EP0341872A3 - Steckverbinder mit hoher Dichte - Google Patents
Steckverbinder mit hoher Dichte Download PDFInfo
- Publication number
- EP0341872A3 EP0341872A3 EP89304292A EP89304292A EP0341872A3 EP 0341872 A3 EP0341872 A3 EP 0341872A3 EP 89304292 A EP89304292 A EP 89304292A EP 89304292 A EP89304292 A EP 89304292A EP 0341872 A3 EP0341872 A3 EP 0341872A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- high density
- circuit pack
- connectors
- density connectors
- backplane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001971 elastomer Polymers 0.000 abstract 1
- 239000000806 elastomer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19163688A | 1988-05-09 | 1988-05-09 | |
| US191636 | 1988-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0341872A2 EP0341872A2 (de) | 1989-11-15 |
| EP0341872A3 true EP0341872A3 (de) | 1990-08-08 |
Family
ID=22706283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89304292A Withdrawn EP0341872A3 (de) | 1988-05-09 | 1989-04-28 | Steckverbinder mit hoher Dichte |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0341872A3 (de) |
| JP (1) | JPH0218881A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8832348B2 (en) * | 2010-01-29 | 2014-09-09 | Hewlett-Packard Development Company, L.P. | Methods and systems for an interposer board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04368792A (ja) * | 1991-06-14 | 1992-12-21 | Yamaichi Electron Co Ltd | 電気接触子ユニット |
| US6062872A (en) * | 1998-03-23 | 2000-05-16 | Thomas & Betts International, Inc. | High speed backplane connector |
| JP2020520740A (ja) * | 2017-05-22 | 2020-07-16 | ケーシーアイ ユーエスエイ, インコーポレイテッドKci Usa, Inc. | 弾性変形可能な創傷被覆材 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0070136A1 (de) * | 1981-07-06 | 1983-01-19 | Honeywell Information Systems Inc. | Elektrischer Verbinder für gedruckte Schaltungskarten |
| DE3530827A1 (de) * | 1985-08-29 | 1987-03-05 | Vdo Schindling | Kontaktvorrichtung |
| EP0254598A2 (de) * | 1985-07-22 | 1988-01-27 | Digital Equipment Corporation | Verfahren zum Herstellen eines elektrischen Verbinders für Oberflächenmontage |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58209077A (ja) * | 1982-05-31 | 1983-12-05 | 興國ゴム工業株式会社 | 金属のミクロパタ−ンを有する絶縁性高分子弾性体 |
-
1989
- 1989-04-28 EP EP89304292A patent/EP0341872A3/de not_active Withdrawn
- 1989-05-09 JP JP11435889A patent/JPH0218881A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0070136A1 (de) * | 1981-07-06 | 1983-01-19 | Honeywell Information Systems Inc. | Elektrischer Verbinder für gedruckte Schaltungskarten |
| EP0254598A2 (de) * | 1985-07-22 | 1988-01-27 | Digital Equipment Corporation | Verfahren zum Herstellen eines elektrischen Verbinders für Oberflächenmontage |
| DE3530827A1 (de) * | 1985-08-29 | 1987-03-05 | Vdo Schindling | Kontaktvorrichtung |
Non-Patent Citations (2)
| Title |
|---|
| ELECTRO 84, PROFESSIONAL PROGRAM SESSION, RECORD #3, May 1984, LOS ANGELES US pages 1 - 11; A.T. MURPHY: "HIGH DENSITY IMPEDANCE CONTROLLED CONNECTORS" * |
| IBM TECHNICAL DISCLOSURE BULLETIN. vol. 20, no. 8, January 1978, NEW YORK US page 2934 L.W. HOLMSTROM: "ELECTRICAL FIXTURE FOR PRINTED-CIRCUIT ASSEMBLIES" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8832348B2 (en) * | 2010-01-29 | 2014-09-09 | Hewlett-Packard Development Company, L.P. | Methods and systems for an interposer board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0218881A (ja) | 1990-01-23 |
| EP0341872A2 (de) | 1989-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB IT NL |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB IT NL |
|
| 17P | Request for examination filed |
Effective date: 19901206 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Withdrawal date: 19910204 |
|
| R18W | Application withdrawn (corrected) |
Effective date: 19910204 |