EP0309042A2 - Quartz vibrator enclosure for surface mounting - Google Patents

Quartz vibrator enclosure for surface mounting Download PDF

Info

Publication number
EP0309042A2
EP0309042A2 EP88202009A EP88202009A EP0309042A2 EP 0309042 A2 EP0309042 A2 EP 0309042A2 EP 88202009 A EP88202009 A EP 88202009A EP 88202009 A EP88202009 A EP 88202009A EP 0309042 A2 EP0309042 A2 EP 0309042A2
Authority
EP
European Patent Office
Prior art keywords
housing
housing part
quartz crystal
parts
interconnectable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP88202009A
Other languages
German (de)
French (fr)
Other versions
EP0309042B1 (en
EP0309042A3 (en
Inventor
Franz Dipl.-Ing. Fick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Patentverwaltung GmbH
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH, Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Patentverwaltung GmbH
Publication of EP0309042A2 publication Critical patent/EP0309042A2/en
Publication of EP0309042A3 publication Critical patent/EP0309042A3/en
Application granted granted Critical
Publication of EP0309042B1 publication Critical patent/EP0309042B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Definitions

  • the invention relates to a hermetically sealed, box-shaped or box-shaped quartz crystal housing with surface conductors suitable for surface mounting (SMD) made of two interconnectable housing parts in which the connecting conductor is passed through an isolated housing part and at least one further connecting conductor is connected to the housing part.
  • SMD surface mounting
  • the welding edge connecting the two housing parts runs perpendicular to the mounting surface (printed circuit board), which complicates the assembly and makes a larger distance between the housing and the printed circuit board necessary.
  • the invention has for its object to eliminate this disadvantage and to design the housing so that manipulations can still be carried out on the quartz crystal already connected to the connection conductors when the connection conductor-carrying part of the housing is already mounted and contacted.
  • the housing is divided in an inclined plane relative to its base into an upper and a lower, interconnectable housing part, that the connecting conductors of the component are insulated on one side through the lower housing part, with which on the opposite the side is connected to at least one further connecting conductor, and that the quartz crystal is mounted in the lower housing part.
  • a quartz crystal housing according to the invention is characterized in that its mounting on the printed circuit board is not influenced by the connection of the housing parts and that the housing is designed such that it only needs to be closed if necessary when the lower housing part with the quartz crystal is already fully functional the printed circuit board is mounted.
  • the box-shaped housing 1 shown in the figure is divided into two parts 2 and 3 by a plane inclined with respect to its base surface, which in the plane in which they form a flange are welded to one another in the final state or are otherwise firmly connected to one another.
  • the plane preferably runs diagonally in the housing, ie from its upper left edge to its lower right edge.
  • connection leads 4a and 4b suitable for surface mounting which are insulated from the housing by a glass bushing.
  • this itself forms two (or possibly only one) connection conductors 5a and 5b, so that the housing with 4 (or 3) connection conductors is securely mounted on a printed circuit board using the usual (automatic) methods can be.
  • the quartz crystal 8 is connected via an auxiliary part 7 to the connecting conductors 4a and 4b and extends in the direction of the lower edge of the lower housing part 3, so that even with a fully contacted housing - as long as the upper housing part 2 is not attached - the quartz crystal can be manipulated.
  • the upper housing part 2 is connected to the lower housing part 3 in a suitable manner, e.g. connected by welding or gluing. Under certain circumstances, this can only happen when the lower housing part 3 with the component 8 is already connected to a printed circuit board via its connecting conductors 4 and 5, e.g. is attached by soldering or with the help of a conductive adhesive.
  • the two housing parts 2 and 3 are preferably deep drawn from sheet metal. Together they preferably form a box-like or cuboid housing; however, the housing can be made from a can, that is to say have a circular cross section in plan view.
  • the housing according to the invention is suitable not only for quartz crystals but also for other components which are to be accommodated in a hermetically sealed housing with connection conductors suitable for surface mounting.

Abstract

The quartz oscillator housing comprises 2 cooperating halves (2,3) joined together to provide a hermetically sealed enclosure. Each of the terminal leads (4b) projects through the wall of one of the housing halves (3) which insulates them from one another. One further lead (5b) is attached to this housing half (3). The separation plane between the 2 housing halves (2,3) extends diagonally with the lower housing half (3) containing the quartz oscillator (8) and having the terminal leads (4b) projecting from its base at the corner edge. The further leads (5b) project from the lower housing half (3) at the other end of the base, lying in line with the diagonal separation plane.

Description

Die Erfindung betrifft ein hermetisch verschlossenes, schachtel- oder dosenförmiges Schwingquarzgehäuse mit für Oberflächenmontage (SMD) geeigneten Anschlußleitern aus zwei miteinander verbindbaren Gehäuseteilen bei dem Anschlußleiter isoliert durch ein Gehäuseteil hindurchge­führt und mindestens ein weiterer Anschlußleiter mit dem Gehäuseteil verbunden ist.The invention relates to a hermetically sealed, box-shaped or box-shaped quartz crystal housing with surface conductors suitable for surface mounting (SMD) made of two interconnectable housing parts in which the connecting conductor is passed through an isolated housing part and at least one further connecting conductor is connected to the housing part.

Ein Gehäuse dieser Art ist aus dem Datenbuch 1986 der Firma Telequarz, Seite 8 bekannt.A housing of this type is known from the Telequarz 1986 data book, page 8.

Bei den bekannten Gehäusen verläuft der die beiden Gehäu­seteile verbindende Schweißrand senkrecht zur Montageflä­che (Printplatte), was die Montage erschwert und einen größeren Abstand zwischen Gehäuse und Printplatte erfor­derlich macht.In the known housings, the welding edge connecting the two housing parts runs perpendicular to the mounting surface (printed circuit board), which complicates the assembly and makes a larger distance between the housing and the printed circuit board necessary.

Der Erfindung liegt die Aufgabe zugrunde, diesen Nachteil zu beseitigen und dabei das Gehäuse so auszubilden, daß an dem bereits mit den Anschlußleitern verbundenen Schwing­quarz noch Manipulationen vorgenommen werden können, wenn der Anschlußleiter tragende Teil des Gehäuses bereits mon­tiert und kontaktiert ist.The invention has for its object to eliminate this disadvantage and to design the housing so that manipulations can still be carried out on the quartz crystal already connected to the connection conductors when the connection conductor-carrying part of the housing is already mounted and contacted.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß das Gehäuse in einer gegenüber seiner Grundfläche geneigten Ebene in einen oberen und einen unteren, miteinander ver­bindbaren Gehäuseteil geteilt ist, daß die Anschlußleitern des Bauelementes an einer Seite isoliert durch das untere Gehäuseteil geführt sind, mit dem an der gegenüberliegen­ den Seite mindestens ein weiterer Anschlußleiter verbunden ist, und daß der Schwingquarz in dem unteren Gehäuseteil montiert ist.This object is achieved in that the housing is divided in an inclined plane relative to its base into an upper and a lower, interconnectable housing part, that the connecting conductors of the component are insulated on one side through the lower housing part, with which on the opposite the side is connected to at least one further connecting conductor, and that the quartz crystal is mounted in the lower housing part.

Weitere Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen.Further refinements of the invention result from the subclaims.

Ein erfindungsgemäßes Schwingquarzgehäuse zeichnet sich dadurch aus, daß seine Montage auf der Printplatte durch die Verbindung der Gehäuseteile nicht beeinflußt wird und daß das Gehäuse so ausgebildet ist, daß es erforderlichen­falls erst verschlossen zu werden braucht, wenn der untere Gehäuseteil mit dem Schwingquarz bereits voll funktions­fähig auf der Printplatte montiert ist.A quartz crystal housing according to the invention is characterized in that its mounting on the printed circuit board is not influenced by the connection of the housing parts and that the housing is designed such that it only needs to be closed if necessary when the lower housing part with the quartz crystal is already fully functional the printed circuit board is mounted.

Ein Ausführungsbeispiel der Erfindung wird im folgenden anhand der beigefügten Zeichnungen näher erläutert.
Es zeigen:

  • Fig. 1 ein Schwingquarzgehäuse nach der Erfindung,
  • Fig. 2 einen senkrechten Schnitt durch das Gehäuse nach Figur 1,
  • Fig. 3 eine Draufsicht auf das Gehäuse nach Figur 1.
An embodiment of the invention is explained below with reference to the accompanying drawings.
Show it:
  • 1 is a quartz crystal housing according to the invention,
  • 2 shows a vertical section through the housing according to FIG. 1,
  • 3 shows a plan view of the housing according to FIG. 1.

Das in der Figur dargestellte schachtelförmige Gehäuse 1 ist durch eine gegenüber seiner Grundfläche geneigte Ebe­ne in zwei Teile 2 und 3 geteilt, die in dieser Ebene, in der sie einen Flansch bilden, im Endzustand miteinander verschweißt oder auf andere Weise fest miteinander verbun­den sind. Die Ebene verläuft vorzugsweise diagonal im Ge­häuse, d.h. von seiner linken oberen Kante zu seiner rech­ten unteren Kante.The box-shaped housing 1 shown in the figure is divided into two parts 2 and 3 by a plane inclined with respect to its base surface, which in the plane in which they form a flange are welded to one another in the final state or are otherwise firmly connected to one another. The plane preferably runs diagonally in the housing, ie from its upper left edge to its lower right edge.

Der Schwingquarz 8 ist in dem unteren Gehäuseteil 3 mon­tiert. In dies Gehäuseteil führen von der einen Seite zwei für die Oberflächenmontage geeignete Anschlußleiter 4a und 4b, die durch eine Glasdurchführung von dem Gehäuse iso­liert sind.
An der gegenüberliegenden, niedrigen Seite des unteren Ge­häuseteils 3 bildet dieses selbst zwei (oder gegebenen­falls nur einen) Anschlußleiter 5a und 5b, so daß das Ge­häuse mit 4 (bzw. 3) Anschlußleitern sicher mit Hilfe der üblichen (automatischen) Verfahren auf einer Printplatte montiert werden kann.The quartz crystal 8 is mounted in the lower housing part 3. From one side lead into this housing part two connection leads 4a and 4b suitable for surface mounting, which are insulated from the housing by a glass bushing.
On the opposite, lower side of the lower housing part 3, this itself forms two (or possibly only one) connection conductors 5a and 5b, so that the housing with 4 (or 3) connection conductors is securely mounted on a printed circuit board using the usual (automatic) methods can be.

Der Schwingquarz 8 ist über ein Hilfsteil 7 mit den An­schlußleitern 4a und 4b verbunden und erstreckt sich in Richtung des niedrigen Randes des unteren Gehäuseteils 3, so daß selbst bei vollkontaktiertem Gehäuse - solange der obere Gehäuseteil 2 nicht angebracht ist - der Schwing­quarz manipuliert werden kann.The quartz crystal 8 is connected via an auxiliary part 7 to the connecting conductors 4a and 4b and extends in the direction of the lower edge of the lower housing part 3, so that even with a fully contacted housing - as long as the upper housing part 2 is not attached - the quartz crystal can be manipulated.

Das obere Gehäuseteil 2 wird mit dem unteren Gehäuseteil 3 auf geeignete Weise, z.B. durch Schweißen oder Kleben ver­bunden. Dies kann unter Umständen erst dann geschehen, wenn der untere Gehäuseteil 3 mit dem Bauelement 8 bereits über seine Anschlußleiter 4 und 5 auf einer Printplatte z.B. durch Löten oder mit Hilfe eines leitenden Klebers befestigt ist.The upper housing part 2 is connected to the lower housing part 3 in a suitable manner, e.g. connected by welding or gluing. Under certain circumstances, this can only happen when the lower housing part 3 with the component 8 is already connected to a printed circuit board via its connecting conductors 4 and 5, e.g. is attached by soldering or with the help of a conductive adhesive.

Die beiden Gehäuseteile 2 und 3 sind vorzugsweise aus Blech tiefgezogen.
Sie bilden zusammen vorzugsweise ein schachtel- oder qua­derförmiges Gehäuse; das Gehäuse kann jedoch aus dosenför­mig gestaltet sein, d.h. in der Draufsicht einen kreisför­migen Querschnitt aufweisen.The two housing parts 2 and 3 are preferably deep drawn from sheet metal.
Together they preferably form a box-like or cuboid housing; however, the housing can be made from a can, that is to say have a circular cross section in plan view.

Selbstverständlich ist das erfindungsgemäße Gehäuse außer für Schwingquarze auch für andere Bauelemente geeignet, die in einem hermetisch verschlossenen Gehäuse mit für Oberflächenmontage geeigneten Anschlußleitern unterge­bracht werden sollen.Of course, the housing according to the invention is suitable not only for quartz crystals but also for other components which are to be accommodated in a hermetically sealed housing with connection conductors suitable for surface mounting.

Claims (6)

1. Hermetisch verschlossenes, schachtel- oder dosenförmi­ges Schwingquarzgehäuse (1) mit für Oberflächenmontage (SMD) geeigneten Anschlußleitern (4,5) aus zwei miteinan­der verbindbaren Gehäuseteilen (2,3), bei dem Anschlußlei­ter (4a,4b) isoliert durch ein Gehäuseteil (3) hindurchge­führt und mindestens ein weiterer Anschlußleiter (5a,5b) mit dem Gehäuseteil verbunden ist,
dadurch gekennzeichnet,
daß das Gehäuse (1) in einer gegenüber seiner Grundfläche geneigten Ebene in einen oberen (2) und einen unteren (3), miteinander verbindbares Gehäuseteil geteilt ist, daß die Anschlußleiter (4a,4b) des Schwingquarzes an einer Seite isoliert durch das untere Gehäuseteil (3) geführt sind, mit dem an der gegenüberliegenden Seite mindestens ein weiterer Anschlußleiter (5) verbunden ist und daß der Schwingquarz (8) in dem unteren Gehäuseteil (3) montiert ist.1. Hermetically sealed, box-shaped or box-shaped quartz crystal housing (1) with connection conductors (4,5) suitable for surface mounting (SMD) made of two interconnectable housing parts (2,3), with the connection conductor (4a, 4b) insulated by a housing part ( 3) passed through and at least one further connecting conductor (5a, 5b) is connected to the housing part,
characterized,
that the housing (1) is divided into an upper (2) and a lower (3), interconnectable housing part in a plane inclined with respect to its base area, that the connecting conductors (4a, 4b) of the quartz crystal are insulated on one side by the lower housing part (3) are guided, with which at least one further connecting conductor (5) is connected on the opposite side and that the quartz crystal (8) is mounted in the lower housing part (3). 2. Schwingquarzgehäuse nach Anspruch 1,
dadurch gekennzeichnet,
daß die Ebene das Gehäuse diagonal schneidet.2. quartz crystal housing according to claim 1,
characterized,
that the plane intersects the case diagonally. 3. Schwingquarzgehäuse nach Anspruch 1,
dadurch gekennzeichnet,
daß die miteinander verbindbaren Ränder der beiden Gehäu­seteile (2,3) als Flansch (9) ausgebildet sind.3. quartz crystal housing according to claim 1,
characterized,
that the interconnectable edges of the two housing parts (2, 3) are designed as a flange (9). 4. Schwingquarzgehäuse nach Anspruch 2,
dadurch gekennzeichnet,
daß die Ränder der beiden Gehäuseteile miteinander ver­schweißt sind.4. quartz crystal housing according to claim 2,
characterized,
that the edges of the two housing parts are welded together. 5. Schwingquarzgehäuse nach Anspruch 1,
dadurch gekennzeichnet,
daß der bzw. die mit dem unteren Gehäuseteil (3) verbunde­nen Anschlußleiter (5a,5b) als Teile dieses Gehäuseteils ausgebildet sind.5. quartz crystal housing according to claim 1,
characterized,
that the one or more connecting conductors (5a, 5b) connected to the lower housing part (3) are formed as parts of this housing part. 6. Schwingquarzgehäuse nach Anspruch 1,
dadurch gekennzeichnet,
daß das Bauelement (8) so in dem unteren Gehäuseteil (3) montiert ist, daß es sich, vorzugsweise parallel zur Bodenfläche des Gehäuseteils, zu der niedrigsten Seiten­kante des Gehäuseteils hin erstreckt.6. quartz crystal housing according to claim 1,
characterized,
that the component (8) is mounted in the lower housing part (3) such that it extends, preferably parallel to the bottom surface of the housing part, to the lowest side edge of the housing part.
EP88202009A 1987-09-22 1988-09-15 Quartz vibrator enclosure for surface mounting Expired - Lifetime EP0309042B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3731785 1987-09-22
DE19873731785 DE3731785A1 (en) 1987-09-22 1987-09-22 SWINGING QUARTZ CASE FOR SURFACE MOUNTING

Publications (3)

Publication Number Publication Date
EP0309042A2 true EP0309042A2 (en) 1989-03-29
EP0309042A3 EP0309042A3 (en) 1990-03-21
EP0309042B1 EP0309042B1 (en) 1993-06-16

Family

ID=6336539

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88202009A Expired - Lifetime EP0309042B1 (en) 1987-09-22 1988-09-15 Quartz vibrator enclosure for surface mounting

Country Status (5)

Country Link
US (1) US4891469A (en)
EP (1) EP0309042B1 (en)
JP (1) JPH0193911A (en)
KR (1) KR970005294B1 (en)
DE (2) DE3731785A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69233329T2 (en) 1991-12-18 2004-08-05 Icu Medical, Inc., Irvine Method for fluid transfer
US5738663A (en) * 1995-12-15 1998-04-14 Icu Medical, Inc. Medical valve with fluid escape space
IT1283673B1 (en) * 1996-08-02 1998-04-23 Italtel Spa SURFACE MOUNTING PROCESS OF OSCILLATORS COMPONENTS ON PRINTED CIRCUITS, USING CONDUCTIVE EPOXY RESIN

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1537012A (en) * 1976-01-29 1978-12-29 Seiko Instr & Electronics Piezoelectric vibrator
EP0204379A2 (en) * 1985-06-05 1986-12-10 Philips Patentverwaltung GmbH Production method for an air-tight component enclosure, in particular for a quartz resonator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE758826C (en) * 1940-02-07 1953-03-23 Aeg Extension vessel attached to the side of the tank of a step transformer
US3754153A (en) * 1971-12-02 1973-08-21 Bulova Watch Co Inc Crystal mounting assembly
JPS5938480B2 (en) * 1977-03-16 1984-09-17 日本鋼管株式会社 Piping equipment for multiphase flow fluid
US4190735A (en) * 1978-03-08 1980-02-26 Rca Corporation Semiconductor device package
GB2146839B (en) * 1983-07-27 1987-04-01 Nihon Dempa Kogyo Co Piezoelectric resonator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1537012A (en) * 1976-01-29 1978-12-29 Seiko Instr & Electronics Piezoelectric vibrator
EP0204379A2 (en) * 1985-06-05 1986-12-10 Philips Patentverwaltung GmbH Production method for an air-tight component enclosure, in particular for a quartz resonator

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF ELECTRONIC ENGINEERING (JEE), Band 24, Nr. 246, Juni 1987, Seiten 61-65, Tokyo, JP; K. HINO: "Chip technology for crystal units and oscillators" *

Also Published As

Publication number Publication date
US4891469A (en) 1990-01-02
KR970005294B1 (en) 1997-04-15
KR890005980A (en) 1989-05-18
JPH0193911A (en) 1989-04-12
EP0309042B1 (en) 1993-06-16
DE3881803D1 (en) 1993-07-22
DE3731785A1 (en) 1989-03-30
EP0309042A3 (en) 1990-03-21

Similar Documents

Publication Publication Date Title
EP0400175B1 (en) Surface-mountable optical element
DE602005005646T2 (en) Piezoelectric resonator and arrangement with the enclosed in a housing resonator
DE3718463A1 (en) CONNECT THE CAPACITOR WITH THREE
DE19652030B4 (en) Method for encapsulating an infrared transceiver
EP0952763A2 (en) Housing for electronic components
DE1195829B (en) Electrical circuit chassis and method for its manufacture and assembly
DE3210113C2 (en)
DE3039702C2 (en) relay
AT398676B (en) PCB ARRANGEMENT
DE2617466A1 (en) REEL BODY
EP1284333A2 (en) Electric component assembly
DE3313967A1 (en) Device for the reliable production of electrically conductive connections between housing parts of a housing
EP0309042B1 (en) Quartz vibrator enclosure for surface mounting
DE60204896T2 (en) SOCKET FOR HORIZONTAL MOUNTING OF A COMPONENT
EP0685906A1 (en) Process for producing an electrical apparatus and electrical apparatus produced by this process
DE4132994C2 (en) Device structure for an electrical or electronic device
EP0828412A1 (en) HF-Module, e.g.Tuner
EP0402739A1 (en) Device for electrical connecting of sliding electrical assemblies
CH659918A5 (en) Clamping device
EP0071917B1 (en) Electrical device, group of devices, or integrated circuit, the active part of which is placed on a metal support, and process for its or their manufacture
DE3515910A1 (en) Radio-frequency-proof housing
DE8123367U1 (en) Two-part shielding housing for a high-frequency component
DE4102349A1 (en) Control appts. for current circuit monitoring - involves housing with inlet side covered by baseplate with pin contacts forming part of at least one stamp grid
DE19838218A1 (en) Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board
DE3410983A1 (en) Mounting element for the attachment of an LCD display on a printed-circuit board

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19900919

17Q First examination report despatched

Effective date: 19920820

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

REF Corresponds to:

Ref document number: 3881803

Country of ref document: DE

Date of ref document: 19930722

ITF It: translation for a ep patent filed

Owner name: ING. C. GREGORJ S.P.A.

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19930913

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
ITPR It: changes in ownership of a european patent

Owner name: CAMBIO RAGIONE SOCIALE;PHILIPS ELECTRONICS N.V.

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19980901

Year of fee payment: 11

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19980922

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19981123

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990915

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19990915

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20000531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20000701

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050915