EP0124312A2 - Structures de résistance pour imprimantes à jet d'encre thermiques - Google Patents

Structures de résistance pour imprimantes à jet d'encre thermiques Download PDF

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Publication number
EP0124312A2
EP0124312A2 EP84302524A EP84302524A EP0124312A2 EP 0124312 A2 EP0124312 A2 EP 0124312A2 EP 84302524 A EP84302524 A EP 84302524A EP 84302524 A EP84302524 A EP 84302524A EP 0124312 A2 EP0124312 A2 EP 0124312A2
Authority
EP
European Patent Office
Prior art keywords
resistive
ink
resistor
ink jet
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84302524A
Other languages
German (de)
English (en)
Other versions
EP0124312A3 (fr
Inventor
Tommie Camis
Robert R. Hay
Paul R. Spencer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0124312A2 publication Critical patent/EP0124312A2/fr
Publication of EP0124312A3 publication Critical patent/EP0124312A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14032—Structure of the pressure chamber
    • B41J2/14056—Plural heating elements per ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Definitions

  • This invention is concerned with resistor structures for thermal ink jet printers.
  • Ink jet systems may be classified as follows: (1) continuous, in which ink droplets are continuously ejected out from a nozzle at a constant rate under constant ink pressure; (2) electrostatic, in which an electrostatically charged ink jet is impelled by controllable electrostatic fields; and (3) impulse, or ink-on-demand, in which ink droplets are impelled on demand from a nozzle by a controllable mechanical force.
  • the invention is concerned with a nozzle head for this latter type of system.
  • Typical of the ink-on-demand systems is the approach set forth in U.S. Patent Specification no. 3.832,579.
  • a cylindrical piezoelectric transducer is tightly bound to the outer surface of a cylindrical nozzle.
  • Ink is delivered to the nozzle by means of a hose connected between one end of the nozzle and an ink reservoir.
  • the piezoelectric transducer receives an electrical impulse, it squeezes the nozzle which in turn generates a pressure wave resulting in the acceleration of the ink toward both ends of the nozzle.
  • An ink droplet is formed when the ink pressure wave exceeds the surface tension of the meniscus at the orifice on the small end of the nozzle.
  • an ink-on-demand printing system which utilizes an ink-containing capillary having an orifice from which ink is ejected.
  • an ink-heating mechanism which may be a resistor located either within or adjacent to the capillary.
  • Upon the application of a suitable current to the resistor it is rapidly heated.
  • a significant amount of thermal energy is transferred to the ink resulting in vaporization of a small portion of the ink adjacent the orifice and producing a bubble in the capillary.
  • the formation of this bubble in turn creates a pressure wave which propels a single ink droplet from the orifice onto a nearby writing surface or recording medium.
  • the ink bubble will quickly collapse on or near the ink - heating mechanism before any vapor escapes from the orifice.
  • the lifetime of thermal ink jet printers is dependent upon resistor lifetime. It has been found that a majority of resistor failures is due to cavitation damage which occurs during bubble collapse. Hence it is desirable that resistor wear due to cavitation damage should be minimized as much as possible.
  • the resistive element is provided with a central "cold" spot formed of a conductive material, it being assumed that most of the bubble damage occurs at or near the center of the resistor. The cold spot causes the formation of a toroidal bubble which upon collapse is randomly distributed across the resistor surface instead of being concentrated in a small central area of the resistor.
  • the cold spot is actually formed by means of a gold deposition in the center of the resistive element.
  • the gold spot thus effectively serves to short out the resistor or the resistive portion beneath it, thus preventing heat from being generated in that area. It will be appreciated that with this cold central spot, the heating of the ink immediately thereabove will be non-uniform which may not be efficacious for optimum bubble formation. Nor is it at all sure that the bubble collapse will not also occur in the central area of the resistive element albeit being separated from the resistive material by the gold spot in the center thereof. Should this occur, erosion of the gold spot or layer may result eventually causing resistor failure.
  • the present invention provides a resistive heater for use in thermal ink jet printers of the type having discrete ink-ejecting nozzles associated with discrete heaters, said heater being characterized by (a) a pair of resistive elements spaced apart from each other and adjacent to one of said ink-ejecting nozzles, and (b) electrically conductive means connecting said resistive elements in series with each other.
  • the resistive elements are preferably two-dimensional thin films.
  • each of said resistive elements has a sheet resistance which is multiple of the resistance of a single square.
  • the preferred embodiment of the present invention provides a resistive area in the form of two resistive legs, having an open central portion extending therebetween.
  • the resistance of each leg will be doubled or twice the resistance of a single square of resistance material as practiced heretofore in the art of thermal ink jet printers.
  • each leg of the resistive structure according to the present invention will provide 100 ohms per square for a total resistance of 200 ohms.
  • the present invention not only enhances resistor lifetime by eliminating bubble collapse/cavitation damage in the center of the thin film resistive area, but also reduces power losses in the conductors leading to the resistors by using lower operating currents.
  • the reduced current requirements also enhances the overall reliability of the thermal ink jet printhead.
  • the principal support structure is a substrate 2 of single crystalline silicon.
  • a thermally insulating layer 4 of silicon dioxide which may typically be 3.5 microns in thickness.
  • a resistive element 8 formed of tantalum and aluminium, for example.
  • conductor elements or strips, 10 and 10' disposed on the silicon dioxide layer 4 are conductor elements or strips, 10 and 10', which may be of aluminium or of an alloy of aluminium and copper. The conductors overlay the resistive element 8 except where it is desired to have resistive heating occur.
  • the next structure disposed over the resistive element 8 and its associated conductors 10 and 10' may be a passivation layer 12 of silicon carbide, for example, of from 0.5 to 2.5 microns in thickness.
  • barrier elements 14 and 16 Disposed on the upper surface of the silicon carbide layer 12 are barrier elements 14 and 16.
  • the barrier elements may comprise photo-definable organic plastic materials such as RISTON and VACREL. These barriers may take various configurations. As shown in Figure 1, they are formed on each side of the underlying resistor element 8. As shown in Figure 2, these barrier structures may surround each resistive element on three sides.
  • the barriers 14 and 16 serve to control refilling and collapse of the bubble, and prevent spattering from an adjacent orifice, as well as minimizing cross-talk or acoustic reflections between adjacent resistors.
  • the particular materials RISTON and VACREL are organic polymers manufactured and sold by E.I. DuPont de Nemours and Company of Wil- mington, Delaware, U.S.A.
  • the barriers 14 and 16 serve to space and hold an orifice plate 18 in position on the upper surface of the printhead assembly. In addition, the materials used can withstand temperatures as high as 300o C .
  • the orifice plate 18 may be formed of nickel. As shown, the orifice 20 itself is disposed immediately above and in line with its associated resistive element 8. While only a single orifice has been shown, it will be understood that the complete printhead may comprise an array of orifices each having respective underlying - resistive elements and conductors to permit the selective ejection of a droplet of ink from any particular orifice. With particular reference to Figure 2, it will be appreciated that the barriers 14, 14' and 16, 16' serve to space the orifice plate 20 above the passivation layer 12B permitting ink to flow in this space and between the barriers so as to be available in each orifice and over and above respective resistive elements 8, 8' and 8". The barriers 14, 14 1 and 16, 16' may simply extend between the resistive areas 8, 8 1 , 8" or the barriers may be joined at one end, as shown, to form a three-sided barrier structure around each resistive element.
  • the thermal energy developed thereby is transmitted through the passivation layer 12 to heat and vaporize a portion of a quantity of the ink 22 disposed in the orifice 20 and immediately above the resistive element 8.
  • the vaporization of the ink 22 eventually results in the expulsion of a droplet 22 1 of ink which impinges upon an immediately adjacent recording medium (not shown).
  • the bubble of ink vapor formed during the heating and vaporization thereof then collapses back onto the area immediately above the resistive element 8.
  • the resistor 8 is protected from any deleterious effects due to collapse of the ink bubble by means of the passivation layers 12.
  • the silicon carbide layer 12 being the layer in immediate contact with the ink, provides protection to the underlying materials due to its extreme hardness and resistance to cavitation.
  • any particular element or layer may be achieved by techniques well known in the art of film deposition and formation. These techniques involve the utilization of photo-resists and etching procedures to expose desired areas of the layer or structure where an element is to be formed followed by the deposition of the material of which the particular element is to be formed. These processes for forming the various layers and elements of the printhead assembly are well known in the art and will not be described in greater detail herein.
  • the resistive structures 8, 8" may be formed by depositing tantalum and aluminium onto the silicon dioxide layer 4 formed on the silicon substrate 2. Instead of a single resistive element, a pair of resistive elements 8', 8" are provided in the area previously occupied by the single resistive element 8.
  • This split resistive structure comprises two rectangular regions or legs 8' and 8" each being about 2 x 4 mils and spaced from each other by about .6 mil, for example. Electrical energy to produce heating is supplied to the resistive elements 8 1 and 8" by means of conductors 10' and 10", each contacting corresponding respective end portions of the two resistive elements. The circuit connections for these resistive elements is completed by the common conductor 10 which contacts the opposite ends of the resistive elements 8' and 8". It will also be appreciated that in actual practice, a passivation layer (not shown) may be applied over the surface of the structure shown in Figures 3 and 4.
  • FIG 6A depicts the typical geometry of a resistive element 8 according to the prior art.
  • the resistive element 8 mounted on a base b, is provided with conductors 10, 10' contacting opposed ends of the element.
  • the resistive element is a square (typically 4 mils on a side).
  • the sheet resistance of the resistive element 8 as shown in Figure 6A may be 50 ohms per square.
  • the resistive structure according to the present invention is shown wherein each resistor element or leg, 8' and 8", may be about 3 mils x 1.5 mils. It will thus be appreciated that each leg comprises two squares about 1.5 x 1.5 mils.
  • each leg now has a resistivity of 100 ohms while the total resistive structure, comprising both legs, provides a resistivity of 200 ohms. Since the total resistance is now four times that of a single square, considerably lower operating current is required in order to achieve the same degree of heating.
  • the resistive structure comprising four squares of 50 ohms per square each, reduces the required operating current to about 200 ma. This means that the power loss in the conductors typically may now be only about five percent.
  • the resistive structure according to the present invention not only reduces or eliminates damage to the resistive structure itself, but that structure also provides the opportunity to substantially decrease the operating current for the resistive structure.
  • both the geometry of the resistive structure and the reduced current requirements attainable with this structure enhance the overall reliability and lifetime of the resistive structure.

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
EP84302524A 1983-04-29 1984-04-13 Structures de résistance pour imprimantes à jet d'encre thermiques Withdrawn EP0124312A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49010483A 1983-04-29 1983-04-29
US490104 1983-04-29

Publications (2)

Publication Number Publication Date
EP0124312A2 true EP0124312A2 (fr) 1984-11-07
EP0124312A3 EP0124312A3 (fr) 1985-08-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP84302524A Withdrawn EP0124312A3 (fr) 1983-04-29 1984-04-13 Structures de résistance pour imprimantes à jet d'encre thermiques

Country Status (2)

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EP (1) EP0124312A3 (fr)
JP (1) JPS59207262A (fr)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0244643A2 (fr) * 1986-05-08 1987-11-11 Hewlett-Packard Company Procédé de fabrication de têtes d'impression pour imprimantes thermiques par jets d'encre
GB2206082A (en) * 1987-06-17 1988-12-29 Alcatel Business Systems Franking machine incorporating ink-jet printer and microprocessor for accounting and control
US4870433A (en) * 1988-07-28 1989-09-26 International Business Machines Corporation Thermal drop-on-demand ink jet print head
EP0396315A1 (fr) * 1989-05-01 1990-11-07 Xerox Corporation Tête d'impression thermique à jet d'encre avec des éléments chauffants générant des bulles
EP0514706A2 (fr) * 1991-05-24 1992-11-25 Hewlett-Packard Company Procédé de fabrication de têtes d'impression thermique pour jet d'encre ayant des substrats métalliques et têtes d'impression réalisées par le dit procédé
EP0534495A1 (fr) * 1988-06-03 1993-03-31 Canon Kabushiki Kaisha Tête d'enregistrement avec émission de liquide, substrat à cet effet et appareil d'enregistrement avec émission de liquide utilisant la dite tête
EP0638424A2 (fr) * 1993-08-09 1995-02-15 Hewlett-Packard Company Tête d'impression par jet d'encre thermique et méthode de fabrication
EP0707963A3 (fr) * 1994-10-20 1997-03-12 Canon Kk Tête à jet d'encre, cartouche de tête à jet d'encre et appareil à jet d'encre
EP0707964A3 (fr) * 1994-10-20 1997-03-19 Canon Kk Tête à jet d'encre liquide, cartouche de tête, appareil à jet liquide, procédé d'éjection de liquide et procédé d'éjection d'encre
EP0775580A3 (fr) * 1995-11-27 1997-10-22 Samsung Electronics Co Ltd Tête d'impression pour imprimante à projection d'encre par bulles
EP0803361A2 (fr) * 1996-04-22 1997-10-29 Canon Kabushiki Kaisha Tête à jet d'encre, cartouche à jet d'encre et appareil d'enregistrement à jet d'encre
EP0855277A2 (fr) * 1997-01-24 1998-07-29 Lexmark International, Inc. Tête d'impression à jet d'encre adaptée à la modulation de la taille des gouttes
US6070969A (en) * 1994-03-23 2000-06-06 Hewlett-Packard Company Thermal inkjet printhead having a preferred nucleation site
US6139131A (en) * 1999-08-30 2000-10-31 Hewlett-Packard Company High drop generator density printhead
EP1080905A1 (fr) * 1999-08-30 2001-03-07 Hewlett-Packard Company Générateur de gouttes à jet d'encre avec résistances fractionnées pour réduire le tassement des courants
US6276775B1 (en) 1999-04-29 2001-08-21 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6290336B1 (en) 1999-08-30 2001-09-18 Hewlett-Packard Company Segmented resistor drop generator for inkjet printing
US6309052B1 (en) * 1999-04-30 2001-10-30 Hewlett-Packard Company High thermal efficiency ink jet printhead
US6310639B1 (en) 1996-02-07 2001-10-30 Hewlett-Packard Co. Printer printhead
US6318847B1 (en) 2000-03-31 2001-11-20 Hewlett-Packard Company Segmented heater resistor for producing a variable ink drop volume in an inkjet drop generator
US6485128B1 (en) 1996-03-04 2002-11-26 Hewlett-Packard Company Ink jet pen with a heater element having a contoured surface
US6491377B1 (en) 1999-08-30 2002-12-10 Hewlett-Packard Company High print quality printhead
US6711806B2 (en) 2001-05-14 2004-03-30 Hewlett-Packard Development Company, L.P. Method of manufacturing a thermal fluid jetting apparatus
EP1447222A1 (fr) * 2003-01-15 2004-08-18 Samsung Electronics Co., Ltd. Tête à jet d'encre
US7431430B2 (en) * 2002-10-08 2008-10-07 Sony Corporation Liquid ejecting head having selectively controlled heat-energy evolving element regions
US10166778B2 (en) 2015-04-10 2019-01-01 Hewlett-Packard Development Company, L.P. Removing segment of a metal conductor while forming printheads
CN109562625A (zh) * 2016-08-16 2019-04-02 斑马技术公司 打印头针配置

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JPH0698753B2 (ja) * 1984-10-23 1994-12-07 セイコーエプソン株式会社 インクジエツト記録装置
US4746935A (en) * 1985-11-22 1988-05-24 Hewlett-Packard Company Multitone ink jet printer and method of operation
KR100413677B1 (ko) 2000-07-24 2003-12-31 삼성전자주식회사 버블 젯 방식의 잉크 젯 프린트 헤드
JP2006088711A (ja) * 2002-04-16 2006-04-06 Sony Corp 液体吐出装置及び液体吐出方法

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US4317124A (en) * 1979-02-14 1982-02-23 Canon Kabushiki Kaisha Ink jet recording apparatus

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JPS5931940B2 (ja) * 1979-02-19 1984-08-06 キヤノン株式会社 液滴噴射記録装置
JPS588660A (ja) * 1981-07-09 1983-01-18 Canon Inc 液体噴射記録ヘツド
JPS59124865A (ja) * 1982-12-29 1984-07-19 Canon Inc 液体噴射記録ヘッド及びこれを用いる液体噴射記録装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4317124A (en) * 1979-02-14 1982-02-23 Canon Kabushiki Kaisha Ink jet recording apparatus

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0244643A3 (fr) * 1986-05-08 1988-09-28 Hewlett-Packard Company Procédé de fabrication de têtes d'impression pour imprimantes thermiques par jets d'encre
EP0244643A2 (fr) * 1986-05-08 1987-11-11 Hewlett-Packard Company Procédé de fabrication de têtes d'impression pour imprimantes thermiques par jets d'encre
GB2206082A (en) * 1987-06-17 1988-12-29 Alcatel Business Systems Franking machine incorporating ink-jet printer and microprocessor for accounting and control
GB2206082B (en) * 1987-06-17 1991-05-15 Alcatel Business Systems Franking machine
EP0534495A1 (fr) * 1988-06-03 1993-03-31 Canon Kabushiki Kaisha Tête d'enregistrement avec émission de liquide, substrat à cet effet et appareil d'enregistrement avec émission de liquide utilisant la dite tête
US4870433A (en) * 1988-07-28 1989-09-26 International Business Machines Corporation Thermal drop-on-demand ink jet print head
EP0352978A2 (fr) * 1988-07-28 1990-01-31 Lexmark International, Inc. Tête thermique d'impression à jet d'encre générant des gouttelettes à la demande
EP0352978A3 (fr) * 1988-07-28 1990-07-18 Lexmark International, Inc. Tête thermique d'impression à jet d'encre générant des gouttelettes à la demande
EP0396315A1 (fr) * 1989-05-01 1990-11-07 Xerox Corporation Tête d'impression thermique à jet d'encre avec des éléments chauffants générant des bulles
EP0514706A2 (fr) * 1991-05-24 1992-11-25 Hewlett-Packard Company Procédé de fabrication de têtes d'impression thermique pour jet d'encre ayant des substrats métalliques et têtes d'impression réalisées par le dit procédé
EP0514706A3 (en) * 1991-05-24 1993-07-28 Hewlett-Packard Company Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby
EP0638424A2 (fr) * 1993-08-09 1995-02-15 Hewlett-Packard Company Tête d'impression par jet d'encre thermique et méthode de fabrication
EP0638424A3 (fr) * 1993-08-09 1996-07-31 Hewlett Packard Co Tête d'impression par jet d'encre thermique et méthode de fabrication.
US6227640B1 (en) 1994-03-23 2001-05-08 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6594899B2 (en) 1994-03-23 2003-07-22 Hewlett-Packard Development Company, L.P. Variable drop mass inkjet drop generator
US6070969A (en) * 1994-03-23 2000-06-06 Hewlett-Packard Company Thermal inkjet printhead having a preferred nucleation site
EP0707964A3 (fr) * 1994-10-20 1997-03-19 Canon Kk Tête à jet d'encre liquide, cartouche de tête, appareil à jet liquide, procédé d'éjection de liquide et procédé d'éjection d'encre
US5731828A (en) * 1994-10-20 1998-03-24 Canon Kabushiki Kaisha Ink jet head, ink jet head cartridge and ink jet apparatus
US5754201A (en) * 1994-10-20 1998-05-19 Canon Kabushiki Kaisha Liquid jet head, head cartridge, liquid jet apparatus, method of ejecting liquid, and method of injecting ink
US5880762A (en) * 1994-10-20 1999-03-09 Canon Kabushiki Kaisha Ink jet head with preliminary heater element
US6439690B2 (en) 1994-10-20 2002-08-27 Canon Kabushiki Kaisha Element substrate having connecting wiring between heat generating resistor elements and ink jet recording apparatus
EP0707963A3 (fr) * 1994-10-20 1997-03-12 Canon Kk Tête à jet d'encre, cartouche de tête à jet d'encre et appareil à jet d'encre
EP0775580A3 (fr) * 1995-11-27 1997-10-22 Samsung Electronics Co Ltd Tête d'impression pour imprimante à projection d'encre par bulles
US6540325B2 (en) 1996-02-07 2003-04-01 Hewlett-Packard Company Printer printhead
US6310639B1 (en) 1996-02-07 2001-10-30 Hewlett-Packard Co. Printer printhead
US6485128B1 (en) 1996-03-04 2002-11-26 Hewlett-Packard Company Ink jet pen with a heater element having a contoured surface
EP0803361A2 (fr) * 1996-04-22 1997-10-29 Canon Kabushiki Kaisha Tête à jet d'encre, cartouche à jet d'encre et appareil d'enregistrement à jet d'encre
EP0803361A3 (fr) * 1996-04-22 1998-08-19 Canon Kabushiki Kaisha Tête à jet d'encre, cartouche à jet d'encre et appareil d'enregistrement à jet d'encre
US6290335B1 (en) 1996-04-22 2001-09-18 Canon Kabushiki Kaisha Ink-jet head, ink-jet cartridge, and ink jet recording apparatus
US6079811A (en) * 1997-01-24 2000-06-27 Lexmark International, Inc. Ink jet printhead having a unitary actuator with a plurality of active sections
EP0855277A2 (fr) * 1997-01-24 1998-07-29 Lexmark International, Inc. Tête d'impression à jet d'encre adaptée à la modulation de la taille des gouttes
EP0855277A3 (fr) * 1997-01-24 1999-06-16 Lexmark International, Inc. Tête d'impression à jet d'encre adaptée à la modulation de la taille des gouttes
US6402283B2 (en) 1999-04-29 2002-06-11 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6276775B1 (en) 1999-04-29 2001-08-21 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6309052B1 (en) * 1999-04-30 2001-10-30 Hewlett-Packard Company High thermal efficiency ink jet printhead
US6491377B1 (en) 1999-08-30 2002-12-10 Hewlett-Packard Company High print quality printhead
US6290336B1 (en) 1999-08-30 2001-09-18 Hewlett-Packard Company Segmented resistor drop generator for inkjet printing
US6422688B2 (en) 1999-08-30 2002-07-23 Hewlett-Packard Company Segmented resistor inkjet drop generator with current crowding reduction
EP1080905A1 (fr) * 1999-08-30 2001-03-07 Hewlett-Packard Company Générateur de gouttes à jet d'encre avec résistances fractionnées pour réduire le tassement des courants
US6139131A (en) * 1999-08-30 2000-10-31 Hewlett-Packard Company High drop generator density printhead
US6280019B1 (en) * 1999-08-30 2001-08-28 Hewlett-Packard Company Segmented resistor inkjet drop generator with current crowding reduction
US6799822B2 (en) 1999-08-30 2004-10-05 Hewlett-Packard Development Company, L.P. High quality fluid ejection device
US6367147B2 (en) 1999-08-30 2002-04-09 Hewlett-Packard Company Segmented resistor inkjet drop generator with current crowding reduction
US6318847B1 (en) 2000-03-31 2001-11-20 Hewlett-Packard Company Segmented heater resistor for producing a variable ink drop volume in an inkjet drop generator
US6711806B2 (en) 2001-05-14 2004-03-30 Hewlett-Packard Development Company, L.P. Method of manufacturing a thermal fluid jetting apparatus
US7431430B2 (en) * 2002-10-08 2008-10-07 Sony Corporation Liquid ejecting head having selectively controlled heat-energy evolving element regions
EP1447222A1 (fr) * 2003-01-15 2004-08-18 Samsung Electronics Co., Ltd. Tête à jet d'encre
US7101024B2 (en) 2003-01-15 2006-09-05 Samsung Electronics Co., Ltd. Ink-jet printhead
US10166778B2 (en) 2015-04-10 2019-01-01 Hewlett-Packard Development Company, L.P. Removing segment of a metal conductor while forming printheads
CN109562625A (zh) * 2016-08-16 2019-04-02 斑马技术公司 打印头针配置
CN109562625B (zh) * 2016-08-16 2020-11-27 斑马技术公司 打印头针配置

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JPS59207262A (ja) 1984-11-24
EP0124312A3 (fr) 1985-08-28
JPH0448623B2 (fr) 1992-08-07

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