EP0329050B1 - Electronic micro-circuit - Google Patents
Electronic micro-circuit Download PDFInfo
- Publication number
- EP0329050B1 EP0329050B1 EP19890102421 EP89102421A EP0329050B1 EP 0329050 B1 EP0329050 B1 EP 0329050B1 EP 19890102421 EP19890102421 EP 19890102421 EP 89102421 A EP89102421 A EP 89102421A EP 0329050 B1 EP0329050 B1 EP 0329050B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- housing
- partition
- metal blade
- circuit according
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
Definitions
- the invention relates to a microelectronic circuit.
- This circuit makes it possible to carry out an electromagnetic decoupling by means of a partition separating two cavities, with active electrical vocation, of a microwave unit (or H.F.).
- an electromagnetic decoupling is achieved by a partition obtained by machining the two adjacent cavities of the HF box.
- the electrical transition between the two cavities is obtained thanks to an opening machined in the partition and skimming the internal bottom of the box, this opening can also be of complex shape, conforming as precisely as possible to the silhouette of the electrical transition.
- the position, shape and precision of the location of the opening make it difficult to machine in the partition, and sometimes even impossible as soon as the small dimensions of the cavities do not allow the tool to pass through.
- the object of the invention is to overcome these drawbacks.
- the invention proposes, in fact, a microelectronic circuit comprising a microwave box with at least one microelectronic substrate incorporated, this box being provided with a longitudinal cavity in which each substrate is disposed, a transverse metallic partition of electromagnetic decoupling being provided for separating the housing in two adjacent active electrical cavities, this metal partition being provided at its lower part with an opening, characterized in that this box is provided with at least a couple of lateral housings machined on either side of said longitudinal cavity and in that this metal partition is removable and is for this purpose constituted by a metal blade, the part of which central constitutes the separating part and the two end parts of which form two elastic fins which are provided to come to lock respectively in each of the two aforementioned lateral housing housings, so that this removable partition is put in place in this housing by a simple vertical pressure exerted on this metal blade with elastic lateral fins.
- Documentary may be cited documents JP-A-55/97702 and DE-A-1591570 which show one a conductive and fixed separating partition between a waveguide and a circuit integrated, and the other an insulating part for holding in position a substrate which is positioned across a metal receiving part with a U-section.
- the invention thus makes it possible to simultaneously establish an electrical connection between the two cavities as well as the necessary electromagnetic decoupling, while eliminating the machining problems described above.
- the invention improves the electrical performance of the HF package by the fact that the two aforementioned substrates, housed in two adjacent cavities, come together in a single substrate; this solution offers the advantage of limiting the clearances or "voids” due to the addition of manufacturing-machining tolerances of the cavities, cutting of the substrate, positioning of the active component (s), etc. These "voids” are d otherwise harmful to operation HF enclosure electrical
- the invention facilitates assembly of the assembly, since each active component can be mounted and welded to the substrate before the latter is housed in the housing.
- the invention therefore makes it possible to reduce assembly times as well as the risks of workmanship.
- the partition is formed of a central part provided in its lower part with an opening and on the sides of two elastic fins relative to the latter so as to be blocked respectively in each lateral opening; It may for example be a metal blade which has been folded on either side of its central part to form two fins inclined relative to the latter.
- FIG. 1 These different parts formed from etched substrates are shown diagrammatically in FIG. 1.
- the amplifier proper 18 is formed of an etched substrate 21 onto which the active components 22, here two in number, are welded, and of "C.M.S.” components. 23 (surface mounted components) such as capacities, resistances ...
- a coaxial input plug 24 and a coaxial output plug 25 make it possible to make a connection respectively with the circulator 17 and with the line 20.
- Two grooves 31 and 32 are produced near the inlet and the outlet of the housing 10, to allow better positioning of the circulator 17 respectively with respect to the plug 24 and of the line 20 with respect to the plug 25.
- the removable partition 14, shown more particularly in FIG. 3, is formed by a flat central part 26 provided in its lower part with an opening 27, here semi-circular, and on its two sides with two lateral fins 28 and 29 exhibiting a certain elasticity with respect thereto.
- This partition 14 can be, as here, a metal blade which has been folded on either side of the central part 26 to form two fins 28 and 29 inclined relative to the latter.
- this partition 14 is shown once placed in the housing 10 between the two orifices 15 and 16.
- An absorbent plate 30, shown in Figure 2 is disposed between the upper part of this partition 14 and the cover 12 to absorb any vibrations in the vertical direction when using the circuit in a material, the longitudinal vibrations being damped due to the elasticity of this partition 14.
- This partition 14 is made of a material with low transmission and a high power of reflection of electromagnetic radiation due to the presence of at least one active element (transistors 22): It can thus be made of beryllium bronze.
- the plate 30 is made of absorbent material from a point of view radioelectric.
- housing 10 and its cover can be made of aluminum alloy, the (or) substrates of ferrite, epoxy or duroid.
- the amplifier A.F.B. mentioned above operating in the band 10.3 GHz - 10.7 GHz was produced with a box with dimensions of the order of 72 cm x 21 cm x 16 cm.
- the characteristics of the invention therefore make it possible to produce a very simplified and better quality precise wiring assembly, the removable partition 14 being installed at the end of assembly.
- the microelectronic circuit produced may be something other than an amplifier, it may also include any number of substrates.
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
L'invention concerne un circuit microélectronique.The invention relates to a microelectronic circuit.
Ce circuit permet de réaliser un découplage électromagnétique par l'intermédiaire d'une cloison séparant deux cavités, à vocation électrique active, d'un boîtier hyperfréquence (ou H.F.).This circuit makes it possible to carry out an electromagnetic decoupling by means of a partition separating two cavities, with active electrical vocation, of a microwave unit (or H.F.).
Dans les dispositifs de l'art connu, un découplage électromagnétique est réalisé par une cloison obtenue en usinant les deux cavités adjacentes du boîtier H.F. La transition électrique entre les deux cavités (composant électronique, piste ou câble) est obtenue grâce à une ouverture usinée dans la cloison et rasant le fond interne du boîtier, cette ouverture pouvant d'ailleurs être de forme complexe, épousant le plus précisément possible la silhouette de la transition électrique. La position, la forme ainsi que la précision d'emplacement de l'ouverture rendent son usinage dans la cloison difficile, et même quelquefois impossible dès que les petites dimensions des cavités ne permettent pas le passage de l'outil.In the devices of the known art, an electromagnetic decoupling is achieved by a partition obtained by machining the two adjacent cavities of the HF box. The electrical transition between the two cavities (electronic component, track or cable) is obtained thanks to an opening machined in the partition and skimming the internal bottom of the box, this opening can also be of complex shape, conforming as precisely as possible to the silhouette of the electrical transition. The position, shape and precision of the location of the opening make it difficult to machine in the partition, and sometimes even impossible as soon as the small dimensions of the cavities do not allow the tool to pass through.
L'invention a pour objet de pallier ces inconvénients.The object of the invention is to overcome these drawbacks.
L'invention propose, en effet, un circuit microélectronique comportant un boîtier hyperfréquence avec au moins un substrat microélectronique incorporé, ce boîtier étant muni d'une cavité longitudinale dans laquelle est disposé chaque substrat, une cloison métallique transversale de découplage électromagnétique étant prévue pour séparer le boîtier en deux cavités à vocation électrique actives adjacentes, cette cloison métallique étant munie à sa partie inférieure d'une ouverture, caractérisé en ce que ce boitier est muni d'au moins un couple de logements latéraux usinés de part et d'autre de ladite cavité longitudinale et en ce que cette cloison métallique est amovible et est dans ce but constituée par une lame métallique dont la partie centrale constitue la partie séparatrice et dont les deux parties d'extrémités forment deux ailettes élastiques qui sont prévues pour venir se bloquer respectivement dans chacun des deux logements latéraux précités du boîtier, de sorte que cette cloison amovible se met en place dans ce boîtier par une simple pression verticale exercée sur cette lame métallique à ailettes élastiques latérales.The invention proposes, in fact, a microelectronic circuit comprising a microwave box with at least one microelectronic substrate incorporated, this box being provided with a longitudinal cavity in which each substrate is disposed, a transverse metallic partition of electromagnetic decoupling being provided for separating the housing in two adjacent active electrical cavities, this metal partition being provided at its lower part with an opening, characterized in that this box is provided with at least a couple of lateral housings machined on either side of said longitudinal cavity and in that this metal partition is removable and is for this purpose constituted by a metal blade, the part of which central constitutes the separating part and the two end parts of which form two elastic fins which are provided to come to lock respectively in each of the two aforementioned lateral housing housings, so that this removable partition is put in place in this housing by a simple vertical pressure exerted on this metal blade with elastic lateral fins.
A titre documentaire peuvent être cités les documents JP-A-55/97702 et DE-A-1591570 qui montrent l'un une cloison séparatrice conductrice et fixe entre un guide d'ondes et un circuit intégré, et l'autre une pièce isolante de maintien en position d'un substrat qui se positionne en travers d'une pièce métallique réceptrice à section en U.Documentary may be cited documents JP-A-55/97702 and DE-A-1591570 which show one a conductive and fixed separating partition between a waveguide and a circuit integrated, and the other an insulating part for holding in position a substrate which is positioned across a metal receiving part with a U-section.
L'invention permet ainsi d'établir simultanément une liaison électrique entre les deux cavités ainsi que le découplage électromagnétique nécessaire, tout en s'affranchissant des problèmes d'usinage décrits ci-dessus.The invention thus makes it possible to simultaneously establish an electrical connection between the two cavities as well as the necessary electromagnetic decoupling, while eliminating the machining problems described above.
De plus, l'invention améliore les performances électriques du boîtier H.F. par le fait que les deux substrats précités, logés dans deux cavités voisines, se réunissent en un seul et unique substrat ; cette solution offre l'avantage de limiter les jeux ou "vides" dus à l'addition des tolérances de fabrication-usinage des cavités, de découpe du substrat, de positionnement du ou des composants actifs etc... Ces "vides" sont d'ailleurs nuisibles au fonctionnement électrique du boîtier H.F.In addition, the invention improves the electrical performance of the HF package by the fact that the two aforementioned substrates, housed in two adjacent cavities, come together in a single substrate; this solution offers the advantage of limiting the clearances or "voids" due to the addition of manufacturing-machining tolerances of the cavities, cutting of the substrate, positioning of the active component (s), etc. These "voids" are d otherwise harmful to operation HF enclosure electrical
En outre, l'invention facilite le montage de l'ensemble, car chaque composant actif peut être monté et soudé sur le substrat avant que ce dernier ne soit logé dans le boîtier. L'invention permet donc de réduire les temps de montage ainsi que les risques de malfaçon.In addition, the invention facilitates assembly of the assembly, since each active component can be mounted and welded to the substrate before the latter is housed in the housing. The invention therefore makes it possible to reduce assembly times as well as the risks of workmanship.
Avantageusement, la cloison est formée d'une partie centrale munie dans sa partie inférieure d'une ouverture et sur les côtés de deux ailettes élastiques par rapport à celle-ci pour venir se bloquer respectivement dans chaque ouverture latérale ; Ce peut être par exemple une lame métallique qui a été pliée de part et d'autre de sa partie centrale pour former deux ailettes inclinées par rapport à celle-ci.Advantageously, the partition is formed of a central part provided in its lower part with an opening and on the sides of two elastic fins relative to the latter so as to be blocked respectively in each lateral opening; It may for example be a metal blade which has been folded on either side of its central part to form two fins inclined relative to the latter.
Les caractéristiques et avantages de l'invention ressortiront d'ailleurs de la description qui va suivre, à titre d'exemple non limitatif, en référence aux figures annexées sur lesquelles :
- la figure 1 représente une vue de dessus du circuit microélectronique de l'invention, le boîtier étant présenté sans son couvercle ;
- la figure 2 représente une vue en coupe transversale du circuit microélectronique de l'invention, selon le plan II-II de la figure 1 ;
- la figure 3 représente une cloison amovible utilisée dans le circuit microélectronique de l'invention tel que représenté aux figures 1 et 2.
- Figure 1 shows a top view of the microelectronic circuit of the invention, the housing being presented without its cover;
- 2 shows a cross-sectional view of the microelectronic circuit of the invention, along the plane II-II of Figure 1;
- FIG. 3 represents a removable partition used in the microelectronic circuit of the invention as shown in FIGS. 1 and 2.
Le circuit microélectronique de l'invention, représenté à la figure 1, comprend :
- un boîtier H.F. 10 dans lequel est usiné une cavité longitudinale 11, un couvercle 12 pouvant lui être fixé en utilisant des moyens de
fixation 9, par exemple des vis, associés par exemple à destrous 13 de manière à fermer lacavité 11 ; - au moins un substrat microélectronique 21 ;
- une cloison amovible 14 qui peut être disposée dans deux logements latéraux 15 et 16 usinés dans les parois latérales du
boîtier 10 de part et d'autre de lacavité 11.
- an HF housing 10 in which a
longitudinal cavity 11 is machined, a cover 12 which can be fixed to it using fixing means 9, for example screws, associated for example withholes 13 so as to close thecavity 11; - at least one
microelectronic substrate 21; - a
removable partition 14 which can be arranged in twolateral housings housing 10 on either side of thecavity 11.
Le circuit représenté à titre d'exemple sur la figure 1 est un amplificateur A.F.B. (amplificateur faible bruit) fonctionnant par exemple dans la bande de fréquence 10,3 GHz - 10,7 GHz. Ce circuit comprend quatre parties :
- un circulateur d'entrée 17 ;
- un amplificateur proprement dit 18 ;
- un circulateur de
sortie 19 ; - une ligne d'adaptation d'impédance 20.
- an
input circulator 17; - an amplifier proper 18;
- an
output circulator 19; - an impedance matching
line 20.
Ces différentes parties formées de substrats gravés sont représentées schématiquement sur la figure 1.These different parts formed from etched substrates are shown diagrammatically in FIG. 1.
L'amplificateur proprement dit 18 est formé d'un substrat 21 gravé sur lequel sont soudés les composants actifs 22, ici au nombre de deux, et des composants "C.M.S." 23 (composants montés en surface) tels que capacités, résistances...The amplifier proper 18 is formed of an
Une fiche d'entrée coaxiale 24, et une fiche de sortie coaxiale 25 permettent d'effectuer une liaison respectivement avec le circulateur 17 et avec la ligne 20.A
Deux rainures 31 et 32 sont réalisées à proximité de l'entrée et de la sortie du boîtier 10, pour permettre un meilleur positionnement respectivement du circulateur 17 par rapport à la fiche 24 et de la ligne 20 par rapport à la fiche 25.Two
La cloison amovible 14, représentée plus particulièrement à la figure 3, est formée d'une partie centrale plane 26 munie dans sa partie inférieure d'une ouverture 27, ici semi-circulaire, et sur ses deux côtés de deux ailettes latérales 28 et 29 présentant une certaine élasticité par rapport à celle-ci.The
Cette cloison 14 peut être, comme ici, une lame métallique qui a été pliée de part et d'autre de la partie centrale 26 pour former deux ailettes 28 et 29 inclinées par rapport à celle-ci.This
Sur les figures 1 et 2, cette cloison 14 est représentée une fois disposée dans le boîtier 10 entre les deux orifices 15 et 16.In FIGS. 1 and 2, this
Une plaque absorbante 30, représentée à la figure 2, est disposée entre la partie supérieure de cette cloison 14 et le couvercle 12 pour amortir les vibrations éventuelles dans le sens vertical lors de l'utilisation du circuit dans un matériel, les vibrations longitudinales étant amorties du fait de l'élasticité de cette cloison 14.An absorbent plate 30, shown in Figure 2, is disposed between the upper part of this
Cette cloison 14 est réalisée en un matériau à faible transmission et à grand pouvoir de réflexion du rayonnement électromagnétique dû à la présence d'au moins un élément actif (transistors 22) : Elle peut ainsi être réalisée en bronze béryllium.This
La plaque 30 est en matériau absorbant d'un point de vue radioélectrique.The plate 30 is made of absorbent material from a point of view radioelectric.
De manière connue le boîtier 10 et son couvercle peuvent être réalisés en aliage d'aluminium, le (ou les) substrats en ferrite, epoxy ou duroïd.In known manner the
A titre d'exemple l'amplificateur A.F.B. précité fonctionnant dans la bande 10,3 GHz - 10,7 GHz a été réalisé avec un boîtier de dimensions de l'ordre de 72 cm x 21 cm x 16 cm.As an example, the amplifier A.F.B. mentioned above operating in the band 10.3 GHz - 10.7 GHz was produced with a box with dimensions of the order of 72 cm x 21 cm x 16 cm.
La mise en place du circuit de l'invention est effectuée de la manière suivante :
- on usine la
cavité 11 dans leboîtier 10 en réalisant les deux logements latéraux 15 et 16 face à face de part et d'autre de lacavité 11 ; - on met en place la
cloison 14 par simple pression verticale après avoir logé le (ou les) substrats (21) ; le blocage de lacloison 14 s'effectuant grâce à l'élasticité des deuxailettes 28 et 29 ; - on dispose une plaque absorbante 30 à vocation électrique au-dessus de la
cloison 14 pour permettre le maintien vertical de celle-ci ; - on fixe le couvercle 12 au-dessus du
boîtier 10.
- the
cavity 11 is machined in thehousing 10 by making the twolateral housings cavity 11; - the
partition 14 is put in place by simple vertical pressure after having housed the substrate (s) (21); the blocking of thepartition 14 being effected by the elasticity of the twofins - there is an absorbent plate 30 for electrical purposes above the
partition 14 to allow the vertical maintenance thereof; - the cover 12 is fixed above the
housing 10.
Les caractéristiques de l'invention permettent donc de réaliser un montage-câblage précis très simplifié et de meilleure qualité, la cloison 14 amovible étant installée en fin de montage.The characteristics of the invention therefore make it possible to produce a very simplified and better quality precise wiring assembly, the
Il est bien entendu que la présente invention n'a été décrite et représentée qu'à titre d'exemple préférentiel et que l'on pourra remplacer ses éléments constitutifs par des éléments équivalents sans, pour autant, sortir du cadre de l'invention.It is understood that the present invention has only been described and shown as a preferred example and that its constituent elements can be replaced by equivalent elements without, however, departing from the scope of the invention.
Ainsi le circuit microélectronique réalisé peut être autre chose qu'un amplificateur, il peut de plus comporter un nombre quelconque de substrats.Thus, the microelectronic circuit produced may be something other than an amplifier, it may also include any number of substrates.
Il peut en effet permettre d'obtenir les résultats suivants :
- augmentation de l'isolation entrée/sortie de boîtiers amplificateurs ;
- . amplificateurs sur substrat à faible permittivité ;
- . amplificateurs à grand gain (≧ + 20 dB) ;
- augmentation de l'isolation entre un dispositif suivi ou précédé d'un dispositif rayonnant :
- * isolation entre un isolateur microstrip et un amplificateur ;
- * isolation entre un isolateur microstrip et un oscillateur ;
- * isolation entre un amplificateur et un filtre microstrip ;
- réjection des signaux perturbateurs :
- . entre un amplificateur et un mélangeur
- . entre un mélangeur et un oscillateur local.
- increased input / output isolation of amplifier boxes;
- . low permittivity substrate amplifiers;
- . high gain amplifiers (≧ + 20 dB);
- increased insulation between a device followed or preceded by a radiating device:
- * insulation between a microstrip isolator and an amplifier;
- * insulation between a microstrip isolator and an oscillator;
- * insulation between an amplifier and a microstrip filter;
- rejection of disturbing signals:
- . between an amplifier and a mixer
- . between a mixer and a local oscillator.
Claims (6)
- A microelectronic circuit including a microwave housing (10) with at least one microelectronic substrate (21) incorporated therein, the housing being provided with a longitudinal cavity (11) inside which each substrate (21) is disposed, a transverse metal electromagnetic decoupling partition being provided to separate the housing into two adjacent electrically active cavities, the bottom portion of the metal partition being provided with an opening (27), said circuit being characterized in that the housing is provided with at least a pair of side recesses (15, 16) machined on respective sides of said longitudinal cavity (11), and in that the metal partition (14) is removable, and, to this end, is constituted by a metal blade having a central portion (26) constituting the separating portion, and two end portions (28, 29) forming two resilient fins which are designed to be locked into respective ones of the above-mentioned side recesses (15, 16) in the housing, so that the removable partition (14) is installed in the housing by merely exerting vertical pressure on the metal blade having resilient side fins.
- A microwave circuit according to claim 1, characterized in that the central portion (26) of the removable metal blade (14) is plane.
- A microwave circuit according to claim 1 or 2, characterized in that the central portion (26) of the removable metal blade (14) is rectangular.
- A microwave circuit according to any one of claims 1 to 3, characterized in that the partition (14) is a metal blade which has been folded on either side of the central portion to form two fins (28, 29) that slope relative thereto.
- A microwave circuit according to claim 4, characterized in that the metal blade is made of beryllium bronze.
- A microwave circuit according to any preceding claim, characterized in that an absorbent plate (30) is disposed between the housing (10) and the cover (12) thereof.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8801748 | 1988-02-15 | ||
| FR8801748A FR2627328B1 (en) | 1988-02-15 | 1988-02-15 | MICROELECTRONIC CIRCUIT |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0329050A1 EP0329050A1 (en) | 1989-08-23 |
| EP0329050B1 true EP0329050B1 (en) | 1993-11-18 |
Family
ID=9363257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19890102421 Expired - Lifetime EP0329050B1 (en) | 1988-02-15 | 1989-02-13 | Electronic micro-circuit |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0329050B1 (en) |
| DE (1) | DE68910707T2 (en) |
| FR (1) | FR2627328B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4304656A1 (en) * | 1993-02-16 | 1994-08-18 | Deutsche Aerospace | Method for avoiding electrical crosstalk and arrangement for carrying out the method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1191874B (en) * | 1962-11-23 | 1965-04-29 | Siemens Ag | Waveguide section with an inductively acting, adjustable screen |
| JPS5597702A (en) * | 1979-01-22 | 1980-07-25 | Mitsubishi Electric Corp | Waveguide-coupled microwave integrated-circuit device |
| US4270106A (en) * | 1979-11-07 | 1981-05-26 | The United States Of America As Represented By The Secretary Of The Air Force | Broadband mode suppressor for microwave integrated circuits |
| JPS5863201A (en) * | 1981-10-12 | 1983-04-15 | Matsushita Electric Ind Co Ltd | High frequency circuit device |
| US4547755A (en) * | 1984-03-27 | 1985-10-15 | Watkins Johnson Company | Microwave circuit structure and method of mounting |
-
1988
- 1988-02-15 FR FR8801748A patent/FR2627328B1/en not_active Expired - Lifetime
-
1989
- 1989-02-13 EP EP19890102421 patent/EP0329050B1/en not_active Expired - Lifetime
- 1989-02-13 DE DE1989610707 patent/DE68910707T2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0329050A1 (en) | 1989-08-23 |
| FR2627328B1 (en) | 1990-11-30 |
| DE68910707D1 (en) | 1993-12-23 |
| FR2627328A1 (en) | 1989-08-18 |
| DE68910707T2 (en) | 1994-03-10 |
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