EP0335277A1 - Procédé et appareil de dépôt sur des surfaces déterminées par voie électrolytique - Google Patents

Procédé et appareil de dépôt sur des surfaces déterminées par voie électrolytique Download PDF

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Publication number
EP0335277A1
EP0335277A1 EP89105309A EP89105309A EP0335277A1 EP 0335277 A1 EP0335277 A1 EP 0335277A1 EP 89105309 A EP89105309 A EP 89105309A EP 89105309 A EP89105309 A EP 89105309A EP 0335277 A1 EP0335277 A1 EP 0335277A1
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EP
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Prior art keywords
gap
solution
anode
workpiece
plating
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Granted
Application number
EP89105309A
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German (de)
English (en)
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EP0335277B1 (fr
Inventor
Gary W. Smith
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Sifco Industries Inc
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Sifco Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece

Definitions

  • the invention relates to a method and an apparatus for electroplating, and more particularly to the electrodeposition of metal on a selected surface of a workpiece according to the gap electroplating method.
  • the invention In contrast to tank or bath plating, in which a remotely located, consumable or non-consumable anode is placed in a container together with a workpiece to be treated, the invention relates to gap electroplating.
  • bath plating the metal is deposited on all surfaces of the workpiece that are in the tank using electrolysis technology.
  • the workpiece In order to plate only a selected surface in such a tank or container method, the workpiece must be masked, provided with a protective coating or otherwise protected from the bath solution in the tank.
  • a completely different concept is used for gap electroplating.
  • An anode is given a shape and surface which is largely adapted to the shape and the selected surface of the workpiece to be plated.
  • This gap electroplating can be carried out in a container and is often carried out in a container for galvanic surface treatment; however, gap electroplating does not necessarily require a tank. Rather, it can also be accomplished by passing a plating solution into the gap between the anode and cathode while allowing a current to flow between these two electrodes as long as a closed or uninterrupted flow of plating agent flows through the gap.
  • This type of gap plating is the subject of the present invention.
  • Closed loop gap electroplating is generally described in U.S. Patents 4,111,761 to LaBoda and 4,441,976 to Iemmi, where an anode having a cylindrical outer peripheral surface is concentric in a cylindrical surface to be plated workpiece is arranged with which it forms a gap or a plating cell.
  • the rest of the workpiece, including its entire outer surface, should not be clad.
  • the electroplating solution is not brought into contact with the surface of the workpiece that is not to be plated.
  • a modified container system is used in the process of U.S. Patent 4,345,977 to Blanc. Cladding of the outer part of the workpiece is prevented here by seals.
  • the inner cylinder surface is primarily plated by this device due to the anode arrangement and the solution flow, but other parts of the workpiece are also plated because the tank actually encloses more than the selected inner cylinder surface.
  • This patent does not disclose gap electroplating, but it shows, in general form, an apparatus for Plating a selected area.
  • chromium from container plating is not entirely satisfactory for the repair of workpieces, that is, for plating the inside surface of a bore in a high strength steel forging.
  • chrome plating for repairing worn surfaces even if possible and / or desirable, requires extremely long plating times. Higher current densities to reduce this plating time do not significantly increase the rate at which chrome is deposited because the efficiency decreases rapidly with increased current density.
  • the plating method and apparatus according to the invention have been created to achieve substantial advantages over special plating for a specific application, which is about plating selective surfaces, while the workpiece itself does not require special treatment, and where the long coating time which is required when tank plating is not required.
  • a remarkably thick metal layer is rapidly deposited on a selected surface of a workpiece, even if the workpiece is complex in shape, without masking and other complex, lengthy and time-consuming pre-plating processes.
  • the invention provides an electroplating device for rapidly depositing a metal on a selected surface of the workpiece, which has an anode with an active surface of selected shape which, together with the selected surface shape of the workpiece, forms an elongated gap of at least 0.050 "
  • An electroplating device is a carrier that fixes this anode in position to form the elongated gap, and a circulating device is provided which forces an electroplating solution loaded with metal ions through the gap in a substantially closed circuit at a rate that the electroplating solution is in the gap is replaced at least 25 times per minute.
  • a power source is also provided to allow current to flow between the selected workpiece area and the active area of the anode at a current density greater than 2.0 A / "2 (2.0 amperes / square inch) .
  • This new device according to the invention is primarily suitable for plating a cylindrical inner surface in a substantially complex shaped, high-strength steel forging, in which the gap has an annular cross section and has a first and a second end face.
  • the plating solution is pressed from the first end of the gap to the second end thereof at an ultra high speed.
  • the anode is a non-consumable anode and the plating solution consists of nickel sulfamate.
  • the flow rate through the gap can be referred to as "ultra high speed” or “high speed flow rate” because the flow rate or fluid exchange through the gap is greater than before.
  • the flow rate is preferably of the order of 200 to 1000 times the exchange of solution in the gap per minute.
  • the ultra high liquid exchange rate can be at least 2500 times per minute, being limited only by the equipment and pumps available.
  • a gap is created between the selected surface of a fixed anode and the selected surface to be plated.
  • This gap controls the solution flow along these surfaces.
  • Ultra-high flow rates allow high current densities, which in turn result in rapid metal deposition from the flowing plating solution, which is preferably nickel.
  • a fresh, unused plating solution of controlled temperature is available in all cross-sectional areas of the gap for uniform plating, which exerts a high contact pressure on the surfaces delimiting the gap.
  • the plating solution is pushed vertically upwards, so that all gas which develops in the gap during electrolysis migrates upwards and is expelled in the same direction as the plating solution.
  • the method according to the invention which uses the device explained above, serves for gap plating of a selected surface of a workpiece.
  • This selected surface to be plated forms the boundary of the above-mentioned plating gap.
  • the primary object of the invention is to provide a gap plating method and apparatus which uses ultra-high flow rates or flow rates of the plating solution through the gap.
  • the gap is the plating cell between a fixed anode and the special surface of the workpiece that was selected for the plating.
  • the invention has the advantage that current densities exceeding 2.0 A / "2 can be used, so that the plating speed is increased significantly and the plating time is reduced, thereby making an application previously in a tank over three days lasted, can now go on in less than two to four hours.
  • Another advantage of the invention is that thick, uniform surfaces can be produced which have so far been difficult, if at all, to achieve without substantial clamping and / or masking by tank plating.
  • a swirling flow of the plating solution through the annular gap is used where the flow is generated by the plating solution itself.
  • Another advantage of the invention is that the plating solution can be maintained at a uniform, relatively low temperature over the entire length of the gap to ensure uniform plating along the entire gap.
  • a device A is shown according to the invention, which is used to apply a uniform layer of an electroplatable metal, such as nickel, on a selected surface S in the form of a cylindrical wall 10, which has a lower, conically recessed part 12 and an upper, conically recessed part 14 in a complex workpiece W.
  • an electroplatable metal such as nickel
  • the present invention can be used for plating selective surfaces of relatively simple workpiece shapes, one of its remarkable advantages is that it can be used on a complex workpiece as represented by workpiece W, which in the illustrated embodiment is a high strength steel forging for aircraft landing gear, in which the surface 10 is a supporting surface, which may be subject to gnawing corrosion and must be repaired from time to time by metal plating in order to restore the usability of the core forging.
  • workpiece W which in the illustrated embodiment is a high strength steel forging for aircraft landing gear, in which the surface 10 is a supporting surface, which may be subject to gnawing corrosion and must be repaired from time to time by metal plating in order to restore the usability of the core forging.
  • the selectively plated surface S is generally cylindrical, as shown in the workpiece W, which has many surface areas that are not to be plated, such as the entire outer surface to which, as examples of unplated shapes, include a gear member 20, an elongated bushing 22, outwardly projecting areas such as a shoulder 24, a lower flange 26, an outwardly projecting support projection 28, and many other outer and inner surface areas that are not to be plated. It can be seen that if this forging W were plated as a cathode in a plating tank, the entire surface of the forging would normally be plated to a certain extent.
  • the present invention now provides a method in which the current density can be increased drastically in a plating process in order to increase the rate of deposition of a material, such as nickel, on the surface S.
  • the preferred material deposits at a rate that increases significantly with increasing current density, even if the efficiency can be somewhat lower than that which is achieved with low current densities, such as less than 1.0 A / "2 .
  • the device A according to the invention can plate a selected surface S with its recessed parts 12 and 14, using a high current density above 2.0 A / "2 to reduce the plating time required to reach a predetermined metal thickness to reach a size greater than 0.050 ".
  • a high current density can be maintained so that the deposited layer grows proportionally with the plating time.
  • the invention is particularly applicable to the deposition of nickel on the selected surface S, since the deposit increases with the current density without a significant drop in efficiency, as has been observed with chrome plating in the tank.
  • the workpiece W is one of many complex forgings, in which internal bores often have to be rebuilt after their wear or if they have been worked to excess.
  • the device A can repair, eliminate or correct defects in a complex workpiece in a relatively short time, so that the expensive forging W can be obtained in an economical manner. This saves many such forgings from the scrap because in the past, remanufacturing often cost more than a new forging, remanufacturing was often impossible, or forgings could be severely damaged by immersion in tank plating solutions, especially if the masking had not been properly performed .
  • the same hole in Similar forgings can be plated with the same device without new adjustment.
  • the device A has components that are made for the surface S. Other holes or surfaces require modified but functionally the same components as those shown in FIG. 2.
  • a lower or first end cap 30 engages and seals gap g , which is the plating cell defined by surface S and anode 40.
  • An upper or second end cap 32 closes the other end of the plating cell on the receding part 14 of the surface S. The end caps are clamped together and sit tightly on the opposite ends of the surface S, the anode 40 being concentrically surrounded by the surface S and itself extends axially through the plating cell parallel to the cylinder surface 10.
  • a suitable fastening device is provided, which is shown as a support foot 50.
  • This support leg carries an upwardly directed, rigid metal tube 52 which connects the support leg 50 to the cap 32, as shown in FIGS. 1 and 2, so that the workpiece W and the end caps 30 and 32 with the surface S in between in layers fixed position are arranged so that the first end cap is under the second end cap.
  • An ultra high throughput liquid pump 60 which has a reservoir for the electroplating solution, which in the preferred embodiment is nickel sulfamate, pumps the solution in a closed circuit P through the plating cell defined by end caps 30 and 32. This liquid flow has an ultra-high volume.
  • the liquid pump 60 pumps 300 to 700 gallons of liquid per hour, so that the solution flows along the path indicated by the arrows in FIGS. 1 and 2 at such a high speed that the solution in the plating cell is exchanged on the order of 200 to 1000 times per minute.
  • the pump has an ultra high volume flow rate to force a liquid flow through the annular gap g at a rate which results in a complete change of the liquid at least 25 times / minute. This extremely large volume flow allows nickel to deposit on the surface S from the plating solution if a current density above 2.0 A / "2 is used.
  • the current density can also increase to at least approximately 10.0 A / "2 can be increased to substantially increase the amount of nickel deposited on the surface S from the plating solution.
  • the anode 40 is a non-consumable anode. For this reason, the gap g remains constant over the plating cycle, which lasts less than six hours in the illustrated embodiment. The same precipitation of nickel previously required when plating using the tank plating system, about three days when it could be reached.
  • the pump 60 conveys the nickel sulfamate or similar plating solution into a high pressure plastic delivery line 62 which extends up the tube 52 into the lower end cap.
  • the liquid flow then moves up through the plating cell defined by surface S and anode 40 and exits through upper end cap 32 into two outflow lines 64 and 66 which open into a larger return line 68.
  • the outflow through the upper end cap 32 is more evenly distributed by one To prevent cavitation and to achieve a smooth flow of the plating solution through the respective plating cell.
  • direct current is passed through the annular gap g from a conventional portable plating power source.
  • an anode terminal 80 is connected to the anode 40 and a cathode terminal 82 to the workpiece or forging W.
  • a cathode is connected next to the end caps 30 and 32 of the device A by placing a clamp around the workpiece W in the vicinity of the surface S.
  • the special construction for applying a current flowing through the fixed, annular gap g is not part of the invention and can be realized by various electrical connections.
  • the electrical current flow between terminals 80 and 82 is adjusted to achieve the desired plating performance, which is extremely high to achieve the greatest benefit of the invention and is at least about 2.0 A / "2.
  • the current density can increase as much how to increase the flow rate provided by pump 60.
  • the pumps currently available perform about 300 to 800 gallons / min and, as stated above, create an ultra high volume flow rate of at least about 200 times / min To achieve electroplating solution in the gap g .
  • the lower end cap 30 is designed to ensure an even distribution of the plating solution in the gap g at the ultra high flow rate. As a result, all cross-sectional areas of the cylindrical anode surface and surface S are continuously and uniformly coated with a fresh plating solution in intimate, direct, continuous, physical and electrical surface contact.
  • the end cap 30 has a nose 100 which has an outer peripheral surface which is specially shaped and dimensioned such that it is adapted to the contour 102 of the workpiece W. In the drawing, this contour has annular, concentric shoulders 104 and 106 which form part of the overall shape of the workpiece. These shoulders are concentric with the surface S and define the outer peripheral surface of the nose 100 which is shaped for the bore shown.
  • a second part namely a lower base plate 110, is clamped to parallel end faces 112 and 114 which extend to the side with a plurality of bolts 116 which are arranged at a distance from one another and which pull the nose 100 and the base plate 110 together.
  • An O-ring 118 seals the inner flow openings of the cap 30. These flow openings receive the high-pressure plating solution, which flows through the inflow line 62 with an ultra-high flow rate. The solution moves through the cap 30, as indicated by the arrows in FIG. 2.
  • the base plate 110 has a central threaded bore 120 which receives the threaded end 122 of the feed line 62, which is used to connect this high pressure pipe to the base plate 110.
  • a concentric, second threaded bore 130 receives the threaded end 132 of the rigid support tube 52, which carries the device A and the workpiece W in its vertical position.
  • the nose 100 is provided with the base flow openings of the lower end cap 30 and has an outward shoulder 140 which abuts the concentric shoulder 106 of the workpiece W to align the cap 30.
  • an O-ring 142 with a rectangular cross section is arranged such that its outer circular edge 146 with the edge 148 on extreme end of the conical recess part 12 coincides such that the edge 146 delimits the outer edge of the plating area of the plating cell.
  • the edges 146 and 148 can be brought into exact alignment by hand by moving the workpiece W on the nose 100 before the anode 40 clamps the upper end cap 32 in place.
  • the inner flow openings of the cap 30 include a concentric plenum 150, which has a diameter e and a height of 1 2nd
  • the diameter e is approximately the same size as the diameter a of the cylindrical part 10 of the surface S, so that a large volume of solution coming from the supply line 62 can collect in the plenum chamber 150 before it leaves the plenum chamber into a distribution space 160 at the upper, exposed end of the nose 100.
  • a novel nozzle arrangement is provided in order to bring the solution from the lower plenum chamber 150 into the upper distribution space.
  • This nozzle arrangement generates a plurality of separate and different, spiral flows of plating solution 170, which are shown schematically in FIG. 2 as spiral arrows 170.
  • the nozzle device for generating this spiral-shaped flow through the annular gap g is produced by a plurality of holes or bores 180 arranged at a distance from one another in the circumferential direction, eight of which are shown at the same circumferential distance from one another.
  • Holes 180 in the preferred embodiment of the invention are approximately diameter 1 4th ", which is shown schematically as the dimension f in FIGS. 2 and 4.
  • a central threaded bore 190 is provided which receives the threaded end 192 of the anode 40 and supports the lower end of the anode of device A when the two caps are in the plating position.
  • the nose 100 and the base plate 110 consist of a suitable plastic material which is non-conductive and forms an insulation between the positive anode 40 and the negatively polarized workpiece W.
  • the upper end cap 32 has a substantially flat plastic body, in which there is an annular recess 204, in which a downwardly extending, right in cross section angular O-ring 202 is located, the lower inner edge 206 of which coincides with the outer edge 208 of the conical, recessed part 14 to be plated.
  • the O-ring 202 has the same function as the O-ring 142 of the lower end cap, so that these two rectangular O-rings limit the extreme extent of the selected surface to be plated during the operation of the device A.
  • the body 200 has a central central opening 210 which receives the cylindrical shaft 218 of the anode 40.
  • a standard O-ring 212 is arranged in the central opening 210, which seals this opening against the shaft 218 of the anode, which can slide in the opening.
  • An upper collar 214 is fastened to the shaft 218 using a suitable means, for example a clamping screw 216.
  • the flow openings for the electroplating solution in the top cap 32 are designed to collect any gas that may be formed during the plating process. Due to its buoyancy, this gas can pass from the cap 30 upwards into the cap 32.
  • the body 200 has an outwardly flared conical top plenum 220 with a substantially flat surface that intersects with two spaced-apart bores 222 and 224 which receive threaded nipples 230 and 232 of drain lines 64 and 66, respectively. These lines have relatively large cross sections and must be at a distance from the anode 40.
  • the bores 222 and 224 therefore cut down into the conical surfaces 240 and 242 and form an oblique intersection with the conical surface which forms the cavity 220, as best shown in FIGS. 2 and 6.
  • the solution flowing through the gap g is collected in the cavity 220, which widens in the transverse direction, ie in a direction perpendicular to the direction of movement on the path P.
  • This outward expanding, speed reducing portion allows all of the gases that are formed during the plating process to be collected, but increasing the cross sectional area of the cross sectional area of surface 10 is not sufficient to significantly reduce the speed.
  • end 192 of anode 40 is screwed into bore 190 of lower end cap 30.
  • the workpiece W is then centered on the square O-ring 142 and positioned so that the edges 146 and 148 lie one on top of the other.
  • the body 200 is slid over the shaft 218 of the anode and guided down to a central position in which the edges 206 and 208 lie one on top of the other.
  • the collar 214 is fixed on the shaft 218 with the clamping screw 216.
  • the anode 40 is then rotated on its upper, polygonal part 250 in order to clamp the end caps together by screwing the lower end 192 into the threaded bore 190 of the lower end cap 30.
  • a suitable anode connector 252 is then snapped into the top of the anode and the anode and cathode leads are connected.
  • the pump 60 pushes the plating solution through the plating cell, as indicated by the arrows in FIG. 2, while current flows through the annular gap g . The plating process continues until the desired thickness of the plated metal has been reached.
  • a standard platinum coated titanium anode bar is machined to have a selected area of section 300 that matches the selected surface S to be plated.
  • this surface 10 is cylindrical. Therefore, the surface or the selected part 300 is also cylindrical and has a length h which is adapted to the length of the surface S to be plated.
  • the exposed parts of the anode 40, except for the region 300 are made of titanium, which is anodized and therefore does not generate current flow. The current therefore only flows from the surface 300 which is adapted to the surface S to be coated. Because the anode 40 is not consumable in one embodiment of the invention, the gap g remains constant and enables continuous and uniform flow through the plating cell without causing changes due to depletion or depletion of the anode.
  • FIG. 8 is a schematic representation of another embodiment of the invention.
  • the solution flow along the path P through the gap from the feed end F to the outlet end D between the end caps 30 and 32 is controlled so that a quick and forced exchange of plating solution in the gap g takes place.
  • the cross-sectional area or the boundary of the outlet lines 64 and 66 is larger than the cross-sectional area or the boundary of the feed line 62; however, the combined area of the outlet pipes is not larger than twice the cross-sectional area of the feed pipe. In this way, the flow of solution through the plating cell is controlled to cause a rate drop in the cell due to an increase in cross-sectional areas in the flow passage through the cell is prevented.
  • outlet cross-section is at least as large as the inlet cross-section, there is no back pressure and there is no significant reduction in speed since the outlet cross-section is not larger than about twice the inlet cross-section.
  • This is another feature of the invention that supports a uniform and continuous flow of plating solutions through the annular gap g .
  • the parameters given in Fig. 2 and discussed above represent an example of the present invention.
  • the surface 10 has a diameter of 1.62 "and the gap is 0.625". In practice, this gap is between 0.050 and 2.0 ".
  • the length of the area S is 1.50" and the current is approximately 30 A. 300 gallons of a nickel sulfamate plating solution are pumped through the gap g per hour.
  • the cross-sectional area A e of the plenum chamber 150 is approximately equal to the cross-sectional area A a of the bore of the workpiece, which is delimited by the surface 10; however, it is larger than the cross-sectional area of the gap g and considerably larger than the sum of the cross-sectional areas A f of the various holes 180 which represent the nozzles.
  • This example enables nickel deposition to the desired thickness with a plating cycle between 2.0 and 6.0 hours. In contrast, tank plating the same surface using chrome to the same thickness, if possible, would take more than three days.
  • the exchange rate of the plating solution in the gap g is at least 25 times / min. This is shown in general terms by the graph in Fig. 9, where the highest current density increases with the rate of exchange. This ratio defines an operating range that increases to 10 or more A / "2 while the exchange speed up to 2500 times / min. increases.
  • the current density used in the process is not necessarily the maximum current density, since other process parameters determine the exact current density that is desired by the operator for a particular workpiece to be machined.
  • the desired current density can be determined by the size of the gap, the temperature in the gap and related parameters which are not part of the present invention.
  • the ultra high flow rate is adjusted so that plating can only be accomplished using two separate closures or end caps which delimit the plating cell and that the plating solution passes through the gap between the anode and the selected surface to be plated at such a high speed is pushed through, that high current densities are possible.
  • the plating solution is a nickel solution and preferably nickel sulfamate. The temperature in the gap is maintained between 110 and 130 ° F.
  • the surface 10 is cylindrical and the peripheral surface 300 of the anode 40 is also cylindrical and defines a non-consumable anode.
  • the plating solution is any of the various plating solutions used in tankless selective plating processes. Chromium is usually not used in this type of process. The solutions normally preferred for selective plating are nickel, lead, copper, iron, tin and zinc. Of course, precious metals could also be used; however, the invention is primarily applicable for industrial purposes which do not intend to use precious metals. Chromium makes use of the present Invention difficulties in that the plating must be carried out very slowly and the advantages achieved by the rapid flow in chrome plating are not fully realized.
  • Chrome deposits are brittle and limited in thickness, which detracts from the utility of the present invention. In all cases, chromium would be difficult to use with the present invention and is therefore not preferred. However, some features of the invention can provide some advantage for a chrome plating system. Nickel is considered the preferred and best metal to be used in the practice of the present invention.
  • the solution flow is limited to the surface to be plated and the anode surface. There is no need for painting or other insulating coating to prevent unwanted plating.
  • the workpiece W can have different shapes.
  • By providing the high flow volume there is a constant solution / metal interface at the anode surface 300 and the surface S to be plated.
  • There is no liquid splashing of the solution and no other auxiliary inputs into the gap g which is due to the uniformity of the rapid axial movement can divert the gap flowing solution.
  • the tendency for gas formation in the solution decreases and there is a high surface pressure between the solution on the one hand and the anode surface and the surface S to be plated on the other hand, so that an extremely intensive liquid / metal interface contact is made with the flowing solution.
  • the gap g need not be precisely controlled as long as its cross section remains essentially the same so as not to interrupt the high surface pressure contact of the liquid solution flowing axially through the gap.
  • the gap shouldn't be Have areas that collect the solution or slow down the speed of the solution as it moves through the gap. Such a reduction in speed is common in tank plating and leads to stagnation and accumulation of weaker plating solution which is in contact with certain parts of the surface to be plated.
  • the direction of flow is directed upwards in the vertical direction in order to match the flow of any gas bubbles which arise during the plating process.
  • the term "ultra-high" volume means more than 25 solution exchanges in the gap g per minute and preferably more than 200 exchanges per minute.
  • the anode construction according to the invention is geometrically adapted to the surface 10 to be plated, in contrast to the tank plating method, where the anode is located far away from the surface to be plated and has no real geometric relationship with it.
  • the anode surface cooperates with the surface S and forms the gap through which the liquid flows at ultra high speed.
  • each workpiece could have its own specially designed fastening device.
  • This fastening device with the pump for the plating solution and the power supply for it are portable.
  • the solution runs through a closed system and can be refreshed periodically after a predetermined period of use.
  • uniform plating is achieved throughout the gap and there are no areas of stagnation, elevated temperature or lower flow rates.
  • This advantage is achieved by the high solution exchange rates, which are primarily limited by the resilience and design of the equipment and reach 2500 exchanges per minute, as graphically shown in FIG. 9.
  • the anode is shaped to match the selected shape to be plated; in the one preferred embodiment it is insoluble, i.e. unusable and allows current to flow only from the selected surface, for example from surface 300 shown in FIGS. 2 and 7. In this way, a uniform current also flows through the gap from the surface 300 of the anode to the surface S to be plated.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP89105309A 1988-03-28 1989-03-24 Procédé et appareil de dépôt sur des surfaces déterminées par voie électrolytique Expired - Lifetime EP0335277B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/174,431 US4853099A (en) 1988-03-28 1988-03-28 Selective electroplating apparatus
US174431 1993-12-28

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EP0335277A1 true EP0335277A1 (fr) 1989-10-04
EP0335277B1 EP0335277B1 (fr) 1994-05-25

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US (1) US4853099A (fr)
EP (1) EP0335277B1 (fr)
KR (1) KR910009403B1 (fr)
AT (1) ATE106105T1 (fr)
CA (1) CA1335972C (fr)
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CA1335972C (fr) 1995-06-20
US4853099A (en) 1989-08-01
KR910009403B1 (ko) 1991-11-15
ATE106105T1 (de) 1994-06-15
DE58907703D1 (de) 1994-06-30
EP0335277B1 (fr) 1994-05-25
KR890014786A (ko) 1989-10-25

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