EP0224937A2 - Montage d'une tête d'imprimante à gicleur d'encre thermique - Google Patents
Montage d'une tête d'imprimante à gicleur d'encre thermique Download PDFInfo
- Publication number
- EP0224937A2 EP0224937A2 EP86116956A EP86116956A EP0224937A2 EP 0224937 A2 EP0224937 A2 EP 0224937A2 EP 86116956 A EP86116956 A EP 86116956A EP 86116956 A EP86116956 A EP 86116956A EP 0224937 A2 EP0224937 A2 EP 0224937A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- ink
- thin film
- film resistor
- slot
- resistor structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17513—Inner structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14024—Assembling head parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
Definitions
- This invention relates generally to thermal ink jet printing and more particularly to a new and improved thermal ink jet printhead assembly.
- thermal ink jet printing it is known to provide a plurality of electrically resistive elements on a common thin film substrate for the purpose of heating a corresponding plurality of adjacent ink reservoirs during the ink ejection and printing process.
- the adjacent ink reservoirs are typically provided as cavities in a barrier layer above the substrate for properly concentrating thermal energy emanating from the resistive elements to predefined volumes of ink.
- a plurality of ink ejection orifices are provided above these cavities and provide exit paths for ink during the printing process.
- a further disadvantage of using a plurality of ink flow channels in a common substrate is that they normally require a special routing of conductive leads on the substrate surface. In addition to the added costs associated with this special routing, this requirement also greatly reduces the achievable packing density because of the surface area required to accomodate such special routing schemes.
- the general purpose of this invention is to provide a new and improved ink jet printhead assembly which eliminates the above problems associated with the use of drilled holes through a common printhead substrate member.
- a single elongated slot is cut in the substrate and provides ink flow to a plurality of ink reservoirs associated with resistive heater elements formed above the top surface of the substrate. These heater elements are spaced around the periphery of the slot at predetermined distances therefrom.
- Conductive leads are provided on the substrate between each resistive heater element and external electrical connections, and a barrier layer and orifice plate member covers all of the resistive heater elements and defines a plurality of individual ink reservoirs repectively above each of the resistive heater elements.
- the above described slotted geometry structure greatly increases the packing density of heater resistors on the common printhead substrate.
- This increase in packing density is partially a result of the fact that, in the prior art multiple hole printhead structures, the conductive traces to the individual resistor elements had to be routed around the holes, thus increasing the required substrate area.
- a packing density increase of 8:1 to 10:1 may be achieved.
- the substrate is die bonded to a header manifold member.
- This manifold member has an elongated slot therein for passing ink from a well section of the header manifold and through the substrate slot to the individual reservoirs of the barrier layer and orifice plate member.
- Another object is to provide a new and improved manufacturing process for realizing this assembly using latest state-of-the-art semiconductor processing techniques.
- a novel feature of this invention is the provision of improved control of ink flow pressures from a common ink supply source and through a single slot in a thin film resistor structure and then through a common ink flow path simultaneously to a plurality of ink reservoirs in the printhead assembly.
- FIG. 1 there is shown a thin film resistor substrate 10 for a thermal ink jet printer and including a metal orifice plate 12 thereon.
- the orifice plate 12 is typically constructed of nickel and includes a plurality of ink ejection openings or nozzles 14 spaced uniformly around the edges of an ink feed slot 16 indicated by the dotted lines in Figure 1.
- the thin film resistor substrate 10 will be mounted on the top, I-beam shaped surface 18 of a header manifold 20.
- the header manifold 20 will include an ink reservoir (not shown) within the confines thereof which communicates with an ink feed slot 22.
- the slot 22 is aligned with the ink feed slot 16 in the thin film resistor substrate 10.
- the header manifold 20 further includes contoured walls 24 which have been shaped to match corresponding contoured walls of an ink jet printer carriage assembly (not shown) for receiving the printhead structure of Figure 2 when completely assembled.
- the thin film resistor substrate 10 is positioned directly on the upper surface 18 of the header 20, and a flexible, tape automated bond (TAB) circuit 26 is brought into electrical contact with conductive traces on the top surface of the thin film resistor substrate 10.
- TAB tape automated bond
- a plurality of thin conductive leads 28 overlie the contoured side walls 24 of the header 20, and the interior leads 30 of the tab bond flex circuit 26 are thermocompression bonded to conductive traces on the thin film resistor substrate 10.
- the orifice plate 12 will be brought into alignment with the thin film resistor substrate 10 by means of an orifice plate and barrier layer manufacturing process.
- the thin film resistor substrate 10 will typically include a silicon substrate 32 upon which is deposited a thin layer 34 of silicon dioxide for passivating and insulating the surface of the silicon substrate 32.
- a plurality of heater resistors 36 and 38 are formed on the upper surface of the silicon dioxide layer 34 and will typically be either tantalum aluminum or tantalum pentoxide and fabricated using known photolithographic masking and etching techniques.
- Aluminum trace conductors 40 make electrical contact to the heater resistors 36 and 38 for providing electrical pulses thereto during an ink jet printing operation, and these conductors are formed from a layer of aluminum previously evaporated on the upper surface of the silicon layer 34 using conventional metal evaporation processes.
- a surface barrier layer 42 typically of silicon carbide or silicon nitride, is deposited over the upper surfaces of the conductors 40 and the heater resistors 36 and 38 to protect these members from cavitation wear and the ink corrosion which would otherwise be caused by the highly corrosive ink located in the reservoirs directly above these heater resistors.
- the silicon carbide layer 42, as well as the previously identified S i O2 surface layer 34, resistors 36 and 38 and aluminum conductors 40 are all formed using semiconductor processes well known to those skilled in thermal ink jet and semiconductor processing arts and for that reason are not described in detail herein. However, for a further detailed discussion of such processes, reference may be made to the above Hewlett Packard Journal , Volume 36, Number 5, May 1985.
- a nickel orifice plate 44 is positioned as shown on top of the silicon carbide layer 42 and includes ink reservoir areas 46 and 48 located directly above the heater resistors 36 and 38 for receiving ink therein by way of the horizontal slot 16.
- These ink reservoirs 46 and 48 extend vertically upward of the substrate 10 as shown and merge into the output ink ejection orifices defined by the convergent contoured walls 50 and 52.
- These contoured walls 50 and 52 have been designed to reduce cavitational wear and prevent "gulping" during an ink jet printing operation as described in more detail in the above identified copending Chan et al. application.
- ink will flow along the path indicated by the arrow 54 and laterally along the path 56 and into the ink flow ports 58, 60, 62, 64, 66 and 68 as identified on the left-hand portion of the structure of Figures 3A and 3B.
- ink will enter the ink flow ports 70 , 72, 74, 76, 78 and 80 on the right-hand portion of the structure of Figure 3B.
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80629485A | 1985-12-06 | 1985-12-06 | |
US806294 | 1985-12-06 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0224937A2 true EP0224937A2 (fr) | 1987-06-10 |
EP0224937A3 EP0224937A3 (en) | 1988-11-17 |
EP0224937B1 EP0224937B1 (fr) | 1991-11-21 |
Family
ID=25193745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19860116956 Expired EP0224937B1 (fr) | 1985-12-06 | 1986-12-05 | Montage d'une tête d'imprimante à gicleur d'encre thermique |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0224937B1 (fr) |
JP (1) | JPH0773915B2 (fr) |
CA (1) | CA1278949C (fr) |
DE (1) | DE3682569D1 (fr) |
SG (1) | SG77492G (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3717294A1 (de) * | 1986-06-10 | 1987-12-17 | Seiko Epson Corp | Tintenstrahlaufzeichnungsgeraet |
EP0401996A2 (fr) * | 1989-06-08 | 1990-12-12 | Ing. C. Olivetti & C., S.p.A. | Procédé de fabrication de têtes d'impression thermique à jet d'encre et têtes fabriquées de cette manière |
EP0568247A2 (fr) * | 1992-04-28 | 1993-11-03 | Hewlett-Packard Company | Géométrie de canal d'encre pour le fonctionnement à haute température de têtes à jet d'encre |
EP0785072A2 (fr) * | 1996-01-16 | 1997-07-23 | Canon Kabushiki Kaisha | Tête à jet d'encre, cartouche à jet d'encre, appareil à jet d'encre et procédé d'éjection d'encre pour une impression graduée |
EP0842776A2 (fr) * | 1996-11-15 | 1998-05-20 | Canon Kabushiki Kaisha | Tête à jet d'encre |
EP0914949A2 (fr) * | 1997-11-04 | 1999-05-12 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
EP0914948A3 (fr) * | 1997-11-04 | 1999-12-15 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
CN102211456A (zh) * | 2010-03-25 | 2011-10-12 | 精工爱普生株式会社 | 液体喷射头及液体喷射装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2671300B2 (ja) * | 1986-03-17 | 1997-10-29 | セイコーエプソン株式会社 | インクジエツト記録装置 |
JP2638780B2 (ja) * | 1986-04-30 | 1997-08-06 | セイコーエプソン株式会社 | インクジェット記録ヘッド |
JP2661016B2 (ja) * | 1986-06-24 | 1997-10-08 | セイコーエプソン株式会社 | インクジェット記録ヘッド |
JP5679665B2 (ja) * | 2009-02-06 | 2015-03-04 | キヤノン株式会社 | インクジェット記録ヘッド |
JP6272002B2 (ja) * | 2013-12-18 | 2018-01-31 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2842755A1 (de) * | 1977-10-03 | 1979-04-12 | Ibm | Tintenstrahldruckkopf |
US4357614A (en) * | 1980-10-07 | 1982-11-02 | Fuji Xerox Co., Ltd. | Ink particle jetting device for multi-nozzle ink jet printer |
US4500895A (en) * | 1983-05-02 | 1985-02-19 | Hewlett-Packard Company | Disposable ink jet head |
EP0161341A2 (fr) * | 1984-05-18 | 1985-11-21 | Siemens Aktiengesellschaft | Dispositif pour fixer et réaliser des contacts pour transducteurs piézo-électriques cylindriques |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61125441U (fr) * | 1985-01-25 | 1986-08-07 |
-
1986
- 1986-12-05 JP JP61291384A patent/JPH0773915B2/ja not_active Expired - Lifetime
- 1986-12-05 CA CA000524688A patent/CA1278949C/fr not_active Expired - Lifetime
- 1986-12-05 EP EP19860116956 patent/EP0224937B1/fr not_active Expired
- 1986-12-05 DE DE8686116956T patent/DE3682569D1/de not_active Expired - Lifetime
-
1992
- 1992-07-30 SG SG77492A patent/SG77492G/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2842755A1 (de) * | 1977-10-03 | 1979-04-12 | Ibm | Tintenstrahldruckkopf |
US4357614A (en) * | 1980-10-07 | 1982-11-02 | Fuji Xerox Co., Ltd. | Ink particle jetting device for multi-nozzle ink jet printer |
US4500895A (en) * | 1983-05-02 | 1985-02-19 | Hewlett-Packard Company | Disposable ink jet head |
EP0161341A2 (fr) * | 1984-05-18 | 1985-11-21 | Siemens Aktiengesellschaft | Dispositif pour fixer et réaliser des contacts pour transducteurs piézo-électriques cylindriques |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3717294A1 (de) * | 1986-06-10 | 1987-12-17 | Seiko Epson Corp | Tintenstrahlaufzeichnungsgeraet |
EP0401996A2 (fr) * | 1989-06-08 | 1990-12-12 | Ing. C. Olivetti & C., S.p.A. | Procédé de fabrication de têtes d'impression thermique à jet d'encre et têtes fabriquées de cette manière |
EP0401996A3 (fr) * | 1989-06-08 | 1991-12-04 | Ing. C. Olivetti & C., S.p.A. | Procédé de fabrication de têtes d'impression thermique à jet d'encre et têtes fabriquées de cette manière |
EP0568247A2 (fr) * | 1992-04-28 | 1993-11-03 | Hewlett-Packard Company | Géométrie de canal d'encre pour le fonctionnement à haute température de têtes à jet d'encre |
EP0568247A3 (en) * | 1992-04-28 | 1995-10-18 | Hewlett Packard Co | Ink path geometry for high temperature operation of ink-jet printheads |
US6447088B2 (en) | 1996-01-16 | 2002-09-10 | Canon Kabushiki Kaisha | Ink-jet head, an ink-jet-head cartridge, an ink-jet apparatus and an ink-jet recording method used in gradation recording |
EP0785072A3 (fr) * | 1996-01-16 | 1997-09-17 | Canon Kk | Tête à jet d'encre, cartouche à jet d'encre, appareil à jet d'encre et procédé d'éjection d'encre pour une impression graduée |
EP0785072A2 (fr) * | 1996-01-16 | 1997-07-23 | Canon Kabushiki Kaisha | Tête à jet d'encre, cartouche à jet d'encre, appareil à jet d'encre et procédé d'éjection d'encre pour une impression graduée |
EP0842776A2 (fr) * | 1996-11-15 | 1998-05-20 | Canon Kabushiki Kaisha | Tête à jet d'encre |
EP0842776A3 (fr) * | 1996-11-15 | 1999-10-06 | Canon Kabushiki Kaisha | Tête à jet d'encre |
EP0914949A2 (fr) * | 1997-11-04 | 1999-05-12 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
EP0914948A3 (fr) * | 1997-11-04 | 1999-12-15 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
EP0914949A3 (fr) * | 1997-11-04 | 1999-12-15 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
EP1864812A1 (fr) * | 1997-11-04 | 2007-12-12 | Lexmark International, Inc. | Appareil d'impression à jet d'encre |
CN102211456A (zh) * | 2010-03-25 | 2011-10-12 | 精工爱普生株式会社 | 液体喷射头及液体喷射装置 |
CN102211456B (zh) * | 2010-03-25 | 2015-07-08 | 精工爱普生株式会社 | 液体喷射头及液体喷射装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0224937A3 (en) | 1988-11-17 |
EP0224937B1 (fr) | 1991-11-21 |
JPS62134268A (ja) | 1987-06-17 |
SG77492G (en) | 1992-10-02 |
DE3682569D1 (de) | 1992-01-02 |
JPH0773915B2 (ja) | 1995-08-09 |
CA1278949C (fr) | 1991-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4683481A (en) | Thermal ink jet common-slotted ink feed printhead | |
US4680859A (en) | Thermal ink jet print head method of manufacture | |
US6997540B2 (en) | Substrate for fluid ejection devices | |
JP4355777B2 (ja) | スケーラブルなワイドアレイインクジェットプリントヘッドの製作方法 | |
US4894664A (en) | Monolithic thermal ink jet printhead with integral nozzle and ink feed | |
US4985710A (en) | Buttable subunits for pagewidth "Roofshooter" printheads | |
EP0845359B1 (fr) | Puces pour matrices de grande dimension d'éléments chauffants pour têtes d'imprimante à jet d'encre thermiques | |
US5659346A (en) | Simplified ink jet head | |
EP0244214B1 (fr) | Tête d'impression à jet d'encre thermique | |
US4899181A (en) | Large monolithic thermal ink jet printhead | |
JP2994344B2 (ja) | インクジェットのプリントヘッド及びその形成方法 | |
US5635966A (en) | Edge feed ink delivery thermal inkjet printhead structure and method of fabrication | |
US6543880B1 (en) | Inkjet printhead assembly having planarized mounting layer for printhead dies | |
EP0224937B1 (fr) | Montage d'une tête d'imprimante à gicleur d'encre thermique | |
US5300959A (en) | Efficient conductor routing for inkjet printhead | |
US20020051036A1 (en) | Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies | |
JPH08174838A (ja) | インクジェットプリントヘツド | |
JPS6280054A (ja) | インクジェット式印字ヘッド及びその製造方法 | |
JPH08174837A (ja) | インクジェットプリントヘッド | |
JPH08174840A (ja) | インクジェットプリントヘッド | |
US6464333B1 (en) | Inkjet printhead assembly with hybrid carrier for printhead dies | |
JPH04211949A (ja) | 動作温度および熱効率を高めたサーマルインクジェットプリントヘッド | |
US4835553A (en) | Thermal ink jet printhead with increased drop generation rate | |
US6880246B2 (en) | Method of forming substrate with fluid passage supports | |
EP0006165B1 (fr) | Méthode de fabrication d'une série d'électrodes de charge pour imprimante à jet d'encre à buses multiples |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB IT |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB IT |
|
17P | Request for examination filed |
Effective date: 19881019 |
|
17Q | First examination report despatched |
Effective date: 19900808 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT |
|
ITF | It: translation for a ep patent filed |
Owner name: SOCIETA' ITALIANA BREVETTI S.P.A. |
|
REF | Corresponds to: |
Ref document number: 3682569 Country of ref document: DE Date of ref document: 19920102 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
REG | Reference to a national code |
Ref country code: GB Ref legal event code: 732E |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: TP |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: CL |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20051130 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20051216 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: PE20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20051229 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20060131 Year of fee payment: 20 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20061204 |