DE19838218A1 - Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board - Google Patents

Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board

Info

Publication number
DE19838218A1
DE19838218A1 DE1998138218 DE19838218A DE19838218A1 DE 19838218 A1 DE19838218 A1 DE 19838218A1 DE 1998138218 DE1998138218 DE 1998138218 DE 19838218 A DE19838218 A DE 19838218A DE 19838218 A1 DE19838218 A1 DE 19838218A1
Authority
DE
Germany
Prior art keywords
circuit board
board
circuit boards
printed circuit
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1998138218
Other languages
German (de)
Inventor
Joachim Dorau
Peter Wiffel
Jochen Straetner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INSTA ELEKTRO GMBH, 58511 LUEDENSCHEID, DE
Original Assignee
Insta Elektro GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Insta Elektro GmbH and Co KG filed Critical Insta Elektro GmbH and Co KG
Priority to DE1998138218 priority Critical patent/DE19838218A1/en
Publication of DE19838218A1 publication Critical patent/DE19838218A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads

Abstract

The base circuit board (LP1) is produced with a central aperture (S) and is fixed edge on to a carrier plate using a standard edge connector. The second board (LP2) is T shaped with the central section passing through the aperture. Components are mounted on both surfaces.

Description

Die vorliegende Erfindung betrifft eine Vorrichtung nach dem Oberbegriff des Anspruchs 1.The present invention relates to a device according to the preamble of claim 1.

Im Zuge der ständigen Weiterentwicklung von elektronischen Produkten wird immer umfangreichere Funktionalität in ein Gerät implementiert. Entsprechend steigt auch der schaltungstechnische Aufwand eines Gerätes. Folglich fällt bei der Umsetzung der Schaltung in ein Layout aufgrund der gestiegenen Anzahl an elektronischen Bauteilen auch ein erhöhter Platzbedarf an. Geräte, die für den Einsatz im Unterputzbereich vorgesehen sind, haben aufgrund der vorgegebenen Dimensionen einer Unterputzdose feste Gehäuseabmessungen. Eine für ein Unterputzgehäuse vorgesehene Leiterplatte hat somit nur einen beschränkten Raum für die Unterbringung von Bauteilen. Darüber hinaus stellt die Unterbringung von Bauteilen mit vergleichsweise großen geometrischen Außenabmessungen wie z. B. Relais oder Kondensatoren in einem Unterputzgehäuse ein Problem dar.In the course of the constant further development of electronic products always extensive functionality implemented in one device. The rises accordingly circuit complexity of a device. Consequently falls in the implementation of the circuit in a layout due to the increased number of electronic components also an increased one Space requirements. Devices that are intended for use in the flush-mounted area due to the given dimensions of a flush-mounted box, fixed housing dimensions. A printed circuit board provided for a flush-mounted housing thus has only a limited one Space for housing components. In addition, the placement of Components with comparatively large geometrical external dimensions such as B. Relay or capacitors in a flush-mounted housing are a problem.

Nach dem Stand der Technik verwendet man Anordnungen gemäß Fig. 1, vgl. G 80 23 162.5. Zwei einzelne Leiterplatten werden parallel zueinander angeordnet und über eine Stiftreihe St oder eine flexible Verbindung J elektrisch miteinander verbunden. Dadurch wird zum einen die zur Verfügung stehende Bestückungsfläche vergrößert, zum anderen können hohe Bauteile B wie z. B. Relais oder Mosfet auf der unteren Leiterplatte Lu plaziert werden, die durch eine entsprechende Aussparung in der oberen Leiterplatte Lo herausragen. Der Nachteil dieser Lösung besteht darin, daß zur elektrischen Kontaktierung zwischen den beiden Leiterplatten eine zusätzliche Verbindung notwendig ist. Darüber hinaus wird die bekannte Anordnung bei einer starren Verbindung serviceunfreundlich, da Bauteile auf der unteren Leiterplatte Lu nur mit Aufwand erreichbar sind.According to the prior art, arrangements according to FIG. 1 are used, cf. G 80 23 162.5. Two individual circuit boards are arranged parallel to each other and electrically connected to one another via a row of pins St or a flexible connection J. This on the one hand increases the available assembly area, on the other hand high components B such as. B. relays or mosfets can be placed on the lower circuit board Lu, which protrude through a corresponding recess in the upper circuit board Lo. The disadvantage of this solution is that an additional connection is necessary for electrical contact between the two circuit boards. In addition, the known arrangement with a rigid connection becomes unfriendly, since components on the lower printed circuit board Lu can only be reached with great effort.

Darüber hinaus ist ein Stand der Technik bekannt, bei dem diskrete Bauteile von der Ober- und der Unterseite einer Leiterplatte bestückt werden. Derartige Anordnungen sind fertigungsunfreundlich, da nur eine Seite der Leiterplatte automatisch bestückt werden kann und die andere manuell bestückt und gelötet werden muß.In addition, a prior art is known in which discrete components of the The top and bottom of a circuit board can be populated. Such arrangements are Unfriendly to manufacture, since only one side of the circuit board can be automatically populated and the other has to be manually assembled and soldered.

Der vorliegenden Erfindung lag daher die Aufgabe zugrunde, eine preiswerte, service- und fertigungsgerechte konstruktive Lösung zu schaffen, um auch für aufwendige Schaltungsanordnungen für den Einsatz im Unterputzbereich eine ausreichend große Bestückungsfläche zur Verfügung zu stellen. Darüber hinaus sollte eine sinnvolle Einbindung verhältnismäßig großer Bauteile gefunden werden.The present invention was therefore based on the object of an inexpensive, service and to create a constructive solution suitable for production, also for complex Circuit arrangements for use in the flush-mounted area a sufficiently large To provide assembly area. In addition, there should be a meaningful involvement relatively large components can be found.

Diese Aufgabe wird mit den Merkmalen des Anspruchs 1 gelöst. Weitere vorteilhafte Ausgestaltungsmerkmale der Erfindung sind in nachfolgender Figurenbeschreibung und in den Unteransprüchen angegeben. Es zeigen:This object is achieved with the features of claim 1. More beneficial Design features of the invention are in the following description of the figures and in specified in the subclaims. Show it:

Fig. 1 den Stand der Technik; Fig. 1 shows the prior art;

Fig. 2 eine schematische Darstellung der Einzelleiterplatten; Fig. 2 is a schematic representation of the individual circuit boards;

Fig. 3 eine schematische Darstellung der sich durchdringenden Leiterplatten; Figure 3 is a schematic representation of the penetrating circuit boards.

Fig. 4 eine schematische Darstellung der konstruktiven Anordnung der beiden Leiterplatten in einem Unterputzgehäuse. Fig. 4 is a schematic representation of the structural arrangement of the two circuit boards in a flush-mounted housing.

Fig. 2 zeigt eine mögliche Ausführung der beiden Einzelleiterplatten LP1 und LP2. Diese können im Fertigungsablauf zunächst automatisch oder manuell mit diskreten Bauteilen und SMD-Komponenten bestückt werden. Anschließend wird die Leiterplatte LP2 senkrecht in die Leiterplatte LP1 gesteckt, wobei die Nasen N der Leiterplatte LP2 in die Ausschnitte A der Leiterplatte LP1 geführt werden. Große Bauteile B auf der Leiterplatte LP2 finden dabei, wie in Fig. 4 dargestellt, in dem Durchbruch S Platz. Um eine elektrisch leitende Verbindung zwischen den beiden Leiterplatten sicherzustellen, werden die Nasen N der Leiterplatte LP2 als Kupferflächen ausgeführt und nach dem Zusammenstecken an den ebenfalls mit Kupferflächen versehenen Ausschnitten A der Leiterplatte LP1 verlötet, ohne hierzu weitere Bauteile zu investieren. Auf der Leiterplatte LP2 können zusätzlich weitere Komponenten K bestückt werden. Fig. 2 shows a possible embodiment of the two individual printed circuit boards LP1 and LP2. In the production process, these can be automatically or manually equipped with discrete components and SMD components. Then the circuit board LP2 is inserted vertically into the circuit board LP1, the tabs N of the circuit board LP2 being guided into the cutouts A of the circuit board LP1. Large components B on the printed circuit board LP2 find space in the opening S, as shown in FIG. 4. In order to ensure an electrically conductive connection between the two printed circuit boards, the lugs N of the printed circuit board LP2 are designed as copper surfaces and, after being plugged together, are soldered to the cutouts A of the printed circuit board LP1, which are also provided with copper surfaces, without investing in additional components. Additional components K can also be fitted on the PCB LP2.

Besonders vorteilhaft ist bei der oben beschriebenen Lösung, daß keine zusätzlichen Komponenten zur Kontaktierung der beiden Leiterplatten benötigt werden. Hierdurch werden Bestückungs- und Bauteilkosten eingespart. Weitere Vorteile sind die fertigungsgerechte Handhabung und im Gegensatz zu den als Stand der Technik beschriebenen Anordnungen eine servicefreundliche Ausführung. It is particularly advantageous in the solution described above that no additional Components for contacting the two circuit boards are required. This will Assembly and component costs saved. Further advantages are the production-oriented Handling and in contrast to the arrangements described as prior art a service-friendly version.  

BezugszeichenlisteReference list

A Ausschnitte
B große Bauteile
G Gehäuse
J flexible Verbindung
K zusätzliche Bauteile
Lo, Lu, LP1, LP2 Leiterplatte
N Nasen
S Durchbruch
St Stiftreihe
T Tragplatte
A cutouts
B large components
G housing
J flexible connection
K additional components
Lo, Lu, LP1, LP2 circuit board
N noses
S breakthrough
St row of pins
T support plate

Claims (6)

1. Vorrichtung zur konstruktiven Anordnung von zwei Leiterplatten in einem elektrischen Installationsgerät zum Einbau in genormte Installationsdosen, insbesondere zum Einbau in 60 mm Unterputzdosen, dadurch gekennzeichnet, daß die beiden Leiterplatten (LP1, LP2) senkrecht zueinander angeordnet sind und sich in einem gehäusetechnisch vorgegebenen Verhältnis durchdringen und die Leiterplatte (LP1) an der Durchdringungsstelle einen Durchbruch (S) aufweist.1. Device for the constructive arrangement of two printed circuit boards in an electrical installation device for installation in standardized installation boxes, in particular for installation in 60 mm flush-mounted boxes, characterized in that the two circuit boards (LP1, LP2) are arranged perpendicular to each other and in a predetermined housing technology penetrate and the circuit board (LP1) has an opening (S) at the penetration point. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß beide Leiterplatten (LP1, LP2) zur Aufnahme von Bauteilen (B) vorgesehen sind (Fig. 4).2. Device according to claim 1, characterized in that both printed circuit boards (LP1, LP2) are provided for receiving components (B) ( Fig. 4). 3. Vorrichtung nach Anspruch 1 und 2, dadurch gekennzeichnet, daß große Bauteile (B) auf der Leiterplatte (LP2) untergebracht sind und durch den Durchbruch (S) der Leiterplatte (LP1) beidseitig herausragen.3. Device according to claim 1 and 2, characterized in that large components (B) are housed on the circuit board (LP2) and through the opening (S) of the Stick out the printed circuit board (LP1) on both sides. 4. Vorrichtung nach Anspruch 1 bis 3, dadurch gekennzeichnet, daß zusätzliche Bauteile (K) auf der Leiterplatte (LP1) und auf der Leiterplatte (LP2) bestückbar sind, die nicht den Schacht (S) durchragen.4. Apparatus according to claim 1 to 3, characterized in that additional components (K) on the printed circuit board (LP1) and on the printed circuit board (LP2), which are not protrude through the shaft (S). 5. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß bei den senkrecht zueinander angeordneten Leiterplatten (LP1, LP2) Nasen (N) der Leiterplatte (LP2) in Ausschnitte (A) der Leiterplatte (LP1) geführt sind.5. The device according to claim 1, characterized in that the vertical PCBs arranged to each other (LP1, LP2) lugs (N) of the PCB (LP2) in Cutouts (A) of the circuit board (LP1) are guided. 6. Vorrichtung nach Anspruch 1 und 5, dadurch gekennzeichnet, daß die elektrisch leitende Verbindung zwischen den beiden Leiterplatten (LP1, LP2) durch direktes Verlöten miteinander erfolgt, wobei die Nasen (N) und die zugehörigen Ausschnitte (A) mit Kupferflächen versehen sind.6. Apparatus according to claim 1 and 5, characterized in that the electrically conductive connection between the two circuit boards (LP1, LP2) by direct Soldering takes place with one another, the lugs (N) and the associated cutouts (A) are provided with copper surfaces.
DE1998138218 1998-08-22 1998-08-22 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board Withdrawn DE19838218A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1998138218 DE19838218A1 (en) 1998-08-22 1998-08-22 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1998138218 DE19838218A1 (en) 1998-08-22 1998-08-22 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board

Publications (1)

Publication Number Publication Date
DE19838218A1 true DE19838218A1 (en) 2000-02-24

Family

ID=7878405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998138218 Withdrawn DE19838218A1 (en) 1998-08-22 1998-08-22 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board

Country Status (1)

Country Link
DE (1) DE19838218A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1718137A2 (en) * 2005-02-16 2006-11-02 Alps Electric Co., Ltd. Three-dimensional circuit module and method of manufacturing the same
DE102008012443A1 (en) 2008-03-04 2009-09-10 Ifm Electronic Gmbh Optical sensor i.e. optical proximity switch, has opening partially limited by metal edge surface, and printed circuit boards forming mechanically rigid and electrically conductive solder connection and arranged right-angled to each other
DE102011054105A1 (en) 2011-09-30 2013-04-04 Sick Ag Connecting conductor plate for electrically and mechanically connecting two printed circuit boards in linear magnetic field sensor, has contacts for connecting with contact surfaces of boards that are arranged surface-parallel to each other
DE102014102976A1 (en) 2014-03-06 2015-09-10 Endress + Hauser Wetzer Gmbh + Co. Kg Printed circuit board and arrangement for electrically connecting an operating electronics

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1951167A1 (en) * 1968-10-11 1970-04-23 S E Lab Holdings Ltd oscilloscope
DE8023162U1 (en) * 1980-08-30 1981-03-19 INSTA Elektro GmbH & Co KG, 5880 Lüdenscheid Electrical installation device with a device for remote control and an electro-mechanical switchgear
DE2824384C2 (en) * 1978-06-03 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Hand-held power tool with a printed circuit board housed in the handle
DE3402826A1 (en) * 1984-01-27 1985-08-01 Siemens AG, 1000 Berlin und 8000 München ELECTRICAL INSTALLATION DEVICE, IN PARTICULAR FOR TRANSMITTING INFORMATION ABOUT INSTALLATION CABLES
DE4236268A1 (en) * 1991-11-25 1993-05-27 Siemens Ag Oesterreich Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections
EP0674473A2 (en) * 1994-03-21 1995-09-27 Eaton Corporation Direct circuit board connection

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1951167A1 (en) * 1968-10-11 1970-04-23 S E Lab Holdings Ltd oscilloscope
DE2824384C2 (en) * 1978-06-03 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Hand-held power tool with a printed circuit board housed in the handle
DE8023162U1 (en) * 1980-08-30 1981-03-19 INSTA Elektro GmbH & Co KG, 5880 Lüdenscheid Electrical installation device with a device for remote control and an electro-mechanical switchgear
DE3402826A1 (en) * 1984-01-27 1985-08-01 Siemens AG, 1000 Berlin und 8000 München ELECTRICAL INSTALLATION DEVICE, IN PARTICULAR FOR TRANSMITTING INFORMATION ABOUT INSTALLATION CABLES
DE4236268A1 (en) * 1991-11-25 1993-05-27 Siemens Ag Oesterreich Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections
EP0674473A2 (en) * 1994-03-21 1995-09-27 Eaton Corporation Direct circuit board connection

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1718137A2 (en) * 2005-02-16 2006-11-02 Alps Electric Co., Ltd. Three-dimensional circuit module and method of manufacturing the same
EP1718137A3 (en) * 2005-02-16 2007-08-01 Alps Electric Co., Ltd. Three-dimensional circuit module and method of manufacturing the same
DE102008012443A1 (en) 2008-03-04 2009-09-10 Ifm Electronic Gmbh Optical sensor i.e. optical proximity switch, has opening partially limited by metal edge surface, and printed circuit boards forming mechanically rigid and electrically conductive solder connection and arranged right-angled to each other
DE102008012443B4 (en) * 2008-03-04 2015-05-21 Ifm Electronic Gmbh Connection arrangement of two printed circuit boards for an optical proximity switch
DE102011054105A1 (en) 2011-09-30 2013-04-04 Sick Ag Connecting conductor plate for electrically and mechanically connecting two printed circuit boards in linear magnetic field sensor, has contacts for connecting with contact surfaces of boards that are arranged surface-parallel to each other
DE102014102976A1 (en) 2014-03-06 2015-09-10 Endress + Hauser Wetzer Gmbh + Co. Kg Printed circuit board and arrangement for electrically connecting an operating electronics

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: INSTA ELEKTRO GMBH, 58511 LUEDENSCHEID, DE

8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee