EP0335878A1 - Sonde d'echographe avec circuit de connexion perfectionne. - Google Patents
Sonde d'echographe avec circuit de connexion perfectionne.Info
- Publication number
- EP0335878A1 EP0335878A1 EP87907780A EP87907780A EP0335878A1 EP 0335878 A1 EP0335878 A1 EP 0335878A1 EP 87907780 A EP87907780 A EP 87907780A EP 87907780 A EP87907780 A EP 87907780A EP 0335878 A1 EP0335878 A1 EP 0335878A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- elements
- probe according
- blocks
- support
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 35
- 238000001465 metallisation Methods 0.000 claims description 38
- 238000002604 ultrasonography Methods 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 241001573881 Corolla Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Definitions
- the present invention relates to an ultrasound probe with an improved connection circuit. It finds more particularly its application in the medical field where such probes are used for echographic examinations capable of allowing the revelation of the internal structures of the tissues of a human body examined. It can nevertheless find its application in all the other fields of the industry where echographs are used whose frequency of the acoustic signal is high. Indeed the increase in this frequency leads to a corresponding reduction in the size of the probes. This results in specific connection problems due to miniaturization.
- the present invention provides a solution.
- An ultrasound system in principle comprises means for emitting an electric signal vibrating at an acoustic frequency, a transducer probe receiving this electric signal and transforming it into a mechanical excitation, this probe being applied against a medium to be insonified.
- the backscatter signal which results from the insonification of the medium is generally received by the same probe, during emission stoppages.
- the reversible probe thus transforms the acoustic signal which reaches it into an electrical signal.
- the means which effect the transformation of an electrical signal into an acoustic signal and / or vice versa comprise in a known manner elements of a piezoelectric crystal.
- the connection object of the invention relates to the electrical connection of all the elements of the probe.
- the piezoelectric elements are generally aligned against each other to form a strip.
- a front face can be distinguished on this bar, on the side on which the useful acoustic signal is propagated, and a rear face opposite the front face. The process of electrical-acoustic transformation occurs most effectively when the front and rear faces of the elements of the bar are provided with electrodes.
- the electric signal is applied to these electrodes, it causes the existence of an alternating electric field in the pleo-electric crystal. It vibrates and emits an acoustic signal. The opposite occurs at the reception.
- the dimensions of the piezoelectric elements are preferably calculated as a function of the acoustic working frequency of the probe and as a function of the speed of propagation of the waves in the crystal. These two quantities determine the wavelength ⁇ of the acoustic vibration in the crystal. In the bar, the piezoelectric elements are aligned side by side, parallel to their length, and their height is the distance between the two electrodes.
- the length of the elements must be greater than ten times ⁇ , that the height must be substantially equal to ⁇ / 2, and that the width, measured orthogonally to these first two dimensions, must be less than or equal to ⁇ / 6.
- the elements of the bar must have a width and therefore a connection pitch less than or equal to about 30 micrometers.
- a relay is used, next to each element, which is in the form of a parallelepipedal block having the particularity of being metallized on at least two adjacent faces.
- This relay therefore includes in itself the desired fold. Indeed by one of its faces it can be connected, in the same plane, with an electrode of the element. By its other face, electrically connected to the first, it can be connected to a connection circuit presented orthogonally.
- This solution which is particularly useful in the context of the use of curved bars, convex as well as concave, can of course also be used with straight bars, in a broken line, etc.: it replaces the folding of the sheets.
- the invention relates to an ultrasound probe of the type comprising aligned piezoelectric elements, mounted on a support common to all the elements, and electrical connection means for connecting electronic circuits to these elements, characterized in that these means connection comprise on at least one side of the alignment and to the right of each of the elements, at least one block in general parallelepiped shape, metallized on at least two of its adjacent faces, and fixed on the support.
- Figures 3a and 3b two variants of electrical connections of the elements of a probe provided with the improvement of the invention.
- Figure 1 shows a strip of an ultrasound probe according to the invention.
- the strip 1 comprises piezoelectric elements: for example the element 2 consisting of two half-elements 2a and 2b. These elements are aligned, and mounted between a support 3, common to all the elements, and acoustic transition blades such as 4, divided into two half-blades 4a and 4b, assigned to each of these elements.
- An element 2 is thus composed of two half-elements, this division serving to solve crosstalk problems which may appear between two adjacent elements, for example elements 2 and 5.
- the front 6 and rear 7 faces of each element are respectively provided with a metallization 8, 9, which is used to induce an electric field in the element when an electric signal is applied to them.
- the metallizations of the front and rear faces make it possible to apply an electric field parallel to the direction of propagation of the acoustic waves. This arrangement is advantageous because it improves the coupling coefficient between the electric field and the acoustic field.
- the piezoelectric elements comprise for example plastic elements such as for example PVF 2 , or PVT 2 F copolymer; a ceramic such as for example PZT, PZT polymer composite or PBTiO 3 or a crystal.
- What characterizes the invention is essentially the presence, on at least one side of the alignment A of the elements, here for example on the right, of blocks 10 of generally parallelepiped shape, assigned to each of the elements (block 10 is assigned to element 2), and which have the particularity of being metallized on at least two of their adjacent faces.
- the faces 11 to 14 of the block 10 are even all metallized.
- the metallizations 8 and 9 of the elements, produced in planes parallel to the plane of the bar can be simply connected, in parallel planes, to metallized faces of the block.
- the continuity of metallization, at the location of the adjacent faces of the blocks brings a possibility of electrical connection to these elements in planes which are now perpendicular to the plane of the bar.
- Relay blocks can have any shape. With the parallelepiped characteristic, it is understood that these blocks have at least two metallized faces located in two substantially perpendicular planes.
- a general method of manufacturing a bar according to the invention On examining FIGS. 2a to 2c, we will examine a general method of manufacturing a bar according to the invention.
- a thin support 3 for example made of polyurethane, and in the general shape of an inverted T, metallization is carried out by a known process. For example by evaporation-projection under vacuum or even by electrolysis. Then a bar of a piezoelectric crystal 15 is fixed above the central part of this support, from which the elements will be cut later.
- the strip 16 is then metallized on all its faces 11-14 so as to ensure electrical continuity at its periphery. Then, by a simple grooving operation (FIG. 2c), the metallization is separated into two electrically independent metalizations 21 and 22. For example, grooves 17, 18 are produced through the metallization as far as the ceramic body of the strip. In a preferred embodiment, two strips are produced for each bar in this way. Each strip 16 and 19 is then fixed on either side of the crystal 15 above the branches 23 and 24 of the support 3. The general shape of the inverted T of the support is used to wedge on either side of this support strips 16 and 19.
- a so-called transition blade 20 is then produced, the thickness of which, in a known manner, is equal to a quarter of the future working acoustic wavelength of the probe.
- This blade 20 is metallized by its lower face.
- the blade is then fixed to the crystal 15 and to the strips 16 and 19.
- One of the two metalizations of each strip, the metallization 21 can then come into contact with the metallization of the support 3, on a vertical blank and on a horizontal blank of this support; while the other metallization, metallization 22, can come into contact under the metallization of the blade 20.
- the intermediate cuts 28 are made in the middle of each element to a depth recalled by a dotted line 30 whose plane is underlying the altitude of the groove 17 which, in the preferred version, separates the metalizations from the strips 16 in two electrically independent metalizations. It follows from this way of doing that it is possible, for the same element, to access its lower electrode by a connection applied to a lateral face 31 of the relay block of this element. Access to the upper electrodes of each of the two half-elements which constitutes this element by the metalizations 32 and 33, belonging to the same block, and having been electrically separated from each other by the cutout 28. It is noted that the connections 31 to 33 are effectively located in a plane now perpendicular to the plane of the bar 1.
- FIGS. 3a and 3b show exemplary embodiments of the rest of the connection means, the realization of which is simplified because of the invention.
- the invention is more particularly advantageous in the cases of production of curved bars.
- the curvature is obtained after performing the separations 27 and 28 by applying the deformable support 3 to an adequate curved shape.
- the microassembly solution shown in FIG. 3a comprises, with the preferred variant with grooving 17,18 of fully metallized strips, two printed circuits 35,36 (obtained for example by etching) each comprising a flared part whose head has a rounded shape to nest under, or near the support curved 3.
- Each printed circuit has a number of tracks 37, 38 flaring into a corolla in the head of the circuit.
- the number of tracks is equal to the number of piezoelectric elements of the probe.
- these printed circuits include a track 39 which crowns the circuit.
- the track 39 is intended to be connected, by electrical connection wires 40 and 42, to the connections 32 and 33 of each of the parallelepipedic blocks.
- the ends of each of the tracks 37, 38 are intended to be connected by connecting wires 41 to the connections 32 of the parallelepipedic blocks. Similar connections are made for circuit 36.
- connections 40 to 42 provide, compared to the mounting of the prior art cited, an additional advantage of symmetry of the connection. Indeed in the state of the art cited a connection relating to one of the faces of the elements was organized on one side of the bar, while the other connection (to the other face of the elements) was organized on the other side of the bar. This resulted in a harmful change in the operation of the piezoelectric crystal.
- the supply by the same side of the strip, or better still in a preferred manner by the two sides of the strip at the same time, of the two electrodes of each element has the effect of avoiding this drawback.
- the technique used to make connections 40 to 42 is derived from a link type technique practiced in semiconductor technology.
- connection technique used and a technique called reflow.
- circuit 35 is approached on each side of the curved bar.
- Circuit 35 includes, at the ends of the tracks and opposite the crowning track, metallized holes 43 to 45. These metallized holes are arranged opposite the faces 31 to 33 respectively of the relay blocks of each of the piezoelectric elements.
- the metallization of these holes as well as the metallization of these lateral faces is suitable for receiving a tiny drop of Indium obtained by growth.
- the printed circuit is applied against the strip so that the corresponding drops touch. Then by moderate heating (90 °) under vacuum, the reflow is carried out. Under these conditions, the drops melt into each other as well as into the metalizations which carry them.
- the advantage of this solution is to make the simultaneous connection of all the blocks, and therefore of all the elements. Other operations are then carried out in a conventional manner.
- a connector is produced to connect the probe to its electronic circuits (not shown) as well as a protective cover for the probe thus prepared.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT87907780T ATE85450T1 (de) | 1986-11-28 | 1987-11-24 | Echographie-wandler mit verbindungsschaltung. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8616660 | 1986-11-28 | ||
FR8616660A FR2607590B1 (fr) | 1986-11-28 | 1986-11-28 | Sonde d'echographe avec circuit de connexion perfectionne |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0335878A1 true EP0335878A1 (fr) | 1989-10-11 |
EP0335878B1 EP0335878B1 (fr) | 1993-02-03 |
Family
ID=9341353
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87907780A Expired - Lifetime EP0335878B1 (fr) | 1986-11-28 | 1987-11-24 | Sonde d'echographe avec circuit de connexion perfectionne |
EP87402634A Withdrawn EP0271394A1 (fr) | 1986-11-28 | 1987-11-24 | Sonde d'échographe avec circuit de connexion perfectionné |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87402634A Withdrawn EP0271394A1 (fr) | 1986-11-28 | 1987-11-24 | Sonde d'échographe avec circuit de connexion perfectionné |
Country Status (7)
Country | Link |
---|---|
US (1) | US5027822A (fr) |
EP (2) | EP0335878B1 (fr) |
JP (1) | JPH02503753A (fr) |
AT (1) | ATE85450T1 (fr) |
DE (1) | DE3784078T2 (fr) |
FR (1) | FR2607590B1 (fr) |
WO (1) | WO1988004090A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281887A (en) * | 1992-06-15 | 1994-01-25 | Engle Craig D | Two independent spatial variable degree of freedom wavefront modulator |
FR2702309B1 (fr) * | 1993-03-05 | 1995-04-07 | Thomson Csf | Procédé de fabrication d'une sonde acoustique multiéléments, notamment d'une sonde d'échographie. |
JP3487981B2 (ja) * | 1994-10-20 | 2004-01-19 | オリンパス株式会社 | 超音波プローブ |
WO2004091255A1 (fr) * | 2003-04-01 | 2004-10-21 | Olympus Corporation | Vibrateur ultrasonore et son procede de fabrication |
US10347818B2 (en) * | 2016-03-31 | 2019-07-09 | General Electric Company | Method for manufacturing ultrasound transducers |
US10596598B2 (en) * | 2016-12-20 | 2020-03-24 | General Electric Company | Ultrasound transducer and method for wafer level front face attachment |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217684A (en) * | 1979-04-16 | 1980-08-19 | General Electric Company | Fabrication of front surface matched ultrasonic transducer array |
JPS5920240B2 (ja) * | 1979-11-02 | 1984-05-11 | 横河電機株式会社 | 超音波探触子及び該超音波探触子の製造方法 |
JPS5711648A (en) * | 1980-06-27 | 1982-01-21 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
JPS5990498A (ja) * | 1982-11-15 | 1984-05-24 | Toshiba Corp | 超音波探触子 |
US4773140A (en) * | 1983-10-31 | 1988-09-27 | Advanced Technology Laboratories, Inc. | Phased array transducer construction |
EP0145429B1 (fr) * | 1983-12-08 | 1992-02-26 | Kabushiki Kaisha Toshiba | Ensemble linéaire courbé de transducteurs ultrasonores |
JPS60140153A (ja) * | 1983-12-28 | 1985-07-25 | Toshiba Corp | 超音波探触子の製造方法 |
JPS63207300A (ja) * | 1987-02-24 | 1988-08-26 | Toshiba Corp | 超音波プロ−ブ |
-
1986
- 1986-11-28 FR FR8616660A patent/FR2607590B1/fr not_active Expired
-
1987
- 1987-11-24 EP EP87907780A patent/EP0335878B1/fr not_active Expired - Lifetime
- 1987-11-24 EP EP87402634A patent/EP0271394A1/fr not_active Withdrawn
- 1987-11-24 WO PCT/FR1987/000462 patent/WO1988004090A1/fr active IP Right Grant
- 1987-11-24 DE DE8787907780T patent/DE3784078T2/de not_active Expired - Fee Related
- 1987-11-24 JP JP63500066A patent/JPH02503753A/ja active Pending
- 1987-11-24 AT AT87907780T patent/ATE85450T1/de not_active IP Right Cessation
- 1987-11-24 US US07/368,336 patent/US5027822A/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO8804090A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1988004090A1 (fr) | 1988-06-02 |
US5027822A (en) | 1991-07-02 |
JPH02503753A (ja) | 1990-11-08 |
ATE85450T1 (de) | 1993-02-15 |
FR2607590B1 (fr) | 1989-09-08 |
EP0271394A1 (fr) | 1988-06-15 |
DE3784078D1 (de) | 1993-03-18 |
EP0335878B1 (fr) | 1993-02-03 |
FR2607590A1 (fr) | 1988-06-03 |
DE3784078T2 (de) | 1993-06-09 |
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