EP0394638A2 - Méthode pour attaquer des polyimides et structures passivées en résultant - Google Patents

Méthode pour attaquer des polyimides et structures passivées en résultant Download PDF

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Publication number
EP0394638A2
EP0394638A2 EP90103546A EP90103546A EP0394638A2 EP 0394638 A2 EP0394638 A2 EP 0394638A2 EP 90103546 A EP90103546 A EP 90103546A EP 90103546 A EP90103546 A EP 90103546A EP 0394638 A2 EP0394638 A2 EP 0394638A2
Authority
EP
European Patent Office
Prior art keywords
polyimide
weight
etching
metallization
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP90103546A
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German (de)
English (en)
Other versions
EP0394638A3 (fr
EP0394638B1 (fr
Inventor
Thomas E. Kindl
Paul G. Rickerl
David J. Russel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
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Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0394638A2 publication Critical patent/EP0394638A2/fr
Publication of EP0394638A3 publication Critical patent/EP0394638A3/fr
Application granted granted Critical
Publication of EP0394638B1 publication Critical patent/EP0394638B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Definitions

  • TAB tape automatic bonding
  • the polyimide would be provided with metal­lized lines thereon and the polyimide substrate and metallized lines would be covered with some type of photoresist material which was patterned to reveal the portions of the polyimide which is to be removed.
  • photoresist material which was patterned to reveal the portions of the polyimide which is to be removed.
  • Several different types of photoresist have been used for this patterning but they have suffered from certain serious drawbacks.
  • a photoresist must be strong enough to resist the etchant used for the polyimide material which is a concentrated potassium hydroxide at temperatures in excess of 70 or 80°C.
  • the photo­resist must be sufficiently resistant during the etching process to prevent the potassium hydroxide from attacking the polyimide except at the exposed areas.
  • the photoresists that have had this property have conventionally been those which required removal by chlorinated solvents which require special handling as opposed to those that can be removed by nonchlorinated solvents. Further, while these photoresist materials that have been used have held up reasonably well during the etching process, they have not had the adherent properties necessary to remain in place after the etching in a bonded relationship over the sub­strate and metallization thereon to provide the necessary passivation. Hence, after the etching has been performed, it has been necessary to then strip the remaining photoresist and perform a separate step of applying passivating material to the substrate with the lines thereon. This problem is further exacerbated if the exposed or extending copper lines have to be further processed such as by gold plating which entails the necessary surface preparation followed by the plating operation.
  • TAB tape automated bonding
  • a process is provided which allows photoimageable material to be utilized as a mask to reveal the desired pattern to be etched on a substrate and the same material to be used as a mask during the etching and also following the etching as a passivation material overlying the remaining polyimide substrate with the metallization layers thereon.
  • Figs. 1 through 10 thereby show perspective views somewhat diagrammatic depicting the various steps in the method of this invention of selectively etching and passivating a polyimide substrate with copper metallization thereon and plating gold on this exposed copper.
  • the starting material is a com­posite structure of a sheet of polyimide material 10 which preferably is a strip of material such as mater­ial sold under the trade mark Kapton by E.I. DuPont & Co.
  • the polyimide material 10 has disposed on at least one side and preferably both sides, a thin seed layer comprised of a layer of chromium 12 deposited directly on the polyimide layer 10 and a layer of copper 14 deposited on top of the chromium.
  • These two layers, 12 and 14 together are no more than a few thousand angstroms thick and are applied in a conventional manner such as vacuum sputtering and do not per se constitute a portion of the invention.
  • a layer of photoresist material 16 such as a negative photoresist sold by Dynachem of Tustin, California (a Division of Morton Thiokol) as Laminar Brand aqueous resist type UF 38 ⁇ m (1.5 mil) is applied to the surface thereof and imagewise exposed and developed in a conventional manner such as in sodium carbonate to reveal the underlying copper layer 14, the revealed pattern having channels 18 disposed on both sides where the metallization is to be applied.
  • This structure is shown in Fig. 2.
  • Fig. 4 which includes a series of copper lines 20 on each side of the substrate 10, the copper lines being deposited on the thin seed layer of chromium and copper 12, 14.
  • the exposed seed layer of copper 14 and chromium 12 is then removed by a flash etch in two steps, for example the copper being removed in an etchant of sodium persulfate and the chromium being removed in an etchant of alkaline potassium permanganate. This will result in the structure shown in Fig. 5.
  • a layer of photoimageable epoxy resin 22 is applied over both sides of the substrate 10 with the metal­lization 20 thereon as shown in Fig. 6.
  • This photo­imageable material 22 will serve both as a mask to protect the underlying polyimide 10 for selective etching as will be described presently and also serve as a passivation layer overlying the remaining metal­lization after the etching has been completed.
  • the preferred epoxy material for use as the photoimageable photo mask is shown and described in application Serial No. 318,536, filed March 3, 1989, entitled Improved Composition for Photo Imaging.
  • this material is extremely well suited for this particular purpose and serves excellently both as a masking material for the etchant and a passivation material afterwards and also if plating is done serves as a protective coating during the preparation for and plating operations such as gold plating.
  • the preferred material is an epoxy resin which consists essentially from about 10% to about 80% by weight of a polyol resin which is a condensation product of epi­chlorohydrin and bisphenol A having a molecular weight of between 40,000 and 130,000 and between 20% and 90% by weight of epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight between about 4,000 and 10,000, and optionally, if flame retardancy is required, up to about 50% by weight of an epoxidized di-glycidyl ether of tetrabromo bisphenol A having a melting point of between about 90°C and 110°C and a molecular weight of between about 600 and 2500 and between about 0.1 to about 15 parts by weight of resin of a cationic photoinitiator capable of initiating polymerization of the epoxidized resin system upon exposure to radiation.
  • a polyol resin which is a condensation product of epi­chlorohydrin and bisphenol A having a mo
  • a suitable polyol resin which is a condensation product of epichlorohydrin and bisphenol A resin is sold under the Trade Mark PKHC by Union Carbide Corporation.
  • a suitable epoxidized octafunctional bisphenol A form­aldehyde novolak resin is sold under the Trade Mark EpiRez SU8 by High Tek Polymers, Inc.
  • a suitable epoxidized di-glycidal ether of tetrabromo bisphenol A is sold under the Trade Mark EpiRez 5183 by High Tek Polymers Corporation, Inc.
  • a suitable photoinitiator is a complex triaryl sulfonium hexifluoroantimonate salt sold by General Electric Co. sold under the Trade Mark UVE1014.
  • the material may also optionally contain up to about 10 parts by weight of a photosensitizer such as anthracene and perylene or their derivatives.
  • a photosensitizer such as anthracene and perylene or their derivatives.
  • the preferred resin is about 30% PKHC, about 45% EpiRez 5183 and about 25% SU-8 and about 5 parts by weight of UVE 1014 which is disclosed in said application Serial No. 318,536.
  • a surfactant such as FC 430 sold by 3M Corporation can be added in amounts up to 1 part per 100 by weight.
  • various dyes such as Malachite Green, Ethyl violet, and Rhodamine B can be used in amounts up to about 1 part per 100 weight.
  • the preferred process for applying the photoimageable material includes a surface treatment which includes a rinse in dilute aqueous HCl followed by a rinse in dilute aqueous carbonate followed by a benzotriazole rinse which will act to preserve the copper surface state.
  • a surface treatment which includes a rinse in dilute aqueous HCl followed by a rinse in dilute aqueous carbonate followed by a benzotriazole rinse which will act to preserve the copper surface state.
  • the resin material is spray applied, first on one side and then the other and then dried in an oven between 80° and 90°C for approxi­mately 6-7 minutes. The process is then repeated on the second side.
  • Material can be coated up to about 76 ⁇ m (3 mils) thick with preferred thickness being approximately 30 ⁇ m (1.2 mils).
  • the solvent is removed by baking for a suitable time and temperature, preferably 140°C for 30 minutes. The material is then ready to be masked and exposed to actinic radiation.
  • the exposure is conventional and can be done at an energy of about 750 to 1,000 mJ/cm2 per side.
  • the material is a negative acting resist and hence the areas which are exposed are polymerized and become the mask and the unexposed areas will be de­veloped and removed.
  • the areas to be removed are shown in Fig. 6 designated by referenced character 24 and the areas to remain after exposure and development are designated by the referenced character 26.
  • the material is then baked at a temperature and time to sufficiently remove solvent and activate material for developing.
  • Preferred temperature and time is about 140°C for about 30 minutes for the preferred thickness of about 30 ⁇ m (1.2 mils).
  • Any one of a number of types of developers can be used.
  • the pre­ferred developer is 100% butyrolactone with the part being immersed for sufficient time in the developer to fully develop the material, then in deionized water to rinse the part clean of developer.
  • the preferred develop and rinse conditions for the preferred thick­ness of about 30 ⁇ m (1.2 mils) are about 1 minute immersion in butyrolactone, followed by about 1 minute in butyrolactone spray, followed by about a 1 minute spray water rinse, followed by about 1 minute radiant heat or hot air dry.
  • both sides of the remaining material are blanket exposed to at least 1,000 mJ/cm2 preferably to 4,000 mJ/cm2, followed by a final cure at about 110° to 180°C preferably 150°C for 30 minutes.
  • This is the final cure of the material and results in a mask of material which is resistant to concentrated KOH which will be used to etch the polyimide material and also is a resistant material adhering firmly to both the copper lines and the polyimide material and resistant to attack by gold plating solutions.
  • the epoxy resin of this particular formula­tion is extremely resistant to the attack of both the potassium hydroxide and the sulfuric acid and remains firmly adherent to the polyimide substrate and the overlying metallization layer even after this very harsh and intrusive treatment, and the material remains on as a passivation layer when the polyimide has been etched to the structure shown in Fig. 8.
  • the etching is isotropic and provides some undercut.
  • the passivation layer is also useful in acting as a mask for a further gold plating operation in which the remaining seed layer 12 of chromium is stripped from the exposed surfaces of the copper layers 14, 20 and gold is plated thereon.
  • This particular structure is used to form a contact member for bonding to chips.
  • the gold plating is performed by first removing the chromium 12 from the exposed copper which can be done in potassium permanganate and dilute sodium hydroxide solution, the resulting structure which is shown in Fig. 9, is given a surface preparation treatment in oxalic acid and the surface is then prepared by immersing the piece in sodium persulfate followed by a water rinse followed by an immersion in 10% sulfuric acid followed by another water rinse. Gold is then plated in a conventional manner on the exposed copper lines as shown in Fig. 10. Conventional gold plating solutions can be employed. One solution and process utilized a dibasic potassium phosphate, citric acid, and potassium gold cyanide bath for electrolytic plating of gold.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
EP90103546A 1989-04-26 1990-02-23 Méthode pour attaquer des polyimides et structures passivées en résultant Expired - Lifetime EP0394638B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US343217 1989-04-26
US07/343,217 US4911786A (en) 1989-04-26 1989-04-26 Method of etching polyimides and resulting passivation structure

Publications (3)

Publication Number Publication Date
EP0394638A2 true EP0394638A2 (fr) 1990-10-31
EP0394638A3 EP0394638A3 (fr) 1992-07-15
EP0394638B1 EP0394638B1 (fr) 1997-07-30

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ID=23345176

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Application Number Title Priority Date Filing Date
EP90103546A Expired - Lifetime EP0394638B1 (fr) 1989-04-26 1990-02-23 Méthode pour attaquer des polyimides et structures passivées en résultant

Country Status (4)

Country Link
US (1) US4911786A (fr)
EP (1) EP0394638B1 (fr)
JP (1) JPH02302053A (fr)
DE (1) DE69031143T2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000067536A1 (fr) * 1999-04-30 2000-11-09 3M Innovative Properties Company Procede permettant de fabriquer des circuits souples
WO2001037050A1 (fr) * 1999-11-19 2001-05-25 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Utilisation de polyimide pour des couches adhesives, procede lithographique pour produire des microcomposants et procede pour produire un materiau composite

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300402A (en) * 1988-12-30 1994-04-05 International Business Machines Corporation Composition for photo imaging
US6210862B1 (en) 1989-03-03 2001-04-03 International Business Machines Corporation Composition for photoimaging
US5217849A (en) * 1989-08-28 1993-06-08 Sumitomo Metal Mining Company Limited Process for making a two-layer film carrier
US5066360A (en) * 1990-09-24 1991-11-19 International Business Machines Corp. Pad printing of resist over via holes
US5227008A (en) * 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
US5334487A (en) * 1992-07-23 1994-08-02 International Business Machines Corporation Method for forming a patterned layer on a substrate
US5350487A (en) * 1993-05-03 1994-09-27 Ameen Thomas J Method of etching polyimide
US5960306A (en) * 1995-12-15 1999-09-28 Motorola, Inc. Process for forming a semiconductor device
US5993945A (en) * 1996-05-30 1999-11-30 International Business Machines Corporation Process for high resolution photoimageable dielectric
US5879572A (en) * 1996-11-19 1999-03-09 Delco Electronics Corporation Method of protecting silicon wafers during wet chemical etching
US6022670A (en) * 1997-05-08 2000-02-08 International Business Machines Corporation Process for high resolution photoimageable dielectric
US6680440B1 (en) 1998-02-23 2004-01-20 International Business Machines Corporation Circuitized structures produced by the methods of electroless plating
US6066889A (en) * 1998-09-22 2000-05-23 International Business Machines Corporation Methods of selectively filling apertures
US6204456B1 (en) 1998-09-24 2001-03-20 International Business Machines Corporation Filling open through holes in a multilayer board
JP3846550B2 (ja) * 1999-03-16 2006-11-15 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6207350B1 (en) * 2000-01-18 2001-03-27 Headway Technologies, Inc. Corrosion inhibitor for NiCu for high performance writers
US9165821B2 (en) * 2013-12-23 2015-10-20 Infineon Technologies Ag Method for providing a self-aligned pad protection in a semiconductor device

Citations (2)

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Publication number Priority date Publication date Assignee Title
US4436583A (en) * 1981-12-21 1984-03-13 Hitachi, Ltd. Selective etching method of polyimide type resin film
JPS63122224A (ja) * 1986-11-12 1988-05-26 Nec Corp 薄膜混成集積回路

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US3833436A (en) * 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
US4426253A (en) * 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
US4523976A (en) * 1984-07-02 1985-06-18 Motorola, Inc. Method for forming semiconductor devices
US4606998A (en) * 1985-04-30 1986-08-19 International Business Machines Corporation Barrierless high-temperature lift-off process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4436583A (en) * 1981-12-21 1984-03-13 Hitachi, Ltd. Selective etching method of polyimide type resin film
JPS63122224A (ja) * 1986-11-12 1988-05-26 Nec Corp 薄膜混成集積回路

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 15, no. 9, February 1973, NEW YORK US page 2820; M.A. LOUKIANOFF: 'Etchant and Solvent for Cured Polyimides' *
PATENT ABSTRACTS OF JAPAN vol. 12, no. 369 (E-665)4 October 1988 & JP-A-63 122 224 ( NEC CORP. ) 26 May 1988 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000067536A1 (fr) * 1999-04-30 2000-11-09 3M Innovative Properties Company Procede permettant de fabriquer des circuits souples
US6177357B1 (en) * 1999-04-30 2001-01-23 3M Innovative Properties Company Method for making flexible circuits
WO2001037050A1 (fr) * 1999-11-19 2001-05-25 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Utilisation de polyimide pour des couches adhesives, procede lithographique pour produire des microcomposants et procede pour produire un materiau composite
US6746819B1 (en) 1999-11-19 2004-06-08 Institut Fur Mikrotechnik Mainz Gmbh Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material

Also Published As

Publication number Publication date
US4911786A (en) 1990-03-27
EP0394638A3 (fr) 1992-07-15
DE69031143D1 (de) 1997-09-04
DE69031143T2 (de) 1998-02-12
JPH0587978B2 (fr) 1993-12-20
JPH02302053A (ja) 1990-12-14
EP0394638B1 (fr) 1997-07-30

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