EP0341872A2 - Steckverbinder mit hoher Dichte - Google Patents

Steckverbinder mit hoher Dichte Download PDF

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Publication number
EP0341872A2
EP0341872A2 EP89304292A EP89304292A EP0341872A2 EP 0341872 A2 EP0341872 A2 EP 0341872A2 EP 89304292 A EP89304292 A EP 89304292A EP 89304292 A EP89304292 A EP 89304292A EP 0341872 A2 EP0341872 A2 EP 0341872A2
Authority
EP
European Patent Office
Prior art keywords
conductive
insulating medium
disposed
pads
compliant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89304292A
Other languages
English (en)
French (fr)
Other versions
EP0341872A3 (de
Inventor
Kaushik Sharma Akkapeddi
Ronald J. Rhodes
Mark K. Mantay
Clifford Lawrence Winings
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc, AT&T Corp filed Critical American Telephone and Telegraph Co Inc
Publication of EP0341872A2 publication Critical patent/EP0341872A2/de
Publication of EP0341872A3 publication Critical patent/EP0341872A3/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Definitions

  • This invention relates to electrical connectors, such as those which are useful for connecting circuit packs to backplanes.
  • a circuit pack typically includes components mounted to a circuit board and connected to an array of pads at an edge of one or both surfaces of the board. This circuit pack is electrically coupled to terminal pins or an edge-card connector protruding from a backplane surface which is orthogonal to the circuit board surfaces.
  • the connection is typically provided by some form of plug-in connector attached to the circuit board or in the backplane so that each pad on the circuit board is coupled to a corresponding pad or pin on the backplane when the circuit pack is inserted within an appropriate shelf.
  • a connector adapted for interconnecting conductive elements on two essentially orthogonal surfaces.
  • the connector comprises an insulating medium with conductive paths disposed from one surface of the insulating medium to another surface of said medium which is essentially orthogonal thereto so that the orthogonal surfaces are adapted for connection to the conducting elements.
  • the connector also includes a layer of compliant, anisotropically conductive material disposed adjacent to the insulating medium on at least one orthogonal surface of the insulating medium which is adapted for connection to the conductive elements.
  • FIG. 1 shows the basic elements of an interconnection system in accordance with the invention.
  • the circuit pack includes an array of conductive pads, such as 13, which are coupled to the components.
  • the backplane also includes arrays of conductive pads, such as 14, which correspond in number and location to those on the circuit pack. (In the example shown, two arrays are shown on the backplane to accommodate two circuit packs in the shelf).
  • the pads are typically made of copper having a thickness of approximately 0.05mm with successive layers of nickel and gold plated thereon to thicknesses of 2 microns each.
  • a connector element, 15, partially broken away in the view of FIG. 1, provides electrical connection between corresponding pads (e.g. 13) on the circuit pack and on the backplane (e.g.14) by providing conductive paths between the orthogonally disposed arrays.
  • Sufficient pressure for mating the pads on the backplane with conductive paths on the surface of the connector element facing the backplane is provided by the combination of a latch, 16, and spring 17, engaged at the other end of the shelf. Because the surfaces of the backplane and circuit pack are not usually flat, a compliant medium is generally needed between those surfaces and the connector element to insure a proper electrical connection. At the same time, it is desirable for the pressure exerted on the pad arrays to penetrate any insulating material on the surface of the pads.
  • the compliant material is preferably an elastomer which includes chains of conductive particles of wires extending in a direction orthogonal to the major surfaces of the material to achieve anisotropic electrical conduction in that direction.
  • Materials for providing anisotropic conduction also referred to as conductive polymer interconnect (CPI) are known generally and are not discussed in great detail. (See, for example, U.S. Patent 4,548,862 issued to Hartman which is incorporated by reference herein).
  • the elastomer is an RTV silicone insulator and the conductive particles are gold-coated nickel.
  • the compliance of such materials is preferably in the range of 0.25-0.50mm with a pressure of 50 grams/mm2. If the compliance is too low, an unacceptably high resistance could result, while if it is too high, the conductive particles could buckle. Typical thickness of the layers are 1.3-2.6mm.
  • the layers, 18 and 19, can be attached to the circuit pack and backplane surfaces, respectively, over the pad arrays or attached to the connector element, by means of alignment pins. In this example, layer 19 is attached to the connector 15 by alignment pins 21 and 22. The layer 18 is attached to the circuit pack by alignment pins (not shown).
  • the connector element, 15, is then attached to the circuit pack 10, with layer 18 therebetween, by some type of standard mechanical clamping, such as screws, bolts, rivets or heat stakes (not shown).
  • Alignment pins, 21 and 22, are also provided in the connector element in order to fit within holes, 23 and 24, respectively, in the compliant layer 19 and in the backplane so that the connector element is properly aligned with the pads on the backplane. Similar pins (not shown) may be used to align the connector element with the circuit pack.
  • the connector element includes a support structure 31, made of metal or plastic which is attached to the circuit pack, 10, by mounting screws (not shown). Electrical connection between the pads on the circuit pack (not shown) and pads on the backplane is provided by a flexible circuit member, 33, connected electrically to the surface portion of the circuit pack including the pad array, (by a CPI layer 18) and extending between the CPI layer 19 and the support structure 31 in the area of the backplane pad array. CPI layer 18 is mounted between the flexible circuit 33 and the circuit pack 10, while a stiffener element, 30, is provided on the opposite surface of the circuit pack.
  • the circuit pack could be moved to the area behind the support 31 (the surface opposite the backplane) with one end of the flexible circuit contacting one surface of the circuit pack and the other end extending around the support element to contact the opposite surface of the circuit pack.
  • pads on both major surfaces of the circuit pack can make contact with the backplane pads.
  • grounded conductive portions can br provided on the flexible circuit for electrical shielding and/or impedance control of the signal lines.
  • FIG. 3 illustrates a portion of the flexible circuit member 33.
  • the circuit includes conductive strips, such as 34, formed on the flexible substrate, 35.
  • the strips are typically made of copper with a thickness of the order of 0.05mm, while the substrate is typically polyimide with a thickness of 1.2mm.
  • Each strip extends from a conductive pad, e.g., 36, which makes electrical contact with a corresponding pad on the circuit pack, to a pad, e.g., 37, which is positioned to provide electrical contact to a corresponding pad on the backplane.
  • circuit pack and backplane pads Electrical contact to the circuit pack and backplane pads is effected by providing via holes, e.g., 38 and 39, in the pad areas which allow the conductive material to extend to the opposite surface of the flexible circuit to form the same pad array on said opposite surface (not shown) for physical and electrical connection to the CPI material (18 and 19).
  • compliant material may eliminate the need for special raised dots on the flexible circuit pads for penetrating any oxide on the circuit pack or backplane pads, although such dots may be included if desired. (See Howett, cited previously.)
  • FIG. 4 illustrates a portion of the interconnection system of FIG. 1 in accordance with a further embodiment. Again, similar elements are similarly numbered.
  • electrical connection is made between the pad array (e.g., 13) of the circuit pack, 10, and the pad array (e.g., 14) of the backplane, 12, by means of a multilayer structure 40.
  • the structure can be the standard type of multilayer printed circuit board comprising multiple layers of a dielectric, 41, such as ceramic, epoxy-glass, or photopolymer, with patterns of conductive material, 42, such as copper formed on each level.
  • the conductive patterns at different levels are connected by via holes (e.g., 43) formed through the dielectric layers.
  • via holes e.g., 43
  • the multilayer structure is fabricated at the edge of the circuit pack 10 over the area of the pad array to be connected.
  • each level can be formed with strips of metal which correspond in number and position with a particular column of backplane pads.
  • Each strip contacts one of the backplane pads through the CPI layer 19 at the edge of the multilayer structure.
  • Each such strip can then be contacted to a corresponding pad 13 on the circuit pack by means of a metalized via (e.g. 43) extending from that strip through the multilayer structure as shown.
  • a metalized via e.g. 43
  • conductors can be formed for ground connection shielding or impedance control in high frequency applications.
  • a second multilayer structure (not shown) can also be fabricated on the opposite surface of the circuit pack to connect any array of pads on that surface to another pad array on the backplane (also not shown),
  • connection between the pad arrays on the circuit pack and backplane is provided by a connector 15 which comprises a pair of molded insulating piece parts 50, 51 with a conductive layers (52, 53 and 54, 55 respectively) formed on their major surfaces.
  • the molded piece parts are typically plastic which are formed in the shape indicated to provide the 90 degree translation between the pad arrays.
  • the conductive layers (52-55) are typically made of copper which is plated onto the surfaces in strips which correspond in number and position to the columns of pads to be connected.
  • the molded parts are separated by a spacer element 56, also made of plastic, which may be pinned or bonded to the facing surfaces of the parts (the piece parts are shown slightly separated for the sake of illustration).
  • the CPI layer 18, is disposed between the molded parts 50 and 51 and the circuit pack 10, to connect conductive layers 52-55 to pads 13.
  • CPI layer 19 is disposed between connector 15 and backplane 12. Attachment of connector 15, to the circuit pack 10, is effected by screws or other clamping means (not shown).
  • FIG. 6 illustrates a still further embodiment of the invention where the connector, 15, is again made from a molded insulating material, 60, such as plastic.
  • the conduction paths comprise conductive pins, e.g. 61, which are insert molded into the material.
  • the pins are oriented at an angle of approximately 45 degrees with respect to the surfaces of the molded material adjacent to the CPI layers (18 and 19) to achieve the shortest electrical path between the pad arrays on the circuit pack and backplane.
  • the pins may be flush with or protrude from the faces of the connector, and are plated with gold to produce pads, such as 62 and 63 which correspond to the backplane and circuit pack pad arrays.
  • the connector, 15, is typically made of stacked modules (not shown) which are attached by screws or other clamping means (not shown) to the circuit pack with CPI layer 18 therebetween.
  • the invention in its various embodiments includes the use of an insulating medium with conductive paths disposed between two surfaces of the medium which are essentially orthogonal so that connection can be made between orthogonally disposed pad arrays.
  • a connector in combination with a CPI layer adjacent to at least one surface of the insulating medium, permits reliable electrical connection of high density pad arrays.
  • the invention is desirable where the pad arrays comprise at least 20 pads per inch of height (h of FIG. 1) of the circuit pack (8 pads per cm).
  • a high density system will comprise at least 80 pads per inch (32 pads per cm) and the invention is particularly desirable for such systems.
  • Some of the embodiments may be desirable in systems where lower cross talk and/or lower reflection coefficients are required.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
EP89304292A 1988-05-09 1989-04-28 Steckverbinder mit hoher Dichte Withdrawn EP0341872A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19163688A 1988-05-09 1988-05-09
US191636 1988-05-09

Publications (2)

Publication Number Publication Date
EP0341872A2 true EP0341872A2 (de) 1989-11-15
EP0341872A3 EP0341872A3 (de) 1990-08-08

Family

ID=22706283

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89304292A Withdrawn EP0341872A3 (de) 1988-05-09 1989-04-28 Steckverbinder mit hoher Dichte

Country Status (2)

Country Link
EP (1) EP0341872A3 (de)
JP (1) JPH0218881A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0518578A1 (de) * 1991-06-14 1992-12-16 Yamaichi Electronics Co., Ltd. Elektrische Kontaktanordnung
EP0945921A3 (de) * 1998-03-23 2001-08-08 Thomas & Betts International, Inc. Hochfrequenzrückwandverbinder
US20120131249A1 (en) * 2010-01-29 2012-05-24 Darren Cepulis Methods and systems for an interposer board
US20200163803A1 (en) * 2017-05-22 2020-05-28 Kci Usa, Inc. Elastically deformable wound dressings

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU553463B2 (en) * 1981-07-06 1986-07-17 Honeywell Information Systems High density connector
JPS58209077A (ja) * 1982-05-31 1983-12-05 興國ゴム工業株式会社 金属のミクロパタ−ンを有する絶縁性高分子弾性体
US4729166A (en) * 1985-07-22 1988-03-08 Digital Equipment Corporation Method of fabricating electrical connector for surface mounting
DE3530827A1 (de) * 1985-08-29 1987-03-05 Vdo Schindling Kontaktvorrichtung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0518578A1 (de) * 1991-06-14 1992-12-16 Yamaichi Electronics Co., Ltd. Elektrische Kontaktanordnung
EP0945921A3 (de) * 1998-03-23 2001-08-08 Thomas & Betts International, Inc. Hochfrequenzrückwandverbinder
US20120131249A1 (en) * 2010-01-29 2012-05-24 Darren Cepulis Methods and systems for an interposer board
US8832348B2 (en) * 2010-01-29 2014-09-09 Hewlett-Packard Development Company, L.P. Methods and systems for an interposer board
US20200163803A1 (en) * 2017-05-22 2020-05-28 Kci Usa, Inc. Elastically deformable wound dressings

Also Published As

Publication number Publication date
JPH0218881A (ja) 1990-01-23
EP0341872A3 (de) 1990-08-08

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