EP0130902A2 - Induktives elektronisches Bauteil für Übertragung mit flachen Kontakten - Google Patents

Induktives elektronisches Bauteil für Übertragung mit flachen Kontakten Download PDF

Info

Publication number
EP0130902A2
EP0130902A2 EP84401338A EP84401338A EP0130902A2 EP 0130902 A2 EP0130902 A2 EP 0130902A2 EP 84401338 A EP84401338 A EP 84401338A EP 84401338 A EP84401338 A EP 84401338A EP 0130902 A2 EP0130902 A2 EP 0130902A2
Authority
EP
European Patent Office
Prior art keywords
groove
electronic component
cheeks
mandrel
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84401338A
Other languages
English (en)
French (fr)
Other versions
EP0130902A3 (en
EP0130902B1 (de
Inventor
Daniel Granjean
Henri Larue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Europeenne de Composants Electroniques LCC CICE
Original Assignee
Compagnie Europeenne de Composants Electroniques LCC CICE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Europeenne de Composants Electroniques LCC CICE filed Critical Compagnie Europeenne de Composants Electroniques LCC CICE
Publication of EP0130902A2 publication Critical patent/EP0130902A2/de
Publication of EP0130902A3 publication Critical patent/EP0130902A3/fr
Application granted granted Critical
Publication of EP0130902B1 publication Critical patent/EP0130902B1/de
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0053—Printed inductances with means to reduce eddy currents

Definitions

  • the present invention relates to an inductive electronic component for the flat transfer, comprising a pulley consisting of two cheeks secured to a mandrel on which is wound an electrical winding whose ends are respectively connected to an electrode, a mechanical protection means such as 'a resin coating the winding substantially up to the height of the cheeks.
  • the electronic components for the flat transfer are commonly referred to as "chip". These known components, both inductive and capacitive, have a generally parallelepiped shape having two planar electrodes arranged on two lateral faces of the parallelepiped allowing the flat transfer of said component.
  • these components for example placed in chargers, generally supply automatic insertion machines and are positioned on the printed circuit for which they are intended using a point of glue. When the printed circuit is completely lined with the various active and passive elements which must be connected to it, these are then connected to the printed tracks of the circuit by the technique known as "wave soldering" to "dipping” or any other connection system well known to those skilled in the art.
  • the electronic component according to the invention is characterized in that the cheeks of the pulley are covered substantially exclusively on their outer face, with a conductive layer forming an electrode, in that each cheek and its conductive layer have a groove extending parallel to the mandrel and at least until the extension thereof at the cheeks, and in that each end of the winding is respectively fixed in each groove, by means of a weld, ensuring the electrical contact between the electrodes and the ends of the winding.
  • this welding will be carried out by an electrically conductive solder, said solder at least partially filling each of the grooves.
  • the bottom of the groove will be located in the extension of the mandrel.
  • it will include at least one flat face which will be extended by a flat part in each groove.
  • the component thus formed which does not have the disadvantages of chips of the same type of the prior art, namely losses by eddy current a very low quality coefficient Q, has the essential advantages of the simplicity of manufacture leading to reduced production costs.
  • the first point is the presence of a groove in each of the cheeks of the pulley, groove crossing these from their internal face to their external face, and extending at least to the level of the mandrel of the pulley (but stopping preferably at this level). In this way, the problem of fixing and / or welding the ends of the windings of this inductor is considerably simplified.
  • this groove in other words the height of the cheek
  • the coating of the component with an epoxy-type resin can be limited to the external dimension of the cheeks.
  • the component thus formed has external dimensions, equal to the dimensions of the pulley used. With this structure, no additional thickness is added to the pulley to produce the component.
  • a second important point of the invention which, combined with the previous one provides the same advantages of small external dimensions, is the use of metallization electrodes deposited on the external face of the cheeks of the pulley.
  • the width of the component is only very slightly increased while retaining the height and the thickness of the pulley.
  • This structure also has the great advantage of the complete indifference of the component as to its soldering face on the printed circuit. Indeed, in the case of a pulley of parallelepiped external shape, when for example the electrodes are formed on two opposite lateral faces (external face of the cheeks), the component can be welded by being positioned on the circuit on the any of the other four faces of the parallelepiped, as will be readily understood later.
  • the pulley may be made of plastic, ceramic or preferably ferrite or agglomerated iron powder in order to increase the magnetic properties of the component.
  • this pulley can be either molded, or obtained from a reciprocating parallel bar tified.
  • the external shape of the pulley can be either cylindrical (as described for example in the French patent cited above) or parallelepipedic with a central mandrel constituting a section section smaller than that of the side cheeks integral with the mandrel.
  • the electrodes deposited on the external faces of the cheeks of the pulley will preferably be produced by soaking in a silver, silver-palladium bath, or deposited by screen printing, by chemical, electrolytic deposition or by vacuum metallization, etc., in a manner known per se.
  • the inks chosen must be appropriate, in particular in the case of deposition before firing of ceramics or ferrites.
  • the grooves made in each cheek will be either directly by molding, or by rectification, in the latter case before or after depositing the electrodes.
  • the deposition by dipping or by screen printing of the electrodes makes it possible of course to directly obtain the appropriate grooves in the corresponding part of the electrodes.
  • the winding wire will be placed at each end of the latter in said grooves, and welded in said groove electrically, by pressure, by ultrasound (or by the technique known as "Ball bonding" used in microelectronics), etc. or also using tin or tin-lead solder, so as to mechanically join the wire and the pulley on the one hand, and to ensure an electrical connection between the end of the winding and the electrodes on the other go.
  • the final coating of the component will generally be carried out using suitable molds so as not to soil the ends of the electrodes of the component, or by wrapping of adhesive films or plastic wires or using a sleeve. heat-shrinkable plastic, etc.
  • FIG. 1 is shown the pulley according to the invention coated with its end electrodes.
  • This shaped pulley is composed of a mandrel 1 itself parallelepipedic carrying at each of its ends parallelepipedic cheeks 2 and 3.
  • the outer faces of said cheeks 2 and 3 are covered respectively with metal layers of electrodes 4 and 5.
  • a lateral face of each cheek 2 and 3 has a groove 6 and 7 disposed on the same side relative to the mandrel 1.
  • Each groove 6 and 7 extends to the face 8 of the mandrel 1 which it extends by a flat part, 10 and 9 respectively.
  • FIG 2 there is shown a side view of the component according to the invention obtained from the pulley of Figure 1, wound and then coated with resin.
  • the winding of the wire 12 is wound around the mandrel 1 and ends at its ends 13 and 14 placed respectively in the grooves 6 and 7.
  • the pulley is filled between its lateral cheeks at the mandrel with a resin 11 of epoxy type coating the winding 12 and arriving at said cheeks.
  • the end view of the component of FIG. 3 provides a better understanding of the fixing of each winding end in the corresponding groove.
  • the end 13 is made mechanically integral with the pulley by introduction into the groove 6 and fixing using a solder of the tin-lead type 15. This tin-lead solder 15 also electrically connects the end 13 and the electrode 4. During filling with epoxy resin 11, the part of the groove which may not be filled with solder is completed with resin 11.
  • Figure 4 which is a sectional view parallel to the median plane of the grooves 6 and 7 shows the finished component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
EP19840401338 1983-07-04 1984-06-26 Induktives elektronisches Bauteil für Übertragung mit flachen Kontakten Expired EP0130902B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8311078A FR2548821B1 (fr) 1983-07-04 1983-07-04 Composant electronique inductif pour le report a plat
FR8311078 1983-07-04

Publications (3)

Publication Number Publication Date
EP0130902A2 true EP0130902A2 (de) 1985-01-09
EP0130902A3 EP0130902A3 (en) 1985-03-06
EP0130902B1 EP0130902B1 (de) 1987-11-19

Family

ID=9290470

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19840401338 Expired EP0130902B1 (de) 1983-07-04 1984-06-26 Induktives elektronisches Bauteil für Übertragung mit flachen Kontakten

Country Status (4)

Country Link
EP (1) EP0130902B1 (de)
JP (1) JPS6053005A (de)
DE (1) DE3467656D1 (de)
FR (1) FR2548821B1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3615037A1 (de) * 1986-05-03 1987-11-05 Johann Leonhard Huettlinger Anordnung bei der herstellung von spulenkoerpern fuer smd-spulen
GB2258764A (en) * 1991-08-14 1993-02-17 Abc Taiwan Electronics Corp Securing chip coil to p.c.b
EP0845792A3 (de) * 1996-11-29 1999-02-10 Taiyo Yuden Co., Ltd. Drahtgewickeltes elektronisches Bauelement und Verfahren zu seiner Herstellung
EP0785559A4 (de) * 1995-06-08 1999-08-11 Matsushita Electric Industrial Co Ltd Chip-spule
US7312682B2 (en) 2005-05-27 2007-12-25 Tdk Corporation Coil component and electronic device
US7467760B2 (en) 2002-04-29 2008-12-23 Allflex Europe Sas Coil arrangement for radio-frequency identification devices, process and apparatus for making said arrangement

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122208U (de) * 1987-02-03 1988-08-09
JPH03163808A (ja) * 1989-11-22 1991-07-15 Murata Mfg Co Ltd インダクタンス部品
JPH10172832A (ja) * 1996-12-11 1998-06-26 Taiyo Yuden Co Ltd 巻線型電子部品
JP4673499B2 (ja) * 2001-05-01 2011-04-20 コーア株式会社 チップ型コイル
JP4569533B2 (ja) * 2006-07-05 2010-10-27 Ｔｄｋ株式会社 コイル部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB879085A (en) * 1959-03-21 1961-10-04 Ericsson Telephones Ltd Improved bobbin for coils
DE6907606U (de) * 1969-02-26 1969-11-13 Sel Kontakt Bauelemente G M B Spulenkoerper
US3585553A (en) * 1970-04-16 1971-06-15 Us Army Microminiature leadless inductance element
DE3042433A1 (de) * 1980-11-11 1982-07-01 Draloric Electronic GmbH, 8500 Nürnberg Induktives bauelement zum einsatz in gedruckte schaltungen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3615037A1 (de) * 1986-05-03 1987-11-05 Johann Leonhard Huettlinger Anordnung bei der herstellung von spulenkoerpern fuer smd-spulen
GB2258764A (en) * 1991-08-14 1993-02-17 Abc Taiwan Electronics Corp Securing chip coil to p.c.b
EP0785559A4 (de) * 1995-06-08 1999-08-11 Matsushita Electric Industrial Co Ltd Chip-spule
EP0845792A3 (de) * 1996-11-29 1999-02-10 Taiyo Yuden Co., Ltd. Drahtgewickeltes elektronisches Bauelement und Verfahren zu seiner Herstellung
US7467760B2 (en) 2002-04-29 2008-12-23 Allflex Europe Sas Coil arrangement for radio-frequency identification devices, process and apparatus for making said arrangement
US7312682B2 (en) 2005-05-27 2007-12-25 Tdk Corporation Coil component and electronic device

Also Published As

Publication number Publication date
DE3467656D1 (en) 1987-12-23
EP0130902A3 (en) 1985-03-06
EP0130902B1 (de) 1987-11-19
FR2548821A1 (fr) 1985-01-11
JPS6053005A (ja) 1985-03-26
FR2548821B1 (fr) 1986-01-24

Similar Documents

Publication Publication Date Title
EP0130902B1 (de) Induktives elektronisches Bauteil für Übertragung mit flachen Kontakten
EP0671705B1 (de) Herstellungsverfahren einer Kombi-Karte
EP1157395B1 (de) Induktives elektronisches bauteil, und herstellungsverfahren
AU611082B2 (en) Passive electronic component
EP0217219B1 (de) Miniaturinduktionsspule und ihr Herstellungsverfahren
EP0232197A1 (de) Herstellungsverfahren eines induktiven Chip-Bauteils
EP0065910B1 (de) Magnetischer Kreis, Drossel mit derartigem magnetischem Kreis und Verfahren zur Herstellung von Drosseln
EP0351268B1 (de) Verfahren zum Löten von äusseren Verbindungsdrähten auf einem elektronischen Bauteil
EP0616490A1 (de) Miniaturisierte elektronische Anordnung, insbesondere mit gyromagnetischem Effekt
FR2824231A1 (fr) Dispositif de montage de composants electriques et/ou electroniques sur une plaquette a circuit imprime
EP0160594A1 (de) Piezoelektrischer Resonator
EP0439389B1 (de) Verfahren zur Herstellung von elektromagnetischen Spulen
EP0120754B1 (de) Polarisierte elektronische Vorrichtung und Verfahren zu ihrer Herstellung
FR2585504A1 (fr) Composant electronique inductif pour le report a plat et son procede de fabrication
EP0762602A1 (de) Anlasser für Kraftfahrzeug mit verbesserter Erregerspule
FR2541037A1 (fr) Bobine haute frequence munie de broches de connexion
JPH10163040A (ja) 巻線型電子部品
EP0442411B1 (de) Konische Feder für einen elektrischen Kontakt
EP0895627B1 (de) Elektronische baugruppe mit einer an einer spule verbundenen elektronischen einheit
FR2555356A1 (fr) Condensateur parallelepipedique a report direct et son procede de fabrication
WO2001045117A1 (fr) Composant inductif de faible epaisseur
CH639509A5 (en) Adjustable capacitor and method of manufacturing a series of such adjustable capacitors
JPH09306774A (ja) チップ状インダクタの製造方法
FR2503957A1 (fr) Ligne a retard a constantes localisees
EP0501850A1 (de) Magnetischer Chipbauteil

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Designated state(s): DE GB IT NL

AK Designated contracting states

Designated state(s): DE GB IT NL

17P Request for examination filed

Effective date: 19850316

17Q First examination report despatched

Effective date: 19860410

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES L

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE GB IT NL

ITF It: translation for a ep patent filed
REF Corresponds to:

Ref document number: 3467656

Country of ref document: DE

Date of ref document: 19871223

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19920520

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19920521

Year of fee payment: 9

ITTA It: last paid annual fee
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19930626

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19930630

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19940101

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee
GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19930626

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Effective date: 19940301