EP0329050A1 - Elektronische Mikroschaltung - Google Patents

Elektronische Mikroschaltung Download PDF

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Publication number
EP0329050A1
EP0329050A1 EP89102421A EP89102421A EP0329050A1 EP 0329050 A1 EP0329050 A1 EP 0329050A1 EP 89102421 A EP89102421 A EP 89102421A EP 89102421 A EP89102421 A EP 89102421A EP 0329050 A1 EP0329050 A1 EP 0329050A1
Authority
EP
European Patent Office
Prior art keywords
partition
housing
substrate
cavity
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89102421A
Other languages
English (en)
French (fr)
Other versions
EP0329050B1 (de
Inventor
Eric Fautrat
Christian Fagnon
Sante Fidanza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel Thomson Faisceaux Hertziens SA
Alcatel Telspace SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Thomson Faisceaux Hertziens SA, Alcatel Telspace SA filed Critical Alcatel Thomson Faisceaux Hertziens SA
Publication of EP0329050A1 publication Critical patent/EP0329050A1/de
Application granted granted Critical
Publication of EP0329050B1 publication Critical patent/EP0329050B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices

Definitions

  • the invention relates to a microelectronic circuit.
  • This circuit makes it possible to carry out an electromagnetic decoupling by means of a partition separating two cavities, with active electrical vocation, of a microwave (or H.F.) box.
  • an electromagnetic decoupling is achieved by a partition obtained by machining the two adjacent cavities of the HF box.
  • the electrical transition between the two cavities is obtained thanks to an opening machined in the partition and shaving the internal bottom of the housing; it can also be complex in shape, matching as precisely as possible the silhouette of the electrical transition.
  • the position, the shape and the precision of the location of the opening make machining it in the partition difficult, and sometimes even impossible; since the small dimensions of the cavities do not allow the passage of the tool.
  • the object of the invention is to overcome these drawbacks.
  • the invention proposes, in fact, a microelectronic circuit comprising a microwave housing with at least one microelectronic substrate incorporated, this housing being provided with a longitudinal cavity in which each substrate is disposed, characterized in that this housing is provided with at least a couple of lateral housings machined on either side of the cavity, and in that a removable metal partition is disposed above the corresponding substrate between these two housings in order to partially obstruct said cavity.
  • the invention thus makes it possible to simultaneously establish an electrical connection between the two cavities as well as the necessary electromagnetic decoupling, while eliminating the machining problems described above.
  • the invention improves the electrical performance of the HF package by the fact that the two aforementioned substrates, housed in two adjacent cavities, come together in a single substrate; this solution offers the advantage of limiting the clearances or "voids” due to the addition of manufacturing tolerances - machining of the cavities, cutting of the substrate, positioning of the active component or components, etc. These "voids" are d otherwise harmful to operation HF enclosure electrical
  • the invention facilitates assembly of the assembly, since each active component can be mounted and welded to the substrate before the latter is housed in the housing.
  • the invention therefore makes it possible to reduce assembly times as well as the risks of workmanship.
  • the partition is formed of a central part provided in its lower part with an opening and on the sides of two elastic fins with respect to the latter so as to be blocked respectively in each lateral opening; It may for example be a metal blade which has been folded on either side of its central part to form two fins inclined relative to the latter.
  • the microelectronic circuit of the invention shown in FIG. 1, comprises: - An HF housing 10 in which a longitudinal cavity 11 is machined, a cover 12 which can be fixed to it using fixing means 9, for example screws, associated for example with holes 13 so as to close the cavity 11; - at least one microelectronic substrate 21; a removable partition 14 which can be placed in two lateral housings 15 and 16 machined in the lateral walls of the housing 10 on either side of the cavity 11.
  • the circuit shown by way of example in FIG. 1 is an AFB amplifier (low noise amplifier) operating for example in the frequency band 10.3 GHz - 10.7 GHz.
  • This circuit has four parts: - an input circulator 17; - an amplifier proper 18; - an output circulator 19; - an impedance matching line 20;
  • FIG. 1 These different parts formed from etched substrates are shown diagrammatically in FIG. 1.
  • the amplifier proper 18 is formed of an etched substrate 21 onto which the active components 22, here two in number, are welded, and of "C.M.S.” components. 23 (surface mounted components) such as capacities, resistances ...
  • a coaxial input plug 24 and a coaxial output plug 25 make it possible to make a connection respectively with the circulator 17 and with the line 20.
  • Two grooves 31 and 32 are produced near the inlet and the outlet of the housing 10, to allow better positioning of the circulator 17 respectively with respect to the plug 24 and of the line 20 with respect to the plug 25.
  • the removable partition 14, shown more particularly in FIG. 3, is formed by a flat central part 26 provided in its lower part with an opening 27, here semi-circular, and on its two sides with two lateral fins 28 and 29 exhibiting a certain elasticity with respect thereto.
  • This partition 14 can be, as here, a metal blade which has been folded on either side of the central part 26 to form two fins 28 and 29 inclined relative to the latter.
  • this partition 14 is shown once placed in the housing 10 between the two orifices 15 and 16.
  • An absorbent plate 30, shown in Figure 2 is disposed between the upper part of this partition 14 and the cover 12 to absorb any vibrations in the vertical direction when using the circuit in a material, the longitudinal vibrations being damped due to the elasticity of this partition 14.
  • This partition 14 is made of a material with low transmission and a high power of reflection of the electromagnetic radiation due to the presence of at least one active element (transistors 22): It can thus be made of beryllium bronze.
  • the plate 30 is made of absorbent material from a point of view radioelectric.
  • housing 10 and its cover can be made of aluminum alloy, the (or) substrates of ferrite, epoxy or duroid.
  • the amplifier A.F.B. above operating in the band 10.3 GHz - 10.7 GHz was produced with a housing of dimensions of the order of 72 cm x 21 cm x 16 cm.
  • the installation of the circuit of the invention is carried out as follows: - The cavity 11 is machined in the housing 10 by making the two lateral housings 15 and 16 face to face on either side of the cavity 11; - The partition 14 is put in place by simple vertical pressure after having housed the substrate (s) (21); the blocking of the partition 14 being effected by the elasticity of the two fins 28 and 29; - There is an absorbent plate 30 for electrical purposes above the partition 14 to allow the vertical maintenance thereof; - the cover 12 is fixed above the housing 10.
  • the characteristics of the invention therefore make it possible to produce a very simplified and better quality precise wiring assembly, the removable partition 14 being installed at the end of assembly.
  • the microelectronic circuit produced can be something other than an amplifier, it can also include any number of substrates.

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP19890102421 1988-02-15 1989-02-13 Elektronische Mikroschaltung Expired - Lifetime EP0329050B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8801748 1988-02-15
FR8801748A FR2627328B1 (fr) 1988-02-15 1988-02-15 Circuit microelectronique

Publications (2)

Publication Number Publication Date
EP0329050A1 true EP0329050A1 (de) 1989-08-23
EP0329050B1 EP0329050B1 (de) 1993-11-18

Family

ID=9363257

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890102421 Expired - Lifetime EP0329050B1 (de) 1988-02-15 1989-02-13 Elektronische Mikroschaltung

Country Status (3)

Country Link
EP (1) EP0329050B1 (de)
DE (1) DE68910707T2 (de)
FR (1) FR2627328B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0612118A1 (de) * 1993-02-16 1994-08-24 Daimler-Benz Aerospace Aktiengesellschaft Verfahren zur Vermeidung des elektrischen Übersprechens und Anordnung zur Durchführung des Verfahrens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1191874B (de) * 1962-11-23 1965-04-29 Siemens Ag Hohlleiterabschnitt mit einer induktiv wirkenden, verstellbaren Blende
DE1591570A1 (de) * 1967-09-29 1970-02-19 Siemens Ag Mikrowellenbauteil in Streifenleitungsausfuehrung
US4270106A (en) * 1979-11-07 1981-05-26 The United States Of America As Represented By The Secretary Of The Air Force Broadband mode suppressor for microwave integrated circuits
US4547755A (en) * 1984-03-27 1985-10-15 Watkins Johnson Company Microwave circuit structure and method of mounting

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5597702A (en) * 1979-01-22 1980-07-25 Mitsubishi Electric Corp Waveguide-coupled microwave integrated-circuit device
JPS5863201A (ja) * 1981-10-12 1983-04-15 Matsushita Electric Ind Co Ltd 高周波回路装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1191874B (de) * 1962-11-23 1965-04-29 Siemens Ag Hohlleiterabschnitt mit einer induktiv wirkenden, verstellbaren Blende
DE1591570A1 (de) * 1967-09-29 1970-02-19 Siemens Ag Mikrowellenbauteil in Streifenleitungsausfuehrung
US4270106A (en) * 1979-11-07 1981-05-26 The United States Of America As Represented By The Secretary Of The Air Force Broadband mode suppressor for microwave integrated circuits
US4547755A (en) * 1984-03-27 1985-10-15 Watkins Johnson Company Microwave circuit structure and method of mounting

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 4, no. 145 (E-29)[627], 14 octobre 1980, page 150 E 29; & JP-A-55 97 702 (MITSUBISHI DENKI K.K.) 25-07-1980 *
PATENT ABSTRACTS OF JAPAN, vol. 7, no. 154 (E-185)[1299], 6 juillet 1983; & JP-A-58 63 201 (MATSUSHITA DENKI SANGYO K.K.) 15-04-1983 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0612118A1 (de) * 1993-02-16 1994-08-24 Daimler-Benz Aerospace Aktiengesellschaft Verfahren zur Vermeidung des elektrischen Übersprechens und Anordnung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
FR2627328B1 (fr) 1990-11-30
EP0329050B1 (de) 1993-11-18
DE68910707D1 (de) 1993-12-23
FR2627328A1 (fr) 1989-08-18
DE68910707T2 (de) 1994-03-10

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