EP0217905A1 - Circuit integre a l'echelle de la tranche - Google Patents

Circuit integre a l'echelle de la tranche

Info

Publication number
EP0217905A1
EP0217905A1 EP19860902451 EP86902451A EP0217905A1 EP 0217905 A1 EP0217905 A1 EP 0217905A1 EP 19860902451 EP19860902451 EP 19860902451 EP 86902451 A EP86902451 A EP 86902451A EP 0217905 A1 EP0217905 A1 EP 0217905A1
Authority
EP
European Patent Office
Prior art keywords
chip
chips
terminal
growth
ret
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19860902451
Other languages
German (de)
English (en)
Inventor
Ivor Catt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinclair Research Ltd
Original Assignee
Sinclair Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinclair Research Ltd filed Critical Sinclair Research Ltd
Publication of EP0217905A1 publication Critical patent/EP0217905A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/16—Error detection or correction of the data by redundancy in hardware
    • G06F11/20—Error detection or correction of the data by redundancy in hardware using active fault-masking, e.g. by switching out faulty elements or by switching in spare elements

Definitions

  • the present invention relates to a wafer scale integrated (WSI) circuit comprising a plurality of undiced and interconnected chips.
  • WSI wafer scale integrated circuit
  • a major problem in the way of attempts to extend integrated circuits from large scale integration (LSI) to WSI is the impossibility of producing perfect wafers.
  • LSI large scale integration
  • LSI circuits i.e. memory chips
  • the present invention is concerned with improved architectures and control systems whereby more efficient growth mechanisms may be achieved.
  • a chip means one of the individual integrated circuits which are interconnectable by way of what will be called growth logic, to distinguish from the chips' function circuits which perform whatever are the intended storage and/or processing functions of the WSI circuit.
  • growth logic to distinguish from the chips' function circuits which perform whatever are the intended storage and/or processing functions of the WSI circuit.
  • the present invention is not concerned with the nature of the function circuits themselves. Examples are described in the aforementioned GB 1 377 859 and also in an improvement thereon GB 1 525 048.
  • Each chip comprises at least one set of chip terminals. There may be four such terminals identified as IN, OUT, RET and ROUT.
  • IN receives signals from an upstream chip and OUT passes signals to a downstream chip.
  • RET receives signals in the return direction from a downstream chip and ROUT passes signals in the return direction to an upstream chip.
  • fast line and a “slow line” each passing through and returning through the interconnected chips.
  • Each such line needs its own set of four chip terminals. In the more detailed description below it will be convenient to identify these as FIN, FOUT, FRET and FROUT for the fast line and SIN, SOUT, SRET and SROUT for the slow line.
  • Each chip also comprises a plurality of sets of direction terminals, one set for every chip terminal.
  • the direction terminals are the terminals connected to neighbouring chips.
  • the growth logic is interposed between the chip terminals and the direction terminals which are so called because they are associated with directions to the connected neighbouring chips.
  • connection directions N, S, E, W between chips in a rectangular array and the set of direction terminals for FIN would, in the terminology of the present application, be FIN FROM S, FIN FROM N, FIN FROM W and FIN FROM E.
  • the set of direction terminals for FOUT would be FOUT TO N, FOUT TO S, FOUT TO E, FOUT TO W and so on.
  • the chips are preferably arranged in a rectangular array and the connection directions are a mixture of rectilinear and diagonal directions.
  • the group of potential upstream chips for any given chip is the same as the group of potential downstream chips. Accordingly, when a chip is added to the spiral, the group of potential downstream chips immediately loses one member.
  • the group of potential downstream chips immediately loses one member.
  • the group is cut from 4 to 3 members. In the present invention the group remains intact. This leads to a greater probability of being able to continue growth if both the potential upstream and potential downstream chips are relatively large in number.
  • a chip In a rectangular array, a chip has only 4 edge adjacent physical neighbours but it has 8 neighbours if diagonal adjacency is also permitted and it is possible to use mutually exclusive groups of 4 potential upstream chips and 4 potential downstream chips. Detailed examples are given below.
  • the growth logic permits a chip to be interconnected to more than one downstream chip but in such a way that the chip terminals of any one kind are all interconnected in one non-branching path.
  • the growth pattern is branching but the fast line and slow line are non-branching.
  • the functional path through the chips is a non-branching path identified by the sequential chip numbers (addresses) chip (n), chip (n + 1), chip (n + 2).
  • One possibility is for the first chip to try to make all its connections. If the possible next downstream chips are four in number, and there are no defects at this stage, the growth will immediately branch in four directions to create the chain chip (1) to chip (5). Next chip (2) tries all its possibilities, chip (3) tries all its possibilities and so on. The growth pattern will tend to spread out densely from the initial chip and this may be the most efficient way of ensuring that all or most good chips are used. However it may be difficult for the control circuit to work out efficiently the correct sequence of addressed OPEN and STEP signals to send.
  • Fig 1 is a diagram of a block of chips with the potential connections therebetween.
  • Fig 2 illustrates the connection directions of a single chip from Fig 1.
  • Figs 3 and 4 illustrate the connection directions of alternative chips.
  • Fig 5 illustrates possible paths through a chip of the type shown in Fig 2.
  • Fig 6 is a block diagram of a chip.
  • Figs 7(a) to 7(c) shows examples of specific connections made within the chip of Fig 6, by way of the growth logic.
  • Fig 8 is a diagram of a first part of the growth logic of the chip.
  • Figs 9 to 11 show three embodiments of a second part of the growth logic.
  • Fig 12 is a diagram of a third part of the growth logic.
  • Fig 13 shows instruction decoding circuits of the growth logic.
  • Fig 14 is a diagram of a control chip connected to three further chips.
  • Fig 15 is a flow chart of a chip-addressing operation.
  • Fig 16 is a flow chart for control of the growth process.
  • Fig 17 shows a growth pattern created by the algorithm of Fig 16.
  • Fig 1 is a highly schematic representation of chips 10A and 10B in a rectangular array.
  • the chips are of two different kinds, chips 10A and chips 10B, and the two kinds alternate along both rows and columns so that they form a chequerboard pattern - the 10A chips are "black squares" say and the 10B chips are "white squares”.
  • the potential connections between chips in the direction of growth are represented by arrows in the directions W, S, NE and D.
  • D stands for diagonal and is NW in the case of chips 10A but SE in the case of chips 10B.
  • the D arrows are drawn heavily to emphasize that, unlike the other arrows, they alternate in direction. This is the difference between the two kinds of chips.
  • the arrows represent connections in the direction of growth. Each such connection is actually two physical connections in the preferred embodiment, one for the fast line, one for the slow line, and is accompanied by return connections in the opposite direction.
  • any given chip may always be to any one or more of W, S, NE and D (subject to obvious restrictions in the case of chips at the edge of the array).
  • a chip can be entered or grown into from a preceding chip in a single one of the directions from E, N, SW and from D.
  • the two groups of 4 directions each comprise 2 rectilinear directions and 2 diagonal directions, one of which alternates between opposite directions (NW and SE) as between the two kinds of chips. This has been found to give good chances of efficient growth patterns.
  • two fixed diagonal directions could be used and one of the rectilinear directions could alternate between the two kinds of chips.
  • the four directions of each group are well spread over the compass. This is not essential and in some applications more tightly bunched groups may be employed in order to reduce interconnection distances and save on layout space and speed.
  • Fig 2 shows the connection directions for chips 10 (either 10A or 10B) the incoming and outgoing connection directions being shown at (a) and (b) respectively.
  • Figs 3(a) and (b) similarly show bunched directions for different chips 11A.
  • the chips 11A may alternate with chips 11B whose incoming and outgoing connection directions are shown in Figs 4(a) and (b).
  • Fig 5 illustrates various possible paths through a single chip 10A for a single line (i.e. the fast line or the slow line), the forward and return paths being both shown.
  • the chip is entered from the SW and exits solely to the NE.
  • the chip is entered from the SW and exits both to the NW and to the S.
  • Dotted line loops indicate the connections from the forward to the return paths via downstream chips and show that there is always a single continuous path. No example is illustrated of opening up to three directions but Fig 5(c) shows the chip when it has opened up to all four exit directions.
  • Fig 6 is a schematic block diagram of a single chip 10A or 10B, not intended to carry any implications as to chip layout in general or location of terminals in particular.
  • the chip circuits consist of function circuits 12 and growth logic 13. Internally the chip has two sets of chip terminals 14 which are the means of communication with the function circuits themselves. The two sets serve the fast line and the slow line respectively and the terminals are those already identified above, namely:
  • the chip has no less than 32 direction terminals 15, four for every chip terminal. These are all identified down the right hand side of the drawing. D meaning diagonal is to be interpreted as SE or NW as appropriate depending on whether the chip is a chip 10A or a chip 10B.
  • the growth logic 13 establishes the connections between the chip terminals 14 and selected direction terminals 15 and also connections between pairs of direction terminals. Until a chip has opened up connections to a downstream chip, two connections 16 are made by the growth logic. These connect FOUT to FRET and SOUT to SRET to complete the fast and slow line paths.
  • OR gates 23 Permanent connections through OR gates 23 are also made on the input side between each set of IN FROM terminals and the corresponding IN terminal. This is perfectly satisfactory because, as explained below, the growth algorithm prevents a chip being entered from more than one upstream chip.
  • Fig 7(a) shows the connections which are effective when a chip has been entered from the SW but has not made connection to any downstream chip.
  • the connections 16 remain, the IN terminals from SW are connected to the chip IN terminals (connections 20) while ROUT terminals to SW are connected to the chip ROUT terminals (connections 21).
  • the fast and slow circuits of the function circuits 12 have been brought into the fast and slow lines respectively.
  • Fig 7(b) shows the connections established in the case of Fig 5(a). It can be seen that FIN FROM SW is connected via FIN, the fast line function circuitry and FOUT to FOUT to NE while FRET FROM NE is connected back via FRET, FROUT to FROUT TO SW. Similarly for the slow line.
  • Fig 7(c) shows the connections established in the case of Fig 5(b). FRET FROM NE is now passed to FOUT TO S while FRET FROM S is connected via FRET, FROUT to FROUT TO SW. Similarly for the slow line. Note the connections 24 between FRET/SRET FROM NE to FOUT/SOUT TO S.
  • the connections within the growth logic are made by way of various gates which are enabled by direction enable signals OPEN NE, OPEN S, OPEN W and OPEN D.
  • OPEN NE means “enable the connections to the downstream chip in the NE direction", and so on.
  • the four direction enable signals are provided by corresponding bistables 24 to 27.
  • CLEAR bistable 28 are composed in conventional manner of cross coupled gates and the specific properties of bistable 28, formed of a NOR gate and an AND gate with inverted inputs, are as follows.
  • the A input of the bistable 28 is connected to a conventional hardware clear circuit comprising a differentiating circuit 29 connected to the power line V dd .
  • a conventional hardware clear circuit comprising a differentiating circuit 29 connected to the power line V dd .
  • the circuit 29 may be individual to the chip or one such circuit may be shared among a group of adjacent chips, e.g. a square of 4 chips.
  • B 0 and there is a 1 pulse on A, so the bistable sets to provide the signal CLEAR. This clears the chip circuits in general and ensures in particular that the bistable 24 to 27 are all reset.
  • Input lines 30 and 31 for the aforementioned pulse signals OPEN and STEP are connected to the direction enable bistables 24 to 27 through an array 32 of AND and OR gates. Small delays are inserted as needed and as indicated merely at one location 33, in accordance with conventional practice, for the avoidance of race-away conditions.
  • the first OPEN pulse will set the bistable 24, the second will set the bistable 25, and so on.
  • a STEP pulse will reset the last-set bistable and set the next.
  • the first OPEN pulse resets the CLEAR bistable 28, thereby to remove inhibiting inputs from the AND gates of the direction bistables 24 to 27.
  • Fig 9 is drawn for the fast line.
  • a duplicate circuit is provided for the slow line.
  • a one-bit delay may be desirable at the output of each of the OR gates 38.
  • the simple, serially arranged circuit of Fig 9 introduces appreciable signal delays. More complex arrangements are possible which achieve greater speed at the expense of more gates and hence more chip area devoted to the growth logic.
  • Fig 9 has just 16 gates.
  • Fig 10 shows a parallel logic circuit which reduces propagation delays but requires 29 gates. It can be checked by inspection that the various combinations of OPEN signals establish the required paths. For example, when both OPEN NE and OPEN S are true, gate 40 connects FOUT to FOUT TO NE, gates 41, 42 and 43 connect FRET FROM NE to FOUT to S, and gates 44, 45 and 46 connect FRET FROM S to FRET. Gate 46 is a final gate on FRET which is disabled by CLEAR. Such a gate may be included in Figs 9 and 11 also.
  • a one-bit or half-bit delay may be introduced at the intermediate point 59 in Fig 11.
  • Fig 11 is the preferred embodiment of the routing gates. It is a mixed serial-parallel circuit which only uses 18 gates but which reduces the maximum number of gates through which a signal has to pass appreciably.
  • OPEN NE is TRUE gate 50 connects FOUT to
  • Gates 51, 52, 53 and 54 connect FRET FROM NE to FRET.
  • gate 50 When both OPEN NE and OPEN S are TRUE, gate 50 still connects FOUT to FOUT TO NE, gates 55, 56 and 57 connect FRET FROM NE to FOUT TO
  • Connection routes consist of from 1 to 4 gates as against from 1 to
  • Fig 13 shows the fast line circuits symbolized by the broken line 17 in Fig 6, plus the OR gate 23. As previously mentioned the wafer is traversed by clock lines as well as power supply lines. Fig
  • FIG. 13 shows a bit line 64 connected to a recycling binary counter 65 which establishes the fast line instruction cycle on each chip.
  • the fast line circuits comprise a chain of four flip-flops 70-73 cascaded to form a shift register connected to an instruction decoder 74.
  • FOUT is taken from the output of the first flip-flop 70.
  • the instructions which can be decoded are STEP and OPEN. These are provided via AND gates 75 and 76 when these are enabled by t n which marks the bit interval during which a complete four-bit instruction is in the shift register 70-73.
  • the AND gates 75 and 76 also required an enabling CHIP ADDRESSED signal. This is provided from the fast line circuits 17 essentially in the manner described in GB 1 377 859. The basic idea is to send an address number which is decremented by each chip through which it passes. The chip which receives address 0 (or, if preferred, the chip which creates address 0 by decrementing 1) is the addressed chip.
  • Fig 14 is a diagram showing a control chip 80 connected to a first chip, chip 0 and thence to chips 1 and 2. This is an early stage in the growth process. Fig 14 does not indicate physical locations of chips 10, nor which direction terminals thereof have been used in connecting them up, nor whether they are type 10A or type 10B. So far as the control chip 80 is concerned they are simply a series of chips identified by addresses 0, 1, 2. The fast and slow lines are shown going out through the chips and returning to the control chip, with the fast and slow circuits indicated at 17 and 18 respectively, as in Fig 6.
  • the control chip 80 may be on the same wafer as the chip 10 and is essentially a dedicated microprocessor which can send commands both on the fast line (to the circuits described above) and the slow line.
  • the slow line circuits 18 can act as a simple serial processor and the commands sent down the fast line can include conventional elementary operations such as ADD, SUB, INC, DEC and so on.
  • the commands include an address field, used as described below.
  • One of the commands sent along the fast line is a command to compare the address with 0 and, if there is no match, to decrement the address (and pass the command on). If there is a match, the chip 10 latches the aforementioned CHIP ADDRESSED signal. This is shown in the flow chart of Fig 15. A chip 10 is always addressed in this way before an OPEN or STEP command is sent thereto.
  • Fig 16 is a flow-chart showing how the growth of the path of interconnected chips is controlled by the control chip 80.
  • This chip incorporates three counters:
  • X DISTANCE TO BRANCH. This is the number of chips along the path to the point at which the growth is to branch, i.e. X is the address to use when a branch is made in the growth,.
  • Y TOTAL LENGTH, i.e. Y is the address of the current last chip in the path.
  • Z NUMBER OF BRANCHES, that is to say the number of branches existing at the chip whereat branching is taking place.
  • the flow chart starts by clearing all the counters to zero, block 81. Then the current last chip is tested by sending various test routines thereto. These include a test of the status of the clear bistable 28 which should still be set. If it is not, the chip is already part of the grown path and cannot be re-entered, so the test routines fail.
  • test 85 is made to see if Z is greater than or equal 4 to see whether there remains a possibility of growth from chip X. Assuming Z is less than 4, section 84 of the flow chart is followed whereby Z is incremented and a STEP command is sent to chip X. This opens up the next growth direction while closing the old. Thus, if growth has been proceeding NE, when such growth is halted, STEP causes an attempt to grow S, i.e. chip Y will be to the S of chip X. If necessary tries are made for the chip to the W and to D.
  • Fig 17 shows a nine by ten array of chips 10 including five chips which are defective.
  • the control chip 80 of Fig 14 is connected to a particular one of the chips 10 identified by the numeral 0. It will be recalled that the order in which growth directions are tried is NE, S, W and D. (In fact D never has to be used in the example illustrated.) Growth occurred in the direction
  • the remainder of the growth pattern can be followed through the numbered chips and branch points B2, B3 etc numbered in the order in which the branches occur. It will be seen that all 85 good chips have been included in the growth pattern.
  • block 88 always sets Z to 1 although there will be occasions on which, because of an existing branch, Z should really be set to a higher number. The only consequence of this is that wasted attempts are made to branch from a chip from which branching is actually not possible. This adds to the time taken to grow the pattern which is regarded as an acceptable penalty to pay for the simplicity of the algorithm.
  • the time taken to grow the pattern can actually be quite long, taking perhaps 2 to 5 minutes from switch-on. This may not be acceptable for some equipment which the user expects to be functional virtually instantaneously.
  • This problem may be overcome by providing the wafer with battery back-up (so that growth of the pattern only takes places on a fresh energisation, following switch-off not only of the mains supply but also of the battery supply).
  • An alternative approach is to program the control chip 80 to memorise the pattern of OPEN and STEP commands used in creating the growth pattern at an initial switch-on. At subsequent switch-on times, this pattern of commands will be sent out without performing any tests on the assumption that a satisfactory pattern will again be achieved. A brief test sequence for the whole wafer may then be performed. On a failure, due to chip degradation for example, it will be possible to revert to the initial growth process, testing at every stage, in accordance with the agorithm of Fig 16.

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Abstract

Une tranche de circuit intégré comprend une matrice de puces (10A, 10B) pourvue d'une logique permettant aux puces de se connecter entre elles sous le contrôle de commandes envoyées par un chemin d'aller par l'intermédiaire de puces déjà connectées et renvoyées par un chemin de retour. Une croissance est tentée dans les directions NE, S, W et D, lorsque D est une direction diagonale qui est NW pour les puces 10A et SE pour les puces 10B. Des tests sont effectués au fur et à mesure que chaque puce est ajoutée au chemin développé. Des puces défectueuses sont évitées en changeant la direction de croissance ou de développement pour sélectionner une autre puce. De manière à augmenter l'efficacité de développement pour inclure toutes ou pratiquement toutes les bonnes puces, une forme de développement par branchement est possible. Le développement peut avoir lieu dans plus d'une direction à partir d'une seule puce mais le chemin d'interconnexion, lui, reste unique. Plus particulièrement, lorsqu'un développement par branchement s'effectue à partir d'une puce, le chemin de retour à celle-ci est dirigé dans le chemin d'aller d'une autre puce dont le chemin de retour est dirigé vers le chemin de retour quittant la puce d'où le développement ou croissance par branchement a eu lieu. Les puces amont potentielles et les puces aval potentielles pour une puce donnée forment deux groupes mutuellement exclusifs. Par exemple, une puce 10A possède des puces amont potentielles dans les directions NE, S, W et NW mais possède des puces aval potentielles dans des directions N, E, SE et SW par rapport à la puce (10).
EP19860902451 1985-04-15 1986-04-15 Circuit integre a l'echelle de la tranche Pending EP0217905A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8509632 1985-04-15
GB8509632A GB2174518B (en) 1985-04-15 1985-04-15 Wafer scale integrated circuit

Publications (1)

Publication Number Publication Date
EP0217905A1 true EP0217905A1 (fr) 1987-04-15

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ID=10577677

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19860902451 Pending EP0217905A1 (fr) 1985-04-15 1986-04-15 Circuit integre a l'echelle de la tranche

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EP (1) EP0217905A1 (fr)
GB (1) GB2174518B (fr)
WO (1) WO1986006186A1 (fr)

Families Citing this family (7)

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Publication number Priority date Publication date Assignee Title
KR900003884A (ko) * 1988-08-12 1990-03-27 미다 가쓰시게 대규모 반도체 집적회로 장치
US5020059A (en) * 1989-03-31 1991-05-28 At&T Bell Laboratories Reconfigurable signal processor
GB2243931A (en) * 1990-05-11 1991-11-13 Anamartic Ltd Chaining circuit modules
US5396269A (en) * 1991-02-20 1995-03-07 Hitachi, Ltd. Television telephone
US5587735A (en) * 1991-07-24 1996-12-24 Hitachi, Ltd. Video telephone
DE69222580T2 (de) * 1991-07-15 1998-04-16 Hitachi Ltd Bildkoder-Dekoder und Telekonferenzendstellengerät
AU645431B2 (en) 1991-07-15 1994-01-13 Hitachi Limited Teleconference terminal equipment

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GB1525048A (en) * 1977-04-05 1978-09-20 Catt I Data processing apparatus
GB2020457B (en) * 1978-05-03 1982-03-10 Int Computers Ltd Array processors
GB2082354B (en) * 1980-08-21 1984-04-11 Burroughs Corp Improvements in or relating to wafer-scale integrated circuits
GB2114782B (en) * 1981-12-02 1985-06-05 Burroughs Corp Branched-spiral wafer-scale integrated circuit
GB2111267B (en) * 1981-12-08 1985-10-16 Burroughs Corp Constant-distance structure polycellular very large scale integrated circuit

Non-Patent Citations (1)

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Title
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Also Published As

Publication number Publication date
GB2174518B (en) 1989-06-21
GB8509632D0 (en) 1985-05-22
GB2174518A (en) 1986-11-05
WO1986006186A1 (fr) 1986-10-23

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