Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/09872—Insulating conformal coating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
  • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
  • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
  • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
  • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings

Definitions

• This invention relates to removal of conformal coatings from printed circuit boards, and, in particular, to a composition and method for removing polyurethane and epoxy coatings from printed circuit boards to permit and facilitate repair thereof.
• a conformal coating is a coating applied to a printed circuit board to protect the components and circuitry from moisture and contaminants, and, to some degree, from mechanical shock, vibration, shorting, and tampering. Although a large number of coating compositions have been used as conformal coatings, polyurethane and epoxy coatings are the most common. When properly applied, the conformal coating effectively surrounds the entire printed circuit board and the components thereon.
• conformal coatings may vary from application to application.
• a conformal coating remover that can satisfactorily remove a 10 mil conformal coating may damage the board when used to remove a 2 mil conformal coating.
• the prior art has provided no effective solution to this problem.
• Polyurethane coatings are also insoluble in most common solvents. Corrosive strippers which can remove the cured polyurethane coating will, as a general rule, also corrode metallic surfaces on the board. Thus, polyurethane coatings, like epoxy coatings, are typically removed by mechanical processes such as scraping and abrading to permit rework of the board.
• a material for removing conformal coating from a printed circuit board comprising a base component and an activator component in separate containers, said base component and said activator component forming an active conformal coating remover when mixed, wherein: said base component comprises methylene chloride or toluene or a mixture thereof; and said activator component comprises (a) about 75 to 85 parts by volume methylene chloride or toluene, or a mixture thereof, (b) about 7 to about 25 parts by volume lower alkyl alcohol, and (c) about 2 to about 8 parts by volume acetone or ethylethylketone.
• a composition for removing a conformal coating from a printed circuit board preferably an epoxy conformal coating, comprising a base component of methylene chloride or toluene or a mixture thereof, and an activator component comprising (a) 85 parts by volume methylene chloride or toluene or a mixture thereof,
• the preferred composition for epoxy conformal coating removal has a base ' component comprising methylene chloride and an activator component comprising (a) 85 parts by volume methylene chloride, (b) about 9 to about 13 parts by volume, and preferably about 11 parts by volume lower alkyl alcohol, and (c) 3 to 5 parts by volume, and preferably about 4 parts by volume acetone.
• a composition for removing a conformal coating from a printed circuit board preferably a polyurethane conformal coating, having a base component comprising methylene* chloride or toluene or a mixture thereof, and an activator component comprising (a) 75 parts by volume methylene chloride or toluene or a mixture thereof, (b) 15 to 25 parts by volume lower alkyl alcohol, and (c) 2 to 8 parts by volume acetone or methylethylketone.
• the base component comprises methylene chloride and the activator component comprises (a) 75 parts by volume methylene chloride, (b) about 18 to about 22 parts by volume, and preferably about 20 parts by volume lower alkyl alcohol, and (c) about 4 to about 6 parts by volume, and preferably about 5 parts by volume acetone.
• the base component in the compositions of this invention include a thickener.
• the preferred thickeners are pectin, cellulose thickeners, and silica thickeners.
• the present invention contemplates a conformal coating removal system, comprising a base component ' and an . activator component in separate containers for mixing in a desired ratio.
• a method for removing conformal coatings, preferably epoxy or polyurethane, from a printed circuit board comprising the steps of forming an active coating remover composition by combining the base component and the activator component of one of the coating remover compositions disclosed above, treating a conformal coating on a printed circuit board by applying the active coating remover thereto, and removing the treated conformal coating.
• one embodiment of this invention provides a method for removing a polyurethane or epoxy conformal coating from a printed circuit board, comprising the steps of: obtaining the base component and the activator component of the conformal coating remover system described above; selecting a- -ratio of base component to activator component in the range of about 1:1 to about 10:1 by volume, wherein the selection of the ratio is based on the thickness of the conformal coating to be removed; forming an active conformal coating remover composition by combining the base component and said activator component in the selected ratio; treating a conformal coating on a printed circuit board by applying the active coating remover thereto; and removing the treated conformal coating.
• the action of the active coating remover may be accelerated and improved by exposing the treated conformal coating to an ultraviolet light source. Between about 1 and 15 minutes after treatment, and preferably after about 5 minutes, the treated conformal coating can be loosened by scrubbing and removed by rinsing with water.
• the ultraviolet light preferably has a wavelength of 180-235 n . An intensity of 110 microwatts per square centimeter of board is particularly preferred. When the light is spaced one meter from the work, the conformal coating may be removed in as little as one minute.
• the present invention also includes a method for removing conformal coatings of various thickness, by varying the ratio of base component to activator component.
• a 6 mil coating may be removed by applying a mixture of four parts base component with one part activator component. This ratio is increased for thinner coatings and decreased for thicker coatings.
• the composition of the present invention is a system, preferably two-part, that rapidly removes epoxy and/or polyurethane conformal coating without damaging the printed circuit board itself.
• the composition can be rinsed off of the board with water, together with the treated conformal coating.
• the first component, or base component, of the present composition comprises methylene chloride, toluene, or mixtures thereof.
• the base component also preferably includes a thickening agent.
• the purpose of the thickening agent is to increase the viscosity of the composition, so that localized application of the conformal coating remover composition is possible. Localized application is not only more economical, it also prevents contact between the remover and electronic components that could be damaged thereby.
• the particular thickening agent used is not critical, so long as the thickener is compatible with the other ingredients of the composition. A large number of conventional thickeners are known.
• Such thickeners include starches, gums, casein, gelatin, phycocolloids, semi-synthetic cellulose derivatives (such as carboxymethyl cellulose, cellulose acetate butyrate, cellulose acetate propionate, cellulosic acid, and modified cellulose), pectin, carrageenan, polyvinyl alcohol, carboxy-vinylates, bentonite, silicates, and colloidal silica.
• semi-synthetic cellulose derivatives such as carboxymethyl cellulose, cellulose acetate butyrate, cellulose acetate propionate, cellulosic acid, and modified cellulose
• pectin such as carboxymethyl cellulose, cellulose acetate butyrate, cellulose acetate propionate, cellulosic acid, and modified cellulose
• pectin such as carboxymethyl cellulose, cellulose acetate butyrate, cellulose acetate propionate, cellulosic acid, and modified cellulose
• pectin
• Preferred thickening agents are pectin, cellulose acetate butyrate, colloidal silica such as that sold by Cabot Corporation under the trademark “Cab-O-Sil”, and vinyl polymers such as those sold by B.F. Goodrich Company under the trademark "Carbopol”.
• the amount of thickener in the base component is not critical, and obviously depends to a large extent on the particular thickener used. The optimum amount of any ⁇ particular thickener can be readily determined by a person of ordinary skill in the art. Of course, the amount of thickener is also dependent on the manner in which the coating remover is to be applied to the boards; e.g., by squirting, brushing, or dipping, and is also dependent on the orientation of the board (vertical or horizontal) . For most applications, the thickener will comprise between 2 and 16 percent (by volume) of the base composition, and usually about 8 percent by volume. The preferred consistency is a soft gel that will not run when applied to the board in modest quantities.
• the activator component of the present composition There are three essential ingredients in the activator component of the present composition. If desired, the activator component may consist exclusively of these ingredients.
• the first ingredient is methylene chloride or toluene. Methylene chloride is preferred.
• the second ingredient of the activator component is a lower alkyl alcohol.
• lower alkyl alcohol me'ans alcohols containing from 1 to about 5 carbon atoms, such as methanol, ethanol, the propanols, the butanols, and the pentanols , and also diacetone alcohol. Methanol, ethanol, propanol, and butanol are preferred.
• the third -ingredient of the activator component is acetone or methylethylketone. Acetone is preferred.
• the activator component comprises (a) from about 75 to about 85 parts by volume methylene chloride or toluene, or a mixture thereof, (b) about 7 to about 25 parts by volume lower alkyl alcohol, and (c) about 2 to about 8 parts by volume acetone or methylethylketone.
• composition of the activator component is varied depending on whether an epoxy or a polyurethane coating is to be removed, as described below.
• the activator component for removing epoxy conformal coatings comprises 85 parts by volume of methylene chloride or toluene (or a mixture thereof), about 7 to 15 parts by volume of a lower alkyl alcohol, and about 2 to about 6 parts by volume acetone or methylethylketone (or a mixture thereof) .
• the preferred composition contains from about 9 to about 13 parts, and preferably about 11 parts by volume lower alkyl alcohol, and from about 3 to about 5 parts acetone or methylethylketone, preferably about 4 parts by volume.
• the activator component for use on polyurethane coatings contains 75 parts by volume of methylene chloride or toluene, 15 to 25 parts by volume of a lower alkyl alcohol, and 2 to 8 parts by volume of acetone or methylethylketone.
• the preferred composition contains from about 18 to about 22 parts, and preferably about 20 parts lower alkyl alcohol, and from about 4 to about 6, and preferably about 5 parts acetone or methylethylketone.
• compositions within these ranges, and particularly within the preferred ranges, exhibit markedly superior properties in comparison to compositions outside those ranges. Although the effects of the various components are interrelated, the amount of alcohol appears to be particularly important.
• the composition is used to remove conformal coatings having roughly an 8 mil thickness by combining 75 parts base component with from about 18 to about 32 parts activator component, preferably in a ratio of about 3 to 1. This forms an active coating remover composition.
• the activity of the coating remover is time-dependent, and the most satisfactory results are achieved by using the active coating remover within about 2 or 3 days after formulation.
• the present invention may be used to remove conformal coatings of varying thicknesses by varying the ratio of base component to activator component. By varying this ratio, the activity of the conformal coating remover can be altered. In this way, the user may formulate an active conformal coating remover composition that will /_ effectively remove the conformal coating without harming the board. In other words, the removal of a specified thickness of conformal ' coating exhausts the properly- compounded active conformal coating composition so that no damage to the board occurs.
• the ratio of base component to activator component may vary from about 1:1 to 10:1, and preferably from about 2:1 to 6:1.
• an effective active conformal coating remover composition is made by combining the base and activator components in the ratio of 2:1.
• the ratio is preferably 3:1; for a 6 mil coating, the ratio is 4:1; for a 4 mil coating, the ratio is 5:1, and for a 2 mil coating, the ratio that is preferred is about 6:1.
• the ideal ratio of base component to activator component for any particular coating can be readily determined by testing various ratios of base component to activator component on an innocuous part of the coated board..
• the ratio of 3:1 will ordinarily be used as a starting point.
• the active coating remover is applied to the printed circuit board by any suitable method, such as by dipping one or both sides of the circuit board into the composition, squirting the composition onto the circuit board, or painting the composition on the desired area.
• any suitable method such as by dipping one or both sides of the circuit board into the composition, squirting the composition onto the circuit board, or painting the composition on the desired area.
• the best method is to squirt a small amount of the composition onto the coating to be removed.
• a conventional squeeze bottle has proved satisfactory for this purpose.
• Many electronic components on printed circuit boards are encapsulated in epoxy, polyurethane, or other polymer material, so, in order to avoid damage to these components, it is best to avoid applying the remover directly to the components.
• compositions of the present invention exhibit very precise depth and duration properties. They have been formulated to rapidly remove the outer conformal coating layer, yet become inactive as the coating layer is penetrated and the composition contacts the resin of the printed circuit board.
• the speed with which the composition removes the coating can be significantly accelerated by exposing the treated board to light, preferably ultraviolet light.
• light preferably ultraviolet light.
• an ultraviolet light source of 100 watts at 1 meter . is particularly effective, good results are also seen with ordinary incandescent light.
• the intensity of the ultraviolet light and the wavelength of the ultraviolet light have significant effects.
• the preferred wavelength corresponds to short-wavelength ultraviolet, in th * e range of 180-235 nm.
• a 500 watt ultraviolet light is notably more effective than a 100 watt ultraviolet light, permitting removal of the conformal coating in one minute or less.
• the treated coating is scrubbed to loosen it and is then rinsed off with ordinary tap water.
• the method of the present invention effectively and completely removes the conformal coating from the treated area of the board.
• a thin layer of the outer "gel coat” of the board itself is also removed; however, this gel coat is only cosmetic, and the etching, as it were, does not extend into the fibers of the board or in any way weaken or damage the board.
• ordinary solvents tend to simultaneously soften both the conformal coating and the resin comprising the board itself, so that when the coating is effectively removed, the board is softened and damaged.
• An epoxy conformal coating remover is formulated as follows:
• a polyurethane conformal coating remover was formulated as follows : Base Component:
• the resulting active coating remover composition was applied to a polyurethane conformal coating on a printed circuit board with a squirt bottle and the treated area was exposed to sunlight for 4 minutes. The conformal coating was then loosened with a stiff brush, and the board was rinsed with water. The treated area was smooth and clean and showed no traces of conformal coating. Although the surface pattern of the fibers in the board was visible in the treated area, the fibers were not exposed and the resin impregnating the fibers was not softened or otherwise damaged. Electronic components were easily removed from the treated area by desoldering.
• the conformal coating remover composition of U.S. Patent 4,383,867 was formulated by combining 70 volume percent methylene chloride, 20 volume percent dimethyl formamide, and 10 volume percent methanol. A printed circuit board was immersed in the composition as instructed in the patent. The treated conformal coating was checked at approximately five minute intervals to determine whether the polyurethane conformal coating had been sufficiently softened to permit removal thereof. After about 20 minutes, the conformal coating could be removed by scraping. The resin of the underlying board was softened and damaged by the composition. The paint had been removed from the resistors, and many of the potted electronic components had been damaged. The insulating varnish on the copper wire in inductors on the board had been removed.
• Example 3 The composition of Example 3 was thickened with cellulose acetate butyrate until it was approximately the same consistency as the active compositions of Examples 1 and 2.
• a printed circuit board having the same polyurethane conformal coating as the board in Example 2 was treated by squirting the thickened composition onto a small area on the back of the board. The treated board was exposed o sunlight with no apparent effect. The treated area was periodically tested to ascertain whether the conformal coating could be removed. After approximately 30 minutes, the coating had been sufficiently softened to permit removal by scraping. The underlying board had also been softened and damaged. The scraping procedure removed not only conformal coating, but also part of the resin impregnating the glass fibers of the board.
• novel two-part composition of the present invention provides significantly superior results over the composition o-f U.'S. Patent 4,383,867, and permits ready removal of conformal coating without damage to the printed circuit board.
• base component and activator component for epoxy conformal coating were prepared.
• the base component and activator component were maintained in separate closed metal containers.
• Some of the base component and activator component was used to formulate active conformal coating remover composition by combining the components in the volume ratio of 3:1. This active composition was also placed in a closed container.
• the three containers respectively containing base component, activator component, and active (mixed base and activator) conformal coating remover, were stored for a period of several weeks in a storage building where the temperature ranged from about 55°F to about 90°F. Additional active conformal coating remover composition was then prepared from the base and activator components, and this fresh conformal coating remover was compared to the previously-mixed conformal coating remover.
• the fresh conformal coating remover effectively removed an epoxy conformal coating from a printed circuit board in under five minutes.
• the old conformal coating composition required more than 15 minutes to act, and removal of the conformal coating was not complete.
• conformal coating remover compositions having ratios of base component to activator component from 2:1 to 6:1 are applied to a printed circuit board having a 6 mil epoxy coating.
• the conformal coating remover composition having the best characteristics for removing this 6 mil coating has a ratio of base component to activator component of 4:1. Similar results are achieved with a polyurethane conformal coating.
• Example 6 The test of Example 6 is repeated on four other printed circuit boards having epoxy conformal coating thicknesses of 2 mils, 4 mils, 8 mils, and 10 mils. It is determined that the best volume ratio for a 2 mil coating is 6:1; the best volume ratio for a 4 mil coating is 5:1; the best volume ratio for an 8 mil coating is 3:1; and the best volume ratio for a 10 mil coating is 2:1.
• a conformal coating remover composition is prepared having a volume ratio of base component to activator component of 3:1. This composition is applied to a printed circuit board having an 8 mil epoxy coating. After approximately five minutes at 70°C, the coating has been loosened and may be removed with water. The same composition is then applied to another part of the same board. The boa-rd is then exposed to a 500 watt short-wave ultraviolet light at a distance of one meter. The conformal coating may be removed after approximately 45 seconds.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Paints Or Removers (AREA)

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• 1985
  • 1985-11-22 WO PCT/US1985/002339 patent/WO1986003145A1/en unknown
  • 1985-11-22 EP EP19850906138 patent/EP0203161A1/de not_active Withdrawn
  • 1985-11-22 AU AU52027/86A patent/AU5202786A/en not_active Abandoned

Non-Patent Citations (1)

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