 2.7-naphthalenedicarboxylic acid, 4.4'-diphenylether dicarboxylic acid or 4.4'-benzophenonedicarboxylic acid, 4.4'-diphenylsulfonedicarboxylic acid, 2-phenoxyterephthalic acid, 4.4'-biphenic acid or mixtures thereof in question.
• Isophthalic acid alone or a mixture of isophthalic acid with another of the acids mentioned above is preferably used as component A. In the latter case, up to 45 mol% of isophthalic acid are replaced.
• aromatic diamines (component B. of the polyamides) come, for. B. 4.4'-bis (4-aminophenoxy) diphenyl sulfone, 4.4'-bis (3-aminophenoxy) diphenyl sulfone, 4.4'-bis (4-aminophenoxy) benzophenone, 4.4'-bis (3-aminophenoxy) benzophenone, 4.4'-bis (p-aminophenylmercapto) benzophenone, 4,4'-bis (p-aminophenylmercapto) diphenyl sulfone or mixtures thereof.
• 4,4'-bis (4-aminophenoxy) diphenyl sulfone is preferably used.
• the molar ratio of components A. and B. is in the range of approximately 1: 1.
• the glass transition temperature (T g ) of the aromatic polyamides is in the range from 190 to 270 ° C., the viscosity numbers (J values) are approximately 30 to 100 cm 3 / g; preferably at 60 to 80 cm3 / g.
• 0.01 to 10 mol% - based on the sum of components A. and B. - of a low molecular weight aliphatic, araliphatic or aromatic carboxamide can also be added to the aromatic polyamides.
• the aromatic radical can be substituted by halogen or by C1 to C4 alkyl radicals. This measure is described in DE-OS 38 04 401.
• the hydrolysis resistance can also be improved by using component A. in a slight excess (DE-OS 39 35 467) or, if A. and B. are approximately equimolar, additionally adding a monocarboxylic acid (DE-OS 39 35 468) .
• aromatic polyamides are basically known. It will u. a. described in DE-OS 36 09 011.
• a preferred procedure in the production of the aromatic polyamides is to use dialkylaminopyridines as cocatalyst in addition to the catalyst mixture.
• dialkylaminopyridines are those with 1 to 10 carbon atoms in the alkyl group.
• 4-Dimethylaminopyridine, 4-dibutylaminopyridine, 4-piperidinylpyridine, which can optionally form a pyrrolidine or piperidine ring together with the amino nitrogen, are preferably used.
• a cocatalyst is used, it is used in an amount of 0.05 to 4 mol%, preferably 0.2 to 2 mol%, based on the sum of components A. and B. In particularly preferred cases, the cocatalyst is added to the catalyst mixture in the reaction mixture in an equivalent amount.
• the reaction is carried out in the melt at temperatures in the range from 200 to 400 ° C., preferably from 230 to 360 ° C.
• the aromatic polyamides can be subjected to solid phase post-condensation in an inert gas atmosphere.
• the mixture of polyamide and compound according to the invention can be processed on conventional machines by injection molding or extrusion to give the molding compositions according to the invention.
• the molding compositions can additionally fillers, such as talc, or reinforcing agents, such as glass, ARAMID R - or carbon fibers, as well as other conventional additives, such as. B. pigments or stabilizers.
• fillers such as talc, or reinforcing agents, such as glass, ARAMID R - or carbon fibers, as well as other conventional additives, such as. B. pigments or stabilizers.
• the molding compounds are processed into molded parts, fibers, foils, etc. by customary processes such as injection molding, extrusion or the like. It can also be used as a coating agent based on powder (e.g. fluidized bed sintering), a liquid dispersion or a solution.
• the molding compositions according to the invention have an unexpectedly high temperature stability.
• the products can still be processed at temperatures> 340 ° C. without a decrease in molecular weight or a brown color.
• Molding compositions obtained according to the invention furthermore show excellent stability towards thermal oxidation, so that they can still be used at significantly higher temperatures than corresponding compositions of the prior art.
• Good heat resistance is to be added to these properties, ie molding compositions based on the aromatic polyamides according to the invention can be exposed to high temperatures for long periods without significant loss in mechanical properties Properties occurs.
• an excellent melt viscosity corresponding to the practical requirements can be found, which is significantly below that of other, similarly constructed compositions of the prior art.
• the glass point (T g ) was determined by DSC at a heating rate of 10 ° C / min. certainly.
• the viscosity numbers (J) were determined on 0.5% by weight solutions of the polyamides in a phenol / o-dichlorobenzene mixture (1: 1 parts by weight) at 25 ° C. in accordance with DIN 53 728.
• melt viscosity was measured according to DIN 53 735-MFI-B using a Göttfert viscometer at 320 ° C and 21.6 Kp load.
• Examples 2 and 3 were carried out analogously to Example 1, the compounds according to the invention and their proportion being varied according to the table below.

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• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Polyamides (AREA)
• Compositions Of Macromolecular Compounds (AREA)

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• 1991
  • 1991-12-17 EP EP91121567A patent/EP0498958A1/de not_active Withdrawn
• 1992
  • 1992-02-12 JP JP4025073A patent/JPH04328159A/ja active Pending
  • 1992-02-13 US US07/834,739 patent/US5238983A/en not_active Expired - Fee Related

Patent Citations (1)

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