EP0027520B1 - Electrical weak-current contact - Google Patents

Electrical weak-current contact Download PDF

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Publication number
EP0027520B1
EP0027520B1 EP80105005A EP80105005A EP0027520B1 EP 0027520 B1 EP0027520 B1 EP 0027520B1 EP 80105005 A EP80105005 A EP 80105005A EP 80105005 A EP80105005 A EP 80105005A EP 0027520 B1 EP0027520 B1 EP 0027520B1
Authority
EP
European Patent Office
Prior art keywords
weight
gold
copper
indium
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP80105005A
Other languages
German (de)
French (fr)
Other versions
EP0027520A1 (en
Inventor
Fritz Dr. Aldinger
Elke Biberbach
Albrecht Dr. Bischoff
Nils Dr. Harmsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of EP0027520A1 publication Critical patent/EP0027520A1/en
Application granted granted Critical
Publication of EP0027520B1 publication Critical patent/EP0027520B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31884—Regenerated or modified cellulose
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31895—Paper or wood

Definitions

  • the invention relates to an electrical low-voltage contact, in particular for switching and plug-in connections, made of a composite material which has a carrier and a contact layer made of a gold-silver-palladium alloy thereon.
  • Switching and mating contacts especially when they have to meet higher requirements, mostly consist of base metals or base metal alloys plated with precious metals or precious metal alloys as the contact layer.
  • Copper alloys such as copper-tin, copper-zinc, copper-zinc-nickel, copper-tin-nickel and copper-beryllium, nickel and iron alloys are usually used as carrier materials.
  • support and carrier materials are selected so that their properties, which are essential for the manufacturing process, further processing and application, do not deviate too much from one another, so that the support layer is firmly and crack-free bonded to the carrier material even under thermal and mechanical stress remains.
  • German patent 1,089,491 a contact material for low-voltage contacts, in particular for telecommunications, is known, which consists of an alloy of 25-35% palladium, 35-45% silver and 25-35% gold.
  • indium and tin and other alloys for electrical contacts containing secondary constituents are known from DE-B2-2 540 956 (20-30% by weight palladium, 15-25% by weight silver, 2.5 -5% by weight of tin, 0.05-0.5% by weight of iridium, 0.05-0.5% by weight of ruthenium, 0.05-0.5% by weight of 'copper, 0.1-2% by weight -% indium, balance gold) and from DE-B2-2 637 807 (1040% silver, 2-25% palladium, 1-5% nickel, 0.1-10% indium, 0.1-3% tin , Rest of gold).
  • the object is achieved according to the invention for an electrical low-current contact of the type characterized in the introduction by a composite material which has a contact layer made of an alloy of 35-55% by weight gold, 18-33.5% by weight silver, 30 on the copper-based alloy -40% by weight palladium and either 1-6% by weight indium or 0.5-2% by weight tin and 0.5-2% by weight indium.
  • the naturally hard copper alloys have proven particularly useful as carrier materials. Those with 6 or 8% by weight of tin, Cu Sn 6 and Cu Sn 8 are preferred.
  • the low-current contacts according to the invention have good electrical conductivity, resistance to abrasion and corrosion, as tests of aging in a noxious gas atmosphere have shown.
  • the good adhesion with the copper alloys Cu Sn 6 and Cu Sn 8 preferred as the carrier is due to the good correspondence of the recrystallization temperatures of the carrier and contact material.
  • a switching contact is shown schematically, which is designed according to the invention.
  • the reference number 1 is assigned to the carrier made of the copper-based alloy, the reference number 2 of the intermediate layer made of nickel or copper-nickel and the reference number 3 of the contact layer made of an alloy, as characterized in claims 1 to 5.

Description

Die Erfindung betrifft einen elektrischen Schwachstromkontakt, insbesondere für Schalt-und Steckverbindungen, aus einem Verbundwerkstoff, der einen Träger und auf diesem eine Kontaktschicht aus einer Gold-Silber-Palladium-Legierung aufweist.The invention relates to an electrical low-voltage contact, in particular for switching and plug-in connections, made of a composite material which has a carrier and a contact layer made of a gold-silver-palladium alloy thereon.

Schaltende und steckende Kontakte bestehen, besonders wenn sie höheren Anforderungen genügen müssen, meist aus mit Edelmetallen oder Edelmetall-Legierungen als Kontaktschicht plattierten Trägern aus Unedelmetallen , oder Unedelmetall-Legierungen. Als Trägermaterialien werden üblicherweise Kupfer-Legierungen, wie zum Beispiel Kupfer-Zinn, Kupfer-Zink, Kupfer-Zink-Nickel, Kupfer-Zinn-Nickel und Kupfer-Beryllium, Nickel- und Eisen-Legierungen verwendet.Switching and mating contacts, especially when they have to meet higher requirements, mostly consist of base metals or base metal alloys plated with precious metals or precious metal alloys as the contact layer. Copper alloys, such as copper-tin, copper-zinc, copper-zinc-nickel, copper-tin-nickel and copper-beryllium, nickel and iron alloys are usually used as carrier materials.

Bei der Herstellung von Verbundwerkstoffen werden Auflage- und Trägermaterialien so gewählt, daß sie in ihren für das Herstellungsverfahren, die Weiterverarbeitung und die Anwendung wesentlichen Eigenschaften nicht zu stark voneinander abweichen, damit auch bei thermischer und mechanischer Beanspruchung die Auflageschicht fest und rißfrei mit dem Trägermaterial verbunden bleibt.In the production of composite materials, support and carrier materials are selected so that their properties, which are essential for the manufacturing process, further processing and application, do not deviate too much from one another, so that the support layer is firmly and crack-free bonded to the carrier material even under thermal and mechanical stress remains.

Aus der deutschen Patentschrift 1 089 491 ist ein Kontaktmaterial für Schwachstromkontakte, insbesondere für die Fernmeldetechnik, bekannt, das aus einer Legierung von 25-35% Palladium, 35-45% Silber und 25-35% Gold besteht.From German patent 1,089,491, a contact material for low-voltage contacts, in particular for telecommunications, is known, which consists of an alloy of 25-35% palladium, 35-45% silver and 25-35% gold.

Neben Palladium, Silber und Gold als Hauptbestandteile noch Indium und Zinn und andere Nebenbestandteile enthaltende Legierungen für elektrische Kontakte sind aus der DE-B2-2 540 956 (20-30 Gewichts-% Palladium, 15-25 Gewichts-% Silber, 2,5-5 Gewichts-% Zinn, 0,05-0,5 Gewichts-% Iridium, 0,05-0,5 Gewichts-% Ruthenium, 0,05-0,5 Gewichts-%' Kupfer, 0,1-2 Gewichts-% Indium, Rest Gold) und aus der DE-B2-2 637 807 (10­40% Silber, 2-25% Palladium, 1-5% Nickel, 0,1-10% Indium, 0,1-3% Zinn, Rest Gold) bekannt.In addition to palladium, silver and gold as the main constituents, indium and tin and other alloys for electrical contacts containing secondary constituents are known from DE-B2-2 540 956 (20-30% by weight palladium, 15-25% by weight silver, 2.5 -5% by weight of tin, 0.05-0.5% by weight of iridium, 0.05-0.5% by weight of ruthenium, 0.05-0.5% by weight of 'copper, 0.1-2% by weight -% indium, balance gold) and from DE-B2-2 637 807 (1040% silver, 2-25% palladium, 1-5% nickel, 0.1-10% indium, 0.1-3% tin , Rest of gold).

Es ist die Aufgabe der Erfindung, einen elektrischen Schwachstromkontakt, insbesondere für Schalt- und Steckverbindungen, aus einem Verbundwerkstoff aus einer Kupfer-Basis-Legierung als Trägermaterial und einer Kontaktschicht aus einer Gold-Silber-Palladium-Legierung zu finden, der günstige mechanische und elektrische Eigenschaften und eine gute Haftfestigkeit zwischen der Kontaktschicht und dem Träger aufweist.It is the object of the invention to find an electrical low-current contact, in particular for switching and plug-in connections, made of a composite material made of a copper-based alloy as a carrier material and a contact layer made of a gold-silver-palladium alloy, which is inexpensive mechanical and electrical Properties and a good adhesive strength between the contact layer and the carrier.

Die Aufgabe wird erfindungsgemäß für einen elektrischen Schwachstromkontakt der eingangs charakterisierten Art durch einen Verbundwerkstoff gelöst, der auf der Kupfer-Basis-Legierung eine Kontaktschicht aus einer Legierung aus 35-55 Gewichts-% Gold, 18-33,5 Gewichts-% Silber, 30-40 Gewichts-% Palladium und entweder 1-6 Gewichts-% Indium oder 0,5-2 Gewichts-% Zinn und 0,5-2 Gewichts-% Indium aufweist.The object is achieved according to the invention for an electrical low-current contact of the type characterized in the introduction by a composite material which has a contact layer made of an alloy of 35-55% by weight gold, 18-33.5% by weight silver, 30 on the copper-based alloy -40% by weight palladium and either 1-6% by weight indium or 0.5-2% by weight tin and 0.5-2% by weight indium.

Als Kontaktschichten haben sich besonders solche aus den Legierungen aus

  • 39 Gewichts-% Gold, 22 Gewichts-% Silber, 37 Gewichts-% Palladium und 2 Gewichts-% Indium,
  • 39 Gewichts-% Gold, 20 Gewichts-% Silber, 37 Gewichts-% Palladium und 4 Gewichts-% Indium,
  • 39 Gewichts-% Gold, 22,5 Gewichts-% Silber, 37 Gewichts-% Palladium, 1 Gewichts-% Zinn und 0,5 Gewichts-% Indium und
  • 39 Gewichts-% Gold, 29,5 Gewichts-% Silber, 30 Gewichts-% Palladium, 1 Gewichts-% Zinn und 0,5 Gewichts-% Indium

bewährt.Those made of the alloys have emerged as contact layers
  • 39% by weight gold, 22% by weight silver, 37% by weight palladium and 2% by weight indium,
  • 39% by weight gold, 20% by weight silver, 37% by weight palladium and 4% by weight indium,
  • 39% by weight gold, 22.5% by weight silver, 37% by weight palladium, 1% by weight tin and 0.5% by weight indium and
  • 39% by weight gold, 29.5% by weight silver, 30% by weight palladium, 1% by weight tin and 0.5% by weight indium

proven.

Als Trägermaterialien haben sich die naturharten Kupfer-Legierungen besonders bewährt. Bevorzugt werden die mit 6 bzw. 8 Gewichts-% Zinn, Cu Sn 6 und Cu Sn 8.The naturally hard copper alloys have proven particularly useful as carrier materials. Those with 6 or 8% by weight of tin, Cu Sn 6 and Cu Sn 8 are preferred.

Die erfindungsgemäßen Schwachstromkontakte besitzen eine gute elektrische Leitfähigkeit, Abrieb- und Korrosionsfestigkeit, wie Auslagerungsversuche in Schadgasatmosphäre gezeigt haben.The low-current contacts according to the invention have good electrical conductivity, resistance to abrasion and corrosion, as tests of aging in a noxious gas atmosphere have shown.

Bei der Herstellung der Verbundwerkstoffe durch Walzplattieren und der anschließenden Weiterverarbeitung durch verformende Behandlung, z. B. Biegen, zeigt sich als besonderer Vorteil des Verbundwerkstoffes die haftfeste Bindung von Träger und Kontaktschicht aneinander. Ohne Schwierigkeiten lassen sich durch Walzplattieren auch lange Bänder erhalten. Daraus hergestellte Blattfederkontakte weisen keine Biegerisse auf.In the manufacture of the composite materials by roll cladding and the subsequent further processing by shaping treatment, e.g. B. bending, shows a special advantage of the composite material, the adhesive bond of carrier and contact layer to each other. Long strips can also be obtained without difficulty by roll cladding. Leaf spring contacts made therefrom have no bending cracks.

Die gute Haftung bei den als Träger bevorzugten Kupfer-Legierungen Cu Sn 6 und Cu Sn 8 ist .auf die gute Übereinstimmung der Rekristallisationstemperaturen von Träger- und Kontaktmaterial zurückzuführen.The good adhesion with the copper alloys Cu Sn 6 and Cu Sn 8 preferred as the carrier is due to the good correspondence of the recrystallization temperatures of the carrier and contact material.

Diese vorteilhaften Ergebnisse beruhen auf der erfindungsgemäßen Kombination des speziellen Trägermaterials mit der ausgewählten Legierung als Kontaktschicht.These advantageous results are based on the combination according to the invention of the special carrier material with the selected alloy as the contact layer.

In gewissen Fällen hat es sich als zweckmäßig erwiesen, zwischen dem Träger und der Kontaktschicht eine als Diffusionssperrschicht dienende Zwischenschicht aus Nickel oder Kupfer-Nickel aufzubringen.In certain cases it has proven to be expedient to apply an intermediate layer made of nickel or copper-nickel between the carrier and the contact layer, which serves as a diffusion barrier layer.

In der Figur ist schematisch ein Schaltkontakt dargestellt, der erfindungsgemäß ausgebildet ist. Die Bezugsziffer 1 ist dem Träger aus der Kupfer-Basis-Legierung zugeordnet, die Bezugsziffer 2 der Zwischenschicht aus Nickel oder Kupfer-Nickel und die Bezugsziffer 3 der Kontaktschicht aus einer Legierung, wie sie in den Ansprüchen 1 bis 5 charakterisiert ist.In the figure, a switching contact is shown schematically, which is designed according to the invention. The reference number 1 is assigned to the carrier made of the copper-based alloy, the reference number 2 of the intermediate layer made of nickel or copper-nickel and the reference number 3 of the contact layer made of an alloy, as characterized in claims 1 to 5.

Claims (8)

1. Electrical light-current contact, especially for circuit connections and plug connections made of a compact working material comprising a carrier and a contact layer of gold/silver/palla- dium alloy therein, characterised in that the carrier consists of a copper-based alloy and the contact layer consists of an alloy of 35 to 55% by weight of gold, 18 to 33.5% by weight of silver, 30 to 40% by weight of palladium and either 1 to 6% by weight of indium or 0.5 to 2% by weight of tin and 0.5 to 2% by weight of indium.
2. Electrical light-current contact according to claim 1, characterised in that the contact layer consists of an alloy of 39% by weight of gold, 22% by weight of silver, 37% by weight of palladium and 2% by weight of indium.
3. Electrical light-current contact according to claim 1, characterised in that the contact layer consists of an alloy of 39% by weight of gold, 22% by weight of silver, 37% by weight of . palladium and 2% by weight of indium.
4. Electrical light-current contact according to claim 1, characterised in that the contact layer consists of an alloy of 39% by weight of gold, 22.5% by weight of silver, 37% by weight of palladium, 1% by weight of tin and 0.5% by weight of indium.
5. Electrical light-current contact according to claim 1, characterised in that the contact layer consists of an alloy of 39% by weight of gold, 29.5% by weight of silver, 30% by weight of palladium, 1% by weight of tin and 0.5% by weight of indium.
6. Electrical light-current contact according to one of claims 1 to 5, characterised in that the copper-based alloy consists of 94% by weight of copper and 6% by weight of tin.
7. Electrical light-current contact according to one of claims 1 to 5, characterised in that the copper-based alloy consists of 92% by weight of copper and 8% by weight of tin.
8. Electrical light-current contact according to one of the preceding claims, characterised by an intermediate layer of nickel or copper/nickel between carrier and contact layer.
EP80105005A 1979-10-08 1980-08-22 Electrical weak-current contact Expired EP0027520B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2940772A DE2940772C2 (en) 1979-10-08 1979-10-08 Low-voltage electrical contact
DE2940772 1979-10-08

Publications (2)

Publication Number Publication Date
EP0027520A1 EP0027520A1 (en) 1981-04-29
EP0027520B1 true EP0027520B1 (en) 1983-04-13

Family

ID=6082991

Family Applications (1)

Application Number Title Priority Date Filing Date
EP80105005A Expired EP0027520B1 (en) 1979-10-08 1980-08-22 Electrical weak-current contact

Country Status (4)

Country Link
US (1) US4339644A (en)
EP (1) EP0027520B1 (en)
JP (1) JPS5658939A (en)
DE (1) DE2940772C2 (en)

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Also Published As

Publication number Publication date
DE2940772C2 (en) 1982-09-09
JPS5658939A (en) 1981-05-22
JPH0364969B2 (en) 1991-10-09
US4339644A (en) 1982-07-13
DE2940772A1 (en) 1981-04-09
EP0027520A1 (en) 1981-04-29

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