EP0221924A1 - Cable electrique cavalier flexible et assemblage - Google Patents

Cable electrique cavalier flexible et assemblage

Info

Publication number
EP0221924A1
EP0221924A1 EP86902620A EP86902620A EP0221924A1 EP 0221924 A1 EP0221924 A1 EP 0221924A1 EP 86902620 A EP86902620 A EP 86902620A EP 86902620 A EP86902620 A EP 86902620A EP 0221924 A1 EP0221924 A1 EP 0221924A1
Authority
EP
European Patent Office
Prior art keywords
cable
conductors
circuit assembly
conductive
electrical circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP86902620A
Other languages
German (de)
English (en)
Inventor
Ronald Allen Dery
William Gray Gentry
Warren Charlie Jones
Clifton Carl May, Jr.
Steven George Wentink
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/728,956 external-priority patent/US4659872A/en
Application filed by AMP Inc filed Critical AMP Inc
Publication of EP0221924A1 publication Critical patent/EP0221924A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to electrical cables adapted for electrically interconnecting a plurality of circuit members , such as a printed circuit board and a flat panel of the type having an addressable matrix display , or a plurality of tap cables .
  • Flexible flat cable is employed in electrical and electronic equipment such as business machines , industrial controls , communication systems and computers .
  • flexible flat cable jumper assemblies constituting insulated flat conductors having terminals or connectors attached at one or both ends , comprise a common method of interconnecting separate components or separate circuits in assemblies such as printed circuit boards .
  • These cable interconnections can be made by employing crimp-type contacts which eliminate flat cable preparation , stripping and conductor plating . Solder tab contacts can also be employed.
  • Conventional flat cable comprises a laminated assembly . having an insulating material on opposite sides of conductors disposed therebetween .
  • Such flat cable assemblies commonly employ polyester , polyvinyl , polyimide, polyetherimide, or polycarbonate insulating films .
  • the conductors are sandwiched therebetween in the laminate and comprise flat metallic conductors , such as flat copper. Etched conductors deposited on one substrate of the flat cable can also be employed .
  • Such conventional cables commonly employ an adhesive to bond the two insulating layers together .
  • Cables of this type have been used to interconnect circuit members such as printed circuit boards or flat panel displays. Furthermore, there is often a need to form interconnections between cables or to form a tap interconnection to cables. Interconnections to flat panels are becoming increasingly significant and more difficult as the centerline spacings between flat panels decrease.
  • the cable depicted in the preferred embodiments of this invention comprises a multiconductor flat cable having a single flexible insulating substrate with a plurality of conductors disposed side by side thereon .
  • a dielectric coating which in one embodiment of the invention can comprise a dielectric ink comprising a photopolymer can be disposed along the surface of the conductors .
  • the conductors can comprise separate etched or formed metal conductors , such as discrete copper conductors or the conductors can comprise a conductive ink formed from a solidified polymer having conductive material freely dispersed therein .
  • Conventional substrates such as polyester film , polyetherimide, polyvinyl , polyimide film and. polycarbonate film can be employed in such cable.
  • the conductive and dielectric inks employed in one embodiment of this invention are screen printable and the dielectric ink can be curable upon the application of ultraviolet light.
  • the conductive ink can be formed of a conductive material containing a solvated polyester resin .
  • a tap connection to corresponding conductors in a separate flat cable or other conductor array can be established by using a conductive adhesive which is screen printable on one or both of the cables .
  • openings in the dielectric covering can be positioned in registry with selected conductors .
  • a conductive adhesive located at these tap locations can then be used to establish the interconnection . Both pressure sensitive and heat activated conductive adhesives can be employed for this purpose.
  • the coverlayer can be screen printed with the openings in registry with conductors at desired locations along the length of the cable.
  • Circuit assemblies employing cable to interconnect plural electrical circuit members such as printed circuit board to flat panel or cable to cable can also be constructed .
  • An assembly comprising one or more cables and an intermediate jumper panel can be used to establish an interconnection to an electroluminescent display.
  • the cable can be attached to edges of the jumper panel and electrical components , such as surface mounted integrated circuit packages can be attached intermediate the ends of the conductive traces on the jumper panels .
  • Figure 1 is a top plan view of a cable with conductive ink traces and embodying the principles of this invention .
  • Figure 2 is a sectional view taken along section lines 2-2 of Figure 1 .
  • Figure 3 is a sectional view taken along the section lines 3-3 of Figure 1 .
  • Figure 4 is a sectional view taken along the section lines 4-4 of Figure 1 .
  • Figure 5 is a sectional view taken along section lines 5-5 of Figure 1 .
  • Figure 6 is an exploded sectional view showing two similarly constructed cables prior to mating .
  • Figure 7 is a view similar to Figure 6 but showing two cables interconnected by a pressure-sensitive conductive adhesive.
  • Figure 8 is an exploded cross-sectional view showing the cable of Figure 1 ready to be mated to a conductor array comprising only a substrate and conductor traces disposed thereon .
  • Figure 9 is a fragmentary cross-sectional view showing an exposed conductor at a tap location.
  • Figure 1 0 is a fragmentary top plan view of a segment of the cable in which a conductive pad has been established to enlarge the tap area for a single trace.
  • Figure 11 is a sectional view taken along section lines 1 1 -1 1 of Figure 10.
  • Figure 12 is a perspective view of a flexible flat jumper cable, which embodies the features of the present invention .
  • Figure 13 is a sectional view taken substantially along the line 13-13 of Figure 1 2.
  • Figure 14 is an exploded perspective view of an electrical circuit assembly which includes a jumper cable , and in accordance with the present invention .
  • Figure 15 is a view similar to Figure 14, but illustrating the components in an assembled relationship.
  • Figure 16 is a perspective , partly exploded view illustrating another embodiment of an electrical circuit assembly in accordance with the present invention .
  • Figure 17 is a fragmentary enlarged perspective and partly exploded view of a portion of the jumper cable assembly shown in Figure 16.
  • Figure 18 is an enlarged sectional view taken substantially along the line 18-18 of Figure 17.
  • Figure 19 is a sectional view taken substantially along the line 1 9-19 of Figure 17 and further illustrating a portion of the associated jumper cable;
  • Figure 20 is a sectional view taken substantially along the 20-20 of Figure 17.
  • Figure 1 shows a pair of multiconductor flat cables 2a and 2b containing flat conductors , each attached to a common electrical connector 4 of conventional construction .
  • a third or tap cable 2c extends at right angles to cable 2b .
  • I nterconnections with individual corresponding conductors in cables 2b and 2c are made at a plurality of predisposed tap locations 6 in the cable.
  • Figures 6 and 7 depict the interconnection of a preferred cable 2 with an essentially identical cable 102.
  • Figure 8 depicts the manner of establishing an interconnection between a cable of the preferred embodiment 2 and a separate conductor array 302 which could comprise a conventional flat cable or an array of conductors disposed upon either a flexible or a rigid substrate.
  • the conductor array 302 in Figure 8 is characterized in that the individual conductors 310 disposed on one surface of an insulating substrate 31 1 are exposed .
  • Cable 2 as shown in Figure 1 comprises a plurality of longitudinally distinct segments .
  • a section adjacent the end of the cable shown in Figure 2 shows that the cable is formed from an insulating substrate 16 having a plurality of conductive traces 18 spaced apart and disposed on one surface thereof.
  • these conductive traces 18 comprise conductive ink traces having a conductive material interspersed in a solidified polymer .
  • the conductors 18 in the embodiment of Figures 1 -7 extend in parallel and are spaced apart by a distance sufficient to maintain electrical integrity .
  • These conductive ink traces 18 may be disposed upon the upper surface of insulating film 16 by a conventional silk screen or screen printing operation .
  • the insulating film 16 can comprise a conventional dielectric film such as a polyester film , a polyvinyl , a polyetherimide, a polyimide film or a polycarbonate film .
  • the exposed conductors 18 adjacent one end only of the film would normal ly be provided for test purposed during the manufacture of the cable. It should be understood that the exposed conductors in the vicinity of the section shown in Fig . 2 would be terminated to a separate electrical connector or would be severed in actual use.
  • Figure 3 shows a sectional view along a portion of the cable spaced from both ends .
  • the construction of the cable as shown by section 3 would constitute the construction of the cable over the majority of its length provided that a tap interconnection is not desired along the majority of the length of the cable.
  • a tap interconnection in accordance with this invention cannot be made to the cable at locations in which the cable has a construction such as that shown in Figure 3.
  • the conductive traces 1 8 shown in Figure 3 are the same as the conductive traces 18 shown in Figure 2 and are disposed on a surface of an identical insulating film 16.
  • a dielectric coverlayer 20 extends along the upper surface of film 16 and encapsulates the individual conductive traces between film 16 and the dielectric coverlayer 20.
  • the dielectric cover 20 comprises a dielectric coating comprising a dielectric ink formed of a photopolymer and having desirable insulating properties.
  • Coverlayer 20 is sufficiently flexible to maintain electrical integrity as the flat cable including film 16 is flexed during actual use.
  • Dielectric coverlayer 20 can be screen printed on film 16 in essentially the same manner as the conductive ink traces 18 , and dielectric coverlayer 20 can be cured to provide a solid film coating for the cable.
  • a conductive film 22 may be deposited on the surface of the dielectric coverlayer 20.
  • FIG. 3 is covered by a continuous layer 22 of conductive adhesive.
  • This conductive adhesive 22 is also screen printable and in the preferred embodiment is an anisotropically conductive adhesive such as that described more fully below .
  • Figure 4 is not taken along a tap location where an interconnection can be made to a corresponding conductor array .
  • Figure 4 also shows a silicone coated slip sheet or release liner 24 which can be placed along the non-tacky , dry conductive adhesive 22.
  • the silicone coated slip sheet or release line can be peeled from the interconnection area 12 when it is desired to make a tap • interconnection .
  • a separate insulating screen printed coverlayer can also be provided over the conductive adhesive, provided the conductive media is exposed when the tap interconnection is completed by application of heat and/or pressure.
  • Figure 5 is a section view taken along one of the predetermined tap locations 6 where a conductor 18 can be exposed both to the conductive adhesive 22 and ultimately to a conductive array to be interconnected thereto.
  • Tap locations 6 are predetermined and in the preferred embodiment of this invention , a staggered row of conductive traces 6 is chosen which can in turn be positioned in registry with a separate set of staggered tap locations 6 and a right angle tap cable 2c shown in Figure 1 .
  • a conductor pad 26 is formed over a conductor 18 at a tap location 6.
  • Conductor pad 26 can comprise a conductive ink similar to the conductive ink forming the trace conductors 18 and provides an enlarged area in which to make an interconnection through the anisotropically conductive adhesive 22. Since the dielectric film 20 can be screen printed onto substrate 16 and over conductors 18 , the predetermined tap locations 6 can be easily defined during the screen printing operation and comprise those exposed locations at which a dielectric ink coating 20 is not deposited . Conductive pads 26 extend along the upper surface of the coating 20 both to provide additional surface area in which the connection can be made to the anisotropically conductive adhesive 22 and to provide a section in the conductive adhesive having a smaller thickness . The enlarged conductive pad also provides for a greater target area , thus facilitating a registration between tap locations on separate interconnected conductors .
  • Figures 6 and 7 demonstrate the manner in which a solderiess tap interconnection can be established between two identical cables 2 and 102 at prescribed tap locations 6 and 106 through conductor pads 26 and 126 and through layers of conductive adhesive 22 and 122.
  • a pressure sensitive adhesive interconnection can be made by placing conductive pads 26 and 126 in registry and merely applying pressure to fuse the conductive adhesive layers 22' and 1 22' which comprise a pressure sensitive conductive adhesive.
  • a suitable pressure sensitive conductive adhesive is described more fully below.
  • an anisotropically conductive adhesive which establishes electrical continuity perpendicular to the plane of the cable but does not establish electrical continuity in a lateral direction
  • the conductive adhesive can merely be screen printed on the surface of the cable throughout the location 12 to which electrical continuity is to be established . If a biaxial conductive adhesive were employed , deposition of the conductive adhesive would be limited to areas of individual tap locations 6; and unless a bridging interconnection were to be established , separate dots of conductive adhesive must be deposited on each individual tap location .
  • an anisotropically adhesive obviates the necessity of depositing the conductive adhesive only in dots on the film independently in registry with individual tap locations.
  • suitable printing of the dielectric coating leaving the prescribed tap locations commonly exposed , could be established; and a commoning conductive pad formed with a conductive ink could be screen printed to join the connectors .
  • non-adjacent connectors could be commoned by depositing a conductive ink over the surface of a layer of dielectric coating covering the intermediate conductors .
  • Figure 8 shows the manner in which a single flat cable 2 in accordance with this invention can be attached to a dissimilar conductor array 302 which could be formed by an insulating substrate 316 having a plurality of conductors , one of which 310 is shown herein.
  • a dissimilar conductor array could comprise a printed circuit board , a flat cable without a dielectric coating , or with the dielectric coating removed , or an insulating substrate having a conductive ink pattern formed thereon .
  • Figures 9 through 11 demonstrate the versatility of the preferred embodiment of this invention .
  • Figure 9 illustrates a tap location 6 in which interconnection is made directly between the conductive adhesive 22 in the underlying but exposed conductor 18.
  • No conductive pad is depicted in Figure 9.
  • Figures 10 and 11 disclose a separate configuration in which the conductive pad 26 is positioned not only between conductor 18 and conductive adhesive 22 but in which the conductive pad 26 overlies the diejectric 20 covering adjacent connectors , thus greatly enlarging the area in which registration can be established .
  • Figure 12 illustrating a flexible flat jumper cable 210 which is adapted to form a low profile interconnection between two electrical circuit members , each having a row of closely spaced apart conductive traces .
  • the jumper cable 210 comprises a row of coplanar, and laterally spaced apart electrically conductive traces 21 2.
  • the traces are shown to be parallel to each other. It is to be understood that the traces may be arranged in any desired pattern .
  • An insulating polymeric film 214 overlies each side of the row of traces , with the film on one side of the row (bottom side as seen in Figure 13) being foreshortened at each end of the cable, to define a mounting edge portion 216 which extends laterally across the full width of the row at each end thereof.
  • the jumper cable of Figure 12 further includes a layer of an anisotropically conductive adhesive 218 overlying each of the edge portions 216 so as to cover the exposed portions of the traces 212.
  • the coating of adhesive serves to protectively cover the otherwide exposed traces of the cable during shipment and storage, and to electrically and mechanically join the cable to associated electrical circuit members in the manner further described below .
  • Figures 14 and 15 illustrate an electrical circuit assembly in accordance with the present invention , and which comprises a flat display panel 220 having a row of closely spaced apart electrically conductive traces 221 , and a circuit board 222 having a row of a corresponding number of closely spaced apart electrically conductive traces 223 and a number of conventional circuit components 224. Also, the row of electrical conductive traces on each of the flat panel 220 and the circuit board 222 extend perpendicularly to one side edge of the member.-.
  • the flexible jumper cable 210 is employed to electrically interconnect respective ones of the conductive traces of the flat panel and the conductive traces of the circuit board .
  • the jumper cable 210 is joined to the side edge of the flat panel 220 bv positioning the side of the mounting edge portion of the cable having the coating of anisotropically conductive adhesive 218 thereon in contact with the side edge of the flat panel , with the respective traces in registry . Heat and pressure may then be applied , so that the coating of anisotropically conductive adhesive 218 electrically interconnects the respective traces and mechanically secures the cable to the surface of the flat panel .
  • the jumper cable may be joined to the side edge of the circuit board 22 to form the interconnected assembly.
  • the flat display panel 220 may for example comprise a rigid transparent sheet, such as glass , having an addressable matrix display operatively connected to the associated row of conductive traces 21 , is as well known in the art.
  • the jumper cable 210 is composed of two laminated thin plastic films 214, such as laminated polyimide, polycarbonate, polyvinyl , polyetherimide or polyester film, with each layer having a thickness of about 2-5 mils prior to lamination .
  • the electrically conductive traces 212 preferably comprise a solidified electrically conductive polymer which has been deposited on the substrate as a fluid ink and then dried .
  • the fluid ink comprises silver dispersed in a solvated polyester resin , which dries to form a dried resin binder. Also, it is preferred that the fluid ink is deposited utilizing a screen printing operation .
  • the jumper cable may comprise a film substrate, upon which the traces are deposited by screen printing or the like, and with the outer side of the traces being covered by a layer of a dielectric material which may also be screen printed upon the substrate.
  • the traces for the j-umper cable may alternatively be formed by discrete metal wires , or by a metal sheet which has been etched to form the desired pattern of traces by the procedure well known in the art.
  • FIG 16 illustrates a circuit assembly which includes a flat display panel 226 of the type described above , a total of four jumper cables 210 as described above, and a total of four jumper panels 228 joined between each of the jumper cables 210 and the display panel 226.
  • Each jumper panel 228 comprises a substrate 229 , ( Figure 17) , which may for example comprise a sheet of polyester, polyetherimide, polycarbonate, polyvinyl or polyimide film , having a thickness in the range of between about 1 to 1 0 mils , preferably 2-5 mils .
  • a plurality of electrically conductive traces 230 are disposed on one or both surfaces of the substrate, and define a plurality of component connecting areas 232 , with the conductive traces including component lead traces 233 which extend into respective connector areas . Also, portions of the traces are disposed in at least two rows of closely spaced apart traces which extend to a respective side edge of the substrate to define mounting edge portions 234 , 235 which are each adapted to be adhesively joined to a mating edge portion of either the display panel 226 or the associated jumper cable.
  • the electrically conductive traces 230 preferably comprise a solidified electrically conductive polymer which has been deposited on the substrate as a fluid ink and then dried in the manner described above.
  • the portions of the substrate which mount the electrically conductive traces , but which are not within one of the component connecting areas 232 , or the mounting edge portions 234, 235 are covered with a dielectric cover layer 238 , note for example Figures 19 and 20.
  • the dielectric cover layer 238 thus covers and protects the conductive traces of the circuitry , and specifically 14 the traces are thereby sealed from moisture and most other environmental contamination .
  • a surface mounted electrical component 240 such as a resistor or an integrated circuit, overlies a portion of each of the component connecting areas 232 , and each such electrical component includes a plurality of electrical contact members 41 overlying respective ones of the component contact member mounting pads 233.
  • a layer of an anisotropicallv conductive adhesive 242 as described above overlies each of the component connecting areas 232 , with the anisotropically conductive adhesive layer mechanically securing the component to the substrate and electrically interconnecting each of the contact members 241 to its associated component contact member mounting pad 233.
  • the mounting edge portion 235 of the circuit assembly which is to be joined to the display panel 226 , is also covered with a layer of an anisotropically conductive adhesive 242.
  • the mounting edge portion 234 along the opposite side of the assembly and which is designed for attachment to the jumper cable 210 , is shown as also being covered with a layer of the anisotropically conductive adhesive. However, this mounting edge portion 234 may remain free of the anisotropically conductive adhesive if desired , in which event the anisotropically conductive adhesive on the jumper cable 210 would provide the interconnection .
  • the mounting edge portions 234, 235 of the jumper cable 210 may have a layer of nonconductive adhesive 244 applied over the layer of anisotropically conductive adhesive 218.
  • the nonconductive adhesive provides insulation for the anisotropically conductive adhesivef layer from contact which could cause a short through the anisotropically conductive adhesive. Furthermore, the nonconductive layer provides additional adhesive for mechanically securing the jumper cable to the circuit assembly.
  • the nonconductive adhesive is comprised of the same resin binder as the anisotropically conductive adhesive. .
  • the traces along the mounting edge portion 235 of the circuit assembly are electrically connected to the associated traces of the display panel 226 by the layer of anisotropically conductive adhesive 242 , and the jumper cable 210 is similarly joined to the jumper cable assembly 228 by the layer of anisotropically conductive adhesive 242 on the mounting edge portion of the jumper cable assembly and/or on the jumper cable.
  • These interconnections are preferably made with the application of heat and pressure so as to soften the layer of anisotropically conductive adhesive, and so that upon cooling , a secure interconnection is achieved.
  • the temperature typically used to achieve the interconnection is 125°C , well below the temperature of 200°C usually associated with soldering components to a panel .
  • the jumper cable assembly of Figure 16 further comprises nonconductive adhesive layer 244 (note Figure 18) overlying the layer of anisotropically conductive adhesive 242 on those portions of the component connecting areas 232 not covered by an electrical component or the electrical contact members thereof, so as to electrically insulate the layer of anisotropically conductive adhesive from contact with external members which could cause a short through the anisotropically conductive adhesive.
  • the conductive traces 212 ,230 are preferably applied on the substrate in the form of a polymeric conductive ink , and specifically a silver-containing solvated polyester resin , which is then dried .
  • the polymer may comprise an epoxy , acrylic , polycarbonate, polyimide, polyurethane , or polyvinyl resin .
  • the solvent serves to dissolve the polymer, and may be dried by the application of heat to remove the solvent and bond the polymer to the substrate. Butyl cellesolve acetate, and glycol ethers and their derivatives are commonly used solvents .
  • the conductor ink may be formulated as follows :
  • Cellosolve is a trademark of Union Carbide Corporation , Danbury, Connecticut.
  • the conductor ink sold under the designation ,, 5007 ⁇ by E. I . Du Pont de Nemours & Co. , I nc. , Wilmington , Delaware, is suitable for use with the present invention .
  • the above inks are adapted to be applied to the substrate by screen printing , which is the preferred method of application .
  • Thermoset or crosslinkable conductive inks may also be used .
  • the conductive ink sold under the designation "CT 5030" by Amicon , Lexington , Massachusetts is one such ink suitable for use with the invention . It is a screenable epoxy resin based silver ink .
  • the composition of the dielectric coating 38 of the jumper cable assembly 28 also preferably has a formulation which permits it to be applied by a screen printing operation , and in addition , it should have a desirable degree of flexibility and the ability to adhere to the material of the substrate.
  • One particularly suitable formulation for a dielectric coating is as follows :
  • FLEXCOAT is a trademark of W. R . Grace Co. , New York , New York , for a screen printable photopolymer solder resist which rapidly cures through the apDlication of ultraviolet light , and which forms a tough protective film over the circuitry.
  • the added ingredients provide improved printability , flexibility and adhesion properties .
  • the plasticizer, diallyl phthalate is added to increase the flexibility of the dielectric coating so that the coating will not crack or craze when the substrate to which it is applied is flexed or is subject to thermal expansion .
  • One source for dial lyl phthalate is Fisher Scientific Co. , Pittsburgh , Pennsylvania .
  • N-vinyl pyrrolidone is a monofunctional acrylate monomer added to control shrinkage of the cured dielectric coating 24.
  • This monomer is available under the trade name V-PYROL from GAF Corporation , New York , New York .
  • the acrylated urethane prepolymer used in the above example is available under the trade name PURELAST 169 , from Polymer Systems Corporation , New Brunswick , New Jersey. This polymer was added to increase the flexibility of the coating .
  • I RGACURE 651 available from Ciba Geigy Corporation , Ardsley , New York , was used as the photoinitiator.
  • the adhesion promotor was A186 available from Union Carbide Corporation , Danburv , Connecticut.
  • the adhesive may be made by mixing electrically conductive particles with a non-conductive adhesive binder .
  • the percent by volume and size of the particles are selected so that the particles are dispersed randomly throughout the mixture as non-contiguous conductive units , with each unit being comprised of one or a plurality of individual particles .
  • the percent by volume of the conductive particles is less than twenty percent and volumetric ratios of f ⁇ teen percent or less are desired .
  • the units are sufficiently spaced apart to preclude electrical conductivity between two or more adjacent conductive areas on the same substrate, but the number of particles is sufficient so that the conductive units provide an electrical contact between the conductive areas on two mating substrates.
  • the following example illustrates one method of preparing an anisotropically conductive adhesive which is suitable for use with the present invention .
  • 15.82 grams of silver coated nickel spheroids (8 micron diameter , 15% by weight silver) were mixed with 100 grams of a soivated polyester resin blend (33% by weight sol ids) .
  • Mixing may be accomplished with a propeller type stirrer at moderate rotations per minute for approximately 15 minutes .
  • the mixture may be screen printed using a 105 mesh stainless steel screen , and the unwanted solvents may be driven off by heating at 125°C for 30 minutes .
  • the resulting adhesive film is substantially dry and non-tacky at room temperature. Also, the resulting dry layer of adhesive possesses a relatively high degree of compliance, which is important in permitting accommodation of different coefficients of thermal expansion between the substrate and components , as well as flexure of the substrate.
  • a suitable soivated polyester resin blend for use in the above example may be obtained from KC Coatings , Inc. of Lenexa , Kansas , and is sold under their designation "9627 MYLAR Clear.
  • MYLAR is a trademark of E. I . Du Pone de Nemours & Co. , I nc. , Wilmington , Delaware. More particularly, "9627 MYLAR Clear” comprises 29% by weight of a polyester resin , and the solvent comprises 59% butyrolactone and 41% of an aromatic solvent blend SC 150.
  • the dielectric cover layer 244 of the jumper cable assembly 228 preferably comprises a thermoplastic resin , and preferably is the same soivated polyester resin blend employed in the adhesive layer.

Abstract

Assemblage de câbles plats flexibles destiné à former une connexion de faible épaisseur entre deux organes de circuit électrique, possédant chacun une rangée de tracés conducteurs faiblement écartés (18). Le câble (2) comprend une rangée de tracés (18), un film polymère isolant (20) recouvrant chaque côté de la rangée. Celle-ci est également exposée à chaque extrémité du câble cavalier, et la partie d'extrémité exposée est recouverte d'une couche d'un adhésif conducteur anisotrope (22). Le câble est conçu pour relier électriquement un panneau d'affichage plat (220) à une carte de circuit imprimé (222), le câble cavalier (210) formant la connexion entre les conducteurs (221) sur le panneau d'affichage et les conducteurs sur la carte de circuit imprimé. Est également décrit un assemblage de câbles cavaliers, comprenant des composants électriques (224) pouvant être montés en surface, qui sont connectés électriquement et fixés mécaniquement aux tracés (230) de l'assemblage de câbles cavaliers à l'aide d'un adhésif conducteur anisotrope (22). Est également décrit un assemblage de câbles conçu spécialement pour être utilisé comme dérivation.
EP86902620A 1985-04-30 1986-03-31 Cable electrique cavalier flexible et assemblage Ceased EP0221924A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72898785A 1985-04-30 1985-04-30
US728956 1985-04-30
US06/728,956 US4659872A (en) 1985-04-30 1985-04-30 Flexible flat multiconductor cable
US728987 1985-04-30

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EP0221924A1 true EP0221924A1 (fr) 1987-05-20

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EP (1) EP0221924A1 (fr)
JP (1) JP2524138B2 (fr)
KR (1) KR880700482A (fr)
WO (1) WO1986006551A1 (fr)

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JPS62502715A (ja) 1987-10-15
JP2524138B2 (ja) 1996-08-14
KR880700482A (ko) 1988-03-15
WO1986006551A1 (fr) 1986-11-06

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