EP0484558A1 - Bobine haute frequence et procede pour sa fabrication - Google Patents

Bobine haute frequence et procede pour sa fabrication Download PDF

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Publication number
EP0484558A1
EP0484558A1 EP91909800A EP91909800A EP0484558A1 EP 0484558 A1 EP0484558 A1 EP 0484558A1 EP 91909800 A EP91909800 A EP 91909800A EP 91909800 A EP91909800 A EP 91909800A EP 0484558 A1 EP0484558 A1 EP 0484558A1
Authority
EP
European Patent Office
Prior art keywords
coil
high frequency
coil conductors
insulating layer
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91909800A
Other languages
German (de)
English (en)
Other versions
EP0484558B1 (fr
EP0484558A4 (en
Inventor
Atsuo Senda
Osamu Kanou
Katsuhiro Misaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP0484558A1 publication Critical patent/EP0484558A1/fr
Publication of EP0484558A4 publication Critical patent/EP0484558A4/en
Application granted granted Critical
Publication of EP0484558B1 publication Critical patent/EP0484558B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/045—Trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates generally to a high frequency coil having a structure in which strip-shaped coil conductors are formed on the surface of an insulating substrate and a method of fabricating the same, and more particularly, to a high frequency coil whose Q can be increased without increasing the thickness and the line width of coil conductors and a method of fabricating the same.
  • the high frequency coil used in a microwave circuit or the like has had the following structure. More specifically, the high frequency coil has a structure in which a coil conductor, for example, of a spiral type, is formed on the surface of an insulating substrate, an input electrode and an output electrode are respectively formed in side edge portions opposed to each other of the insulating substrate, and the input electrode and the output electrode are electrically connected to an outer end and an inner end of the above coil conductor, respectively.
  • the above described high frequency coil is disclosed in, for example, British Patent Publication GB223624A.
  • a coil conductor is formed by a thin film forming technique such as sputtering or vacuum evaporation. Therefore, the high frequency coil has the disadvantage in that the electrical resistance of the coil conductor is increased because the thickness of the coil conductor is not made too large, resulting in decreased Q of the coil. Therefore, attempts have been conventionally made to lower the electrical resistance of the coil conductor by increasing the thickness and the line width of the coil conductor so as to increase Q of the coil.
  • the conventional high frequency coil has the disadvantage in that if the line width of the coil conductor is increased, the substrate is increased in size by the amount of the increase, to make it impossible to meet the recent requirement of miniaturization of electronic components.
  • the high frequency coil has the disadvantage in that there occurs a undesirable phenomenon referred to as under etching.
  • the thickness of a coil conductor is increased by superimposing on the upper surface of one coil conductor another coil conductor.
  • the line width of the coil conductor and the spacing between portions where the coil conductors are wound are very small, i.e., several tens of micrometers, thereby to make it very difficult in the fabrication to further superimpose on one coil conductor another coil conductor having the same size with high precision.
  • an object of the present invention is to eliminate the above described disadvantages of the conventional high frequency coil and to provide a high frequency coil having a structure in which Q can be increased without increasing the thickness and the line width of coil conductors and a method of fabricating the same.
  • the inventors of the present application have found that if a plurality of high frequency coils are electrically connected in parallel so as to decrease the conductor resistance of coil conductors, the conductor resistance can be decreased but the inductance is similarly decreased so that Q of the coil cannot be improved.
  • the inventors have found that the amount of the decrease in conductor resistance is larger than the amount of the decrease in inductance if a pair of coil conductors are formed such that the directions of currents flowing through the coil conductors are the same and so as to be opposed to each other with the insulating layer being interposed therebetween and have found that Q of the coil can be increased because the decrease in inductance can be restrained, thereby to make the present invention.
  • a high frequency coil according to the present invention has a structure comprising at least one insulating layer, a pair of coil conductors formed on both major surfaces of the insulating layer so as to be opposed to each other with the above insulating layer being interposed therebetween, and an input electrode and an output electrode formed on the above insulating layer, in which one end of each of the above pair of coil conductors is electrically connected to the input electrode and the other end thereof is electrically connected to the output electrode such that the directions of currents flowing through the above coil conductors are the same.
  • the high frequency coil according to the present invention includes one having the following multilayer structure in addition to the above described structure in which a pair of coil conductors is formed on both major surfaces of one insulating layer. More specifically, the present invention also includes a structure comprising a plurality of insulating layers, in which the insulating layers and pairs of coil conductors are alternately laminated such that the pair of coil conductors is arranged on both major surfaces of each of the insulating layers laminated.
  • an insulating layer made of an insulating material having sufficient mechanical strength to support coil conductors for example, glass or ceramics is generally used as the above described insulating layer.
  • the insulating layers may be made of a flexible insulating material provided that the lowermost insulating layer is made of such a rigid insulating material.
  • the known thin film forming technique such as a sputtering process, an evaporation process, an ion plating process or a screen printing process can be utilized. That is, a method of forming the coil conductors is not particularly limited.
  • a method of fabricating a high frequency coil comprises the steps of preparing an insulating layer, forming a conductor on the entire surface of the above insulating layer, etching the above conductor to form first and second coil conductors formed so as to be opposed to each other while being separated by the insulating layer and input and output electrodes on both major surfaces of the above insulating layer, coating both the entire major surfaces of the above insulating layer with photosensitive synthetic resin to form photosensitive synthetic resin films, disposing masks on portions, which face the above input and output electrodes and one end of each of the coil conductors, of the above photosensitive synthetic resin films to expose and develop the photosensitive synthetic resin films, removing portions other than the portions of the photosensitive synthetic resin films hardened by the exposure after the development to expose the input and output electrodes and to form a through hole in the portion facing the above one end of each of the coil conductors, and forming a conductor film on the above insulating layer to electrically connect the output electrode to the one end of each
  • a pair of coil conductors is formed so as to be opposed to each other while being separated by an insulating layer, and the directions of currents flowing through the coil conductors are the same. Accordingly, the decrease in conductor resistance is made larger than the decrease in inductance. Consequently, inductance L is relatively increased, as compared with that of the conventional high frequency coil having decreased conductor resistance. In the high frequency coil according to the present invention, therefore, Q of the coil can be increased by the amount of the relative increase in the inductance L.
  • Q of the coil can be increased without increasing the thickness and the line width of the coil conductors. Consequently, the increase in size of components of the high frequency coil can be avoided, and no undesired phenomena such as under etching occur at the time of the fabrication of the high frequency coil.
  • Figs. 1 to 3 are diagrams for explaining a high frequency coil according to one embodiment of the present invention.
  • a chip-type high frequency coil 1 is constructed by pattern formation of spiral-shaped first and second coil conductors 3 and 4 on both major surfaces 2a and 2b of an insulating substrate 2 made of glass or ceramics such as alumina.
  • an input electrode 5 and an output electrode 6 are formed on both side surfaces of the above insulating substrate 2 in the longitudinal direction.
  • Outer ends 3a and 4a of the above first and second coil conductors 3 and 4 are connected to the input electrode 5.
  • the surfaces of the first and second coil conductors 3 and 4 excluding regions on the input and output electrodes 5 and 6 on both major surfaces of the above insulating substrate 2 are coated with insulating layers 7 made of polyimide or polyamide resin.
  • Through holes 8 are formed in portions, which face inner ends 3b and 4b of the above first and second coil conductors 3 and 4, of the insulating layers 7.
  • lead electrodes 9 are respectively formed on the upper surfaces of the above insulating layers 7, and one ends of the lead electrodes 9 are respectively connected to the inner ends 3b and 4b of the first and second coil conductors 3 and 4 through the above through holes 8 and the other ends thereof are respectively connected to the output electrode 6.
  • first and second coil conductors 3 and 4 are so constructed that the directions of currents flowing through the first and second coil conductors 3 and 4 are the same.
  • step (4) when the inner ends 3b and 4b of the coil conductors 3 and 4 are connected to the output electrode 6, a method of connecting the inner ends 3b and 4b and the output electrode 6 by wire bonding using an Au line and fastening them with nylon or adhesives of an epoxy resin system may be adopted.
  • the first and second coil conductors 3 and 4 are formed on both the major surfaces 2a and 2b of the insulating substrate 2 so as to be opposed to each other with the substrate 2 being interposed therebetween, and the outer ends 3a and 4a of the coil conductors 3 and 4 are connected to the input electrode 5 and the inner ends 3b and 4b thereof are connected to the output electrode 6, thereby to make the directions of currents flowing through the coil conductors 3 and 4 the same. Accordingly, the conductor resistance can be reduced to approximately half, and Q of the coil can be improved because the decrease in inductance can be restrained.
  • the value of Q is 30 (at 400 MHz) if the value of L is 18 nH.
  • the value of Q is 35 (at 400 MHz) if the value of L is 10.5 nH, thereby to make it possible to improve Q by approximately 15 %.
  • the first and second coil conductors 3 and 4 may be merely formed opposed to each other on both the major surfaces of the insulating substrate 2 by the thin film forming technique. Accordingly, the thickness and the line width of the coil conductors need not be increased unlike the conventional example. Consequently, the increase in size of components can be avoided, and there arise no problems such as under etching.
  • the high frequency coil 1 according to the present embodiment is employed when the thickness and the line width of the coil conductors are made as large as possible and the conductor resistance is made smaller to improve Q, a larger effect is obtained.
  • the present invention may be applied to a multilayer coil constructed by forming one high frequency coil and then, forming an insulating layer in a portion excluding input and output electrodes and forming coil conductors on the upper surface of the insulating layer, or further repeatedly forming insulating layers and coil conductors. More specifically, as shown in Fig. 4, a multilayered high frequency coil may be constructed by further forming an insulating layer 11 and a third coil conductor 12 on a coil conductor 3 formed on the upper surface of one insulating substrate 2. Alternatively, a multilayered high frequency coil having more layers than those in the example as shown in Fig. 4 may be constructed by further laminating insulating layers and coil conductors.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Sont décrits une bobine haute fréquence présentant une structure dans laquelle des conducteurs en forme de bande sont formés sur les surfaces d'un substrat isolant, ainsi qu'un procédé pour fabriquer la bobine. Un objet de l'invention est d'augmenter la valeur Q de la bobine sans augmenter l'épaisseur de film et la largeur de fil des conducteurs de la bobine. Une paire de conducteurs de bobine (3, 4) sont formés de manière à prendre en sandwich un substrat isolant (1). Les deux conducteurs de bobine (3, 4) sont reliés l'un à l'autre en parallèle de sorte que les courants circulent à travers eux dans le même sens. Les extrémités des deux conducteurs de bobine (3, 4) sont reliées électriquement à une électrode d'entrée et à une électrode de sortie (5, 6) formées sur le substrat isolant (1).
EP91909800A 1990-05-25 1991-05-24 Bobine haute frequence et procede pour sa fabrication Expired - Lifetime EP0484558B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13664790A JPH0430406A (ja) 1990-05-25 1990-05-25 高周波コイル
JP136647/90 1990-05-25
PCT/JP1991/000698 WO1991019303A1 (fr) 1990-05-25 1991-05-24 Bobine haute frequence et procede pour sa fabrication

Publications (3)

Publication Number Publication Date
EP0484558A1 true EP0484558A1 (fr) 1992-05-13
EP0484558A4 EP0484558A4 (en) 1993-06-30
EP0484558B1 EP0484558B1 (fr) 1995-07-26

Family

ID=15180214

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91909800A Expired - Lifetime EP0484558B1 (fr) 1990-05-25 1991-05-24 Bobine haute frequence et procede pour sa fabrication

Country Status (4)

Country Link
EP (1) EP0484558B1 (fr)
JP (1) JPH0430406A (fr)
DE (1) DE69111569T2 (fr)
WO (1) WO1991019303A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2272109A (en) * 1992-11-02 1994-05-04 Murata Manufacturing Co Laminated coiled conductive pattern and terminal arrangement
EP1008997A1 (fr) * 1998-12-11 2000-06-14 Matsushita Electric Industrial Co., Ltd. Inductance à haute fréquence à grand coefficient de qualité
EP1047132A1 (fr) * 1999-04-20 2000-10-25 France Telecom Dispositif de circuit intégré comprenant une inductance à haut coefficient de qualité
EP1320109A1 (fr) * 2001-12-14 2003-06-18 Mitsubishi Denki Kabushiki Kaisha Bobine d'inductance multicouche
WO2017052327A1 (fr) * 2015-09-25 2017-03-30 Samsung Electronics Co., Ltd. Dispositif électronique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19835016B4 (de) * 1998-08-03 2006-09-21 Bartels Mikrotechnik Gmbh Blockweise Fertigung von Induktivitäten mit Mikrotechniken

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1191592A (fr) * 1958-02-15 1959-10-20 Dumas & Tible Perfectionnements apportés aux circuits imprimés
GB2083952A (en) * 1980-09-11 1982-03-31 Asahi Chemical Ind Microcoil Assembly
JPS59154009A (ja) * 1983-02-22 1984-09-03 Nec Home Electronics Ltd チツプコイルの製造方法
DE8801879U1 (de) * 1988-02-13 1988-04-07 Akyürek, Altan, Dipl.-Ing., Wien Induktivität für Leistungselektronik- bzw. Leistungselektrikanwendungen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49101249U (fr) * 1972-12-21 1974-08-31
JPH07101652B2 (ja) * 1988-11-01 1995-11-01 株式会社村田製作所 高周波コイルの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1191592A (fr) * 1958-02-15 1959-10-20 Dumas & Tible Perfectionnements apportés aux circuits imprimés
GB2083952A (en) * 1980-09-11 1982-03-31 Asahi Chemical Ind Microcoil Assembly
JPS59154009A (ja) * 1983-02-22 1984-09-03 Nec Home Electronics Ltd チツプコイルの製造方法
DE8801879U1 (de) * 1988-02-13 1988-04-07 Akyürek, Altan, Dipl.-Ing., Wien Induktivität für Leistungselektronik- bzw. Leistungselektrikanwendungen

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 9, no. 4 (E-288)(1727) 10 January 1985 & JP-59 154 009 ( NEC HOME ELECTRONICS K.K. ) 3 September 1984 *
See also references of WO9119303A1 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2272109A (en) * 1992-11-02 1994-05-04 Murata Manufacturing Co Laminated coiled conductive pattern and terminal arrangement
EP1008997A1 (fr) * 1998-12-11 2000-06-14 Matsushita Electric Industrial Co., Ltd. Inductance à haute fréquence à grand coefficient de qualité
EP1498913A1 (fr) * 1998-12-11 2005-01-19 Matsushita Electric Industrial Co., Ltd. Inductance à haute fréquence à grand coefficient de qualité
US6891462B2 (en) 1998-12-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. High-Q inductor for high frequency
EP1047132A1 (fr) * 1999-04-20 2000-10-25 France Telecom Dispositif de circuit intégré comprenant une inductance à haut coefficient de qualité
FR2792775A1 (fr) * 1999-04-20 2000-10-27 France Telecom Dispositif de circuit integre comprenant une inductance a haut coefficient de qualite
US6784518B1 (en) 1999-04-20 2004-08-31 FRANCE TéLéCOM Integrated circuit device comprising an inductor with high quality coefficient
EP1320109A1 (fr) * 2001-12-14 2003-06-18 Mitsubishi Denki Kabushiki Kaisha Bobine d'inductance multicouche
US6657530B2 (en) 2001-12-14 2003-12-02 Mitsubishi Denki Kabushiki Kaisha Multi-layered inductance element
WO2017052327A1 (fr) * 2015-09-25 2017-03-30 Samsung Electronics Co., Ltd. Dispositif électronique
US10468753B2 (en) 2015-09-25 2019-11-05 Samsung Electronics Co., Ltd. Electronic device

Also Published As

Publication number Publication date
EP0484558B1 (fr) 1995-07-26
WO1991019303A1 (fr) 1991-12-12
DE69111569D1 (de) 1995-08-31
EP0484558A4 (en) 1993-06-30
DE69111569T2 (de) 1996-03-21
JPH0430406A (ja) 1992-02-03

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