EP0219361B1 - Verkleinerte Vorrichtung zur Verbindung von elektrisch leitenden Elementen für sehr hohe Stromstärken - Google Patents

Verkleinerte Vorrichtung zur Verbindung von elektrisch leitenden Elementen für sehr hohe Stromstärken Download PDF

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Publication number
EP0219361B1
EP0219361B1 EP86401741A EP86401741A EP0219361B1 EP 0219361 B1 EP0219361 B1 EP 0219361B1 EP 86401741 A EP86401741 A EP 86401741A EP 86401741 A EP86401741 A EP 86401741A EP 0219361 B1 EP0219361 B1 EP 0219361B1
Authority
EP
European Patent Office
Prior art keywords
binder
wires
connection
electrically conductive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP86401741A
Other languages
English (en)
French (fr)
Other versions
EP0219361A1 (de
Inventor
François Marie Girard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AT86401741T priority Critical patent/ATE62356T1/de
Publication of EP0219361A1 publication Critical patent/EP0219361A1/de
Application granted granted Critical
Publication of EP0219361B1 publication Critical patent/EP0219361B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Definitions

  • the present invention relates to a miniaturized device for connecting electrically conductive elements subjected to very high intensities.
  • connections of electrically conductive elements are generally established by bringing together two conductors subjected to a pressure created by a mechanical system. These conductors are very generally made of copper, more rarely brass or silver. These metals being very good conductors of electricity, the dimensions of the connection wires are very small even for very high intensities. For example, a hundred amps can be passed through copper with a cross-section of 0.1 mm2 without it melting. On the other hand, the connection of such elements requires a much larger dimensioning of the conductors. In contact with the conductors, the resistivity is greater. This is due to oxides, surface impurities, reduction of the contact section. To achieve a good connection despite this greater resistivity, the connection surface is increased, and of course the space requirement.
  • connection In the case of tightening by screws and clamps on identical lengths, the space occupied by the connection is 30 to 100 times larger than the space occupied by the conductors.
  • connection very small would be to make an autogenous solder.
  • copper does not lend itself to this type of soldering because it is a good conductor of electricity. Butt welding is not 100% reliable because heat production is ensured by the connection of oxides to oxides and these remain in the weld. The laser does not give any result on copper because the very specific heat is dissipated too quickly. The ultrasounds give a satisfactory result but only for large section connections because a matrixing is necessary. Silver soldering is excluded because of the high temperatures required for a fairly long time, which is not suitable for electronic components.
  • a known solution for reducing the dimensions of the connection consists in establishing the connection by means of an electrically conductive low melting point binder. To make this binder easy to use, the binder is melted. This, at room temperature, is solid and provides the mechanical connection and electrical continuity between the two conductors by keeping them adjacent to each other on a section of a certain length which is coated in a solder block. elongate.
  • This binder generally a lead-tin alloy, is inevitably less good conductor of electricity than copper, therefore of lower quality and the bond length must become very large for very high intensities in order to avoid melting of the binder; the ratio of occupied spaces remains from 10 to 100 times greater, that is to say that the volume of the final connection is 10 to 100 times greater than the volume of the neighboring portions of the two wires.
  • the melting point of the binder is taken relatively low between 200 and 300 ° C, in order to facilitate the implementation and not to alter the environment (fasteners, boxes, insulators, electronic components sensitive to heat).
  • connection device between a bar and a conductive element, usable in particular in electrometallurgy, this device comprising, between the bar and the conductive element, a mass of an electrically conductive fluid material maintained enclosed by a skirt made of flexible material, in order to allow relative movement.
  • a device does not however make it possible to solve the problem of the connection of copper or of a material which is good conductor of electricity, of small dimension (a few millimeters) subjected to very high intensities (50 kA to 100 kA).
  • the present invention aims to remedy these drawbacks by providing a connection device for particularly simple design and allowing very advanced miniaturization while giving 100% operational safety in an application to a miniaturized surge arrester or surge arrester.
  • this miniaturized device for connecting two electrically conductive wires usable more particularly in a surge arrester or surge arrester device comprising, in combination, a low-melting point binder, solid at room temperature, and which surrounds the extreme parts neighboring the two wires is characterized in that the binder ensures the mechanical strength of the end portions of the two wires, a coating of rigid material completely surrounding the solid binder and confining this binder in its place during its melting caused by a high intensity, in thus maintaining the connection between the conductive wires.
  • Figure 1 is a sectional view of a miniaturized device for connection between two conductive wires according to the invention.
  • Figure 2 is a longitudinal sectional view of a surge protection device using miniaturized connection devices according to the invention.
  • the device which is shown in FIG. 1 is intended for the electrical connection of two electrically conductive wires 1 and 2, for example made of copper, the extreme parts of which are close to one another, being, for example , parallel to each other.
  • These wires are electrically connected by a binder 3, which conducts electricity, has a low melting point (200 to 300 ° C), such as a lead-tin alloy and which therefore forms a solid mass at room temperature.
  • a rigid coating 4 surrounds the entire connection in all the axes.
  • This coating is chosen so as to leave no air bubble between the binder 3 and the coating 4 because the probable movement of the air bubble by gravity during the melting of the binder 3 could have the consequence of increasing the resistivity, this increase resulting in an increase in temperature by oxidation of the binder 3 by the oxygen of the bubble and deterioration of the connection.
  • the coating 4 is chosen so as not to have chemical reactivity with the binder 3. It is also chosen as a function of the foreseeable duration of the fusion. For example, an epoxy resin can resist for 10 ms at a temperature of 1000 ° C and a ceramic for several seconds at the same temperature.
  • FIG. 2 represents an application of the invention to a surge protection device, constituted by an assembly of Zener diodes.
  • This assembly can be carried out, according to the invention, in order to give very reduced dimensions to the assembly and to provide absolute bonding security.
  • the Zener diodes 5, three in number in the example described by way of illustration, are connected to one another, according to the invention, by a binder 3, with a low melting point (225 ° C.) in the case of a semiconductor. Using a much higher melting point binder would destroy the semiconductor during the soldering operation.
  • the binder 3 provides, as before, the electrical connection between the conducting wires 1 and 2 of the Zener diodes 5.
  • the three Zener diodes are connected in series to two opposite external brass cylinders 6.
  • a coating 4 confines all the welds established by the binder 3, four in number in the very particular embodiment described by reason of two welds within the coating 4, between the middle Zener diode and the two extreme Zener diodes, and two welds at the ends between the conducting wires 1, 2 and the outer cylinders 6.
  • the coating 4, in this embodiment, is chosen as electrical insulator. It provides both mechanical strength, isolation of the components from each other and containment according to the invention.
  • the coating 4 may not necessarily be the same for each of the links, but in this embodiment the coating 4 does not take up space because it fills the inevitable void that there is between the various constituent elements. Since the coating does not participate in the bulk, the production can be extremely miniaturized, which constitutes an essential advantage of the invention.
  • another advantage of the invention lies in the operational safety of the device because the Zener diodes are welded as a last resort and the connections established must be maintained despite very high currents.
  • the Zener diodes before soldering, the Zener diodes maintained the normal mains voltage and therefore heated up: they therefore transmitted the heat by the wires 1 and 2 had binder 3.
  • the binder 3 can melt before or after fusion of the Zener diodes, the connection is always maintained and operational safety guaranteed.

Landscapes

  • Fuses (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Claims (3)

1. Miniaturisierte Vorrichtung zum Verbinden von zwei elektrischen Leiterdrähten (1, 2) insbesondere für eine Blitzschutz- oder Überspannungsschutzeinrichtung, welche in Kombination ein Verbindungsmittel (3) mit niedrigem Schmelzpunkt enthält, das bei Umgebungstemperatur fest ist und die benachbarten Enden der beiden Drähte (1, 2) umgibt, dadurch gekennzeichnet, daß das Verbindungsmittel (3) die mechanische Halterung der Enden der beiden Drähte (1, 2) gewährleistet, daß eine Umhüllung (4) aus starrem Material das feste Verbindungsmittel (3) gänzlich umgibt und das Verbindungsmittel an seinem Platz einschließt, wenn sein Schmelzen durch eine hohe Belastung verursacht wird, und auf diese Weise die Verbindung zwischen den beiden Leiterdrähten (1, 2) aufrechterhält.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß sie keine Luftblase zwischen dem Bindemittel (3) und der Umhüllung (4) enthält.
3. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die beiden Leiterdrähte (1, 2) jeweils an elektrisch verbundene Komponenten (5, 6) angeschlossen sind und daß die Umhüllung (4) den ganzen Raum zwischen den Komponenten (5, 6) einnimmt sowie deren Isolation gewährleistet.
EP86401741A 1985-08-05 1986-08-04 Verkleinerte Vorrichtung zur Verbindung von elektrisch leitenden Elementen für sehr hohe Stromstärken Expired - Lifetime EP0219361B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT86401741T ATE62356T1 (de) 1985-08-05 1986-08-04 Verkleinerte vorrichtung zur verbindung von elektrisch leitenden elementen fuer sehr hohe stromstaerken.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8512069 1985-08-05
FR8512069A FR2585892B1 (fr) 1985-08-05 1985-08-05 Dispositif de miniaturisation des connexions d'elements soumis a de tres fortes intensites electriques

Publications (2)

Publication Number Publication Date
EP0219361A1 EP0219361A1 (de) 1987-04-22
EP0219361B1 true EP0219361B1 (de) 1991-04-03

Family

ID=9322055

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86401741A Expired - Lifetime EP0219361B1 (de) 1985-08-05 1986-08-04 Verkleinerte Vorrichtung zur Verbindung von elektrisch leitenden Elementen für sehr hohe Stromstärken

Country Status (7)

Country Link
US (1) US4736070A (de)
EP (1) EP0219361B1 (de)
JP (1) JPH0789500B2 (de)
AT (1) ATE62356T1 (de)
CA (1) CA1298377C (de)
DE (1) DE3678523D1 (de)
FR (1) FR2585892B1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9116523D0 (en) * 1991-07-31 1991-09-11 Raychem Sa Nv Electrical component
JPH0538531U (ja) * 1991-10-31 1993-05-25 株式会社明電舎 避雷器の放電電流記録装置
US6049046A (en) * 1997-09-30 2000-04-11 Siemens Energy & Automation, Inc. Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy
US6010059A (en) * 1997-09-30 2000-01-04 Siemens Energy & Automation, Inc. Method for ultrasonic joining of electrical parts using a brazing alloy
FR2798784B1 (fr) * 1999-09-17 2002-01-11 Francois Girard Dispositif de protection contre les surtensions
JP5242587B2 (ja) * 2006-12-08 2013-07-24 サン−ゴバン クリストー エ デテクトゥール 結晶が基材端部上に成長しないように基板上にエピタキシャル成長させて窒化物単結晶を製造する方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201852A (en) * 1961-09-05 1965-08-24 Radio Frequency Lab Inc Method of soldering
US3144507A (en) * 1962-05-04 1964-08-11 American Radiator & Standard Splint type reinforced conductor joint
US3316343A (en) * 1966-01-03 1967-04-25 Raychem Corp Heat shrinkable connector with preplaced solder therein
US3525799A (en) * 1968-05-17 1970-08-25 Raychem Corp Heat recoverable connector
US3622944A (en) * 1969-08-05 1971-11-23 Tokai Denki Kk Electrical connector
US3742594A (en) * 1971-05-10 1973-07-03 Harco Electr Ltd Antimony electrodes and method of manufacturing same
US3889365A (en) * 1971-08-09 1975-06-17 Gordon L Brock Electronic module and method of fabricating same
US3869701A (en) * 1972-03-02 1975-03-04 Douglas G Waltz Plurality of electronic elements connected together by interconnecting wires and connecting joints
GB1465662A (en) * 1975-07-16 1977-02-23 Fontaine A Electrical contact terminal
GB2082109B (en) * 1980-07-28 1985-02-06 Raychem Corp Heat recoverable connector
US4547827A (en) * 1983-02-18 1985-10-15 Shedd Harold E Power surge isolator
US4568795A (en) * 1983-08-19 1986-02-04 Alden Research Foundation Insulation filled carrier of conductive components

Also Published As

Publication number Publication date
FR2585892A1 (fr) 1987-02-06
CA1298377C (fr) 1992-03-31
FR2585892B1 (fr) 1987-11-20
ATE62356T1 (de) 1991-04-15
US4736070A (en) 1988-04-05
DE3678523D1 (de) 1991-05-08
JPS6297361A (ja) 1987-05-06
EP0219361A1 (de) 1987-04-22
JPH0789500B2 (ja) 1995-09-27

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