EP0478956B1 - Mikromechanisches Element - Google Patents

Mikromechanisches Element Download PDF

Info

Publication number
EP0478956B1
EP0478956B1 EP91114504A EP91114504A EP0478956B1 EP 0478956 B1 EP0478956 B1 EP 0478956B1 EP 91114504 A EP91114504 A EP 91114504A EP 91114504 A EP91114504 A EP 91114504A EP 0478956 B1 EP0478956 B1 EP 0478956B1
Authority
EP
European Patent Office
Prior art keywords
substrate
conductive material
micromechanical element
microstructure body
heating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91114504A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0478956A3 (en
EP0478956A2 (de
Inventor
Peter Dr. Bley
Jürgen Dr. Mohr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forschungszentrum Karlsruhe GmbH
Original Assignee
Forschungszentrum Karlsruhe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forschungszentrum Karlsruhe GmbH filed Critical Forschungszentrum Karlsruhe GmbH
Publication of EP0478956A2 publication Critical patent/EP0478956A2/de
Publication of EP0478956A3 publication Critical patent/EP0478956A3/de
Application granted granted Critical
Publication of EP0478956B1 publication Critical patent/EP0478956B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/01—Details
    • H01H61/013—Heating arrangements for operating relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay

Definitions

  • the invention relates to a micromechanical element according to the preamble of claim 1.
  • Such an element is known from DE 38 09 597 A1. It consists of a substrate to which a tongue partially adheres and an etching pit in the substrate into which the tongue moves when the temperature changes.
  • the heating element that triggers this movement is - viewed from above - arranged symmetrically as a plate on the tongue.
  • the disadvantage here is that the heating resistor is attached to the partially movable tongue and that the connection surface between the heating resistor and tongue is mechanically stressed during the movement, so that there is a risk that the heating resistor detaches.
  • the known element only allows movements perpendicular to the substrate.
  • a movement parallel to the substrate is usually cheaper because Have racks or gears and the like driven.
  • DE-37 16 996 A1 discloses a deformation element which is formed from two interconnected strips of material with different expansion coefficients and has an electrical heater for heating and thus deforming the deformation element, in which the electrical heater is a film heating element which is firmly connected to the deformation element .
  • the film heating element consists of a plastic film that is thinly metallized on one side and is again covered with a plastic film as protection or insulation.
  • the metal layer of the film heating element can be structured.
  • the object of the invention is to eliminate the disadvantages shown in the micromechanical element of the type mentioned.
  • a micromechanical element of the type mentioned at the outset is to be proposed, in which the connection surface between the electrically conductive and the non-conductive material is subjected to less mechanical stress.
  • the main advantage of the micromechanical element according to the invention in addition to the fact that the deflection takes place parallel to the substrate, is that the heating resistor 4 forms a much stronger connection with the plastic material of the tongue. This connection is strengthened if the heating resistor is at least partially meandering. Alternatively, if necessary, it can also be provided with toothing elements in one process step.
  • control elements such. B. for gas or liquid flows, gears or racks and the like can be driven, which are on the same substrate with the same irradiation, development, etching and electroplating step.
  • FIG. 1 shows a top view of the micromechanical element.
  • FIG. 2 shows a further development, the microstructure body being partially surrounded by a metal jacket.
  • Figures 3, 4 and 5 show different steps of a manufacturing process for the elements according to the invention.
  • FIG. 1 shows a micromechanical element in which a microstructure body made of plastic and metal is located on an electrically non-conductive substrate 1, for example a silicon wafer, a glass or ceramic substrate.
  • the microstructure body consists of a base body 2 which adheres firmly to the substrate and of a tongue 3 which is at a distance of a few micrometers from the substrate.
  • a heating resistor 4 which has a U-shape, is embedded asymmetrically on one side of the tongue 3, one leg of the U-shape being meandering.
  • the dimensions of the heating resistor are selected so that, on the one hand, in this area of the tongue 3 the metal surface is very high, for example over 50%, and on the other hand its electrical resistance is in a range suitable for the intended use. High resistances are advantageous because they allow the tongue to be heated quickly and with small currents.
  • the heating resistor is connected to larger metal structures 5 (bond pads) which represent contacts to which a power source is connected from the outside.
  • the tongue When an electrical voltage is applied to the two contacts 5, a current flows through the heating resistor of the tongue and heats it up. Since the tongue is made of plastic and a plastic-metal composite, the coefficients of thermal expansion of which differ, internal stresses occur. As a result of the asymmetrical arrangement of the heating resistor, the tongue moves parallel to the substrate when the temperature changes.
  • the height of the tongue measured perpendicular to the substrate, is typically in the range of 300 »m, its width between 50 and 150» m.
  • micromechanical element according to FIG. 1 can be produced by a method which is shown in FIGS. 3, 4 and 5.
  • Figure 5 shows the finished element.
  • Figure 3 shows a plan view and Figure 4 shows a section (B-B in Figure 1) through the micromechanical element during manufacture.
  • a metal layer 6 with a thickness of preferably less than 1 »m is first applied by vapor deposition or sputtering, which is structured with the known steps of microelectronics (coating, exposure, development, selective etching).
  • a spacer layer 7 with a thickness of preferably less than 10 »m is applied using the same methods and is structured analogously (FIG. 3). It must this spacer layer 7 can be selectively etched away. This is possible, for example, if one chooses silver, chrome, copper, nickel or gold as the metal layer 6 and titanium as the spacer layer 7.
  • the part 6a of the metal layer 6 is used for the subsequent connection of the electroplating electrode.
  • a plastic layer that is metallized can also be used as the spacer layer.
  • a resist layer is then applied to this prepared substrate, which later forms both the non-conductive part of the microstructure body 2, 3 and the shape for the electrodeposition of the heating resistor 4 and the metal structures 5.
  • the resist e.g. irradiated with X-rays 8 via an X-ray mask 9.
  • the irradiated partial areas 10 and 11 of the resist are removed with a suitable developer, the unexposed areas remaining.
  • the spacer layer 7 is removed by selective etching.
  • the metal 4 must of course be resistant to the etchant with which the spacer layer is removed. If you take titanium as the spacer layer, you can use it for the metal structure many other materials, such as chrome, silver, copper, nickel or gold can be selected.
  • a 5% hydrofluoric acid solution can be used as the etchant.
  • FIG. 5 shows the finished micromechanical element according to FIG. 1 in section B-B.
  • the microstructure body 2, 3 can also be constructed on a metallic substrate. In this case, the metal layer 6 is omitted. However, it must be ensured that the galvanic metal deposition takes place only at the points that form the heating resistor 4 and the contacts 5. This can be done either by a structured insulation layer, e.g. a photoresist, which is applied to the metallic substrate before the resist is applied.
  • a structured insulation layer e.g. a photoresist
  • the contacts 5 must be moved into the self-supporting, movable part 3 of the microstructure body in order to ensure the necessary insulation.
  • the element shown in FIG. 1 can be produced with a single irradiation, in which both the resist regions 10, which serve as a mold for the electrically conductive material, and the resist regions 11 to be removed are irradiated.
  • the micromechanical element according to FIG. 2 is produced by two adjusted irradiations.
  • the first step all areas that are to be filled with metal are irradiated and developed. After the electroplating, the resist areas that are not required are irradiated and removed by the developer.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
  • Resistance Heating (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
EP91114504A 1990-10-04 1991-08-29 Mikromechanisches Element Expired - Lifetime EP0478956B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4031248A DE4031248A1 (de) 1990-10-04 1990-10-04 Mikromechanisches element
DE4031248 1990-10-04

Publications (3)

Publication Number Publication Date
EP0478956A2 EP0478956A2 (de) 1992-04-08
EP0478956A3 EP0478956A3 (en) 1992-11-25
EP0478956B1 true EP0478956B1 (de) 1995-05-17

Family

ID=6415485

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91114504A Expired - Lifetime EP0478956B1 (de) 1990-10-04 1991-08-29 Mikromechanisches Element

Country Status (3)

Country Link
EP (1) EP0478956B1 (ja)
AT (1) ATE122816T1 (ja)
DE (1) DE4031248A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7950777B2 (en) 1997-07-15 2011-05-31 Silverbrook Research Pty Ltd Ejection nozzle assembly
US7950779B2 (en) 1997-07-15 2011-05-31 Silverbrook Research Pty Ltd Inkjet printhead with heaters suspended by sloped sections of less resistance
US7980667B2 (en) 1997-07-15 2011-07-19 Silverbrook Research Pty Ltd Nozzle arrangement with pivotal wall coupled to thermal expansion actuator
US7997687B2 (en) 1998-06-09 2011-08-16 Silverbrook Research Pty Ltd Printhead nozzle arrangement having interleaved heater elements
US8020970B2 (en) 1997-07-15 2011-09-20 Silverbrook Research Pty Ltd Printhead nozzle arrangements with magnetic paddle actuators
US8025366B2 (en) 1997-07-15 2011-09-27 Silverbrook Research Pty Ltd Inkjet printhead with nozzle layer defining etchant holes
US8029101B2 (en) 1997-07-15 2011-10-04 Silverbrook Research Pty Ltd Ink ejection mechanism with thermal actuator coil
US8029102B2 (en) 1997-07-15 2011-10-04 Silverbrook Research Pty Ltd Printhead having relatively dimensioned ejection ports and arms
US8061812B2 (en) 1997-07-15 2011-11-22 Silverbrook Research Pty Ltd Ejection nozzle arrangement having dynamic and static structures
US8083326B2 (en) 1997-07-15 2011-12-27 Silverbrook Research Pty Ltd Nozzle arrangement with an actuator having iris vanes
US8113629B2 (en) 1997-07-15 2012-02-14 Silverbrook Research Pty Ltd. Inkjet printhead integrated circuit incorporating fulcrum assisted ink ejection actuator
US8123336B2 (en) 1997-07-15 2012-02-28 Silverbrook Research Pty Ltd Printhead micro-electromechanical nozzle arrangement with motion-transmitting structure
US8408679B2 (en) 1997-07-15 2013-04-02 Zamtec Ltd Printhead having CMOS drive circuitry

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994816A (en) * 1996-12-16 1999-11-30 Mcnc Thermal arched beam microelectromechanical devices and associated fabrication methods
US5962949A (en) * 1996-12-16 1999-10-05 Mcnc Microelectromechanical positioning apparatus
AUPO799197A0 (en) 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd Image processing method and apparatus (ART01)
US6540332B2 (en) 1997-07-15 2003-04-01 Silverbrook Research Pty Ltd Motion transmitting structure for a nozzle arrangement of a printhead chip for an inkjet printhead
US7022250B2 (en) 1997-07-15 2006-04-04 Silverbrook Research Pty Ltd Method of fabricating an ink jet printhead chip with differential expansion actuators
US6641315B2 (en) 1997-07-15 2003-11-04 Silverbrook Research Pty Ltd Keyboard
US6672706B2 (en) 1997-07-15 2004-01-06 Silverbrook Research Pty Ltd Wide format pagewidth inkjet printer
US6927786B2 (en) 1997-07-15 2005-08-09 Silverbrook Research Pty Ltd Ink jet nozzle with thermally operable linear expansion actuation mechanism
US7207654B2 (en) 1997-07-15 2007-04-24 Silverbrook Research Pty Ltd Ink jet with narrow chamber
US20040130599A1 (en) 1997-07-15 2004-07-08 Silverbrook Research Pty Ltd Ink jet printhead with amorphous ceramic chamber
US7753463B2 (en) 1997-07-15 2010-07-13 Silverbrook Research Pty Ltd Processing of images for high volume pagewidth printing
US6652052B2 (en) 1997-07-15 2003-11-25 Silverbrook Research Pty Ltd Processing of images for high volume pagewidth printing
EP1640162B1 (en) * 1997-07-15 2007-03-28 Silverbrook Research Pty. Ltd Inkjet nozzle arrangement having paddle forming a portion of a wall
US7401901B2 (en) 1997-07-15 2008-07-22 Silverbrook Research Pty Ltd Inkjet printhead having nozzle plate supported by encapsulated photoresist
US6834939B2 (en) 2002-11-23 2004-12-28 Silverbrook Research Pty Ltd Micro-electromechanical device that incorporates covering formations for actuators of the device
US7008046B2 (en) 1997-07-15 2006-03-07 Silverbrook Research Pty Ltd Micro-electromechanical liquid ejection device
US6986613B2 (en) 1997-07-15 2006-01-17 Silverbrook Research Pty Ltd Keyboard
US6746105B2 (en) 1997-07-15 2004-06-08 Silverbrook Research Pty. Ltd. Thermally actuated ink jet printing mechanism having a series of thermal actuator units
US7044584B2 (en) 1997-07-15 2006-05-16 Silverbrook Research Pty Ltd Wide format pagewidth inkjet printer
US6814429B2 (en) 1997-07-15 2004-11-09 Silverbrook Research Pty Ltd Ink jet printhead incorporating a backflow prevention mechanism
US6679584B2 (en) 1997-07-15 2004-01-20 Silverbrook Research Pty Ltd. High volume pagewidth printing
ATE399644T1 (de) * 1997-07-15 2008-07-15 Silverbrook Res Pty Ltd Tintenstrahldüsenanordnung mit betätigungsmechanismus in kammer zwischen düse und tintenversorgung
US7381340B2 (en) 1997-07-15 2008-06-03 Silverbrook Research Pty Ltd Ink jet printhead that incorporates an etch stop layer
AU2005239718B2 (en) * 1997-07-15 2007-08-09 Memjet Technology Limited Thermal actuator with corrugated heater element
US7303254B2 (en) 1997-07-15 2007-12-04 Silverbrook Research Pty Ltd Print assembly for a wide format pagewidth printer
US7004566B2 (en) 1997-07-15 2006-02-28 Silverbrook Research Pty Ltd Inkjet printhead chip that incorporates micro-mechanical lever mechanisms
US7891767B2 (en) 1997-07-15 2011-02-22 Silverbrook Research Pty Ltd Modular self-capping wide format print assembly
US7431446B2 (en) 1997-07-15 2008-10-07 Silverbrook Research Pty Ltd Web printing system having media cartridge carousel
US6582059B2 (en) 1997-07-15 2003-06-24 Silverbrook Research Pty Ltd Discrete air and nozzle chambers in a printhead chip for an inkjet printhead
US7434915B2 (en) 1997-07-15 2008-10-14 Silverbrook Research Pty Ltd Inkjet printhead chip with a side-by-side nozzle arrangement layout
US7524026B2 (en) 1997-07-15 2009-04-28 Silverbrook Research Pty Ltd Nozzle assembly with heat deflected actuator
US7360872B2 (en) 1997-07-15 2008-04-22 Silverbrook Research Pty Ltd Inkjet printhead chip with nozzle assemblies incorporating fluidic seals
US6527374B2 (en) 1997-07-15 2003-03-04 Silverbrook Research Pty Ltd Translation to rotation conversion in an inkjet printhead
US7287836B2 (en) 1997-07-15 2007-10-30 Sil;Verbrook Research Pty Ltd Ink jet printhead with circular cross section chamber
US6824251B2 (en) 1997-07-15 2004-11-30 Silverbrook Research Pty Ltd Micro-electromechanical assembly that incorporates a covering formation for a micro-electromechanical device
AUPP653998A0 (en) 1998-10-16 1998-11-05 Silverbrook Research Pty Ltd Micromechanical device and method (ij46B)
US6485123B2 (en) 1997-07-15 2002-11-26 Silverbrook Research Pty Ltd Shutter ink jet
US7111925B2 (en) 1997-07-15 2006-09-26 Silverbrook Research Pty Ltd Inkjet printhead integrated circuit
US7131715B2 (en) 1997-07-15 2006-11-07 Silverbrook Research Pty Ltd Printhead chip that incorporates micro-mechanical lever mechanisms
US7246884B2 (en) 1997-07-15 2007-07-24 Silverbrook Research Pty Ltd Inkjet printhead having enclosed inkjet actuators
US6857724B2 (en) 1997-07-15 2005-02-22 Silverbrook Research Pty Ltd Print assembly for a wide format pagewidth printer
US7246881B2 (en) 1997-07-15 2007-07-24 Silverbrook Research Pty Ltd Printhead assembly arrangement for a wide format pagewidth inkjet printer
US6471336B2 (en) 1997-07-15 2002-10-29 Silverbrook Research Pty Ltd. Nozzle arrangement that incorporates a reversible actuating mechanism
US6488359B2 (en) 1997-07-15 2002-12-03 Silverbrook Research Pty Ltd Ink jet printhead that incorporates through-chip ink ejection nozzle arrangements
US6557977B1 (en) 1997-07-15 2003-05-06 Silverbrook Research Pty Ltd Shape memory alloy ink jet printing mechanism
US6916082B2 (en) 1997-07-15 2005-07-12 Silverbrook Research Pty Ltd Printing mechanism for a wide format pagewidth inkjet printer
US6880918B2 (en) 1997-07-15 2005-04-19 Silverbrook Research Pty Ltd Micro-electromechanical device that incorporates a motion-transmitting structure
US6540331B2 (en) 1997-07-15 2003-04-01 Silverbrook Research Pty Ltd Actuating mechanism which includes a thermal bend actuator
US6247792B1 (en) 1997-07-15 2001-06-19 Silverbrook Research Pty Ltd PTFE surface shooting shuttered oscillating pressure ink jet printing mechanism
US7784902B2 (en) 1997-07-15 2010-08-31 Silverbrook Research Pty Ltd Printhead integrated circuit with more than 10000 nozzles
US6652074B2 (en) 1998-03-25 2003-11-25 Silverbrook Research Pty Ltd Ink jet nozzle assembly including displaceable ink pusher
US6959982B2 (en) 1998-06-09 2005-11-01 Silverbrook Research Pty Ltd Flexible wall driven inkjet printhead nozzle
AUPP702098A0 (en) 1998-11-09 1998-12-03 Silverbrook Research Pty Ltd Image creation method and apparatus (ART73)
US7111924B2 (en) 1998-10-16 2006-09-26 Silverbrook Research Pty Ltd Inkjet printhead having thermal bend actuator heating element electrically isolated from nozzle chamber ink
US6236139B1 (en) 1999-02-26 2001-05-22 Jds Uniphase Inc. Temperature compensated microelectromechanical structures and related methods
US6590313B2 (en) 1999-02-26 2003-07-08 Memscap S.A. MEMS microactuators located in interior regions of frames having openings therein and methods of operating same
US6137206A (en) * 1999-03-23 2000-10-24 Cronos Integrated Microsystems, Inc. Microelectromechanical rotary structures
US6218762B1 (en) 1999-05-03 2001-04-17 Mcnc Multi-dimensional scalable displacement enabled microelectromechanical actuator structures and arrays
US6291922B1 (en) 1999-08-25 2001-09-18 Jds Uniphase, Inc. Microelectromechanical device having single crystalline components and metallic components
US6255757B1 (en) 1999-09-01 2001-07-03 Jds Uniphase Inc. Microactuators including a metal layer on distal portions of an arched beam
US6211598B1 (en) 1999-09-13 2001-04-03 Jds Uniphase Inc. In-plane MEMS thermal actuator and associated fabrication methods
US6333583B1 (en) * 2000-03-28 2001-12-25 Jds Uniphase Corporation Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams
FI109155B (fi) 2000-04-13 2002-05-31 Nokia Corp Menetelmä ja järjestely mikromekaanisen elementin ohjaamiseksi
US6921153B2 (en) 2000-05-23 2005-07-26 Silverbrook Research Pty Ltd Liquid displacement assembly including a fluidic sealing structure
US6738600B1 (en) * 2000-08-04 2004-05-18 Harris Corporation Ceramic microelectromechanical structure
DE10260544B4 (de) * 2002-12-21 2005-03-31 Festo Ag & Co.Kg Mehrschichtiges Mikroventil
NL2000209C2 (nl) * 2006-09-04 2008-03-05 Univ Delft Tech Thermische actuator.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6913873A (ja) * 1968-09-19 1970-03-23
DE3716996A1 (de) * 1987-05-21 1988-12-08 Vdo Schindling Verformungselement
DE3809597A1 (de) * 1988-03-22 1989-10-05 Fraunhofer Ges Forschung Mikromechanisches stellelement

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8061812B2 (en) 1997-07-15 2011-11-22 Silverbrook Research Pty Ltd Ejection nozzle arrangement having dynamic and static structures
US8029101B2 (en) 1997-07-15 2011-10-04 Silverbrook Research Pty Ltd Ink ejection mechanism with thermal actuator coil
US7980667B2 (en) 1997-07-15 2011-07-19 Silverbrook Research Pty Ltd Nozzle arrangement with pivotal wall coupled to thermal expansion actuator
US8419165B2 (en) 1997-07-15 2013-04-16 Zamtec Ltd Printhead module for wide format pagewidth inkjet printer
US7950777B2 (en) 1997-07-15 2011-05-31 Silverbrook Research Pty Ltd Ejection nozzle assembly
US8025366B2 (en) 1997-07-15 2011-09-27 Silverbrook Research Pty Ltd Inkjet printhead with nozzle layer defining etchant holes
US7950779B2 (en) 1997-07-15 2011-05-31 Silverbrook Research Pty Ltd Inkjet printhead with heaters suspended by sloped sections of less resistance
US8029102B2 (en) 1997-07-15 2011-10-04 Silverbrook Research Pty Ltd Printhead having relatively dimensioned ejection ports and arms
US8020970B2 (en) 1997-07-15 2011-09-20 Silverbrook Research Pty Ltd Printhead nozzle arrangements with magnetic paddle actuators
US8075104B2 (en) 1997-07-15 2011-12-13 Sliverbrook Research Pty Ltd Printhead nozzle having heater of higher resistance than contacts
US8083326B2 (en) 1997-07-15 2011-12-27 Silverbrook Research Pty Ltd Nozzle arrangement with an actuator having iris vanes
US8113629B2 (en) 1997-07-15 2012-02-14 Silverbrook Research Pty Ltd. Inkjet printhead integrated circuit incorporating fulcrum assisted ink ejection actuator
US8123336B2 (en) 1997-07-15 2012-02-28 Silverbrook Research Pty Ltd Printhead micro-electromechanical nozzle arrangement with motion-transmitting structure
US8287105B2 (en) 1997-07-15 2012-10-16 Zamtec Limited Nozzle arrangement for an inkjet printhead having an ink ejecting roof structure
US8408679B2 (en) 1997-07-15 2013-04-02 Zamtec Ltd Printhead having CMOS drive circuitry
US7997687B2 (en) 1998-06-09 2011-08-16 Silverbrook Research Pty Ltd Printhead nozzle arrangement having interleaved heater elements

Also Published As

Publication number Publication date
ATE122816T1 (de) 1995-06-15
DE4031248A1 (de) 1992-04-09
EP0478956A3 (en) 1992-11-25
DE4031248C2 (ja) 1992-07-23
EP0478956A2 (de) 1992-04-08

Similar Documents

Publication Publication Date Title
EP0478956B1 (de) Mikromechanisches Element
DE60220022T2 (de) Verfahren zur herstellung elektrisch leitender kontaktstrukturen
DE10000090A1 (de) Verfahren zum Herstellen einer mehrlagigen Planarspule
DE10291877B4 (de) Mikroschalter und Verfahren zum Herstellen eines Mikroschalters
DE4126107A1 (de) Beschleunigungssensor und verfahren zur herstellung
WO1992002858A1 (de) Verfahren zur herstellung von mikrostrukturen mit beispielsweise unterschiedlicher strukturhöhe
DE1590870A1 (de) Elektrischer Bauteil,insbesondere Widerstand
DE2358816A1 (de) Verfahren zur herstellung von platten fuer gasentladungs-anzeigetafeln
DE102018005010A1 (de) Transfer und Aufschmelzen von Schichten
DE19729785C2 (de) Kondensatoranordnung und ihr Herstellungsverfahren
DE3440109C2 (ja)
EP0551118A1 (de) Verfahren zur Herstellung von nicht linearen optischen Mikro-Bauelementen
DE10043549C1 (de) Mikroschalter und Verfahren zu dessen Herstellung
DE10210344A1 (de) Verfahren zur Herstellung mikromechanischer Bauteile und nach dem Verfahren hergestellte Bauteile
DE4123249C2 (de) Verfahren zum Herstellen einer Vielzahl von abgeglichenen metallischen Dünnschicht-Widerstandsstrukturen
WO2001037045A1 (de) Flachspule und lithographisches verfahren zur herstellung von mikrobauteilen
EP3445415B1 (de) Schicht mit variabler festigkeit
DE2534414A1 (de) Magneto-widerstand und verfahren zu dessen herstellung
DE4233153C2 (de) Kalorimetrischer Durchflußmesser und Verfahren zu seiner Herstellung
DE19944410C2 (de) Vorrichtung zur Halterung einer zu heizenden Mikrostruktur und Verfahren zur Herstellung der Vorrichtung
DE3117957A1 (de) Verfahren zur herstellung eines schichtwiderstandes und nach diesem verfahren hergestellter schichtwiderstand
WO2002084228A1 (de) Kapazitives sensorelement und verfahren zur herstellung eines kapazitiven sensorelements
WO2006072237A1 (de) Mikrosystemtechnisches bauelement mit einer unter dem einfluss von temperaturänderungen verformbaren einrichtung
DE2649250A1 (de) Traeger fuer elektrische schaltkreise und verfahren zur herstellung eines derartigen traegers
EP0058835B1 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH FR GB LI NL

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH FR GB LI NL

17P Request for examination filed

Effective date: 19921207

17Q First examination report despatched

Effective date: 19940804

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: KERNFORSCHUNGSZENTRUM KARLSRUHE GMBH

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: FORSCHUNGSZENTRUM KARLSRUHE GMBH

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH FR GB LI NL

REF Corresponds to:

Ref document number: 122816

Country of ref document: AT

Date of ref document: 19950615

Kind code of ref document: T

ET Fr: translation filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19950725

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19950830

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Effective date: 19950831

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19950825

BERE Be: lapsed

Owner name: FORSCHUNGSZENTRUM KARLSRUHE G.M.B.H.

Effective date: 19950831

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Effective date: 19960430

26N No opposition filed
REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19960829

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19970301

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19960829

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19970301

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20000727

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20010824

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20010831

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20010831

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20020829