EP0329050A1 - Electronic micro-circuit - Google Patents

Electronic micro-circuit Download PDF

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Publication number
EP0329050A1
EP0329050A1 EP89102421A EP89102421A EP0329050A1 EP 0329050 A1 EP0329050 A1 EP 0329050A1 EP 89102421 A EP89102421 A EP 89102421A EP 89102421 A EP89102421 A EP 89102421A EP 0329050 A1 EP0329050 A1 EP 0329050A1
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EP
European Patent Office
Prior art keywords
partition
housing
substrate
cavity
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89102421A
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German (de)
French (fr)
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EP0329050B1 (en
Inventor
Eric Fautrat
Christian Fagnon
Sante Fidanza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel Thomson Faisceaux Hertziens SA
Alcatel Telspace SA
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Publication of EP0329050A1 publication Critical patent/EP0329050A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices

Definitions

  • the invention relates to a microelectronic circuit.
  • This circuit makes it possible to carry out an electromagnetic decoupling by means of a partition separating two cavities, with active electrical vocation, of a microwave (or H.F.) box.
  • an electromagnetic decoupling is achieved by a partition obtained by machining the two adjacent cavities of the HF box.
  • the electrical transition between the two cavities is obtained thanks to an opening machined in the partition and shaving the internal bottom of the housing; it can also be complex in shape, matching as precisely as possible the silhouette of the electrical transition.
  • the position, the shape and the precision of the location of the opening make machining it in the partition difficult, and sometimes even impossible; since the small dimensions of the cavities do not allow the passage of the tool.
  • the object of the invention is to overcome these drawbacks.
  • the invention proposes, in fact, a microelectronic circuit comprising a microwave housing with at least one microelectronic substrate incorporated, this housing being provided with a longitudinal cavity in which each substrate is disposed, characterized in that this housing is provided with at least a couple of lateral housings machined on either side of the cavity, and in that a removable metal partition is disposed above the corresponding substrate between these two housings in order to partially obstruct said cavity.
  • the invention thus makes it possible to simultaneously establish an electrical connection between the two cavities as well as the necessary electromagnetic decoupling, while eliminating the machining problems described above.
  • the invention improves the electrical performance of the HF package by the fact that the two aforementioned substrates, housed in two adjacent cavities, come together in a single substrate; this solution offers the advantage of limiting the clearances or "voids” due to the addition of manufacturing tolerances - machining of the cavities, cutting of the substrate, positioning of the active component or components, etc. These "voids" are d otherwise harmful to operation HF enclosure electrical
  • the invention facilitates assembly of the assembly, since each active component can be mounted and welded to the substrate before the latter is housed in the housing.
  • the invention therefore makes it possible to reduce assembly times as well as the risks of workmanship.
  • the partition is formed of a central part provided in its lower part with an opening and on the sides of two elastic fins with respect to the latter so as to be blocked respectively in each lateral opening; It may for example be a metal blade which has been folded on either side of its central part to form two fins inclined relative to the latter.
  • the microelectronic circuit of the invention shown in FIG. 1, comprises: - An HF housing 10 in which a longitudinal cavity 11 is machined, a cover 12 which can be fixed to it using fixing means 9, for example screws, associated for example with holes 13 so as to close the cavity 11; - at least one microelectronic substrate 21; a removable partition 14 which can be placed in two lateral housings 15 and 16 machined in the lateral walls of the housing 10 on either side of the cavity 11.
  • the circuit shown by way of example in FIG. 1 is an AFB amplifier (low noise amplifier) operating for example in the frequency band 10.3 GHz - 10.7 GHz.
  • This circuit has four parts: - an input circulator 17; - an amplifier proper 18; - an output circulator 19; - an impedance matching line 20;
  • FIG. 1 These different parts formed from etched substrates are shown diagrammatically in FIG. 1.
  • the amplifier proper 18 is formed of an etched substrate 21 onto which the active components 22, here two in number, are welded, and of "C.M.S.” components. 23 (surface mounted components) such as capacities, resistances ...
  • a coaxial input plug 24 and a coaxial output plug 25 make it possible to make a connection respectively with the circulator 17 and with the line 20.
  • Two grooves 31 and 32 are produced near the inlet and the outlet of the housing 10, to allow better positioning of the circulator 17 respectively with respect to the plug 24 and of the line 20 with respect to the plug 25.
  • the removable partition 14, shown more particularly in FIG. 3, is formed by a flat central part 26 provided in its lower part with an opening 27, here semi-circular, and on its two sides with two lateral fins 28 and 29 exhibiting a certain elasticity with respect thereto.
  • This partition 14 can be, as here, a metal blade which has been folded on either side of the central part 26 to form two fins 28 and 29 inclined relative to the latter.
  • this partition 14 is shown once placed in the housing 10 between the two orifices 15 and 16.
  • An absorbent plate 30, shown in Figure 2 is disposed between the upper part of this partition 14 and the cover 12 to absorb any vibrations in the vertical direction when using the circuit in a material, the longitudinal vibrations being damped due to the elasticity of this partition 14.
  • This partition 14 is made of a material with low transmission and a high power of reflection of the electromagnetic radiation due to the presence of at least one active element (transistors 22): It can thus be made of beryllium bronze.
  • the plate 30 is made of absorbent material from a point of view radioelectric.
  • housing 10 and its cover can be made of aluminum alloy, the (or) substrates of ferrite, epoxy or duroid.
  • the amplifier A.F.B. above operating in the band 10.3 GHz - 10.7 GHz was produced with a housing of dimensions of the order of 72 cm x 21 cm x 16 cm.
  • the installation of the circuit of the invention is carried out as follows: - The cavity 11 is machined in the housing 10 by making the two lateral housings 15 and 16 face to face on either side of the cavity 11; - The partition 14 is put in place by simple vertical pressure after having housed the substrate (s) (21); the blocking of the partition 14 being effected by the elasticity of the two fins 28 and 29; - There is an absorbent plate 30 for electrical purposes above the partition 14 to allow the vertical maintenance thereof; - the cover 12 is fixed above the housing 10.
  • the characteristics of the invention therefore make it possible to produce a very simplified and better quality precise wiring assembly, the removable partition 14 being installed at the end of assembly.
  • the microelectronic circuit produced can be something other than an amplifier, it can also include any number of substrates.

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Microelectronic circuit comprising a microwave case (10) with at least one incorporated microelectronic substrate (17, 18, 19, 10), this case being provided with a longitudinal cavity (11) in which each substrate (17, 18, 19, 20) is arranged. This case (10) is provided with at least one pair of lateral housings (15, 16) machined on either side of the cavity (11). A removable metal partition (14) is arranged above the corresponding substrate between these two housings (15, 16) in order to be able to partially obstruct the said cavity (11). Application to the field of microwave frequencies. <IMAGE>

Description

L'invention concerne un circuit microélectronique.The invention relates to a microelectronic circuit.

Ce circuit permet de réaliser un découplage électromagnétique par l'intermédiaire d'une cloison séparant deux cavités, à vocation électrique active, d'un boîtier hyperfréquence (ou H.F.).This circuit makes it possible to carry out an electromagnetic decoupling by means of a partition separating two cavities, with active electrical vocation, of a microwave (or H.F.) box.

Dans les dispositifs de l'art connu, un découplage électromagnétique est réalisé par une cloison obtenue en usinant les deux cavités adjacentes du boîtier H.F. La transition électrique entre les deux cavités (composant électronique, piste ou câble) est obtenue grâce à une ouverture usinée dans la cloison et rasant le fond interne du boîtier ; celle-ci pouvant d'ailleurs être de forme complexe, épousant le plus précisément possible la silhouette de la transition électrique. La position, la forme ainsi que la précision d'emplacement de l'ouverture rendent son usinage dans la cloison difficile, et même quelquefois impossible ; dès lors que les petites dimensions des cavités ne permettent pas le passage de l'outil.In the devices of the known art, an electromagnetic decoupling is achieved by a partition obtained by machining the two adjacent cavities of the HF box. The electrical transition between the two cavities (electronic component, track or cable) is obtained thanks to an opening machined in the partition and shaving the internal bottom of the housing; it can also be complex in shape, matching as precisely as possible the silhouette of the electrical transition. The position, the shape and the precision of the location of the opening make machining it in the partition difficult, and sometimes even impossible; since the small dimensions of the cavities do not allow the passage of the tool.

L'invention a pour objet de pallier ces inconvénients.The object of the invention is to overcome these drawbacks.

L'invention propose, en effet, un circuit microélectronique comportant un boîtier hyperfréquence avec au moins un substrat microélectronique incorporé, ce boîtier étant muni d'une cavité longitudinale dans laquelle est disposé chaque substrat, caractérisé en ce que ce boîtier est muni d'au moins un couple de logements latéraux usinés de part et d'autre de la cavité, et en ce qu'une cloison métallique amovible est disposée au-dessus du substrat correspondant entre ces deux logements pour venir obstruer en partie ladite cavité.The invention proposes, in fact, a microelectronic circuit comprising a microwave housing with at least one microelectronic substrate incorporated, this housing being provided with a longitudinal cavity in which each substrate is disposed, characterized in that this housing is provided with at least a couple of lateral housings machined on either side of the cavity, and in that a removable metal partition is disposed above the corresponding substrate between these two housings in order to partially obstruct said cavity.

L'invention permet ainsi d'établir simultanément une liaison électrique entre les deux cavités ainsi que le découplage électromagnétique nécessaire, tout en s'affranchissant des problèmes d'usinage décrits ci-dessus.The invention thus makes it possible to simultaneously establish an electrical connection between the two cavities as well as the necessary electromagnetic decoupling, while eliminating the machining problems described above.

De plus, l'invention améliore les performances électriques du boîtier H.F. par le fait que les deux substrats précités, logés dans deux cavités voisines, se réunissent en un seul et unique substrat ; cette solution offre l'avantage de limiter les jeux ou "vides" dus à l'addition des tolérances de fabrication - usinage des cavités, de découpe du substrat, de positionnement du ou des composants actifs etc... Ces "vides" sont d'ailleurs nuisibles au fonctionnement électrique du boîtier H.F.In addition, the invention improves the electrical performance of the HF package by the fact that the two aforementioned substrates, housed in two adjacent cavities, come together in a single substrate; this solution offers the advantage of limiting the clearances or "voids" due to the addition of manufacturing tolerances - machining of the cavities, cutting of the substrate, positioning of the active component or components, etc. These "voids" are d otherwise harmful to operation HF enclosure electrical

En outre, l'invention facilite le montage de l'ensemble, car chaque composant actif peut être monté et soudé sur le substrat avant que ce dernier ne soit logé dans le boîtier. L'invention permet donc de réduire les temps de montage ainsi que les risques de malfaçon.In addition, the invention facilitates assembly of the assembly, since each active component can be mounted and welded to the substrate before the latter is housed in the housing. The invention therefore makes it possible to reduce assembly times as well as the risks of workmanship.

Avantageusement, la cloison est formée d'une partie centrale munie dans sa partie inférieure d'une ouverture et sur les côtés de deux ailettes élastiques par rapport à celle-ci pour venir se bloquer respectivement dans chaque ouverture latérale ; Ce peut être par exemple une lame métallique qui a été pliée de part et d'autre de sa partie centrale pour former deux ailettes inclinées par rapport à celle-ci.Advantageously, the partition is formed of a central part provided in its lower part with an opening and on the sides of two elastic fins with respect to the latter so as to be blocked respectively in each lateral opening; It may for example be a metal blade which has been folded on either side of its central part to form two fins inclined relative to the latter.

Les caractéristiques et avantages de l'invention ressortiront d'ailleurs de la description qui va suivre, à titre d'exemple non limitatif, en référence aux figures annexées sur lesquelles :

  • - la figure 1 représente une vue de dessus du circuit microélectronique de l'invention, le boîtier étant présenté sans son couvercle ;
  • - la figure 2 représente une vue en coupe transversale du circuit microélectronique de l'invention, selon le plan II-II de la figure 1 ;
  • - la figure 3 représente une cloison amovible utilisée dans le circuit microélectronique de l'invention tel que représenté aux figures 1 et 2.
The characteristics and advantages of the invention will become apparent from the description which follows, by way of nonlimiting example, with reference to the appended figures in which:
  • - Figure 1 shows a top view of the microelectronic circuit of the invention, the housing being presented without its cover;
  • - Figure 2 shows a cross-sectional view of the microelectronic circuit of the invention, along the plane II-II of Figure 1;
  • FIG. 3 represents a removable partition used in the microelectronic circuit of the invention as shown in FIGS. 1 and 2.

Le circuit microélectronique de l'invention, représenté à la figure 1, comprend :
- un boîtier H.F. 10 dans lequel est usiné une cavité longitudinale 11, un couvercle 12 pouvant lui être fixé en utilisant des moyens de fixation 9, par exemple des vis, associés par exemple à des trous 13 de manière à fermer la cavité 11 ;
- au moins un substrat microélectronique 21 ;
- une cloison amovible 14 qui peut être disposée dans deux logements latéraux 15 et 16 usinés dans les parois latérales du boîtier 10 de part et d'autre de la cavité 11.The microelectronic circuit of the invention, shown in FIG. 1, comprises:
- An HF housing 10 in which a longitudinal cavity 11 is machined, a cover 12 which can be fixed to it using fixing means 9, for example screws, associated for example with holes 13 so as to close the cavity 11;
- at least one microelectronic substrate 21;
a removable partition 14 which can be placed in two lateral housings 15 and 16 machined in the lateral walls of the housing 10 on either side of the cavity 11.

Le circuit représenté à titre d'exemple sur la figure 1 est un amplificateur A.F.B. (amplificateur faible bruit) fonctionnant par exemple dans la bande de fréquence 10,3 GHz - 10,7 GHz. Ce circuit comprend quatre parties :
- un circulateur d'entrée 17 ;
- un amplificateur proprement dit 18 ;
- un circulateur de sortie 19 ;
- une ligne d'adaptation d'impédance 20 ;
The circuit shown by way of example in FIG. 1 is an AFB amplifier (low noise amplifier) operating for example in the frequency band 10.3 GHz - 10.7 GHz. This circuit has four parts:
- an input circulator 17;
- an amplifier proper 18;
- an output circulator 19;
- an impedance matching line 20;

Ces différentes parties formées de substrats gravés sont représentées schématiquement sur la figure 1.These different parts formed from etched substrates are shown diagrammatically in FIG. 1.

L'amplificateur proprement dit 18 est formé d'un substrat 21 gravé sur lequel sont soudés les composants actifs 22, ici au nombre de deux, et des composants "C.M.S." 23 (composants montés en surface) tels que capacités, résistances...The amplifier proper 18 is formed of an etched substrate 21 onto which the active components 22, here two in number, are welded, and of "C.M.S." components. 23 (surface mounted components) such as capacities, resistances ...

Une fiche d'entrée coaxiale 24, et une fiche de sortie coaxiale 25 permettent d'effectuer une liaison respectivement avec le circulateur 17 et avec la ligne 20.A coaxial input plug 24 and a coaxial output plug 25 make it possible to make a connection respectively with the circulator 17 and with the line 20.

Deux rainures 31 et 32 sont réalisées à proximité de l'entrée et de la sortie du boîtier 10, pour permettre un meilleur positionnement respectivement du circulateur 17 par rapport à la fiche 24 et de la ligne 20 par rapport à la fiche 25.Two grooves 31 and 32 are produced near the inlet and the outlet of the housing 10, to allow better positioning of the circulator 17 respectively with respect to the plug 24 and of the line 20 with respect to the plug 25.

La cloison amovible 14, représentée plus particulièrement à la figure 3, est formée d'une partie centrale plane 26 munie dans sa partie inférieure d'une ouverture 27, ici semi-circulaire, et sur ses deux côtés de deux ailettes latérales 28 et 29 présentant une certaine élasticité par rapport à celle-ci.The removable partition 14, shown more particularly in FIG. 3, is formed by a flat central part 26 provided in its lower part with an opening 27, here semi-circular, and on its two sides with two lateral fins 28 and 29 exhibiting a certain elasticity with respect thereto.

Cette cloison 14 peut être, comme ici, une lame métallique qui a été pliée de part et d'autre de la partie centrale 26 pour former deux ailettes 28 et 29 inclinées par rapport à celle-ci.This partition 14 can be, as here, a metal blade which has been folded on either side of the central part 26 to form two fins 28 and 29 inclined relative to the latter.

Sur les figures 1 et 2, cette cloison 14 est représentée une fois disposée dans le boîtier 10 entre les deux orifices 15 et 16.In FIGS. 1 and 2, this partition 14 is shown once placed in the housing 10 between the two orifices 15 and 16.

Une plaque absorbante 30, représentée à la figure 2, est disposée entre la partie supérieure de cette cloison 14 et le couvercle 12 pour amortir les vibrations éventuelles dans le sens vertical lors de l'utilisation du circuit dans un matériel, les vibrations longitudinales étant amorties du fait de l'élasticité de cette cloison 14.An absorbent plate 30, shown in Figure 2, is disposed between the upper part of this partition 14 and the cover 12 to absorb any vibrations in the vertical direction when using the circuit in a material, the longitudinal vibrations being damped due to the elasticity of this partition 14.

Cette cloison 14 est réalisée en un matériau à faible transmission et à grand pouvoir de réflexion du rayonnement électromagnétique dû à la présence d'au moins un élément actif (transistors 22) : Elle peut ainsi être réalisée en bronze béryllium.This partition 14 is made of a material with low transmission and a high power of reflection of the electromagnetic radiation due to the presence of at least one active element (transistors 22): It can thus be made of beryllium bronze.

La plaque 30 est en matériau absorbant d'un point de vue radioélectrique.The plate 30 is made of absorbent material from a point of view radioelectric.

De manière connue le boîtier 10 et son couvercle peuvent être réalisés en aliage d'aluminium, le (ou les) substrats en ferrite, epoxy ou duroïd.In known manner the housing 10 and its cover can be made of aluminum alloy, the (or) substrates of ferrite, epoxy or duroid.

A titre d'exemple l'amplificateur A.F.B. précité fonctionnant dans la bande 10,3 GHz - 10,7 GHz a été réalisé avec un boîtier de dimensions de l'ordre de 72 cm x 21 cm x 16 cm.As an example, the amplifier A.F.B. above operating in the band 10.3 GHz - 10.7 GHz was produced with a housing of dimensions of the order of 72 cm x 21 cm x 16 cm.

La mise en place du circuit de l'invention est effectuée de la manière suivante :
- on usine la cavité 11 dans le boîtier 10 en réalisant les deux logements latéraux 15 et 16 face à face de part et d'autre de la cavité 11 ;
- on met en place la cloison 14 par simple pression verticale après avoir logé le (ou les) substrats (21) ; le blocage de la cloison 14 s'effectuant grâce à l'élasticité des deux ailettes 28 et 29 ;
- on dispose une plaque absorbante 30 à vocation électrique au-dessus de la cloison 14 pour permettre le maintien vertical de celle-ci ;
- on fixe le couvercle 12 au-dessus du boîtier 10.The installation of the circuit of the invention is carried out as follows:
- The cavity 11 is machined in the housing 10 by making the two lateral housings 15 and 16 face to face on either side of the cavity 11;
- The partition 14 is put in place by simple vertical pressure after having housed the substrate (s) (21); the blocking of the partition 14 being effected by the elasticity of the two fins 28 and 29;
- There is an absorbent plate 30 for electrical purposes above the partition 14 to allow the vertical maintenance thereof;
- the cover 12 is fixed above the housing 10.

Les caractéristiques de l'invention permettent donc de réaliser un montage-câblage précis très simplifié et de meilleure qualité, la cloison 14 amovible étant installée en fin de montage.The characteristics of the invention therefore make it possible to produce a very simplified and better quality precise wiring assembly, the removable partition 14 being installed at the end of assembly.

Il est bien entendu que la présente invention n'a été décrite et représentée qu'à titre d'exemple préférentiel et que l'on pourra remplacer ses éléments constitutifs par des éléments équivalents sans, pour autant, sortir du cadre de l'invention.It is understood that the present invention has only been described and shown as a preferred example and that its constituent elements can be replaced by equivalent elements without, however, departing from the scope of the invention.

Ainsi le circuit microélectronique réalisé peut être autre chose qu'un amplificateur, il peut de plus comporter un nombre quelconque de substrat.Thus, the microelectronic circuit produced can be something other than an amplifier, it can also include any number of substrates.

Il peut en effet permettre d'obtenir les résultats suivants :
- augmentation de l'isolation entrée/sortie de boîtiers amplificateurs ;
. amplificateurs sur substrat à faible permittivité ;
. amplificateurs à grand gain (≧ + 20 dB) ;
- augmentation de l'isolation entre un dispositif suivi ou précédé d'un dispositif rayonnant :
* isolation entre un isolateur microstrip et un amplificateur ;
* isolation entre un isolateur microstrip et un oscillateur ;
* isolation entre un amplificateur et un filtre microstrip ;
- réjection des signaux perturbateurs :
. entre un amplificateur et un mélangeur
. entre un mélangeur et un oscillateur local.It can indeed allow the following results to be obtained:
- increased input / output isolation of amplifier boxes;
. low permittivity substrate amplifiers;
. high gain amplifiers (≧ + 20 dB);
- increased insulation between a device followed or preceded by a radiating device:
* insulation between a microstrip isolator and an amplifier;
* insulation between a microstrip isolator and an oscillator;
* insulation between an amplifier and a microstrip filter;
- rejection of disturbing signals:
. between an amplifier and a mixer
. between a mixer and a local oscillator.

Claims (7)

1/ Circuit microélectronique comportant un boîtier hyperfréquence (10) avec au moins un substrat (21) microélectronique incorporé, ce boîtier étant muni d'une cavité (11) longitudinale dans laquelle est disposée chaque substrat (21), caractérisé en ce que ce boîtier (10) est muni d'au moins un couple de logements latéraux (15, 16) usinés de part et d'autre de la cavité (11), et en ce qu'une cloison (14) métallique amovible est disposée au-dessus du substrat correspondant entre ces deux logements (15, 16) pour venir obstruer en partie ladite cavité (11).1 / Microelectronic circuit comprising a microwave housing (10) with at least one incorporated microelectronic substrate (21), this housing being provided with a longitudinal cavity (11) in which each substrate (21) is arranged, characterized in that this housing (10) is provided with at least a pair of lateral housings (15, 16) machined on either side of the cavity (11), and in that a removable metal partition (14) is arranged above the corresponding substrate between these two housings (15, 16) to partially obstruct said cavity (11). 2/ Circuit hyperfréquence selon la revendication 1, caractérisé en ce que la cloison (14) est formé d'une partie centrale (26) munie dans sa partie inférieure d'une ouverture (27) et sur les côtés de deux ailettes (28, 29) élastiques par rapport à celle-ci pour venir se bloquer respectivement dans chaque ouverture latérale (15, 16).2 / microwave circuit according to claim 1, characterized in that the partition (14) is formed by a central part (26) provided in its lower part with an opening (27) and on the sides of two fins (28, 29) elastic with respect to the latter to block respectively in each lateral opening (15, 16). 3/ Circuit hyperfréquence selon la revendication 2, caractérisé en ce que la cloison (14) a une partie centrale (26) plane.3 / microwave circuit according to claim 2, characterized in that the partition (14) has a central portion (26) planar. 4/ Circuit hyperfréquence selon l'une quelconque des revendications 2 ou 3, caractérisé en ce que la cloison (14) a une partie centrale (26) rectangulaire.4 / microwave circuit according to any one of claims 2 or 3, characterized in that the partition (14) has a central central portion (26) rectangular. 5/ Circuit hyperfréquence selon l'une quelconque des revendications 2 à 4, caractérisé en ce que la cloison (14) est une lame métallique qui a été pliée, de part et d'autre de la partie centrale, pour former deux ailettes (28, 29) inclinées par rapport à celle-ci.5 / microwave circuit according to any one of claims 2 to 4, characterized in that the partition (14) is a metal strip which has been folded, on either side of the central part, to form two fins (28 , 29) inclined with respect thereto. 6/ Circuit hyperfréquence selon la revendication 5, caractérisé en ce que la lame métallique est en bronze béryllium.6 / microwave circuit according to claim 5, characterized in that the metal strip is made of beryllium bronze. 7/ Circuit hyperfréquence selon l'une quelconque des revendications précédentes, caractérisé en ce qu'une plaque absorbante (30) est disposée entre le boîtier (10) et son couvercle (12).7 / microwave circuit according to any one of the preceding claims, characterized in that an absorbent plate (30) is disposed between the housing (10) and its cover (12).
EP19890102421 1988-02-15 1989-02-13 Electronic micro-circuit Expired - Lifetime EP0329050B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8801748 1988-02-15
FR8801748A FR2627328B1 (en) 1988-02-15 1988-02-15 MICROELECTRONIC CIRCUIT

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EP0329050A1 true EP0329050A1 (en) 1989-08-23
EP0329050B1 EP0329050B1 (en) 1993-11-18

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DE (1) DE68910707T2 (en)
FR (1) FR2627328B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0612118A1 (en) * 1993-02-16 1994-08-24 Daimler-Benz Aerospace Aktiengesellschaft Method for preventing electrical crosstalk and device for performing this method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1191874B (en) * 1962-11-23 1965-04-29 Siemens Ag Waveguide section with an inductively acting, adjustable screen
DE1591570A1 (en) * 1967-09-29 1970-02-19 Siemens Ag Microwave component in stripline design
US4270106A (en) * 1979-11-07 1981-05-26 The United States Of America As Represented By The Secretary Of The Air Force Broadband mode suppressor for microwave integrated circuits
US4547755A (en) * 1984-03-27 1985-10-15 Watkins Johnson Company Microwave circuit structure and method of mounting

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5597702A (en) * 1979-01-22 1980-07-25 Mitsubishi Electric Corp Waveguide-coupled microwave integrated-circuit device
JPS5863201A (en) * 1981-10-12 1983-04-15 Matsushita Electric Ind Co Ltd High frequency circuit device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1191874B (en) * 1962-11-23 1965-04-29 Siemens Ag Waveguide section with an inductively acting, adjustable screen
DE1591570A1 (en) * 1967-09-29 1970-02-19 Siemens Ag Microwave component in stripline design
US4270106A (en) * 1979-11-07 1981-05-26 The United States Of America As Represented By The Secretary Of The Air Force Broadband mode suppressor for microwave integrated circuits
US4547755A (en) * 1984-03-27 1985-10-15 Watkins Johnson Company Microwave circuit structure and method of mounting

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 4, no. 145 (E-29)[627], 14 octobre 1980, page 150 E 29; & JP-A-55 97 702 (MITSUBISHI DENKI K.K.) 25-07-1980 *
PATENT ABSTRACTS OF JAPAN, vol. 7, no. 154 (E-185)[1299], 6 juillet 1983; & JP-A-58 63 201 (MATSUSHITA DENKI SANGYO K.K.) 15-04-1983 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0612118A1 (en) * 1993-02-16 1994-08-24 Daimler-Benz Aerospace Aktiengesellschaft Method for preventing electrical crosstalk and device for performing this method

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FR2627328B1 (en) 1990-11-30
DE68910707D1 (en) 1993-12-23
FR2627328A1 (en) 1989-08-18
DE68910707T2 (en) 1994-03-10
EP0329050B1 (en) 1993-11-18

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