EP0224937B1 - Montage d'une tête d'imprimante à gicleur d'encre thermique - Google Patents

Montage d'une tête d'imprimante à gicleur d'encre thermique Download PDF

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Publication number
EP0224937B1
EP0224937B1 EP19860116956 EP86116956A EP0224937B1 EP 0224937 B1 EP0224937 B1 EP 0224937B1 EP 19860116956 EP19860116956 EP 19860116956 EP 86116956 A EP86116956 A EP 86116956A EP 0224937 B1 EP0224937 B1 EP 0224937B1
Authority
EP
European Patent Office
Prior art keywords
ink
thin film
film resistor
heater elements
elongated slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19860116956
Other languages
German (de)
English (en)
Other versions
EP0224937A3 (en
EP0224937A2 (fr
Inventor
Samuel A. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0224937A2 publication Critical patent/EP0224937A2/fr
Publication of EP0224937A3 publication Critical patent/EP0224937A3/en
Application granted granted Critical
Publication of EP0224937B1 publication Critical patent/EP0224937B1/fr
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17513—Inner structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Definitions

  • This invention relates to a thermal ink jet print head assembly and a method for making the same.
  • a plurality of electrically resistive elements is provided on a common thin film substrate for the purpose of heating a corresponding plurality of adjacent ink reservoirs during the ink ejection and printing process.
  • the adjacent ink reservoirs are typically provided as cavities in a barrier layer above the substrate for properly concentrating thermal energy emanating from the resistive elements to predefined volumes of ink.
  • a plurality of ink ejection orifices are provided above these cavities and provide exit paths for ink during the printing process.
  • a further disadvantage of using a plurality of ink flow channels in a common substrate is that they normally require a special routing of conductive leads on the substrate surface. In addition to the added costs associated with this special routing, this requirement also greatly reduces the achievable packing density because of the surface area required to accomodate such special routing schemes.
  • the general problem of this invention is to provide a new and improved ink jet printhead assembly and a method for fabricating the same, which eliminate the above problems associated with the use of drilled holes through a common printhead substrate member particularly to avoid different pressure drops in the ink flow paths.
  • a single elongated slot is cut in the substrate and provides ink flow to a plurality of ink reservoirs associated with resistive heater elements formed above the top surface of the substrate. These heater elements are spaced around the periphery of the slot at predetermined distances therefrom.
  • Conductive leads are provided on the substrate between each resistive heater element and external electrical connections, and a barrier layer and orifice plate member covers all of the resistive heater elements and defines a plurality of individual ink reservoirs repectively above each of the resistive heater elements.
  • the above described slotted geometry structure greatly increases the packing density of heater resistors on the common printhead substrate.
  • This increase in packing density is partially a result of the fact that, in the prior art multiple hole printhead structures, the conductive traces to the individual resistor elements had to be routed around the holes, thus increasing the required substrate area.
  • a packing density increase of 8:1 to 10:1 may be achieved.
  • the substrate is die bonded to a header manifold member.
  • This manifold member has an elongated slot therein for passing ink from a well section of the header manifold and through the substrate slot to the individual reservoirs of the barrier layer and orifice plate member.
  • An important advantage of a printhead assembly of the present invention is an improved packing density for the heater resistors and their associated ink jet orifices and reservoirs.
  • Another advantage is that according to the method of the invention the printhead assembly is realized by using latest state-of-the-art semiconductor processing techniques.
  • Still a further advantage of this invention is the provision of improved control of ink flow pressures from a common ink supply source and through a single slot in a thin film resistor structure and then through a common ink flow path simultaneously to a plurality of ink reservoirs in the printhead assembly.
  • Figure 1A is an isometric view of the slotted thin film resistor die (substrate) used in a preferred embodiment of the invention.
  • Figure 2 is an exploded view showing the die placement, the external lead attachment, and the orifice plate attachment steps used in fabricating the complete thermal ink jet printhead assembly in a preferred embodiment of the invention.
  • Figures 3A and 3B are fragmented and greatly enlarged plan and cross section views respectively, of the novel slot and lateral ink feed sections of the above printhead structure.
  • FIG. 1 there is shown a thin film resistor substrate 10 for a thermal ink jet printer and including a metal orifice plate 12 thereon.
  • the orifice plate 12 is typically constructed of nickel and includes a plurality of ink ejection openings or nozzles 14 spaced uniformly around the edges of an ink feed slot 16 indicated by the dotted lines in Figure 1.
  • the thin film resistor substrate 10 will be mounted on the top, I-beam shaped surface 18 of a header manifold 20.
  • the header manifold 20 will include an ink reservoir (not shown) within the confines thereof which communicates with an ink feed slot 22.
  • the slot 22 is aligned with the ink feed slot 16 in the thin film resistor substrate 10.
  • the header manifold 20 further includes contoured walls 24 which have been shaped to match corresponding contoured walls of an ink jet printer carriage assembly (not shown) for receiving the printhead structure of Figure 2 when completely assembled.
  • the thin film resistor substrate 10 is positioned directly on the upper surface 18 of the header 20, and a flexible, tape automated bond (TAB) circuit 26 is brought into electrical contact with conductive traces on the top surface of the thin film resistor substrate 10.
  • TAB tape automated bond
  • a plurality of thin conductive leads 28 overlie the contoured side walls 24 of the header 20, and the interior leads 30 of the tab bond flex circuit 26 are thermocompression bonded to conductive traces on the thin film resistor substrate 10.
  • the orifice plate 12 will be brought into alignment with the thin film resistor substrate 10 by means of an orifice plate and barrier layer manufacturing process.
  • the thin film resistor substrate 10 will typically include a silicon substrate 32 upon which is deposited a thin layer 34 of silicon dioxide for passivating and insulating the surface of the silicon substrate 32.
  • a plurality of heater resistors 36 and 38 are formed on the upper surface of the silicon dioxide layer 34 and will typically be either tantalum aluminum or tantalum pentoxide and fabricated using known photolithographic masking and etching techniques.
  • Aluminum trace conductors 40 make electrical contact to the heater resistors 36 and 38 for providing electrical pulses thereto during an ink jet printing operation, and these conductors are formed from a layer of aluminum previously evaporated on the upper surface of the silicon layer 34 using conventional metal evaporation processes.
  • a surface barrier layer 42 typically of silicon carbide or silicon nitride, is deposited over the upper surfaces of the conductors 40 and the heater resistors 36 and 38 to protect these members from cavitation wear and the ink corrosion which would otherwise be caused by the highly corrosive ink located in the reservoirs directly above these heater resistors.
  • the silicon carbide layer 42, as well as the previously identified S i O2 surface layer 34, resistors 36 and 38 and aluminum conductors 40 are all formed using semiconductor processes well known to those skilled in thermal ink jet and semiconductor processing arts and for that reason are not described in detail herein. However, for a further detailed discussion of such processes, reference may be made to the above Hewlett Packard Journal , Volume 36, Number 5, May 1985.
  • a nickel orifice plate 44 is positioned as shown on top of the silicon carbide layer 42 and includes ink reservoir areas 46 and 48 located directly above the heater resistors 36 and 38 for receiving ink therein by way of the horizontal slot 16.
  • These ink reservoirs 46 and 48 extend vertically upward of the substrate 10 as shown and merge into the output ink ejection orifices defined by the convergent contoured walls 50 and 52.
  • These contoured walls 50 and 52 have been designed to reduce cavitational wear and prevent "gulping" during an ink jet printing operation as described in more detail in the above identified copending Chan et al. application.
  • ink will flow along the path indicated by the arrow 54 and laterally along the path 56 and into the ink flow ports 58, 60, 62, 64, 66 and 68 as identified on the left-hand portion of the structure of Figures 3A and 3B.
  • ink will enter the ink flow ports 70 , 72, 74, 76, 78 and 80 on the right-hand portion of the structure of Figure 3B.

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (7)

  1. Ensemble tête d'impression à jet d'encre thermique comprenant :
    (a) un élément formant substrat (10 ; 32) présentant intérieurement une fente allongée (16) destinée à recevoir l'encre arrivant d'un réservoir commun, ledit substrat (10) étant monté sur un collecteur (20) servant à former une alimentation en encre et présentant aussi une fente (22) d'acheminement de l'encre qui est alignée sur ladite fente allongée (16) dudit substrat (10 ; 32) pour assurer l'écoulement de l'encre vers ladite fente allongée (16) ;
    (b) une pluralité d'éléments chauffants résistants (36, 38) espacés sur le tour de la périphérie de ladite fente (16), à des distances prédéterminées de cette fente, et reliés à une pluralité correspondante de conducteurs (40) prévus sur la surface dudit élément substrat ; et
    (c) un élément formant couche barrière et plaque à orifices (12 ; 44) monté au-dessus desdits conducteurs (40) et comprenant une pluralité correspondante de réservoirs de jets d'encre (46, 48) destinés à recevoir de l'encre en provenance de ladite fente allongée (16), lesdits réservoirs (46, 48) étant alignés sur lesdits éléments chauffants résistants (36, 38) et sur une pluralité d'orifices de sortie (14 ; 50, 52) pour recevoir une énergie thermique desdits éléments chauffants (36, 38) et éjecter l'encre sur un milieu d'impression choisi, lesdits réservoirs (46, 48) étant tous placés à des distances prédéterminées d'écoulement de l'encre de ladite fente allongée (16), de sorte que la perte de charge due à l'écoulement du liquide entre lesdits réservoirs (46, 48) et ladite fente (16) est rendue égale pour tous.
  2. Ensemble selon la revendication 1, caractérisé en ce que :
    (a) ledit élément formant substrat est une structure de résistances à film mince (10 ; 32), la fente allongée (16) prévue dans ce substrat s'étendant d'une grande face à l'autre, et lesdits éléments chauffants résistants (36, 38) étant espacés uniformément autour de la périphérie de ladite fente (16) ;
    (b) un élément (26) formant cadre de conducteurs est uniformément fixé à ladite structure de résistances à film mince (10 ; 32) pour établir des connexions électriques avec lesdits éléments chauffants résistants (36, 38) et s'étend latéralement dans le sens qui s'éloigne desdits éléments chauffants résistants (38, 38) dans le plan de ces éléments ;
    (c) ladite plaque à orifices (12 ; 44) est fixée sur ladite structure de résistances à film mince (10 ; 32) et possède ledit réservoir d'encre (46, 48), ainsi que des orifices de sortie (14 ; 50, 52) alignés sur lesdits éléments chauffants résistants (36, 38) pour recevoir de l'énergie thermique en provenance de ces éléments pendant une opération d'impression à jet d'encre ; et
    (d) ledit collecteur comprend un élément de collecteur isolant (20) dont la fente allongée (22) posséde des dimensions en largeur et longueur égales aux dimensions en largeur et longueur de ladite fente allongée (16) de ladite structure de résistances à film mince (10) et qui est fixé à cette structure de manière que lesdites fentes allongées (16, 22) de ladite structure de résistances à film mince et dudit collecteur soient alignées et forment un trajet d'écoulement de l'encre allant d'une source d'encre commune auxdits réservoirs (46, 48) de ladite plaque à orifices (12), et les conducteurs (30) dudit cadre de conducteur (26) sont profilés à la forme de la surface dudit élément de collecteur (20), de sorte que la densité de groupement desdits éléments chauffants (36, 38) sur ladite structure de résistances à film mince est portée au maximum.
  3. Procédé de fabrication d'un ensemble tête d'impression à jet d'encre thermique comprenant une structure de résistances à film mince (10) comprenant elle-même une pluralité de réservoirs d'encres (46, 48) et des éléments chauffants résistants à film mince (36, 38) qui leur sont respectivement associés, pour activer thermiquement lesdits réservoirs, et un élément formant plaque à orifices (12) placé au-dessus de ladite structure (10) pour en éjecter l'encre en réponse à la réception d'une énergie thermique en provenance desdits éléments chauffants résistants (36, 38), caractérisé
       en ce qu'on forme une fente allongée (16) dans ladite structure de résistances à film mince (10) et dans la région adjacente auxdits réservoirs (46, 48) pour amener l'encre à s'écouler à partir d'une source d'encre commune (22), à travers ladite fente (16) et sur un trajet commun (54, 56) d'écoulement de l'encre, de façon qu'elle atteigne simultanément tous lesdits réservoirs.
  4. Procédé selon la revendication 3, caractérisé en ce que
       lesdits éléments chauffants résistants (36, 38) sont espacés uniformément tout autour de ladite fente allongée (16), à des distances prédéterminées,
       des contacts électriques sont établis sur lesdits éléments chauffants résistants (36, 38), et
       ladite structure de résistances à film mince (10) est fixée à un collecteur isolant (20) qui présente intérieurement une fente (22) d'alimentation en encre correspondante, pour fournir de l'encre à ladite fente allongée (16) de ladite structure de résistances à film mince (10).
  5. Procédé selon la revendication 4, caractérisé en ce que
       les contacts électriques sont formés en fixant une pluralité de conducteurs (28), en contact électrique avec lesdits éléments chauffants résistants (36, 38) et dans le plan desdits élements, à la surface de ladite structure de résistances à film mince (10), et
       ladite structure de résistances à film mince (10) est fixée audit collecteur isolant (20), la fente allongée (22) d'alimentation en encre qui y est formée ayant des dimensions en largeur et longueur égales aux dimensions en largeur et longueur de ladite fente allongée (16) de ladite structure de résistances à film mince (10).
  6. Procédé selon la revendication 5, caractérisé en ce que
       lesdits conducteurs (28) sont prolongés le long de surfaces inclinées dudit collecteur isolant (20).
  7. Procédé selon une quelconque des revendications 3 à 6, caractérisé en ce que
       ladite fente (16) est formée en découpant un substrat de silicium (10) à l'aide d'une lame de scie diamantée.
EP19860116956 1985-12-06 1986-12-05 Montage d'une tête d'imprimante à gicleur d'encre thermique Expired EP0224937B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80629485A 1985-12-06 1985-12-06
US806294 1985-12-06

Publications (3)

Publication Number Publication Date
EP0224937A2 EP0224937A2 (fr) 1987-06-10
EP0224937A3 EP0224937A3 (en) 1988-11-17
EP0224937B1 true EP0224937B1 (fr) 1991-11-21

Family

ID=25193745

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19860116956 Expired EP0224937B1 (fr) 1985-12-06 1986-12-05 Montage d'une tête d'imprimante à gicleur d'encre thermique

Country Status (5)

Country Link
EP (1) EP0224937B1 (fr)
JP (1) JPH0773915B2 (fr)
CA (1) CA1278949C (fr)
DE (1) DE3682569D1 (fr)
SG (1) SG77492G (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2671300B2 (ja) * 1986-03-17 1997-10-29 セイコーエプソン株式会社 インクジエツト記録装置
JP2638780B2 (ja) * 1986-04-30 1997-08-06 セイコーエプソン株式会社 インクジェット記録ヘッド
DE3717294C2 (de) * 1986-06-10 1995-01-26 Seiko Epson Corp Tintenstrahlaufzeichnungskopf
JP2661016B2 (ja) * 1986-06-24 1997-10-08 セイコーエプソン株式会社 インクジェット記録ヘッド
IT1234800B (it) * 1989-06-08 1992-05-27 C Olivetti & C Spa Sede Via Je Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute
US5274400A (en) * 1992-04-28 1993-12-28 Hewlett-Packard Company Ink path geometry for high temperature operation of ink-jet printheads
US6447088B2 (en) 1996-01-16 2002-09-10 Canon Kabushiki Kaisha Ink-jet head, an ink-jet-head cartridge, an ink-jet apparatus and an ink-jet recording method used in gradation recording
US6137510A (en) * 1996-11-15 2000-10-24 Canon Kabushiki Kaisha Ink jet head
US5984455A (en) * 1997-11-04 1999-11-16 Lexmark International, Inc. Ink jet printing apparatus having primary and secondary nozzles
US6017112A (en) * 1997-11-04 2000-01-25 Lexmark International, Inc. Ink jet printing apparatus having a print cartridge with primary and secondary nozzles
JP5679665B2 (ja) * 2009-02-06 2015-03-04 キヤノン株式会社 インクジェット記録ヘッド
JP5532227B2 (ja) * 2010-03-25 2014-06-25 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP6272002B2 (ja) * 2013-12-18 2018-01-31 キヤノン株式会社 液体吐出ヘッド及び液体吐出装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188635A (en) * 1977-10-03 1980-02-12 International Business Machines Corporation Ink jet printing head
JPS5764563A (en) * 1980-10-07 1982-04-19 Fuji Xerox Co Ltd Ink particle jet apparatus of multi-nozzle ink jet printer
US4500895A (en) * 1983-05-02 1985-02-19 Hewlett-Packard Company Disposable ink jet head
DE3480183D1 (en) * 1984-05-18 1989-11-23 Siemens Ag Device for fastening and contacting for cylindrical piezo-electrical transducers
JPS61125441U (fr) * 1985-01-25 1986-08-07

Also Published As

Publication number Publication date
EP0224937A3 (en) 1988-11-17
DE3682569D1 (de) 1992-01-02
SG77492G (en) 1992-10-02
JPS62134268A (ja) 1987-06-17
CA1278949C (fr) 1991-01-15
EP0224937A2 (fr) 1987-06-10
JPH0773915B2 (ja) 1995-08-09

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