KR900700230A - 저항 확산 접합법 - Google Patents

저항 확산 접합법

Info

Publication number
KR900700230A
KR900700230A KR1019890701979A KR890701979A KR900700230A KR 900700230 A KR900700230 A KR 900700230A KR 1019890701979 A KR1019890701979 A KR 1019890701979A KR 890701979 A KR890701979 A KR 890701979A KR 900700230 A KR900700230 A KR 900700230A
Authority
KR
South Korea
Prior art keywords
bonding method
diffusion bonding
resistance diffusion
resistance
diffusion
Prior art date
Application number
KR1019890701979A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4663988A external-priority patent/JPH0211265A/ja
Priority claimed from JP7519088A external-priority patent/JPH01249278A/ja
Priority claimed from JP63206593A external-priority patent/JPH0677829B2/ja
Application filed filed Critical
Publication of KR900700230A publication Critical patent/KR900700230A/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/10—Spot welding; Stitch welding
    • B23K11/11—Spot welding
    • B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/29171—Chromium [Cr] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
KR1019890701979A 1988-02-29 1989-10-26 저항 확산 접합법 KR900700230A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4663988A JPH0211265A (ja) 1988-02-29 1988-02-29 抵抗拡散接合法
JP7519088A JPH01249278A (ja) 1988-03-29 1988-03-29 抵抗拡散接合法
JP63206593A JPH0677829B2 (ja) 1988-08-19 1988-08-19 摺動部品の製造方法
PCT/JP1989/000172 WO1989007999A1 (en) 1988-02-29 1989-02-21 Process for resistance diffusion junction

Publications (1)

Publication Number Publication Date
KR900700230A true KR900700230A (ko) 1990-08-11

Family

ID=27292672

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890701979A KR900700230A (ko) 1988-02-29 1989-10-26 저항 확산 접합법

Country Status (3)

Country Link
EP (1) EP0389625A1 (ko)
KR (1) KR900700230A (ko)
WO (1) WO1989007999A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100733524B1 (ko) * 2003-06-02 2007-06-29 신닛뽄세이테쯔 카부시키카이샤 금속 기계 부품의 액상 확산 접합 방법 및 금속 기계 부품

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4007292C1 (ko) * 1990-03-08 1991-06-27 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
DE19615841A1 (de) * 1996-04-20 1997-11-06 Bosch Gmbh Robert Verfahren zur Herstellung von Diffusionslötverbindungen
JP3740858B2 (ja) * 1997-09-16 2006-02-01 マツダ株式会社 接合金属部材及び該部材の接合方法
JP3812789B2 (ja) * 1999-03-15 2006-08-23 マツダ株式会社 金属溶接方法及び金属接合構造
JP5706193B2 (ja) * 2011-03-02 2015-04-22 株式会社タカコ 摺動部材の製造方法
DE102012212202A1 (de) * 2011-12-20 2013-06-20 Siemens Aktiengesellschaft Verfahren zum Verbinden von Werkstücken und Verbindungsvorrichtung
CN102554456B (zh) * 2012-02-24 2014-05-07 华北电力大学 一种钛铝基合金与钛合金添加非晶中间层的扩散焊接方法
CN103028828A (zh) * 2012-11-09 2013-04-10 江苏科技大学 基于局部焊件环境温度独立控制的扩散焊接装置和方法
CN105127535B (zh) * 2015-09-25 2017-11-14 广东小天才科技有限公司 一种潮敏器件的取焊和焊接方法
CN110465714A (zh) * 2019-07-24 2019-11-19 天津锦泰勤业精密电子有限公司 一种电池箱体连接件的焊接方法以及电池箱体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1341337A (en) * 1920-01-08 1920-05-25 Ohio Brass Co Method of uniting dissimilar metals
US3678570A (en) * 1971-04-01 1972-07-25 United Aircraft Corp Diffusion bonding utilizing transient liquid phase
JPS4838851A (ko) * 1971-09-22 1973-06-07
US3769487A (en) * 1971-10-27 1973-10-30 Texas Instruments Inc Method for welding manganese alloys
JPS4870650A (ko) * 1971-12-27 1973-09-25
JPS537917B2 (ko) * 1973-02-05 1978-03-23
JPS5811304B2 (ja) * 1978-10-16 1983-03-02 本田技研工業株式会社 自動二輪車等のフレ−ム
JPS5662672A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Connection method of cu or cu alloy
JPS5722867A (en) * 1980-07-16 1982-02-05 Mitsubishi Heavy Ind Ltd Diffusion brazing method of steel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100733524B1 (ko) * 2003-06-02 2007-06-29 신닛뽄세이테쯔 카부시키카이샤 금속 기계 부품의 액상 확산 접합 방법 및 금속 기계 부품
US7804039B2 (en) 2003-06-02 2010-09-28 Nippon Steel Corporation Liquid phase diffusion bonding method of metal machine part and such metal machine part

Also Published As

Publication number Publication date
EP0389625A1 (en) 1990-10-03
EP0389625A4 (en) 1990-07-16
WO1989007999A1 (en) 1989-09-08

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid