EP0276190B1 - Procédé et dispositif pour déposer électrolytiquement au défilé un film continu de nickel sur du fil métallique à usage électrique - Google Patents

Procédé et dispositif pour déposer électrolytiquement au défilé un film continu de nickel sur du fil métallique à usage électrique Download PDF

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Publication number
EP0276190B1
EP0276190B1 EP88420002A EP88420002A EP0276190B1 EP 0276190 B1 EP0276190 B1 EP 0276190B1 EP 88420002 A EP88420002 A EP 88420002A EP 88420002 A EP88420002 A EP 88420002A EP 0276190 B1 EP0276190 B1 EP 0276190B1
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EP
European Patent Office
Prior art keywords
nickel
wire
bath
tank
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP88420002A
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German (de)
English (en)
French (fr)
Other versions
EP0276190A1 (fr
Inventor
Jacques Léfèbre
Philippe Giménez
Gabriel Colombier
Armand Golay
Jean-Sylvestre Safrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rio Tinto France SAS
Original Assignee
Aluminium Pechiney SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aluminium Pechiney SA filed Critical Aluminium Pechiney SA
Publication of EP0276190A1 publication Critical patent/EP0276190A1/fr
Application granted granted Critical
Publication of EP0276190B1 publication Critical patent/EP0276190B1/fr
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Definitions

  • the invention relates to a method and a device for electrolytically depositing, on parade, a continuous film of nickel in the form of globules of adjustable size on metallic wire for electrical use.
  • French Patent No. 2,526,052 belonging to the applicant, teaches a process and a device for coating a long length of metal with a metal layer. It applies in particular to direct nickel plating, that is to say without the application of intermediate layers, electrical conductors of aluminum or one of its alloys, with a diameter between 1.5 and 3 mm and used for either industrial or domestic purposes.
  • the process consists in passing the wire, previously freed from lubrication residues, firstly through a liquid current socket which will be called hereinafter activation bath where, by passing a continuous or pulsed electric current, it charges positively and acquires, under the action of acidic and / or saline compounds contained in the bath, a so-called active surface which is perfectly suitable for subsequent coating; then, through a nickel-plating bath where, by passing the same current, it becomes negatively charged and gradually becomes covered with nickel until it forms a continuous film.
  • This process made it possible to obtain, on wires traveling at nearly 300 m / minute, a nickel film with a thickness of a few microns having in particular good adhesion and a weak and non-evolving contact resistance, properties which are essential for producing conductors. reliable electrical.
  • This adhesion was such that the wire could then be drawn to a diameter of 0.78 mm without there being any detachment or tearing of the nickel coating.
  • the aforementioned patent also teaches a compact device in which the activation and nickel-plating tanks each have a length close to 5 meters and are each equipped with a planar electrode extending parallel to the wire over its entire path in the bath.
  • the Applicant has found that it is necessary to reduce the current density in the upstream part of the nickel-plating bath in order to see a layer of nickel appear in the form of globules which adhere and cover the substrate better and which confer low contact resistance.
  • This improvement has been accentuated by replacing the profile of the current density inherent in the prior process, namely a decreasing curve from the entry to the exit of the bath, a profile in which a regular growth succeeds a slow decay and, in particular , by locating the maximum density at a point in the bath located between a third of the length from the inlet and the middle while reducing as much as possible the difference between this maximum density and the minimum density.
  • the means of the invention consist, on the other hand, in adjusting the acidity of the nickel-plating bath to a pH value of between 1 and 5 because within this range, the Applicant has found that the size of the nickel globules with the advantages mentioned above and this especially as the acidity increases. These results are particularly clear for pH values between 2.5 and 3.5.
  • This acidity can be increased, for example, by increasing the amount of sulfamic acid in the nickel plating bath which, as described in the aforementioned patent further contains nickel chloride and orthoboric acid while in the plating bath. 'activation, we find the same constituents described in said patent.
  • the method of the invention can be applied to any metallic wire such as copper wire for example.
  • any metallic wire such as copper wire for example.
  • it finds a particular interest in the nickel plating of aluminum wires or in one of its alloys for electrical use because it allows, because of its relatively low specific mass and the lightening which results therefrom, a substantial saving of energy. when it is substituted for copper for making cables intended to equip, for example, land or air transport vehicles.
  • This process is particularly suitable for nickel plating of small section strands (less than 1 mm) because it gives a very adherent coating which makes it suitable for making strands and cables which can be obtained by simultaneously nickel plating several strands placed in vertical tablecloth in the same bath.
  • the invention also relates to a device for applying the method described above.
  • This device comprises, as in the aforementioned patent, in the direction of travel of the wire, a first tank containing the activation bath, a rinsing compartment, a second tank containing the nickel-plating bath, the two tanks each being equipped with at least two pairs of planar electrodes, each pair being formed of electrodes placed on either side of the wire or wires and at least partially immersed in their respective bath, the pairs of the activation bath being connected to a source of negative current and those of the nickel bath being connected to a positive current source.
  • the electrodes of at least one of said pairs are removable, placed at an adjustable distance from at least one neighboring pair and from the wire and which is interposed between each of said electrodes and the wire at least one removable screen made of electrically insulating material.
  • the device according to the invention consists firstly of pairs of electrodes that can be moved either along the length of the tank to bring them closer or away from each other or leave free spaces in particular at one of the ends of the tanks, or according to the other dimension of the tank to bring them closer or less of the wire (s) to be coated.
  • the current density profile along the wire knowing that the absence of electrodes decreases this density and that the approximation of the electrodes of the wire increases it.
  • the profile defined above can be obtained either by leaving a free space in the upstream part of the nickel-plating tank and / or downstream of the activation tank, or by bringing the electrodes of the wire in the part opposite to the aforementioned part.
  • the specific means for moving the electrodes they can be produced from the knowledge of a person skilled in the art.
  • the device of the invention also consists of the presence of at least one removable screen between each of the electrodes of at least one pair and the wire.
  • These screens are made of an electrically insulating material and preferably have good resistance to the activation or nickel-plating bath. These screens are placed more or less far from the wire and at least partially mask the electrodes so that they interrupt or deflect the lines of current flowing in the baths and therefore make it possible to reduce the current density at precise locations in the bath.
  • these screens are placed in the upstream part of the tank and / or downstream of the activation tank.
  • screens provided with holes of variable diameter.
  • the number of holes is varied as a function of the position of the screen in the tank and, in particular, their number is increased in the direction of travel of the wire.
  • the device thus designed is suitable for the treatment of one or more wires by providing in the walls of the tanks located at the end of suitable openings located next to each other and equipped with seals.
  • a circulation of the latter by means of pumps.
  • the device is also notably completed by a rinsing compartment intended to eliminate by means of demineralized water the bath which may have been entrained out of the nickel-plating tank, the water which wets the wire then being evaporated in a drying compartment.
  • All the rinsing tanks and compartments are designed as modular elements, of length and section adaptable to the coating problem posed and easily associable with each other.
  • FIG. 1 represents a perspective view of a nickel-plating tank cut lengthwise along a vertical plane placed a little in front of the plant of median symmetry .
  • the electrodes and the screens are suspended in the bath by means not shown which allow them to be moved longitudinally and transversely in the tank.
  • the bath is driven in a circulation movement from bottom to top by means of a pump, not shown, supplied by the flow of overflows 10 and which discharges said bath into the distribution ramp 11.
  • the strands obtained were each covered with an average thickness of nickel of 1.5 ⁇ m in the form of globules with a diameter of 1.0 ⁇ m, a representation of which at 3000 magnification is shown in FIG. 2 and which can be compared in FIG. 3 corresponding to the prior art and which gave much larger globules (3 wm) and not forming a continuous layer.
  • nickel-plated wires were stranded and wired, then insulated with materials approved by the aeronautics industry.
  • the invention finds its application in the nickel plating of metallic wires in particular of aluminum, of any diameter and, in particular, less than 1 mm and allows obtaining by stranding and wiring of light and reliable electrical conductors which are particularly advantageous for equipping spacecraft. air or land transport where energy saving by reducing equipment is much appreciated.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
EP88420002A 1987-01-06 1988-01-04 Procédé et dispositif pour déposer électrolytiquement au défilé un film continu de nickel sur du fil métallique à usage électrique Expired - Lifetime EP0276190B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8700952A FR2609292B1 (fr) 1987-01-06 1987-01-06 Procede et dispositif pour deposer electrolytiquement au defile un film continu de nickel sur du fil metallique a usage electrique
FR8700952 1987-01-06

Publications (2)

Publication Number Publication Date
EP0276190A1 EP0276190A1 (fr) 1988-07-27
EP0276190B1 true EP0276190B1 (fr) 1990-09-19

Family

ID=9347320

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88420002A Expired - Lifetime EP0276190B1 (fr) 1987-01-06 1988-01-04 Procédé et dispositif pour déposer électrolytiquement au défilé un film continu de nickel sur du fil métallique à usage électrique

Country Status (16)

Country Link
US (1) US4741811A (enrdf_load_stackoverflow)
EP (1) EP0276190B1 (enrdf_load_stackoverflow)
JP (1) JPS63213694A (enrdf_load_stackoverflow)
CN (1) CN1008823B (enrdf_load_stackoverflow)
AT (1) ATE56758T1 (enrdf_load_stackoverflow)
AU (1) AU589106B2 (enrdf_load_stackoverflow)
BR (1) BR8800017A (enrdf_load_stackoverflow)
CA (1) CA1309690C (enrdf_load_stackoverflow)
DE (1) DE3860610D1 (enrdf_load_stackoverflow)
DK (1) DK388A (enrdf_load_stackoverflow)
ES (1) ES2019995B3 (enrdf_load_stackoverflow)
FI (1) FI880021A7 (enrdf_load_stackoverflow)
FR (1) FR2609292B1 (enrdf_load_stackoverflow)
IS (1) IS1431B6 (enrdf_load_stackoverflow)
NO (1) NO880019L (enrdf_load_stackoverflow)
PT (1) PT86493B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1001859A3 (nl) * 1988-10-06 1990-03-20 Bekaert Sa Nv Inrichting voor het continu electrolytisch behandelen van draadvormige voorwerpen.
EP1290246A1 (en) 2000-05-18 2003-03-12 Corus Aluminium Walzprodukte GmbH Method of manufacturing an aluminium product
US6796484B2 (en) 2001-02-02 2004-09-28 Corus Aluminum Walzprodukte Gmbh Nickel-plated brazing product having improved corrosion performance
AU2002316865B2 (en) 2001-04-20 2006-07-20 Corus Aluminium Walzprodukte Gmbh Method of plating and pretreating aluminium workpieces
US6572743B2 (en) * 2001-08-23 2003-06-03 3M Innovative Properties Company Electroplating assembly for metal plated optical fibers
US6815086B2 (en) 2001-11-21 2004-11-09 Dana Canada Corporation Methods for fluxless brazing
US6994919B2 (en) * 2002-01-31 2006-02-07 Corus Aluminium Walzprodukte Gmbh Brazing product and method of manufacturing a brazing product
US7294411B2 (en) * 2002-01-31 2007-11-13 Aleris Aluminum Koblenz Gmbh Brazing product and method of its manufacture
US7056597B2 (en) * 2002-12-13 2006-06-06 Corus Aluminium Walzprodukte Gmbh Brazing sheet product and method of its manufacture
US7078111B2 (en) * 2002-12-13 2006-07-18 Corus Aluminium Walzprodukte Gmbh Brazing sheet product and method of its manufacture
US20060157352A1 (en) * 2005-01-19 2006-07-20 Corus Aluminium Walzprodukte Gmbh Method of electroplating and pre-treating aluminium workpieces
CA2596018C (en) * 2005-02-08 2015-11-03 Dyno Nobel Inc. Delay units and methods of making the same
US8794152B2 (en) 2010-03-09 2014-08-05 Dyno Nobel Inc. Sealer elements, detonators containing the same, and methods of making
CN102790199B (zh) * 2012-08-22 2015-08-05 陈伟洲 锂离子电池正极极耳及其制造方法
CN103820831B (zh) * 2014-02-13 2016-08-24 德清县佳伟线缆有限公司 一种金属线材的电镀处理设备
CN118173330B (zh) * 2024-05-14 2024-07-19 山东无棣海丰电缆有限公司 一种海洋电缆加工用防腐蚀处理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097342A (en) * 1975-05-16 1978-06-27 Alcan Research And Development Limited Electroplating aluminum stock
US4126522A (en) * 1976-08-09 1978-11-21 Telefonaktiebolaget L M Ericsson Method of preparing aluminum wire for electrical conductors
FR2526052B1 (fr) * 1982-04-29 1985-10-11 Pechiney Aluminium Procede et dispositif pour revetir une grande longueur de metal d'une couche metallique

Also Published As

Publication number Publication date
CN1008823B (zh) 1990-07-18
AU589106B2 (en) 1989-09-28
FR2609292B1 (fr) 1989-03-24
JPS63213694A (ja) 1988-09-06
PT86493A (pt) 1989-01-30
DK388D0 (da) 1988-01-04
CN88100133A (zh) 1988-07-20
AU1005988A (en) 1988-07-07
NO880019L (no) 1988-07-07
FR2609292A1 (fr) 1988-07-08
EP0276190A1 (fr) 1988-07-27
IS3303A7 (is) 1988-07-07
PT86493B (pt) 1993-08-31
DK388A (da) 1988-07-07
ATE56758T1 (de) 1990-10-15
FI880021A7 (fi) 1988-07-07
DE3860610D1 (de) 1990-10-25
US4741811A (en) 1988-05-03
ES2019995B3 (es) 1991-07-16
BR8800017A (pt) 1988-08-02
NO880019D0 (no) 1988-01-05
IS1431B6 (is) 1990-07-16
CA1309690C (fr) 1992-11-03
FI880021A0 (fi) 1988-01-05
JPH0317920B2 (enrdf_load_stackoverflow) 1991-03-11

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