EP0389625A4 - Procede de realisation d'une jonction a diffusion par resistance. - Google Patents

Procede de realisation d'une jonction a diffusion par resistance.

Info

Publication number
EP0389625A4
EP0389625A4 EP19890902550 EP89902550A EP0389625A4 EP 0389625 A4 EP0389625 A4 EP 0389625A4 EP 19890902550 EP19890902550 EP 19890902550 EP 89902550 A EP89902550 A EP 89902550A EP 0389625 A4 EP0389625 A4 EP 0389625A4
Authority
EP
European Patent Office
Prior art keywords
insert material
junction
base metals
joined
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19890902550
Other languages
German (de)
English (en)
Other versions
EP0389625A1 (fr
Inventor
Kazuya Prod Techn Ins Kuriyama
Kanji Prod Techn Inst O Katada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4663988A external-priority patent/JPH0211265A/ja
Priority claimed from JP7519088A external-priority patent/JPH01249278A/ja
Priority claimed from JP63206593A external-priority patent/JPH0677829B2/ja
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Publication of EP0389625A4 publication Critical patent/EP0389625A4/fr
Publication of EP0389625A1 publication Critical patent/EP0389625A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/10—Spot welding; Stitch welding
    • B23K11/11—Spot welding
    • B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/29171—Chromium [Cr] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Procédé de réalisation d'une jonction à diffusion par résistance, pouvant être effectuée rapidement en utilisant un équipement simple sans exercer d'influences thermiques sur les métaux de base à relier et présentant une résistance élevée, obtenue par une diffusion suffisante d'un matériau rapporté situé entre les surfaces des métaux de base à relier. Le procédé consiste à placer un matériau rapporté entre les surfaces de jonction d'un ensemble de métaux de base à relier situés à proximité l'un de l'autre, à fondre le matériau rapporté entre les surfaces de jonction et à expulser le matériau rapporté excédentaire pour former une phase liquide à pellicule mince de matériau rapporté par la chaleur de résistance produite par l'application d'une tension sur les électrodes placées sur l'autre côté de chaque métal de base et par l'application d'une pression, et à diffuser le matériau rapporté au niveau des surfaces de jonction. Afin d'empêcher la production de chaleur par effet Joule de la part des électrodes, on dispose un matériau thermo-isolant électroconducteur entre au moins l'un des métaux de base et l'électrode correspondante. En outre, on mesure le déplacement pendant la jonction des métaux de base, pour réguler la pression et la quantité d'électricité appliquée par les électrodes en fonction de la valeur de déplacement mesurée.
EP89902550A 1988-02-29 1989-02-21 Procede de realisation d'une jonction a diffusion par resistance Withdrawn EP0389625A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP46639/88 1988-02-29
JP4663988A JPH0211265A (ja) 1988-02-29 1988-02-29 抵抗拡散接合法
JP7519088A JPH01249278A (ja) 1988-03-29 1988-03-29 抵抗拡散接合法
JP75190/88 1988-03-29
JP206593/88 1988-08-19
JP63206593A JPH0677829B2 (ja) 1988-08-19 1988-08-19 摺動部品の製造方法

Publications (2)

Publication Number Publication Date
EP0389625A4 true EP0389625A4 (fr) 1990-07-16
EP0389625A1 EP0389625A1 (fr) 1990-10-03

Family

ID=27292672

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89902550A Withdrawn EP0389625A1 (fr) 1988-02-29 1989-02-21 Procede de realisation d'une jonction a diffusion par resistance

Country Status (3)

Country Link
EP (1) EP0389625A1 (fr)
KR (1) KR900700230A (fr)
WO (1) WO1989007999A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4007292C1 (fr) * 1990-03-08 1991-06-27 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
DE19615841A1 (de) * 1996-04-20 1997-11-06 Bosch Gmbh Robert Verfahren zur Herstellung von Diffusionslötverbindungen
JP3740858B2 (ja) * 1997-09-16 2006-02-01 マツダ株式会社 接合金属部材及び該部材の接合方法
JP3812789B2 (ja) 1999-03-15 2006-08-23 マツダ株式会社 金属溶接方法及び金属接合構造
JP4540392B2 (ja) * 2003-06-02 2010-09-08 新日本製鐵株式会社 金属機械部品の液相拡散接合方法
JP5706193B2 (ja) * 2011-03-02 2015-04-22 株式会社タカコ 摺動部材の製造方法
DE102012212202A1 (de) * 2011-12-20 2013-06-20 Siemens Aktiengesellschaft Verfahren zum Verbinden von Werkstücken und Verbindungsvorrichtung
CN102554456B (zh) * 2012-02-24 2014-05-07 华北电力大学 一种钛铝基合金与钛合金添加非晶中间层的扩散焊接方法
CN103028828A (zh) * 2012-11-09 2013-04-10 江苏科技大学 基于局部焊件环境温度独立控制的扩散焊接装置和方法
CN105127535B (zh) * 2015-09-25 2017-11-14 广东小天才科技有限公司 一种潮敏器件的取焊和焊接方法
CN110465714A (zh) * 2019-07-24 2019-11-19 天津锦泰勤业精密电子有限公司 一种电池箱体连接件的焊接方法以及电池箱体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1341337A (en) * 1920-01-08 1920-05-25 Ohio Brass Co Method of uniting dissimilar metals
US3678570A (en) * 1971-04-01 1972-07-25 United Aircraft Corp Diffusion bonding utilizing transient liquid phase
US3769487A (en) * 1971-10-27 1973-10-30 Texas Instruments Inc Method for welding manganese alloys

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838851A (fr) * 1971-09-22 1973-06-07
JPS4870650A (fr) * 1971-12-27 1973-09-25
JPS537917B2 (fr) * 1973-02-05 1978-03-23
JPS5811304B2 (ja) * 1978-10-16 1983-03-02 本田技研工業株式会社 自動二輪車等のフレ−ム
JPS5662672A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Connection method of cu or cu alloy
JPS5722867A (en) * 1980-07-16 1982-02-05 Mitsubishi Heavy Ind Ltd Diffusion brazing method of steel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1341337A (en) * 1920-01-08 1920-05-25 Ohio Brass Co Method of uniting dissimilar metals
US3678570A (en) * 1971-04-01 1972-07-25 United Aircraft Corp Diffusion bonding utilizing transient liquid phase
US3769487A (en) * 1971-10-27 1973-10-30 Texas Instruments Inc Method for welding manganese alloys

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO8907999A1 *

Also Published As

Publication number Publication date
KR900700230A (ko) 1990-08-11
EP0389625A1 (fr) 1990-10-03
WO1989007999A1 (fr) 1989-09-08

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Legal Events

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Effective date: 19891020

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Effective date: 19920911