DE68900225D1 - Biegsames leuchtband mit leuchtdioden. - Google Patents

Biegsames leuchtband mit leuchtdioden.

Info

Publication number
DE68900225D1
DE68900225D1 DE8989403222T DE68900225T DE68900225D1 DE 68900225 D1 DE68900225 D1 DE 68900225D1 DE 8989403222 T DE8989403222 T DE 8989403222T DE 68900225 T DE68900225 T DE 68900225T DE 68900225 D1 DE68900225 D1 DE 68900225D1
Authority
DE
Germany
Prior art keywords
lighting
bending
diodes
strip
lighting strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8989403222T
Other languages
English (en)
Inventor
Creff Rene Le
Marc Brassier
Dominique Depardieu
Dominique Montalan
Roger Portefaix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Application granted granted Critical
Publication of DE68900225D1 publication Critical patent/DE68900225D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
DE8989403222T 1988-11-29 1989-11-22 Biegsames leuchtband mit leuchtdioden. Expired - Lifetime DE68900225D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8815560A FR2639749B1 (fr) 1988-11-29 1988-11-29 Bande eclairante souple a diodes electroluminescentes

Publications (1)

Publication Number Publication Date
DE68900225D1 true DE68900225D1 (de) 1991-09-26

Family

ID=9372350

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989403222T Expired - Lifetime DE68900225D1 (de) 1988-11-29 1989-11-22 Biegsames leuchtband mit leuchtdioden.

Country Status (5)

Country Link
EP (1) EP0377352B1 (de)
JP (1) JPH02201396A (de)
DE (1) DE68900225D1 (de)
ES (1) ES2025373B3 (de)
FR (1) FR2639749B1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763431B2 (ja) * 1990-04-24 1995-07-12 佐内 藤田 調理用プレート
JP3041882B2 (ja) * 1990-05-08 2000-05-15 ソニー株式会社 脈診装置
JPH0463660U (de) * 1990-10-12 1992-05-29
JPH0472270U (de) * 1990-11-06 1992-06-25
JP2781475B2 (ja) * 1991-07-19 1998-07-30 シャープ株式会社 光学装置
JPH06207772A (ja) * 1993-01-08 1994-07-26 Toshiba Corp 冷蔵庫
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
WO2002067329A1 (en) * 2001-02-16 2002-08-29 Ignis Innovation Inc. Flexible display device
GB0108309D0 (en) * 2001-04-03 2001-05-23 Koninkl Philips Electronics Nv Matrix array devices with flexible substrates
US7105858B2 (en) * 2002-08-26 2006-09-12 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
US7144748B2 (en) * 2002-08-26 2006-12-05 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
FR2854480A1 (fr) * 2003-04-29 2004-11-05 France Telecom Afficheur souple
US7579218B2 (en) * 2003-07-23 2009-08-25 Onscreen Technologies Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
TWI312583B (en) * 2004-03-18 2009-07-21 Phoseon Technology Inc Micro-reflectors on a substrate for high-density led array
US7138659B2 (en) 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7599626B2 (en) 2004-12-23 2009-10-06 Waytronx, Inc. Communication systems incorporating control meshes
JP5058521B2 (ja) * 2006-06-19 2012-10-24 住友化学株式会社 フレキシブル発光体及びそれに用いるフレキシブル基板
JP4327180B2 (ja) * 2006-07-24 2009-09-09 株式会社東芝 表示装置
JP5207671B2 (ja) * 2007-06-26 2013-06-12 パナソニック株式会社 半導体発光装置用パッケージおよび半導体発光装置
CN103489378A (zh) * 2013-09-11 2014-01-01 深圳市安华隆科技有限公司 一种led显示方法及运用该显示方法的led显示牌
JP6887255B2 (ja) * 2017-01-13 2021-06-16 シチズン電子株式会社 発光装置及び発光装置を用いた撮像装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2426381A1 (fr) * 1978-05-18 1979-12-14 Bourboulon Henri Module lumineux en circuit hybride a diodes electroluminescentes
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
DD200295A1 (de) * 1981-08-12 1983-04-06 Guenter Claus Led-anzeige mit hohem informationsgehalt
DE3148843C2 (de) * 1981-12-10 1986-01-02 Telefunken electronic GmbH, 7100 Heilbronn Mehrfach-Leuchtdiodenanordnung
FR2524155B1 (fr) * 1982-03-26 1985-10-31 Radiotechnique Compelec Conduit de lumiere pour dispositif modulaire d'eclairage de puissance
US4603496A (en) * 1985-02-04 1986-08-05 Adaptive Micro Systems, Inc. Electronic display with lens matrix

Also Published As

Publication number Publication date
FR2639749A1 (fr) 1990-06-01
ES2025373B3 (es) 1992-03-16
FR2639749B1 (fr) 1992-11-27
EP0377352A1 (de) 1990-07-11
JPH02201396A (ja) 1990-08-09
EP0377352B1 (de) 1991-08-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee