EP0215953A1 - Connecteur de film et son procede de fabrication - Google Patents

Connecteur de film et son procede de fabrication Download PDF

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Publication number
EP0215953A1
EP0215953A1 EP86901505A EP86901505A EP0215953A1 EP 0215953 A1 EP0215953 A1 EP 0215953A1 EP 86901505 A EP86901505 A EP 86901505A EP 86901505 A EP86901505 A EP 86901505A EP 0215953 A1 EP0215953 A1 EP 0215953A1
Authority
EP
European Patent Office
Prior art keywords
film
metallic
connector
nickel
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP86901505A
Other languages
German (de)
English (en)
Other versions
EP0215953A4 (fr
Inventor
Kazuyuki Shimada
Takafumi Kashiwagi
Yoshikazu Ishikawa
Kohji Tanaka
Kozo Matsumura
Yukio Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
ThreeBond Co Ltd
Panasonic Holdings Corp
Original Assignee
Nissha Printing Co Ltd
ThreeBond Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd, ThreeBond Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical Nissha Printing Co Ltd
Publication of EP0215953A1 publication Critical patent/EP0215953A1/fr
Publication of EP0215953A4 publication Critical patent/EP0215953A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Definitions

  • the present invention relates to a film connector which is capable of easily performing an electrical connection, for example, between a liquid crystal display panel and a drive module and easily connecting parts such as electric parts with high-density terminal leads, which difficulty is encounterred to effect an electrical connection by a soldering, to a circuit substrat, peripheral module or the like.
  • the present invention further relates to a manufacturing method therefor.
  • the connection is made by a member which is formed by printing thermoplastic insulating ink and conductive ink alternately in stripe-configuration on an insulating film.
  • the electrical connection is made using an aeolotropic conductive adhesive containing powder-like or fiber-like conductive filler.
  • the first method always requires a uniform pressing and has disadvantages in that difficulty is encounterred to effect the positioning with respect to a fine pitch electrode and a discrepancy in position occurs due to deformation.
  • the second method has a disadvantage in that the fine pattern printing is limited owing to many printing steps and therefore the production of a narrow pitch pattern is difficult.
  • the third method has a disadvantage in that a flexible printed subtrate must be used because of the drawing of a lead.
  • An object of the present invention is therefore to provide a film connector which is capable of certainly performing the electrical connection between parts with high-density terminal leads and improving the reliability, and to provide a manufacturing method therefor.
  • a film connector comprises an insulating film with flexibility and first to fourth films formed on a main surface of the insulating film, the first film being a metallic film constituted of one selected from copper, silver, nickel, and aluminium or by an alloy essentially consisting of them, the second film being a metallic film constituted of one selected from nickel, chromium, tungsten and silver or of an alloy consisting of them, the third film being an isotropic conductive film consisting of carbon power and synthetic resin, and the fourth film being an aeolotropic conductive film essentially consisting of carbon powder and synthetic resin.
  • a manufacturing method of the film connector according to the present invention comprises the step of successively forming a second metallic film comprising one selected from copper, silver, nickel and aluminium or comprising an alloy essentially consisting of copper, silver, nickel and aluminium on the whole of one main surface of an insulating film with flexibility, the step of forming a third isotropic conductive film comprising carbon powder and synthetic resin by a printing method in an optional pattern, the step of performing etch removal with respect to the first and second metallic films, and the step of forming an aeolotropic conductive film, consisting of synthetic resin and carbon powder whose particle diameter is greater than that of the third conductive film and whose amount is less than that of the third conductive film, on the entire surface of the pattern.
  • the first metallic film allows using silver or aluminium, and using an alloy further containing the above copper and nickel.
  • An alloy consisting of copper and nickel, as well as nickel, has an advantage in view of oxidation-resistance.
  • the first metallic film is arranged to have two-layer construction and the lower layer formed on the film is constituted of a material such as nickel having an advantage in view of oxidation-resistance and the upper layer is consituted of a material such as copper having an advantage in view of conductivity
  • the upper metallic film is sandwiched between the second metallic film, which will be described hereinafter, and the lower metallic film, resulting in fine oxidation-resistance of the opper metallic film.
  • a main object of the second metallic film is prevention of oxidation for the first metallic film having high conductivity.
  • the second metallic film can be composed of one selected from nickel, chromium, tungsten, and silver or constituted of an alloy consisting of them.
  • the first metallic film has two-layer construction as described above and the lower layer required to have oxidation-resistance is constituted of a material which is identical to the material of the second metallic film, the structure of an evaporation used when these metallic films are formed by a spatter or the like becomes simple, resulting in the reduction in manufacturing cost. Furthermore, it is appropriate that when the first metallic film comprises silver, the second metallic film is constituted of one of above-described materials other than silver to prevent the silver migration.
  • the third isotropic conductive film can be used as an etch resist, and its object is to form an optional pattern and to improve the certainty of connection as a connector and therefore the third isotropic conductive film is formed as an auxiliary conductive film.
  • the third conductive film protects the metallic film positioned therebelow.
  • the isotropic conductive film is required for ensuring conductivity when a crack occurs in the metallic film.
  • the fourth aeolotropic conductive film is required to perform the adhesion to an adhered member and to have conductivity in the thickness direction and insulation in the lateral direction. Therefore, it is preferred that the amount of the carbon powder is less than that of the third conductive film.
  • the particle diameter is greater than that of the third conductive film to effectively achieve the conductivity in the thickness direction. This reason is that the smaller diameter particles are carried in accordance with the flow of the synthetic resin when'pressed and therefore may lose the conductibility.
  • a film connector according to the present invention is roughly divided into pattern-formed film and aeolotropic conductive adhesive, and the functions thereof enable a certainly electrical connection between parts with high-density terminal lead and improving the reliability of the film connector.
  • Fig. 1 shows a cross-sectional view of a two-layer film formed by metallic films which are the basis of a pattern.
  • reference numeral 1 represents an insulating film with flexibility.
  • PET polyethylene terephthalate
  • PES polyether sulfone
  • PI polyimide
  • First and second metallic films 2 and 3 have been successively formed on a main surface of the insulating film 1 by means of a spatter, the first metallic film 2 essentially consisting of copper to have conductivity and having a thickness of 2000 A, and the second metallic film 3 essentially consiting of nickel to have an oxidation prevention function and having a thickness of 350 A. It is possible that the first and second metallic films 2 and 3 are formed by means of EB (electron beam irradiation or metallizing plating, in place of the spatter. Secondly, a conductive paste is formed on the second metallic film 3 by the silk screen printing to have a desired pattern and is heated at a temperature of 130°C for 30 minutes. With respect to the conductive paste (produced by Three-Bond Co.
  • a phenol resin 100 part by weight
  • thermosetting resin a thermosetting resin
  • carbon powder ⁇ carbon black (acetylene black) 60 part by weight, average particle diameter 0.05 ⁇ m
  • graphite 40 part by weight Nippon Kokuen Co., Ltd, CSP 40 part by weight, average particle diameter 5 ⁇ m
  • Fig. 2 shows the cross-sectional view of the formed and heated film.
  • numeral 4 represents a third isotropic conductive film constituted of the conductive paste.
  • the thickness of the isotropic conductive film 4 is about 10 ⁇ m and the cross-section thereof has a semicylindrical configuration as shown in Fig. 2.
  • the isotropic conductive film 4 is used as a resist and the metallic films 2 and 3 are eteh-processed, thereby obtaining a pattern as shown in Fig. 3.
  • synthetic resin 5 used as synthetic resin 5 is a polyester (produced by Toyo Boseki Co., Ltd, Vylon GK-130) which is a thermoplastic resin and prepared as a conductive filler is aeolotropic conductive adhesive 7 (produced by Three-Bond Co., Ltd.), containing carbon powder 6, which is stuck on release paper 8.
  • the carbon powder 6 is produced by pulverizing the product obtained by burning and caking phenol resin (produced by Matsushita Denko Co., Ltd., J-1000) 100 part by weight and acetylene black (produced by Denki Kagaku Co., Ltd) 100 part by weight and is used by 5 part by weight (av. dia. 20 ⁇ m).
  • a film connector 9 is produced by laminating the aeolotropic conductive adhesive 7 on the pattern surface by a laminator under the conditions that rolling temperature is 80°C and film speed is 2m/min so as to obtain a thickness of 30pm.
  • reference 7a designates the fourth aeolotropic conductive film constituted of the aeolotropic conductive adhesive 7 obtained by the lamination.
  • a base plate comprising an 1.6 mm thickness glass epoxy base and copper foil lines provided thereon at equal intervals, and a glass plate having a thickness of 1.1 mm.
  • the number of lines is 200, and the line width of each of lines and the line separation are respectively 325 ⁇ m, that is, the pitch is 650 ⁇ m, and the thickness of the lines is 35 ⁇ m.
  • Transparent conductive films (ITO) having a surface resistance of 10 ⁇ / ⁇ , are deposited on the glass plate and etched to have pitch equal to the above-described pitch.
  • Fig. 8 shows the state that a metallic electrode 15 on a polyimido film 14 is connected to the film connector 9.
  • the film connector is arranged as described above and generally divided into a film with a pattern and aeolotropic conductive adhesive.
  • the surface of the copper foil pattern is flat, and when heated and pressed with aeolotropic.conductive adhesive being interposed, the sufficient flow of resin does not occur, resulting in connection problem due to the generation of insulating covering.
  • the conductive paste constituting the third isotropic conductive film which is positioned uppermost, pushs the aeolotropic conductive adhesive away and comes into contact with the corresponding electrode when heated and pressed.
  • the surface of the paste is arranged to be porous and microscopic proections are crushed, a surface-to-surface connection can be made. Furthermore, the carbon filler of the aeolotropic conductive adhesive is sandwiched between the electrode and a member to be connected, and somewhat enters into the paste. This sufficiently ensures the - initial connection. As shown in Figs. 6 to 8, during the connection, the resin of the aeolotropic conductive adhesive flows into between adjacent electrodes and the gap is filled up. This firmly fixs the film distorted by pressure. Therefore, the electrodes to be connected are always pressed each other during environment testing period by means of the tensile force by the adhesive and the restoring force of the film, so that the contact resistance becomes stable.
  • the aeolotropic conductive adhesive formed on the pattern has functions to protect the pattern and insulate its surface.- For example, it has the effect to relax a strong bending of the pattern. Even'if the metallic film is partially raised due to rust and the conductive paste is cracked, the damage of the pattern can be prevented beause the pattern or insulating film is strongly-pressed by the coating aeolotropic conductive adhesive layer. Furthermore, it has the effect to protect the metallic pattern against moisture. Therefore, the film connector according to the present invention provides great reliability.
  • a film connector according to the present invention has various advantages and enables performing an electrical connection between a drive module and a liquid crystal display panel, which is in great demand, and connecting parts such as electric parts with high-density terminal leads to a circuit substrat, peripheral module or the like with great reliability. Therefore, the film connector can be advantageously applied for industries.

Abstract

Cette invention concerne d'une part un film dans lequel un motif est formé en appliquant sur une surface principale d'un film flexible isolant (1) une première pellicule métallique (2) qui consiste en un métal choisi parmi le cuivre, l'argent, le nickel et l'aluminium, ou un alliage de ces métaux, une seconde pellicule métallique (3) consistant en un métal sélectionné parmi le nickel, le chrome, le tungstène et l'argent ou un alliage de ces métaux, une troisième pellicule conductrice isotropique (4) consistant en une poudre de carbone et en une résine synthétique, et une quatrième pellicule conductrice anisotropique (7a) consistant en de la poudre de carbone et de résine synthétique, et d'autre part un agent de liaison conducteur anisotropique. Grâce aux fonctions de ces produits, on peut obtenir un connecteur de film capable d'assurer une connexion électrique fiable de conducteurs terminaux, y compris des conducteurs de densité élevée, avec une fiabilité améliorée.
EP19860901505 1985-02-25 1986-02-25 Connecteur de film et son procede de fabrication. Withdrawn EP0215953A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35777/85 1985-02-25
JP3577785A JPS61195569A (ja) 1985-02-25 1985-02-25 フイルムコネクタ及びその製造方法

Publications (2)

Publication Number Publication Date
EP0215953A1 true EP0215953A1 (fr) 1987-04-01
EP0215953A4 EP0215953A4 (fr) 1987-07-06

Family

ID=12451321

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19860901505 Withdrawn EP0215953A4 (fr) 1985-02-25 1986-02-25 Connecteur de film et son procede de fabrication.

Country Status (3)

Country Link
EP (1) EP0215953A4 (fr)
JP (1) JPS61195569A (fr)
WO (1) WO1986005034A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0303384A2 (fr) * 1987-08-10 1989-02-15 Minnesota Mining And Manufacturing Company Ruban connecteur flexible

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462244B (zh) * 2011-10-17 2014-11-21 Ind Tech Res Inst 異方向性導電膜片及其製作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285156U (fr) * 1975-12-23 1977-06-24
JPS58115779A (ja) * 1981-12-28 1983-07-09 信越ポリマー株式会社 電気接続構造ならびにその電気接続方法
JPS6010275U (ja) * 1983-06-30 1985-01-24 カシオ計算機株式会社 フイルム状ヒ−トシ−ルコネクタ
JPS60140685A (ja) * 1983-12-28 1985-07-25 日本写真印刷株式会社 フイルム状電極コネクタ及びその製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No relevant documents have been disclosed. *
See also references of WO8605034A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0303384A2 (fr) * 1987-08-10 1989-02-15 Minnesota Mining And Manufacturing Company Ruban connecteur flexible
EP0303384A3 (fr) * 1987-08-10 1989-10-25 Minnesota Mining And Manufacturing Company Ruban connecteur flexible

Also Published As

Publication number Publication date
JPH0576754B2 (fr) 1993-10-25
WO1986005034A1 (fr) 1986-08-28
JPS61195569A (ja) 1986-08-29
EP0215953A4 (fr) 1987-07-06

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: OGAWA, YUKIO

Inventor name: SHIMADA, KAZUYUKI

Inventor name: MATSUMURA, KOZO

Inventor name: KASHIWAGI, TAKAFUMI

Inventor name: ISHIKAWA, YOSHIKAZU

Inventor name: TANAKA, KOHJI