EP0399524B1 - Structure de réalisation de circuits et composants appliquée aux hyperfréquences - Google Patents
Structure de réalisation de circuits et composants appliquée aux hyperfréquences Download PDFInfo
- Publication number
- EP0399524B1 EP0399524B1 EP90109889A EP90109889A EP0399524B1 EP 0399524 B1 EP0399524 B1 EP 0399524B1 EP 90109889 A EP90109889 A EP 90109889A EP 90109889 A EP90109889 A EP 90109889A EP 0399524 B1 EP0399524 B1 EP 0399524B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- antenna structure
- structure according
- mechanical
- dielectric
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
Definitions
- the invention relates to a structure for producing circuits and components applied to microwave frequencies.
- the means used in one case as in the other are defined by the general radio-electric characteristics required: frequency bands, necessary powers, admissible loss levels, complexity levels of the connectors, mission in the broad sense of the term, as well as by a non-specifically radio set of other criteria involving parameters such as the mass, the volume of the circuits or even the admissible temperature range that the technologies used will have to withstand. All of these additional constraints are again governed by the "mission in the broad sense” aspect; the precise choice of a technology having to integrate radio criteria as well as mechanical, structural and thermal criteria.
- radiant elements have appeared over the past ten years that are remarkable in terms of their simplicity of construction and their characteristics of lightness and ability to be shaped: These are printed antennas, the principle of which uses a resonant element. etched on a dielectric support, the assembly being located on a ground plane. Again, such concepts make it possible to offer very competitive solutions in terms of volume, compactness and mass.
- the dielectric substrates must also have radioelectric performances whose values depend on the physical dimensions.
- the region between the dielectric planes is filled either with air, or with a material having a dielectric constant close to that of air (honeycomb, plastic or rubber foam, etc.).
- the mechanical parameters on the one hand, and radioelectric parameters on the other hand cannot be optimized separately and individually, because the rigidity and the dielectric losses depend on the materials used for the different layers, as well as on their physical dimensions and of their relative provision.
- British patent application GB-A-2 194 101 in the name of MATSUSHITA describes a planar antenna the structure of which is produced by stacking successive planes comprising conductive patterns on dielectric substrate, including a supply network printed on a first dielectric substrate , which supplies by electromagnetic coupling the radiating elements of the "patch" type printed on a second dielectric substrate, these two planes being separated from a ground plane and separated from each other by perforated dielectric spacers.
- this antenna is constituted by a plurality of dielectric layers, at least three of which are provided with conductive elements (ground plane, radiating elements, power supplies, etc.), and the dielectric layers are assembled by means of spacers.
- the mechanical rigidity of the assembly comes only from the dielectric substrates, the spacers being preferably perforated and made of a foam material in order to obtain a dielectric constant as close to that of air as possible.
- the dielectric spacers are perforated so as not to present a dielectric constant appreciable only in regions where the electric fields will be weak (far from resonators and radiating elements).
- the dielectric substrates must also have radioelectric performances whose values depend on the physical dimensions.
- the region between the dielectric planes is therefore filled either with air, or with a material having a dielectric constant close to that of air (honeycomb, plastic or rubber foam,. ..).
- the mechanical parameters on the one hand, and radioelectric parameters on the other hand cannot be optimized separately and individually.
- the object of the invention is to propose an embodiment of substrates with variable permittivity.
- said insulating medium (27) is a dielectric material, which can for example be a solid or a gas.
- said insulating medium (27) is a vacuum.
- the advantage of the invention results from its versatility and its considerable weight gain compared to more conventional solutions. Its simplicity of making dielectrics with any constant and its low mass make this solution very attractive for space uses.
- the main design problem is to maintain a conductive element 10 at a precise distance from a ground plane 11 (from two planes respectively massive).
- the medium 12 thus delimited by the conductive element 10, the ground plane (s) 11 and a characteristic distance d chosen during the design as a function of its influence on the phenomena of interaction between the electromagnetic field and the matter contained in this medium, must present the electrical characteristics ⁇ r (dielectric constant) and tg ⁇ (loss factor) chosen by the designer.
- each of these structures is formed for example of a "carbon skin sandwich 18-" honeycomb "made of aluminum 19-carbon skin 20, the carbon skin 20 located inwards being metallized 21.
- the material dielectric 15 can be produced in "honeycomb", in organic foam or by dielectric spacers for example.
- the dielectric material 15 is chosen for its radioelectric performance, which allows a great latitude of choice. We can finally obtain a powerful solution from a radioelectric point of view. On the other hand, the addition of mechanical elements (stiffening of the ground planes, maintenance of the central conductor and of the dielectric medium) leads to poor mechanical performance. This type of solution is therefore well suited for small devices (surfaces typically less than 0.5 m2) and / or for devices where the ground planes are used to provide additional mechanical functions (maintenance of radiating elements of type horns or propellers for example).
- the invention relates to a structure in which the electrical and mechanical functions are globally integrated, but locally dissociated.
- the structure according to the invention comprises a mechanical structure 26 forming an enclosure 33 in which can be disposed a block 27 of dielectric material.
- a layer of dielectric material 28, (29) On either side of the assembly thus formed is disposed a layer of dielectric material 28, (29), the first 28 supporting the conductive element 30 disposed above the dielectric pad 27, the other 29 supporting the plane of mass 31 metallic.
- a bonding layer 32 is disposed between the mechanical structure and each of the two dielectric layers.
- the medium in the vicinity of the conductive element consists of a dielectric material whose selection criteria are mainly electrical ( ⁇ r , tg ⁇ ) and which does not participate in mechanical rigidity from the whole.
- a mechanical structure makes it possible to contain the preceding dielectric material and to guarantee the overall mechanical performance of the device.
- the most suitable materials are PTFE (polytetrafluoroethylene) matrices with glass reinforcement.
- PTFE polytetrafluoroethylene
- the epoxide and polyimide matrices although they make it possible to achieve superior mechanical properties, bring up the values of ⁇ r and tg ⁇ .
- the dielectric material is chosen for its radioelectric properties only.
- the material constituting the structure is mainly chosen for its mechanical characteristics.
- the gain can therefore be a factor of 4 on the R.F. losses and a factor of around 2.5 on the mass.
- the most suitable architectures are obtained by bonding a very aerated organic material (foam, honeycomb) between the substrates supporting the elements. radiant and the ground plane by means of glue films or layers of composite materials.
Landscapes
- Waveguide Aerials (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8906783 | 1989-05-24 | ||
FR8906783A FR2647599B1 (fr) | 1989-05-24 | 1989-05-24 | Structure de realisation de circuits et composants appliquee aux hyperfrequences |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0399524A1 EP0399524A1 (fr) | 1990-11-28 |
EP0399524B1 true EP0399524B1 (fr) | 1995-01-25 |
Family
ID=9381957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90109889A Expired - Lifetime EP0399524B1 (fr) | 1989-05-24 | 1990-05-23 | Structure de réalisation de circuits et composants appliquée aux hyperfréquences |
Country Status (6)
Country | Link |
---|---|
US (1) | US5227749A (ja) |
EP (1) | EP0399524B1 (ja) |
JP (1) | JPH0329401A (ja) |
CA (1) | CA2017352A1 (ja) |
DE (1) | DE69016261D1 (ja) |
FR (1) | FR2647599B1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0519085B1 (en) * | 1990-12-26 | 1996-10-16 | TDK Corporation | High-frequency device |
US5443278A (en) * | 1992-12-22 | 1995-08-22 | Berto; Joseph J. | Snowmobile ski liner |
JPH0750508A (ja) * | 1993-08-06 | 1995-02-21 | Fujitsu Ltd | アンテナモジュール |
FR2711845B1 (fr) * | 1993-10-28 | 1995-11-24 | France Telecom | Antenne plane et procédé de réalisation d'une telle antenne. |
US5559521A (en) * | 1994-12-08 | 1996-09-24 | Lucent Technologies Inc. | Antennas with means for blocking current in ground planes |
US5652595A (en) * | 1995-05-04 | 1997-07-29 | Motorola, Inc. | Patch antenna including reactive loading |
DE19615497A1 (de) * | 1996-03-16 | 1997-09-18 | Pates Tech Patentverwertung | Planarer Strahler |
US6271792B1 (en) * | 1996-07-26 | 2001-08-07 | The Whitaker Corp. | Low cost reduced-loss printed patch planar array antenna |
EP0922942A1 (de) | 1997-12-10 | 1999-06-16 | Endress + Hauser GmbH + Co. | Mit Mikrowellen arbeitendes Füllstandsmessgerät mit einem Einsatz aus einem Dielektrikum und Verfahren zur Herstellung des Dielektrikums |
US6185354B1 (en) * | 1998-05-15 | 2001-02-06 | Motorola, Inc. | Printed circuit board having integral waveguide |
US6131269A (en) * | 1998-05-18 | 2000-10-17 | Trw Inc. | Circuit isolation technique for RF and millimeter-wave modules |
US6211824B1 (en) * | 1999-05-06 | 2001-04-03 | Raytheon Company | Microstrip patch antenna |
US6409650B2 (en) | 1999-08-25 | 2002-06-25 | Terralog Technologies Usa, Inc. | Method for biosolid disposal and methane generation |
DE602005013229D1 (de) * | 2005-09-28 | 2009-04-23 | Siemens Milltronics Proc Instr | Galvanische Trennungsvorrichtung für eine ebene Schaltung |
US7804385B2 (en) * | 2007-04-20 | 2010-09-28 | Rs Microwave Company | Composite resonator for use in tunable or fixed filters |
WO2009049191A2 (en) * | 2007-10-11 | 2009-04-16 | Raytheon Company | Patch antenna |
US8525729B1 (en) * | 2009-01-09 | 2013-09-03 | Lockheed Martin Corporation | Antenna tiles with ground cavities integrated into support structure |
US10601137B2 (en) | 2015-10-28 | 2020-03-24 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10374315B2 (en) * | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
GB2575946B (en) | 2017-06-07 | 2022-12-14 | Rogers Corp | Dielectric resonator antenna system |
US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
KR20210095632A (ko) | 2018-12-04 | 2021-08-02 | 로저스코포레이션 | 유전체 전자기 구조 및 이의 제조방법 |
US10700440B1 (en) | 2019-01-25 | 2020-06-30 | Corning Incorporated | Antenna stack |
US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2721312A (en) * | 1951-06-30 | 1955-10-18 | Itt | Microwave cable |
US2919441A (en) * | 1955-04-15 | 1959-12-29 | Chu Lan Jen | Radio-frequency-energy transmission line and antenna |
US3534299A (en) * | 1968-11-22 | 1970-10-13 | Bell Telephone Labor Inc | Miniature microwave isolator for strip lines |
US3696433A (en) * | 1970-07-17 | 1972-10-03 | Teledyne Ryan Aeronautical Co | Resonant slot antenna structure |
US3936864A (en) * | 1973-05-18 | 1976-02-03 | Raytheon Company | Microwave transistor package |
US3868594A (en) * | 1974-01-07 | 1975-02-25 | Raytheon Co | Stripline solid state microwave oscillator with half wavelength capacitive resonator |
US3908185A (en) * | 1974-03-06 | 1975-09-23 | Rca Corp | High frequency semiconductor device having improved metallized patterns |
JPS566502A (en) * | 1979-06-29 | 1981-01-23 | Nippon Telegr & Teleph Corp <Ntt> | Microstrip line |
US4623893A (en) * | 1983-12-06 | 1986-11-18 | State Of Israel, Ministry Of Defense, Rafael Armament & Development Authority | Microstrip antenna and antenna array |
US4651159A (en) * | 1984-02-13 | 1987-03-17 | University Of Queensland | Microstrip antenna |
US4829309A (en) * | 1986-08-14 | 1989-05-09 | Matsushita Electric Works, Ltd. | Planar antenna |
-
1989
- 1989-05-24 FR FR8906783A patent/FR2647599B1/fr not_active Expired - Lifetime
-
1990
- 1990-05-23 CA CA002017352A patent/CA2017352A1/fr not_active Abandoned
- 1990-05-23 DE DE69016261T patent/DE69016261D1/de not_active Expired - Lifetime
- 1990-05-23 EP EP90109889A patent/EP0399524B1/fr not_active Expired - Lifetime
- 1990-05-24 JP JP2135143A patent/JPH0329401A/ja active Pending
- 1990-05-24 US US07/527,903 patent/US5227749A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2017352A1 (fr) | 1990-11-24 |
DE69016261D1 (de) | 1995-03-09 |
FR2647599B1 (fr) | 1991-11-29 |
US5227749A (en) | 1993-07-13 |
JPH0329401A (ja) | 1991-02-07 |
FR2647599A1 (fr) | 1990-11-30 |
EP0399524A1 (fr) | 1990-11-28 |
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