EP0413569B1 - Thermal imaging system - Google Patents
Thermal imaging system Download PDFInfo
- Publication number
- EP0413569B1 EP0413569B1 EP90308954A EP90308954A EP0413569B1 EP 0413569 B1 EP0413569 B1 EP 0413569B1 EP 90308954 A EP90308954 A EP 90308954A EP 90308954 A EP90308954 A EP 90308954A EP 0413569 B1 EP0413569 B1 EP 0413569B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- thermal imaging
- imaging device
- conductive layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001931 thermography Methods 0.000 title claims description 134
- 239000000758 substrate Substances 0.000 claims description 47
- 238000003384 imaging method Methods 0.000 claims description 40
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- CJOBVZJTOIVNNF-UHFFFAOYSA-N cadmium sulfide Chemical compound [Cd]=S CJOBVZJTOIVNNF-UHFFFAOYSA-N 0.000 claims description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 16
- 239000010936 titanium Substances 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 16
- 239000004411 aluminium Substances 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 14
- 239000004973 liquid crystal related substance Substances 0.000 claims description 10
- 238000005299 abrasion Methods 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 7
- 239000002223 garnet Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005293 ferrimagnetic effect Effects 0.000 claims description 4
- 229910003437 indium oxide Inorganic materials 0.000 claims description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000370 acceptor Substances 0.000 claims description 2
- IEJHYFOJNUCIBD-UHFFFAOYSA-N cadmium(2+) indium(3+) oxygen(2-) Chemical compound [O-2].[Cd+2].[In+3] IEJHYFOJNUCIBD-UHFFFAOYSA-N 0.000 claims description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 2
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 230000000007 visual effect Effects 0.000 claims 2
- 229920006037 cross link polymer Polymers 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 36
- 239000000975 dye Substances 0.000 description 32
- 239000010949 copper Substances 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 239000011521 glass Substances 0.000 description 20
- 238000007639 printing Methods 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 238000005286 illumination Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 10
- 229910052753 mercury Inorganic materials 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000012300 argon atmosphere Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 238000000859 sublimation Methods 0.000 description 7
- 239000005388 borosilicate glass Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 230000008022 sublimation Effects 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- -1 e.g. Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000012802 pre-warming Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 101100171669 Arabidopsis thaliana EDL3 gene Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241001572350 Lycaena mariposa Species 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229940062097 nitrogen 90 % Drugs 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002186 photoactivation Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/3825—Electric current carrying heat transfer sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/028—Layers in which after being exposed to heat patterns electrically conductive patterns are formed in the layers, e.g. for thermoxerography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/153—Charge-receiving layers combined with additional photo- or thermo-sensitive, but not photoconductive, layers, e.g. silver-salt layers
Definitions
- This invention relates to thermal imaging systems and in particular to a multilayer thermal imaging device having a print surface adapted for developing thermally sensitive paper or effecting thermal transfer of a colourant, toner or other image forming material.
- thermal transfer printing is a leading technology, especially when using sublimation dye media.
- the main strengths of the technology lie in the reliability of the machines and their modest cost compared to photographic, electrophotographic or electrostatic printers.
- thermal printers approach photo-quality and for throughput and cost per copy all technologies trail behind electrophotography.
- thermal styli printheads At present digital imaging of such materials is performed by thermal styli printheads. To provide a reasonable image quality, a high density of heat generating resistors is required which must be both accurately sized and of uniform resistance. To achieve this, several highly accurate microlithographic fabrication stages are required. The requirement that all the resistive elements must be functional and of uniform resistance at this level of fabrication complexity leads to a low yield and the cost of the thermal styli printhead is high. Applications requiring a higher resolution than 400 dots per inch (d.p.i.) are therefore not addressed by current thermal printing technology. Furthermore, only one of these high cost devices can economically be incorporated into a printing device. This causes serious disadvantages for full colour printing in which 3 or 4 colour separations must then be printed sequentially, which slows the throughput.
- the donor ribbon is printed in 3 or 4 sequential colours (cyan, magenta, yellow and optionally black) requiring the receptor paper to be re-registered for each colour on the single printhead.
- Each of the 3 or 4 colour ribbon donor sections is not normally re-usable and so the cost of a colour print is constant and high.
- thermoelectrographic processes having a thermal imaging device comprising a trilayer element of a photoconductor interposed between two electrodes, at least one electrode being substantially transparent.
- the second electrode or the photoconductor is thermally deformable or heat disintegrating such that following primary exposure to the image to be recorded and concomitant Joule heating arising from current flow in the conductive path, a permanent image comprising pits or holes is produced which is read for optical data storage.
- U.S. Patent No. 4,277,145, and European Patent No. 12651 disclose an imaging assembly having a thermal imaging device of multilayer format in which a reflective second electrode is in intimate association with a liquid crystal layer. Isotropic change in the liquid crystal caused by Joule heating as the thermal imaging device is scanned and its subsequent cooling scatters light to produce an image for display.
- German Patent No. 2904793 discloses an imaging assembly having a thermal imaging device comprising a support, an electrically conductive layer and a recording layer containing an oxidisable or reducible compound.
- a photoconductor with a conductive backing is brought into contact with the recording medium and upon light exposure, a current caused to flow through the recording medium produces a chemical reaction.
- the assembly is then heated at 130°C for 30 seconds to give a positive image of continuous tone.
- U.S. Patent No. 4,470,055 discloses a thermoelectrographic device having an ink transferral drum comprising a transparent substrate, a transparent electrode and a photoconductor.
- An ink being solid at room temperature and having heat-fusing and semiconductive properties is coated onto the drum and paper brought into contact with the ink.
- illumination from within the drum causes the photoconductor to switch to a low resistance state and the Joule heating in the ink layer causes fusion and transferral of ink to the paper.
- Japanese Patent No. 61244563 discloses a thermal imaging device comprising a transparent substrate, a transparent electrode, a photoconductor, a resistive heat generating layer and a further electrode.
- the device is addressed by a laser through the transparent substrate and electrode and in the light struck areas, the photoconductor switches to a low resistance state causing a large electric field to develop in the resistive layer. The Joule heating effect in this layer is then used to develop thermally sensitive paper.
- the thermal image assembly incorporating such a thermal imaging device has a relatively low resolution (approximately 100 d.p.i.(4 dots per mm)).
- a magneto-optic device is disclosed in the Journal of Applied Physics, Vol. 48 P.366 (1977), comprising a non-magnetic garnet substrate bearing on one surface a ferrimagnetic garnet film, on which is deposited a first transparent electrode layer, followed by a photoconductor layer and a second transparent electrode layer.
- a voltage is applied across the electrodes and the device is laser-exposed, sufficient joule heating occurs to bring about magneto-optical switching of the ferrimagnetic garnet layer.
- the device is useful for optical data storage.
- Japanese Patent Application No. 63-159063 discloses a thermal imaging device comprising an amorphous silicon photoconductor sandwiched between two electrodes, at least one of which is transparent while the other bears a further wear-resistant coating.
- a voltage is applied across the electrodes, and the device is illuminated by a laser diode through the transparent electrode, sufficient heat is generated via Joule heating to image thermally-sensitive paper held in contact with the wear-resistant layer.
- the performance quoted for this device includes a writing speed of 10 ⁇ 2 sec/mm, and a conductivity of 10 ⁇ 5 S/cm for illumination by a 5mW laser diode emitting at 780nm. Much higher writing speeds (e.g., by two orders of magnitude) are necessary for such a device to have practical applications. Much higher sensitivities are required, especially if more energy-demanding imaging media, such as dye-sublimation media, are to be employed.
- thermal imaging device having a simplicity of structure and fabrication and having a particular utility to a thermal imaging assembly having improved resolution and/or multi-colour imaging capability when compared to conventional electrothermographic printers.
- a thermal imaging device having a print surface adapted to provide localised heating to a medium comprising a thermally activatable component of an imaging forming system, the device comprising the following sequential layers:
- Transparent or semi-transparent electrically conductive layer (a) may comprise any suitable material known to the art of electronic imaging, having a transparency commensurate with the exposing power sufficient to generate the required photocurrent, typically at least 70%, and providing an electrical contact with the photoconductive layer (b).
- Conductive layer (a) may comprise an ultra-thin metal layer, e.g., silver, gold, copper etc., with a thickness less than the wavelength of the exposure source, but preferably comprises indium oxide, tin oxide, cadmium indium oxide, cadmium tin oxide or indium tin oxide and in a most preferred embodiment comprises an indium tin oxide layer, typically having greater than 90% transparency and a sheet resistance of from 5 to 200 ohms/square with a typical value of about 30 ohms/square.
- the thickness of conductive layer (a) is selected allowing for composition, surface roughness, conductivity and transparency considerations, and is typically 0.3 ⁇ m but may be 0.1 ⁇ m or less. The upper limit is governed by transparency, but is generally no greater than 1.0 ⁇ m.
- Photoconductive layer (b) may comprise any material known to the art of photoconductors having a high sensitivity and good thermal stability. Suitable photoconductive media having high sensitivity possess a conductivity of at least 0.01 S/cm, more preferably 0.1 to 10 S/cm and a photosensitive ratio of at least 1 x 103, preferably at least 1 x 105 when illuminated by radiation of 633 nm wavelength and intensity of 4.0 x 106 W/m2 measured under steady state.
- the photosensitive ratio is the ratio of the illuminated conductivity of a thermal imaging device to the dark conductivity.
- the photoconductive layer when illuminated by white light of 103 W/m2 intensity exhibits a conductivity of at least 3 x 10 ⁇ 5 S/cm.
- Suitable photoconductive media showing thermal stability survive repeated cycling to high temperatures (e.g., 400°C) without decomposition or change in properties.
- the photoconductive layer typically has a thickness of 6.0 ⁇ m but may be from 1.0 to 20.0 ⁇ m. Thin layers give the best resolution, but run the risk of coating defects such as pinholes.
- Preferred materials are selected from cadmium sulphide, cadmium selenide, cadmium telluride, gallium arsenide, lead sulphide, lead selenide, zinc oxide or mixtures thereof.
- the photoconductive layer has a combination of high illuminated conductivity and fast response time, especially for digital imaging using thermal transfer colourants
- the photoconductor is doped with copper in an amount up to 500 p.p.m.
- the amount of copper dopant will not be more than 180 p.p.m, typically no more than 80 p.p.m.
- Other dopants acting as compensating acceptors may also be used, e.g., silver, oxygen etc.
- the photoconductive layer comprises cadmium sulphide doped with copper in an amount up to 80 p.p.m.
- Electrically conductive layer (c) may comprise any material forming substantially an electrical contact with photoconductive layer (b) but preferably comprises an aluminium or titanium layer.
- Conductive layer (c) typically has a thickness of 0.5 ⁇ m but may be from 0.1 to 1.0 ⁇ m.
- electrically conductive layer (c) comprises a titanium electrode having a sheet resistivity of approximately 2 ohms/sq. or less.
- an abrasion or wear-resistant layer (d) be formed on the external surface of conductive layer (c) to reduce wear resulting from the contact of thermal imaging media.
- the wear-resistant layer may also impart friction reducing properties. In situations where a thermally-activated component of an imaging system is coated directly onto the devices, a wear resistant layer may not be necessary.
- Preferred materials suitable for use in a wear resistant layer comprise alumina, silicon nitride, aluminium nitride, titanium nitride, boron nitride, silicon carbide, silicon oxide, diamond or a diamond-like material or a polymer film which may optionally be crosslinked, e.g., polyimide.
- the wear resistant layer comprises titanium nitride and typically has a thickness of 0.5 ⁇ m.
- the thickness of the wear-resistant layer may be from 0.1 to 10 ⁇ m, with a typical value of from 0.1 to 1.0 ⁇ m.
- the print surface adapted for the provision of localised heating to a thermally-activatable component of an imaging system preferably comprises conductive layer (c) or conductive layer (c) in combination with wear resistant layer (d).
- the print surface may comprise any layer of one or more materials having good thermal properties for efficient conductance of heat generated in layer (b) to the selected thermographic medium.
- Photoconductive layer (b) is in electrical contact with conductive layer (c) such that free electron flow occurs upon exposure of the thermal imaging device and photoactivation of layer (b).
- Layers (b) and (c) complete a path of low resistivity unlike the devices of the prior art, for example, Japanese Patent No. 61244563 which discloses a thermal imaging device having an additional heat generating layer of high resistivity interposed between a photoconductor and an electrode.
- the functional nucleus of the thermal imaging device comprises the trilayer element of (a) to (c) and layer(s) (d) and/or (e), but the nucleus is preferably constructed upon a support substrate for practical purposes.
- the component layers are sequentially deposited upon a support substrate by r.f. magnetron sputtering under operating conditions known to the art, wherein the substrate may comprise a flexible or non-flexible material but preferably is glass, e.g., borosilicate glass.
- the parameters for material suitability are (i) high transparency and (ii) a high tolerance to rapid heating and cooling, e.g., the trilayer (a) to (c) may reach temperatures of up to 400°C.
- the thickness of the substrate is generally greater than 1.0 mm.
- the trilayer is deposited onto the surface of the substrate in the order: (a), (b), (c) and optional wear resistant layer (d).
- thermal annealing e.g., at 300°C, has been found to affect the growth of layer (b) in a manner which may result in a beneficial modification of conductivity to that layer.
- a thin thermally resistant layer between the substrate and electrically conductive layer (a).
- the layer must be transparent and should be less thermally conductive than the base but not totally insulating, in order to direct heat into layers (b) and (c).
- Suitable materials include polyimide, lead oxide and flint glasses containing lead, typically at a thickness of 1.0 ⁇ m.
- the voltage potential connected across layers (a) and (c) depends on the thickness and make-up of layer (b) and the intensity and dwell time of the exposing source, but is generally from 2 to 40V, more usually 5 to 30V with typical values of about 11 to 17V.
- the imaging device in one embodiment may be constructed as a substantially rectangular prism.
- the glass substrate may be constructed as a hollow cylinder, wherein layers are deposited on the external surface of the cylinder.
- thermographic image recording medium may comprise any of the thermographic materials known to the art but the format of the thermal imaging device will influence choice.
- the image recording medium may comprise a thermally sensitive paper held under pressure in intimate contact with the thermal imaging device or a colourant transfer medium such as a ribbon or sheet either impregnated with or having on its surface a thermally transferable colourant, e.g., a wax, ink or dye, or any material capable of modifying a receptor surface, held in intimate association with the thermal imaging device and a colourant receiving substrate.
- the colourant transfer medium may constitute an integral component of the thermal imaging device or it may comprise a temporary layer or coating applied to the print surface of the device, for example, in one embodiment a disposable thermal imaging device, which is periodically replaced, may be achieved by coating a colourant transfer layer on electrically conductive layer (c). In a further embodiment the colourant transfer medium may be coated onto the thermal imaging device as an ink, paste or jelly.
- Both colourant transfer layer and colourant receiving substrate may be contained in an integral construction comprising a device in which the imagewise exposed thermal imaging device is peeled apart to separate the substrate and desired image from the remainder of the device.
- thermal imaging devices of the prior art utilising thermally transferable colourants are unable to provide very high resolution printing and they are not able to provide a cost effective method of multi-colour printing.
- One reason for this lies in the construction of the printhead, typically a line of micro-resistors at a density of 125 to 400 d.p.i. (5 to 16 dots per mm) and of length 10 to 30cm.
- These miniature heating elements and their interconnects are formed on an alumina substrate by microlithographic techniques. The requirements that all elements must be functional and of uniform resistance at this level of fabrication complexity results in low yield and high device costs. The resolution of these devices is limited to 400 d.p.i. (16 dots per mm).
- thermal imaging devices of the present invention having a simplicity of structure and fabrication result in lower production costs and can readily achieve resolutions well in excess of 400 d.p.i.
- the dimensions of the printheads of the invention are not limited and can readily cover areas of many square centimetres.
- the devices of the invention possess additional means of controlling the amount of energy delivered at the print surface compared to devices of prior art.
- the only variables are the magnitude and duration of the current flow.
- the variables include the intensity and duration of the light exposure and also the magnitude and duration of the voltage applied across layers (a) and (c), so that the energy delivered to the print surface may be more readily controlled.
- the devices of the invention are therefore well suited for continuous tone imaging using the so called dye-diffusion-transfer media.
- the devices of the invention may also be used advantageously with so called mass-transfer media, i.e., imaging media which involves the thermal transfer of dyes or pigments along with a waxy binder. With this type of media, it is impossible to achieve gradations of colour within a transferred pixel; below a given energy threshold no transfer takes place, while at higher energies, complete transfer takes place.
- the size of the transferred pixel may be controlled by varying the voltage applied across layers (a) and (c).
- the voltage applied across layers (a) and (c) By this means, it is possible to simulate grey scales via generation of half-tones, as is commonly practised in conventional (lithographic) printing. This capability represents a significant advantage that is not available using thermal printers of the prior art.
- the thermal imaging devices of the present invention have a particular utility in a thermal imaging assembly comprising one or more of the thermal imaging devices and means for the imagewise exposure of said devices.
- the choice of said imagewise exposure means is selected in response to the function of the thermal imaging assembly, i.e., very high resolution printing or a more cost efficient mono or multi-colour printing process.
- one or more scanning lasers may provide exposure means.
- Laser scanners can achieve very high resolutions compared with 300 to 400 d.p.i. thermal printheads of the prior art and so such an imaging assembly can potentially offer very high resolution thermal printing, although limitations may be encountered with the thermal media.
- the dwell-time of the laser per pixel should be as short as possible in order to reduce the total scanning time and increase throughput. Since a fixed amount of energy per pixel is required to develop the imaging media, shorter dwell-times necessitate greater temperature gradients between the heat-generating source (photoconductor layer (b)) and the heat receiving layer (the imaging media). This may necessitate an unreasonably large temperature rise in the photoconductor.
- One method of alleviating this situation is to arrange for the device to be heated above ambient temperature independently of exposure by the scanning laser, provided that such heating is insufficient, by itself, to cause thermal development of the imaging media.
- This may be done by a variety of methods, e.g., external heating of the device, or passing an electric current along either or both of electrodes (a) and (c) so as to produce resistive heating, but the preferred method is to subject the imaging device to uniform, diffuse, low-level illumination. This generates a small photocurrent in layer (b) with concomitant resistive heating, thus raising the temperature by the required amount.
- This method has an additional advantage in that the response time (the time between onset of laser exposure and attainment of peak photocurrent) is reduced, by virtue of the background photocurrent being present, so that more efficient use is made of each laser pulse.
- Uniform illumination can be provided by any suitable light source, such as a tungsten filament lamp, preferably comprising means to control illumination intensity, e.g., in response to measurement of the background photocurrent flowing in the imaging device.
- An alternative method would be to use one or more laser spots preceding the writing laser spot. Such preceding laser spots cause both carrier generation and pre-warming of the pixel to be written.
- the intensity of the laser spot (or spots) on pixels n + 1, n + 2, would have to be modulated, commensurate with the voltage being written on pixel n. This could be achieved, for example, by modifying the image data by a suitable reference or 'look up' table.
- the basic effect of this technique is to elongate the exposure time per pixel at faster scanning rates thereby alleviating the temperature rise in the heat generating layer discussed earlier in this section.
- I ⁇ P ⁇ in which: I is the photocurrent density, P is the light power per unit volume and is a number usually in the range 0.5 ⁇ ⁇ ⁇ 1.
- the thermal imaging device increases as the illuminated area increases, so too does the total power consumption drawn in the thermal imaging device for a given light source.
- the time taken to write an image would be reduced compared to that taken to write the same image using a single laser spot.
- This effect can be utilised, for example, by illuminating the thermal imaging device through a negative of the required image, and using the generated thermal image to transfer the colourants.
- thermal imaging devices of the invention in which at least one of layers (a) and (c) is in the form of a pattern of discrete electrodes, each of which is connected to an independently-modulated voltage supply.
- one such embodiment could be a device comprising an array of n electrode lines (a) and/or electrode lines (c), addressed by a laser line arranged perpendicular to the array of n electrode lines of the thermal imaging device and which is at least as long as the n-line array is wide.
- the laser line would then scan in the direction of the electrode lines, each of which is then varied in voltage, or duration of voltage in accordance with electronic image data. In this way n lines of an image are written simultaneously.
- the spacing of the electrode lines and the width of the laser line will define the resolution of the thermal imaging device.
- Thermal imaging devices wherein layer (a) and/or layer (c) is in the form of an array of discrete electrodes may be fabricated by a combination of known techniques of vapour deposition and microlithography. Although this adds to the complexity of the fabrication process, it remains simpler than the fabrication of conventional thermal styli printheads.
- Mathematical modelling predicts that, using the above technique it should be possible to write an array of, say, 100 lines of image in approximately 3 to 5 times the time taken to write a single line by single-spot scanning, i.e., a 20 to 30 fold increase in throughput. In practice, it is surprisingly found that the equivalent of over 100 lines can be written in the same time as a single line, giving even greater increases in throughput.
- the thermal imaging device may be exposed by one or more electroluminescent devices such as light emitting diodes or conventional lamps, e.g., filament, halogen, sodium or neon bulbs.
- the imaging assembly may incorporate a liquid crystal shutter (LCS) array.
- LCD liquid crystal shutter
- Liquid crystal shutters currently have line densities similar to thermal printheads at around 300 d.p.i. (12 dots per mm), but are much cheaper to fabricate. For this reason several may be incorporated into a printer without increasing the cost substantially.
- the resolution of this printhead system is now limited by the LCS.
- the completed thermal imaging assembly is much less expensive because no microlithographic stages are required for the thermal imaging device and similarly construction of LCS using known techniques is relatively simple and of low expense.
- thermal imaging devices of the present invention typically 3 or 4 devices corresponding to the colours cyan, yellow, magenta and optionally black may be incorporated into a multi-colour thermal imaging assembly.
- Each colour is printed by its own thermal imaging device.
- Each imaging device may be exposed by a single means for exposure or each imaging device may be associated with its own exposure means.
- Prior art multi-colour printers because of their cost, have utilised only a single printhead to transfer the 3 or 4 dye pigments sequentially, i.e., a single colourant donor medium having the 3 or 4 colours printed in series.
- This is not a desirable format for coated media because of production difficulties and expense in coating such materials.
- the format is also undesirable when printing an image because the complete 3 or 4 colour section of the ribbon is consumed in printing, no matter how little of each colour is required, resulting in a high cost per copy.
- each colour is printed in sequence the paper must be re-registered mechanically and the time to print a page becomes lengthy.
- each thermal imaging device may be associated with a donor medium of different uniform colourant. Therefore, the time to produce a print may be reduced, the cost of producing a coloured print is reduced as the colour is only printed when required and the colourant donor medium may be constructed in the simpler format of continuous coloured ribbon leading to more favourable manufacturing costs.
- Thermal imaging assemblies incorporating one or more devices of the invention are thus of significant use in forming images via thermally sensitive media where a light image of the original is available.
- This light image could be a continuous or analogue type of image, but is more commonly a digital image, stored for example on a memory device and to be read but by a computerised system as is the case for many electronic printing machines such as thermal printers, laser printers, ink jet printers etc.
- the system would control the exposure and address system, i.e., the laser or liquid crystal shutter or the voltage applied across layers (a) and (c) etc., and a thermally printed image obtained by passing the thermally sensitive media over, and in intimate thermal contact with the thermal imaging device(s).
- the image recording medium may be exposed in a single dimension or in two dimensions in an image wise fashion. Registration of the image recording medium may be electronic or mechanical.
- a thermal imaging device comprising a transparent glass substrate (1) supporting; thin thermally resistant layer (2), transparent or semi-transparent electrically conductive layer (3), highly sensitive photoconductive layer (4), electrically conductive layer (5) and abrasion/wear resistant layer (6) forming the print surface.
- Electrical power supply (11) is connected across electrically conductive layers (3) and (5).
- a colourant transfer medium for example, a ribbon (not shown) coated or impregnated with a colourant, e.g., dye, wax or ink, and a colourant receiving substrate and held under pressure to secure the imaging process.
- a colourant transfer medium for example, a ribbon (not shown) coated or impregnated with a colourant, e.g., dye, wax or ink, and a colourant receiving substrate and held under pressure to secure the imaging process.
- a colourant transfer medium for example, a ribbon (not shown) coated or impregnated with a colourant, e.g., dye, wax or ink, and a colour
- the 'sandwich' structure of device, colourant medium and substrate is then illuminated by either a low power laser or a liquid crystal shutter (LCS) in a thermal imaging assembly. If the illuminated conductance of the photoconductive layer is large enough, then several watts of power may be dissipated in the illuminated region in the form of Joule heating.
- This "thermal spot” may be used to transfer dyes as in thermal transfer printing.
- the device is basically an amplifying interface, converting a light source of milliwatts or less into a thermal spot of up to a few watts.
- the illumination determines when and where to write the spot and can also modulate the transmitted power, but it is the external supply that provides the power.
- a thermal imaging device having a transparent flexible substrate (1) supporting; transparent or semi-transparent electrically conductive layer (3), highly sensitive photoconductive layer (4), electrically conductive layer (5) and colourant containing layer (7).
- Colourant may comprise an ink, wax or dye which can be transferred to a colourant receiving substrate (not shown) under the action of heating.
- the embodiment shown effectively provides an integral thermal imaging device and colourant transfer medium and is suitable for use in a thermal imaging assembly having a disposable thermal imaging device. Once colourant layer (7) has been depleted, a new thermal imaging device may be inserted into the imaging apparatus and the old thermal imaging device discarded or returned for recoating.
- the device has a voltage potential applied across layers (3) and (5) via voltage supply (11) and, in intimate association with a colourant receiving substrate, is exposed to an image forming light source. As per the device of Figure 1, passage of light through layers (1) to (4) causes thermal transfer of colourant to the colourant receiving substrate.
- a thermal imaging device having a flexible colourant receiving substrate (9) to act as the image receptor and supporting; a receptor/release layer (8) to aid separation during the peel apart of developed substrate, a colourant containing layer (7) which under the action of heating allows transfer of colourant e.g. ink, wax or dye to the receptor/release layer (8), an electrically conductive layer (5), a highly sensitive photoconductive layer (4) and a transparent or semi-transparent electrically conductive layer (3).
- Electrically conductive layers (3) and (5) are connected to voltage supply (11). Image wise exposure of the device in thermal imaging apparatus causes the transfer of colourants to release/receptor layer (8) by the process described for the device of Figure 1.
- the colourant receiving substrate may, subsequent to exposure be peeled apart from the remainder of the printhead aided by release layer (8).
- the embodiment shown is suitable for a disposable imaging assembly.
- a thermal imaging device having a transparent base substrate (1) comprising a rigid material shaped as a hollow drum, which supports; a transparent or semi-transparent electrically conductive layer (3), a highly sensitive photoconductive layer (4) and electrically conductive layer (5).
- Electrical power supply (11) is connected across electrically conductive layers (3) and (5).
- An inking station (10) is provided making contact with the drum, such that electrode layer (5) upon rotation of the drum is coated with a layer of colourant containing medium.
- the colourant containing medium is a paste or jelly impregnated with ink.
- a colourant receiving substrate (not shown) is brought into contact with the inked drum and the photoconductive layer (4) exposed through electrically conductive layer (3) by a light source internal to the drum. Joule Heating as described in the device of Figure 1 causes colourant to be transferred to the colourant receiving substrate.
- a further station removes the ink after image transference (not shown).
- a thermal imaging device was constructed on a borosilicate glass microscope slide as follows.
- a 90% indium oxide 10% tin oxide, 8 inch (20 cm) diameter target was r.f. magnetron sputtered at 200W for 30 minutes in an argon atmosphere at 7 microns of mercury pressure, such that an indium tin oxide (I.T.O.) layer was deposited onto the glass microscope slide.
- I.T.O. indium tin oxide
- the I.T.O. layer was approximately 300 nm thick and exhibited a sheet resistance of approximately 30 ohms/square and greater than 90% light transparency.
- the conductivity of the device was measured to be 0.16 S/cm.
- the photosensitive ratio of the device that is the ratio of the illuminated conductivity to the dark conductivity was approximately 105.
- a Mitsubishi TLP OHP-11 mass transfer donor sheet and paper with a poly(ethylene-co-acrylic acid) receptor coating were pressed into intimate contact with the imaging device by a silicone rubber roller in order to allow transfer of the donor wax to the receptor coating.
- the wax is either transferred or not, depending on whether the wax melting point is reached.
- a 820 nm wavelength, 2.5mW laser diode was focussed to 23 ⁇ m at the 1/e2 points, then scanned across the thermal imaging device and modulated on and off with a 50% duty cycle. With 11.9V applied between the I.T.O. and aluminium electrodes, several rows of approximately 35 ⁇ m to 40 ⁇ m diameter dots were written.
- this dot size would correspond to an addressability of approximately 800 d.p.i. (dots per inch) or alternatively as the 5% dot in a 150 line screen halftone printing process.
- the best resolution currently available in a conventional thermal printhead is 400 d.p.i. this example demonstrates the higher resolution capability of the thermal imaging devices of the present invention.
- a thermal imaging device was constructed as described in Example 1 except for the copper doped cadmium sulphide layer. This was prepared using a different cadmium sulphide target which was not bonded to a backing plate. 60 mm of finely divided copper wire (0.1mm diameter) were uniformly distributed on the 8 inch (20cm) diameter cadmium sulphide target and this target was r.f. magnetron sputtered at 300W for 90 minutes. The glass slide and I.T.O. layer were maintained at a temperature of 170 ⁇ 10°C. This resulted in a copper doped cadmium sulphide layer of approximately 6 ⁇ m thickness and containing approximately 50 ppm of copper. The thermal imaging device exhibited an illuminated conductivity of 1.12 S/cm when addressed by the 3mW HeNe laser operating at 633 nm wavelength, and also exhibited a photosensitive ratio of approximately 1.8 x 106.
- a thermal imaging device was constructed as described in Example 2 except that the cadmium sulphide layer was doped with approximately 42 ppm of copper.
- This thermal imaging device exhibited an illuminated conductivity of 0.2 S/cm and a photosensitive ratio of approximately 3.3 x 105, when illuminated by a 3mW HeNe laser of 633 nm wavelength, and focussed to approximately 30 ⁇ m.
- the 30 ⁇ m HeNe laser spot was applied to the thermal imaging device for 2ms by a shutter.
- the thermal imaging device was then moved approximately 100 ⁇ m horizontally by an x-y manipulator and the exposure repeated. A row of such exposures was made.
- the transferred dots were less than 24 ⁇ m in diameter, corresponding to an addressability of over 1000 d.p.i., again demonstrating the high resolution capability of the device.
- a thermal imaging device was constructed as described in Example 2 except that the cadmium sulphide layer was doped with approximately 33 ppm of copper.
- This thermal imaging device exhibited an illuminated conductance of 0.4 S/cm with a photosensitive ratio of approximately 4 x 105, when illuminated by the 3mW 30 ⁇ m spot size, 633 nm wavelength, HeNe laser.
- 12V was applied between the I.T.O. and aluminium electrodes and a row of dots were transferred as described in Example 3 except that the thermal imaging device was moved approximately 250 ⁇ m for each exposure. At the end of a row the thermal imaging device was moved approximately 250 ⁇ m vertically.
- the voltage to the electrodes was increased by 1V and a further row of dots transferred. This was continued in 1V increments until a row of dots had been written by application of 16V to the electrodes.
- the result of this experiment was that 5 rows of dots had been transferred that increased in size from approximately 40 ⁇ m diameter for the 12V application to approximately 180 ⁇ m diameter for the 16V application.
- the thermal imaging device may modulate dot size by modulation of the applied voltage. Such a variation in dot size would be useful, for example, in a halftone printing system.
- a thermal imaging device was constructed as described in Example 2, but omitting the alumina wear layer.
- a solution of cyan dye was coated onto the thermal imaging device to a dry thickness of approximately 2 ⁇ m. This was accomplished by dissolving 1 g of dye A in 20g of acetone. This was added to 30g of a mixture of; 10g of ethyl cellulose, 80g of toluene and 20g ethanol, and coated at 25 ⁇ m wet thickness, thus leaving a dry layer of cyan dye in an ethyl cellulose binder.
- VYNS poly(vinylidene chloride-vinyl acetate)copolymer
- the optical density of the transferred dots varied in a continuous manner from over 1.0 down to zero as the density of the interposed filter was progressively increased to 1.0. It was also found that the dot diameter varied from 35 ⁇ m for the most optically dense dots to under 20 ⁇ m for the least dense dots. Thus the density of transferred dye and the dot size may be continuously variable with laser intensity.
- a thermal imaging device was constructed as described in Example 1 except that the cadmium sulphide layer was deposited by using an 8 inch (20cm) diameter cadmium sulphide target that was doped with 175 ppm of copper and was bonded to a copper backing plate. This target was r.f. magnetron sputtered at 500W for 54 minutes whilst the glass microscope slide and I.T.O. layer were maintained at a temperature of 285 ⁇ 10°C. The top electrode of aluminium and wear layer of alumina were deposited as described in Example 1.
- the illuminated conductivity of the thermal imaging device was approximately 0.8 S/cm and the photosensitive ratio was approximately 4.4 x 106.
- This device was illuminated by means of a Casio LCS 300 liquid crystal shutter. The illumination to the shutter was provided by a 150W tungsten halogen lamp source and transmitted by means of Pilkington Glass Co. 60mm x 1mm linear fibre optic array.
- a Mitsubishi TLP OHP-11 cyan donor sheet and transparency receptor were pressed by means of a sprung copper plate to the thermal imaging device and a voltage of 21V was applied between the I.T.O. and aluminium electrodes for 1.15 seconds while the shutter was transmitting light in the on condition.
- thermal imaging device may be usefully addressed by a liquid crystal shutter, for the purpose of forming a thermally derived image.
- a thermal imaging device was constructed as described in Example 6, except for the top aluminium electrode and alumina wear resistant layer.
- the top electrode was titanium, deposited by r.f. magnetron sputtering an 8 inch titanium target at 500W for 20 minutes in an argon atmosphere at 10 ⁇ m of mercury pressure.
- the substrate temperature was initially at ambient temperature but was subsequently allowed to increase during deposition. This resulted in the deposition of a titanium layer of approximately 500 nm thickness upon the cadmium sulphide/copper layer.
- the argon pressure was then reduced to 9 ⁇ m of mercury before introduction of nitrogen to the sputtering chamber until a total pressure of 10 ⁇ m of mercury was again obtained, i.e., a 10% nitrogen 90% argon atmosphere.
- the titanium target was r.f. magnetron sputtered in this atmosphere for one hour with 600W applied to the target and 100W to the substrate. This resulted in a titanium nitride layer upon the thermal imaging device which was approximately 150 nm thick.
- the abrasion resistance of the titanium nitride wear layer was demonstrated by means of an oscillating arm wear tester.
- a 5mm diameter ceramic ball was placed in contact with the wear resistant (titanium nitride) layer on the thermal imaging device and subjected to a downward force of 60 gm wt.
- An oscillating mechanical arm then caused the ball to run back and forth across the layer.
- a light detection system caused the arm to stop.
- the number of passes was recorded on a mechanical counter. It was found that less than 10 passes were required to wear through a thermal imaging device having only an aluminium top electrode and no wear layer. An average of 20 passes were required to wear through an imaging device having only a titanium top electrode and no wear layer. However, it was found that over 1,000 passes were required to wear through the thermal imaging device containing a titanium nitride abrasion resistant layer as described in this Example.
- a thermal imaging device was constructed as described in Example 6. This device was then addressed by a helium-neon laser operating at 633 nm wavelength. The laser exhibited a power of 2mW at the thermal imaging device, focused to 15 ⁇ m at the 1/e2 points and scanned by the device at 0.6m/s in an otherwise dark room.
- This same device was then illuminated by a tungsten filament, white light source and the intensity of illumination adjusted to obtain a device conductivity of approximately 5 ⁇ S/cm. This corresponded to a background power dissipation of approximately 1W/sq.cm and had the effect of generating carriers in the photoconductor and raising the device temperature somewhat above ambient.
- a tungsten filament, white light source was then illuminated by a tungsten filament, white light source and the intensity of illumination adjusted to obtain a device conductivity of approximately 5 ⁇ S/cm. This corresponded to a background power dissipation of approximately 1W/sq.cm and had the effect of generating carriers in the photoconductor and raising the device temperature somewhat above ambient.
- the previously described laser spot was scanned over the thermal imaging device it was found that 100 ⁇ m wide lines of the Mitsubishi TLP OHP-11 thermal transfer media were transferred at a faster scanning speed of 6m/s with the same 12V applied between the electrodes of the thermal imaging device, thus illustrating the advantage of using
- a thermal imaging device was constructed on a borosilicate glass microscope slide as follows.
- a 90% indium oxide 10% tin oxide, 8 inch (20 cm) diameter target was r.f. sputtered at 400W for 30 minutes in 1.5 x 10 ⁇ 3% oxygen/99.9985% argon atmosphere, at a total pressure of 7 microns of mercury, such that an indium tin oxide (I.T.O.) layer was deposited onto the glass microscope slide.
- I.T.O. indium tin oxide
- the glass slide was maintained at a temperature of 160 ⁇ 10°C.
- the I.T.O. layer was approximately 450 nm thick and exhibited a sheet resistivity of approximately 30 ohms/square and greater than 90% light transparency at visible and near infrared wavelengths.
- the glass slide, I.T.O. and CdS:Cu layers were allowed to cool below 150°C and a portion of the CdS:Cu layer masked before a titanium layer was deposited on the CdS:Cu layer by r.f. magnetron sputtering an 8 inch diameter titanium target at 300W for 60 minutes, resulting in a film that was approximately 0.5 ⁇ m thick.
- the sputtering chamber was then evacuated and 10% nitrogen/90% argon gas introduced into the sputtering chamber at a total pressure of 10 microns of mercury.
- the titanium target was sputtered at 600W with a bias of 100W on the substrate electrode for 60 minutes.
- a laser scanning system consisting of a galvanometer driven mirror and a lens providing a focussed 633nm He-Ne laser spot of 25 ⁇ m diameter at the 1/e2 points which scanned over the thermal imaging device at a speed of 2.5cm/sec.
- a suitable voltage was applied to the thermal imaging device which was then exposed to a series of laser scan lines spaced at 42 ⁇ m (600 d.p.i.) whilst sublimation dye donor and receptor sheets, commercially available from the Dai Nippon Printing Company, were held in intimate thermal contact with the titanium nitride layer of the thermal imaging device. This resulted in an area of dye transferred to the receptor sheet, the reflected optical density of which was continuously variable with the voltage, see Figure 5.
- the transferred dye may exhibit a gradation of colour density dependent upon the voltage applied to the thermal imaging device, i.e., the thermal imaging device can act as a continuous tone type imaging device when addressing such media.
- a further series of laser scan lines were made at a line separation of 80 ⁇ m and the resulting written lines observed to be approximately 40 ⁇ m wide indicating that about 600 d.p.i. was the most suitable addressability for the system.
- the lines were approximately 30 ⁇ m wide indicating that an addressability of about 800 to 1000 d.p.i. would be suitable, thereby explicitly demonstrating the high resolution capability of the thermal imaging device.
- a thermal imaging device was constructed on a borosilicate glass microscope slide as follows.
- the glass slide was cleaned and dipped in a solution containing 1 drop of 'Glymo' (Glycidyloxypropyltrimethoxy silane commercially available from Dynamit Nobel (UK) Ltd.) to 75 cl of isopropyl alcohol.
- a solution of 50% polyimide PIQ13 (commercially available from the Hitachi Chemical Company Ltd.) in N-methyl-2-pyrollidone was spin coated on the glass slide at 3000 r.p.m.
- the glass slide had been previously masked so that the coating covered only half of the glass slide.
- the coated slide was then baked at 100°C for 1 hour, then at 200°C for 1 hour, and finally at 350°C for 1 hour and then left to cool.
- Thermal imaging devices were deposited on both the uncoated and polyimide coated portions of the slide in the manner described in Example 9, except that the cadmium sulphide layer was deposited in a sputtering gas atmosphere of 99.5% argon 0.5% hydrogen sulphide, i.e., a slight increase in sulphur content.
- the thermal imaging devices were addressed by the exposure system described in Example 9 and the transferred dye density measured as a function of the applied voltage, for the device deposited on polyimide and for the device deposited directly upon the glass substrate. The performance comparison is presented graphically in Figure 6, where it can be seen that the transferred dye was denser at a given voltage for the thermal imaging devices deposited upon the polyimide layer.
- the transferred dye density would decrease at a given printhead voltage with increased scanning speed of the laser spot, because of the reduced energy supplied per pixel. Therefore the density voltage characteristics of a thermal imaging device deposited upon a glass substrate could be achieved at a faster scan rate by a similar device deposited upon a polyimide coated glass substrate. Hence the use of a polyimide coated substrate reduces the time taken to write an image by a given thermal device.
- a thermal imaging device was constructed on a borosilicate glass substrate measuring 100mm by 15mm and 1mm thick.
- the device was fabricated in the same manner as described in Example 9 except that a mask was interposed between the titanium target and the CdS layer in intimate contact with the CdS layer.
- This mask was designed so that a titanium electrode was deposited on the Cds layer that was 92mm long and 2mm wide. Titanium and titanium nitride was then deposited on this area as described in Example 9. Away from this electrode, part of the cadmium sulphide layer was removed along the full length of the substrate by immersing the part to be removed in concentrated nitric acid in order to expose the I.T.O. layer underneath.
- a printer was constructed that contained a housing for the above described thermal imaging device and made two electrical contacts to the thermal imaging device; one to the titanium nitride electrode and one to the full length of the indium tin oxide layer. Facility was made to allow sublimation dye donor ribbon and receptor papers, commercially available from the Dai Nippon Printing Company, to be placed in intimate contact with the thermal imaging device. A rubber roller (95mm in length and 25mm in diameter) was pressed onto the imaging media to ensure good thermal contact between the imaging media and the thermal imaging device (a pressure of approximately 0.7kg/cm2).
- a 3mW He-Ne laser spot of diameter 25 ⁇ m at the 1/e2 points was focussed on the CdS layer and caused to scan 86mm along it directly under both the titanium/titanium nitride electrical contact and the area of rubber roller pressure on the imaging media.
- the voltage between the electrodes was varied between 4.25v and 10v such that pixels of continuously variable, reflected image density, between 0 and 1.3 were written in accordance with image data supplied from a computer memory. Each pixel was written every 3.2ms corresponding to a pixel width 42 ⁇ m.
- the rubber roller was rotated by a stepper motor to move the donor and receptor sheets a distance of 42 ⁇ m.
- the laser then re-scanned the same portion of the imaging device and a further line of new image data was written. This was repeated 2000 times to produce single colour image separation of 2048 x 2000 pixels (8.6cm x 8.4cm).
- the receptor was then rewound, re-registered and the donor sheet replaced by a donor sheet of the next colour separation and written in the same manner as described for the first separation. This was repeated for a third separation to generate a full colour image of 600 d.p.i. resolution in continuous tone.
- a thermal imaging device was constructed on a borosilicate glass microscope slide in the manner described in Example 9 except that the cadmium sulphide layer was deposited in a sputtering gas atmosphere of 99.5% argon 0.5% hydrogen sulphide. This thermal imaging device was then exposed to the laser scanning system described in Example 9 except that a different lens was used providing a 60 ⁇ m diameter spot at the 1/e2 points, and was focussed on the cadmium sulphide layer. A potential of 8V was applied to the thermal imaging device which was then exposed to a series of laser scan lines, scanning at 2.7cm/sec and at a spacing of 42 ⁇ m. This caused a transfer of dye, of density 0.34, from sublimation dye donor ribbon to the receptor sheet, both of which are commercially available from Dai Nippon Printing Company, which had again been held in intimate thermal contact with the thermal imaging device.
- the experiment was repeated with a cylindrical lens positioned in the laser scanning system to cause the 60 ⁇ m diameter laser spot to become a laser line of 5mm length and approximately 60 ⁇ m wide.
- the cylindrical lens was orientated so that deflection of the mirror caused the laser line to scan in a direction perpendicular to its 5mm length. This line was scanned at 2.7 cm/second with only one pass of the line across the thermal imaging device. Holding the sublimation dye transfer media in intimate thermal contact with the thermal imaging device, to which a potential of 35v was applied, a 5mm wide transfer of dye was effected, of density 0.32.
- GLYMO (Dynamit Nobel (UK) Ltd.) is a registered trade name.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electronic Switches (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Fax Reproducing Arrangements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB898918622A GB8918622D0 (en) | 1989-08-15 | 1989-08-15 | Thermal imaging system |
GB8918622 | 1989-08-15 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0413569A2 EP0413569A2 (en) | 1991-02-20 |
EP0413569A3 EP0413569A3 (en) | 1991-10-16 |
EP0413569B1 true EP0413569B1 (en) | 1994-12-07 |
Family
ID=10661671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90308954A Expired - Lifetime EP0413569B1 (en) | 1989-08-15 | 1990-08-15 | Thermal imaging system |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0413569B1 (ko) |
JP (1) | JPH03197053A (ko) |
KR (1) | KR910005103A (ko) |
DE (1) | DE69014768T2 (ko) |
GB (1) | GB8918622D0 (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2798959A (en) * | 1953-10-01 | 1957-07-09 | Rca Corp | Photoconductive thermography |
US3673594A (en) * | 1970-03-16 | 1972-06-27 | Ibm | Photocopying device |
DE2745696A1 (de) * | 1976-10-12 | 1978-04-13 | Eastman Kodak Co | Waerme-entwickelbares elektrophotographisches aufzeichnungsmaterial |
DE2740835C2 (de) * | 1977-09-10 | 1985-06-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Thermoplastischer Aufzeichnungsträger für Deformationsmuster |
US4470055A (en) * | 1982-03-10 | 1984-09-04 | Fuji Xerox Co., Ltd. | Photo-thermal ink transferring device |
-
1989
- 1989-08-15 GB GB898918622A patent/GB8918622D0/en active Pending
-
1990
- 1990-08-14 KR KR1019900012483A patent/KR910005103A/ko not_active Application Discontinuation
- 1990-08-14 JP JP2215693A patent/JPH03197053A/ja active Pending
- 1990-08-15 EP EP90308954A patent/EP0413569B1/en not_active Expired - Lifetime
- 1990-08-15 DE DE69014768T patent/DE69014768T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03197053A (ja) | 1991-08-28 |
GB8918622D0 (en) | 1989-09-27 |
DE69014768D1 (de) | 1995-01-19 |
EP0413569A3 (en) | 1991-10-16 |
DE69014768T2 (de) | 1995-07-13 |
EP0413569A2 (en) | 1991-02-20 |
KR910005103A (ko) | 1991-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3678852A (en) | Printing and copying employing materials with surface variations | |
JP3053110B2 (ja) | 熱プリンタ | |
US5262800A (en) | Thermal imaging system | |
US4915519A (en) | Direct negative from resistive ribbon | |
US5486857A (en) | Thermal imaging system | |
EP0200488A2 (en) | Recording medium for recording apparatus such as printing apparatus | |
US4897669A (en) | Thermal transfer recording media | |
EP0413569B1 (en) | Thermal imaging system | |
US4415903A (en) | Electric ink transfer recording method | |
US4836106A (en) | Direct offset master by resistive thermal printing | |
JP5739625B2 (ja) | 画像形成システム | |
EP1104700B1 (en) | Thermal printhead | |
JP2833476B2 (ja) | 熱印字記録装置 | |
US4609926A (en) | Ribbon transfer color-on-demand resistive ribbon printing | |
US4853707A (en) | Non-impact electrothermic recording method | |
US5762772A (en) | Method and apparatus for image formation | |
US4967206A (en) | Print storage medium | |
US6063730A (en) | Reusable donor layer containing dye wells for continuous tone thermal printing | |
EP0789269A2 (en) | An opto-thermal conversion recording apparatus | |
JP3246228B2 (ja) | 熱印字記録装置 | |
JPH0414480A (ja) | 光熱変換型記録方法及び記録装置 | |
Pennington et al. | Resistive ribbon thermal transfer printing: A historical review and introduction to a new printing technology | |
JPH0280258A (ja) | 画像形成素子 | |
EP0415387A1 (en) | Method and device for regenerating an ink sheet | |
JP2000229430A (ja) | 熱転写プリンタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): BE DE FR GB IT |
|
17P | Request for examination filed |
Effective date: 19901224 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): BE DE FR GB IT |
|
17Q | First examination report despatched |
Effective date: 19940131 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
ITF | It: translation for a ep patent filed | ||
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): BE DE FR GB IT |
|
REF | Corresponds to: |
Ref document number: 69014768 Country of ref document: DE Date of ref document: 19950119 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19960715 Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19960716 Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19960724 Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19960726 Year of fee payment: 7 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19970815 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19970831 |
|
BERE | Be: lapsed |
Owner name: MINNESOTA MINING AND MFG CY Effective date: 19970831 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19970815 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19980430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19980501 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050815 |