EP0377352A1 - Biegsames Leuchtband mit Leuchtdioden - Google Patents

Biegsames Leuchtband mit Leuchtdioden Download PDF

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Publication number
EP0377352A1
EP0377352A1 EP89403222A EP89403222A EP0377352A1 EP 0377352 A1 EP0377352 A1 EP 0377352A1 EP 89403222 A EP89403222 A EP 89403222A EP 89403222 A EP89403222 A EP 89403222A EP 0377352 A1 EP0377352 A1 EP 0377352A1
Authority
EP
European Patent Office
Prior art keywords
matrix
strip according
cavities
illuminating strip
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89403222A
Other languages
English (en)
French (fr)
Other versions
EP0377352B1 (de
Inventor
René Le Creff
Marc Brassier
Dominique Depardieu
Dominique Montalan
Roger Portefaix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Publication of EP0377352A1 publication Critical patent/EP0377352A1/de
Application granted granted Critical
Publication of EP0377352B1 publication Critical patent/EP0377352B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the invention relates to a flexible light-emitting diode strip comprising a matrix of light-emitting elements mounted on an insulating support element having conductive paths for their electrical interconnection and each arranged at the focal point of a collimating optical element constituted by a cavity. , conical, reflective.
  • Electroluminescent elements are mounted on an insulating substrate and are each arranged at the focal point of an optical collimating element, which elements consist of reflective parabolic cavities formed on the upper face of at least one plate the lower face of which covers the upper face of the substrate.
  • the electroluminescent elements are diodes in a housing of a conventional type and having reflective parabolic cavities. The diodes are held mechanically by an insertion plate forming the substrate. A single or double sided printed circuit board is used to make the electrical connections.
  • This matrix has the drawback of a large number of elements and of a relatively complicated assembly since it requires operations of precise alignment of the printed circuit and of the substrate, prior orientation of the anode and of the cathode of the elements. electroluminescent and insertion thereof, each in two aligned holes of the substrate and the printed circuit, and positioning of the plate carrying the parabolic cavities.
  • the substrate directly carries on its two faces the connection conductive paths which have also the function of holding in place the electroluminescent elements and the plate on the upper face of which are formed the reflective parabolic cavities whose inner face is metallized.
  • the electroluminescent elements are connected to the conductive paths through the plate disposed directly on the substrate.
  • the present invention aims to further simplify obtaining an illuminating strip from a matrix of electroluminescent elements mounted according to the standard diagram shown in FIG. 1.
  • the invention relates to a flexible illuminating strip with light-emitting diodes composed, inter alia, of a matrix of light-emitting elements mounted on a support element having conductive paths for their interconnection and each disposed at the focal point of an optical collimation element constituted by a conical-shaped cavity provided with a metallic coating characterized in that the cavities are obtained by molding half-shells directly on the front face of the insulating support element on the surface all or in part of which is deposited a metallic coating and in that the conductive paths are made from the metallic coating itself.
  • the front face of the insulating support provided with a metal coating, has an alignment of cavities separated by a grid of dielectric means, the frame of which is combined so that the one , in one direction separate in parallel in two distinct parts the surface of each of the cavities, the others in the other direction tangent substantially and in parallel the openings of the same cavities.
  • the dielectric means are grooves of small mouth but conversely of enlarged bottom.
  • the matrix 1 consists of a support element 1 a which has on its front face 2 an alignment of cavities 3 in the form of a conic, if not quadric, as well as a grid of grooves 4 with re-entrant walls, the frame is combined so that some 4 a in one direction separate in parallel in two distinct parts A and B the surface of each of the cavities 3, the others 4 b in the other direction tangent substantially and in parallel the openings of the same cavities 3.
  • the support element 1 a is molded from a flexible plastic material injected such as polyester-elastomer or polyamide-elastomer materials.
  • the fluidity of the material must be high enough to allow a faithful reproduction and a good filling of the micro-reliefs of the front face 2.
  • the modulus of elasticity of the material must be at least between 10 and 600 MPa and l elongation at break greater than 150% to result in an elastic release, particularly in the areas of said grooves 4, the re-entrant walls of which are shaped so as to obtain relatively rigid lips substantially reducing the apparent mouth of each of the grooves 4 with a bottom inversely enlarged, if not distant and at least hidden.
  • the front face 2 of the support element 1 a including the cavities 3, is coated on all or part of its surface with a metallic coating 7 to constitute, on the one hand as many optical reflective micro-mirrors as it there are cavities 3, and on the other hand, an array of electrically conductive squares 5 and strips 6.
  • the grooves 4 prevent the metallic coating from penetrating and covering all the interior walls of said grooves 4, which consequently do not can produce a single continuous layer, but forms portions 5 and 6 electrically conductive and well insulated from each other to result in the desired connecting mesh shown in FIG. 2.
  • the light-emitting diodes 8 are positioned and uniformly oriented each in each of the micro-mirrors of the cavities 3 and connected by bonding and by welding so that the anode and the cathode are each connected to the separate conductive parts A and B, reflecting cavities 3, contribute, as a function of the grid pattern of squares 5 and lamellae 6 of electrical junction, to constitute an electronic assembly of m successive longitudinal parallel branches of n diodes coupled in series in the lateral direction of the strip, of the components 9 of SMD technology that can also be integrated on the active face 2 of the strip to connect each of the diode leads to one and / or the other of the lamellae 6 of electrical distribution common to each branch (FIG. 1).
  • the assembly thus equipped as shown in Figures 3-4 and 5 is coated on at least the active face 2 of lighting with a transparent organic material 10 having all the useful optical characteristics (such as, for example, varnish / polyurethane, polysiloxane, melamine, acrylic, etc.) and on the back on the side 11 of docking with a possible support, of a self-adhesive laminatable layer 12 of very thin and a detachable external protective element 13.
  • a transparent organic material 10 having all the useful optical characteristics (such as, for example, varnish / polyurethane, polysiloxane, melamine, acrylic, etc.) and on the back on the side 11 of docking with a possible support, of a self-adhesive laminatable layer 12 of very thin and a detachable external protective element 13.
  • Electrical connection means 14 and 15 external to at least one transistorized control module 16 for generating / regulating current are provided over the entire length of the metallized conductive strips 6 delimiting the longitudinal edges of the matrix 1 produced.
  • the electrical connection means 14 and 15 are each formed longitudinally on either side of the matrix 1, by the flap and the joining by clipping and / or gluing, of a border 17 with a central groove 18 connected by molding to the central active part of the strip by a reduction in thickness constituting a flexible articulation means 19.
  • the edge 17 is arranged, after the metallization operation in overlap and in accordance with a longitudinal groove 20 corresponding to said active face 2 of the strip and which results in constituting, by the coaxial association of the metallized grooves 18 and 20, one of the external electrical connection plugs 14, 15 of the lighting strip.
  • connection plugs 14, 15 is made permanent by the fact that each of the edges 17 and of the corresponding areas for receiving the active face 2 of the support element 1 are respectively provided with a succession of pins 30, and vice versa orifices 31 in concordance, intended to allow in combination the locking in position of the edges 17 folded down on the face 2.
  • This fixing may possibly be reinforced by the addition of a binder previously introduced into said retaining orifices 31.
  • connection device such as spring clips, grip bars, and other known connection systems which would ensure electrical contact by pinching an edge conductive strip 6.
  • a plurality of grooves 25 for reducing / thinning the thickness of the matrix 1 in order to create preferential zones of folding and curvature of the strip.
  • At least one of the longitudinal edges 17 of positive supply of the strip has a slot 17 a notched along the line S to one of the dielectric grooves 4 b in order to connect the ends of the strip specific connection means 21-22 and 23-24 of each of the modules 16 and 16 ′ necessary for the separate and / or simultaneous operations of two desired functions C and D.
  • a transparent complementary color filter can be added to the top of the active face 2 of the matrix 1 to ensure a different color and / or optical distribution for each of the coupled functions C and D.
  • Figures 10 and 11 show more particularly the application of an illuminating strip according to the invention to a retractable safety light.
  • the matrix 1 is provided with indexing grooves 26 on its rear face 11 and is inserted in the opening of a connector 27 of a transistorized control module 28, the housing of which simultaneously forms the base for fixing to an element support 29, such as a heavy vehicle rear bar.
  • the grooves 26 can advantageously form the preferred folding zones in the same way as the grooves 25 in FIGS. 7 and 8.
  • FIG. 12 shows another embodiment of the illuminating strip which is essentially distinguished in that there is on the active face 2, at a certain distance from it, an additional recovery screen 32, capable to reflect and orient, substantially parallel to the optical axis of the light beam generated by each diode 8, all the incident rays emitted by each of said diodes 8, and also by increasing the solid angle of reflection to adapt the apparent surface of lighting of each of the cavities 3 on the apparent surface of the elementary optical relief 33 which should constitute the front lighting screen 37 of the fire intended to ensure the distribution and the homogeneity of lighting / exterior signaling desired.
  • an additional recovery screen 32 capable to reflect and orient, substantially parallel to the optical axis of the light beam generated by each diode 8, all the incident rays emitted by each of said diodes 8, and also by increasing the solid angle of reflection to adapt the apparent surface of lighting of each of the cavities 3 on the apparent surface of the elementary optical relief 33 which should constitute the front lighting screen 37 of the fire intended to ensure the distribution and the homogeneity of lighting
  • the additional recovery screen 32 attached to the front of the die 1 is molded in a plastic material transparent (see translucent depending on the final function to be completed), so as to constitute a light transmitting wall having locally, and facing each cavity 3, at least two elementary surfaces of truncated conics, offset, coaxial and concomitant 34.35 whose axes are aligned and coincident with that of the corresponding cavity 3.
  • the elementary surfaces 34, 35 are designed so that only the recessed portions on the front, back of said screen 32 are metallized.
  • the distance from the screen to the active face 2 of the support element 1 a is determined by the given height of a support shoulder 36.
  • the first central reflection surface 34 which constitutes a conical orifice, crossing the entire thickness of the screen 30, is substantially of the same parameter and same focus as the conical surface of the cavity 3 opposite, which it extends by its dimensions and its position shifted forward to work optically in complementary directional reflection.
  • the second conical peripheral reflection surface 35 envelops the first 34 coaxially at a distance without passing through the entire thickness of the screen 32 and is of a larger parameter, having substantially the same focal point as the reflecting cavity 3 and is located in an offset position which allows it to pick up all the incident rays emitted by the diode 8 which pass through the gap created in relation between said screen 32 and the support element 1 a to then direct these rays in a direction substantially parallel to its focal axis along a magnitude of the apparent reflection / refraction aperture of the screen 32 corresponding substantially to the magnitude of the apparent illumination surface of a relief 33 of a screen front transparent 37 for distribution and homogenization of the appearance and external lighting of the built-up light.
  • the electrical connection means 14, 15 formed longitudinally on either side of the matrix 1 are obtained by positioning, opposite, a groove 38 formed along one of the longitudinal edges of the support element 1 a and metallized simultaneously with said support element in which it is formed with another groove 39 of dimension and corresponding shape, also metallized and formed in the screen 32, at the level of the shoulder 36.
  • the components 9 of CMS technology intended to connect each of the diode branches 8 to one and / or the other of the electrical distribution plates 6 are easily integrated on the active face 2 of the support element 1 a in corresponding positions. to those of longitudinal recesses 40.
  • the invention is not limited to the embodiments described and shown.
  • it is possible to form a network of electrically conductive squares 5 and strips 6 formed from the metallic coating 7 deposited according to one of the known deposition methods and preferably under vacuum, by micro-cutting of the conductive metallic layer 7 under the impact of the focused beam of a micro-intervention laser on thin layers.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP89403222A 1988-11-29 1989-11-22 Biegsames Leuchtband mit Leuchtdioden Expired - Lifetime EP0377352B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8815560A FR2639749B1 (fr) 1988-11-29 1988-11-29 Bande eclairante souple a diodes electroluminescentes
FR8815560 1988-11-29

Publications (2)

Publication Number Publication Date
EP0377352A1 true EP0377352A1 (de) 1990-07-11
EP0377352B1 EP0377352B1 (de) 1991-08-21

Family

ID=9372350

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89403222A Expired - Lifetime EP0377352B1 (de) 1988-11-29 1989-11-22 Biegsames Leuchtband mit Leuchtdioden

Country Status (5)

Country Link
EP (1) EP0377352B1 (de)
JP (1) JPH02201396A (de)
DE (1) DE68900225D1 (de)
ES (1) ES2025373B3 (de)
FR (1) FR2639749B1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2854480A1 (fr) * 2003-04-29 2004-11-05 France Telecom Afficheur souple
US7105858B2 (en) * 2002-08-26 2006-09-12 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7138659B2 (en) 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7144748B2 (en) * 2002-08-26 2006-12-05 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
EP1735844A1 (de) * 2004-03-18 2006-12-27 Phoseon Technology, Inc. Mikroreflektoren auf einem substrat für ein hochdichtes led-array
US7219715B2 (en) 2004-12-23 2007-05-22 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
WO2015035693A1 (zh) * 2013-09-11 2015-03-19 深圳市安华隆科技有限公司 一种led显示方法及运用该显示方法的led显示牌

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763431B2 (ja) * 1990-04-24 1995-07-12 佐内 藤田 調理用プレート
JP3041882B2 (ja) * 1990-05-08 2000-05-15 ソニー株式会社 脈診装置
JPH0463660U (de) * 1990-10-12 1992-05-29
JPH0472270U (de) * 1990-11-06 1992-06-25
JP2781475B2 (ja) * 1991-07-19 1998-07-30 シャープ株式会社 光学装置
JPH06207772A (ja) * 1993-01-08 1994-07-26 Toshiba Corp 冷蔵庫
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
DE60232134D1 (de) * 2001-02-16 2009-06-10 Ignis Innovation Inc Flexible anzeigevorrichtung
GB0108309D0 (en) * 2001-04-03 2001-05-23 Koninkl Philips Electronics Nv Matrix array devices with flexible substrates
JP5058521B2 (ja) * 2006-06-19 2012-10-24 住友化学株式会社 フレキシブル発光体及びそれに用いるフレキシブル基板
JP4327180B2 (ja) * 2006-07-24 2009-09-09 株式会社東芝 表示装置
JP5207671B2 (ja) * 2007-06-26 2013-06-12 パナソニック株式会社 半導体発光装置用パッケージおよび半導体発光装置
JP6887255B2 (ja) * 2017-01-13 2021-06-16 シチズン電子株式会社 発光装置及び発光装置を用いた撮像装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2426381A1 (fr) * 1978-05-18 1979-12-14 Bourboulon Henri Module lumineux en circuit hybride a diodes electroluminescentes
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
FR2512238A1 (fr) * 1981-08-12 1983-03-04 Werk Fernsehelektronik Veb Dispositif d'affichage a diodes electroluminescentes a teneur elevee en informations
FR2518317A1 (fr) * 1981-12-10 1983-06-17 Licentia Gmbh Reseau plan de diodes electroluminescentes
FR2524155A1 (fr) * 1982-03-26 1983-09-30 Radiotechnique Compelec Conduit de lumiere pour dispositif modulaire d'eclairage de puissance
US4603496A (en) * 1985-02-04 1986-08-05 Adaptive Micro Systems, Inc. Electronic display with lens matrix

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2426381A1 (fr) * 1978-05-18 1979-12-14 Bourboulon Henri Module lumineux en circuit hybride a diodes electroluminescentes
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
FR2512238A1 (fr) * 1981-08-12 1983-03-04 Werk Fernsehelektronik Veb Dispositif d'affichage a diodes electroluminescentes a teneur elevee en informations
FR2518317A1 (fr) * 1981-12-10 1983-06-17 Licentia Gmbh Reseau plan de diodes electroluminescentes
FR2524155A1 (fr) * 1982-03-26 1983-09-30 Radiotechnique Compelec Conduit de lumiere pour dispositif modulaire d'eclairage de puissance
US4603496A (en) * 1985-02-04 1986-08-05 Adaptive Micro Systems, Inc. Electronic display with lens matrix

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7144748B2 (en) * 2002-08-26 2006-12-05 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7105858B2 (en) * 2002-08-26 2006-09-12 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
WO2004100113A2 (fr) 2003-04-29 2004-11-18 France Telecom Afficheur souple
WO2004100113A3 (fr) * 2003-04-29 2005-01-13 France Telecom Afficheur souple
FR2854480A1 (fr) * 2003-04-29 2004-11-05 France Telecom Afficheur souple
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
EP1735844A1 (de) * 2004-03-18 2006-12-27 Phoseon Technology, Inc. Mikroreflektoren auf einem substrat für ein hochdichtes led-array
EP1735844A4 (de) * 2004-03-18 2011-07-27 Phoseon Technology Inc Mikroreflektoren auf einem substrat für ein hochdichtes led-array
US7315049B2 (en) 2004-05-18 2008-01-01 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7138659B2 (en) 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7219715B2 (en) 2004-12-23 2007-05-22 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
US7599626B2 (en) 2004-12-23 2009-10-06 Waytronx, Inc. Communication systems incorporating control meshes
US7694722B2 (en) 2004-12-23 2010-04-13 Onscreen Technologies, Inc. Cooling systems incorporating heat transfer meshes
WO2015035693A1 (zh) * 2013-09-11 2015-03-19 深圳市安华隆科技有限公司 一种led显示方法及运用该显示方法的led显示牌

Also Published As

Publication number Publication date
FR2639749B1 (fr) 1992-11-27
DE68900225D1 (de) 1991-09-26
JPH02201396A (ja) 1990-08-09
EP0377352B1 (de) 1991-08-21
FR2639749A1 (fr) 1990-06-01
ES2025373B3 (es) 1992-03-16

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