EP0000856A1 - Magnetische Wärmeleitungsanordnung für Halbleiterplättchen - Google Patents
Magnetische Wärmeleitungsanordnung für Halbleiterplättchen Download PDFInfo
- Publication number
- EP0000856A1 EP0000856A1 EP7878430006A EP78430006A EP0000856A1 EP 0000856 A1 EP0000856 A1 EP 0000856A1 EP 7878430006 A EP7878430006 A EP 7878430006A EP 78430006 A EP78430006 A EP 78430006A EP 0000856 A1 EP0000856 A1 EP 0000856A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- fluid
- heat transfer
- transfer device
- magnet
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Definitions
- the present invention relates to a magnetic heat transfer device for semiconductor microchip which can be used in the field of semiconductor integrated circuits.
- the use of a magnet thermally bonded to a large cooling device allows the heat generated in the microchip to be removed thanks to the use of a magnetic fluid that the flux emanating from the magnet keeps it in place and whose shape it defines, this fluid covering a large part of the rear surface of the chip.
- This fluid allows heat transfer by conduction and convection, and allows replacement and repair. of the microchip.
- This allows the different elements to move relative to each other which solves the problems posed by the different coefficients of thermal expansion.
- the invention makes it possible to obtain maximum heat transfer because the quantity of magnetic fluid maintained by the magnet is greater than would be possible from simple viscosity.
- a magnetic fluid is applied to the rear part of the chip.
- the shape adopted by this fluid and its thermal circulation are determined by the flux generated by a magnet thermally linked to a large cooling device.
- a substrate 1 which may be composed of one or more insulating layers containing conductors and contacts 2 connected to corresponding contacts on a chip 4 by means of connections 3.
- the connections shown are made by soldering by reflow, a technique in which the surface tension of a quantity of solder whose surface is limited by the dimensions of the contacts raises the chip above the substrate while providing an electrical connection.
- Another well known technique of connection with a microchip consists in ensuring the connection of the conductors by means of a mounting frame.
- a magnetic fluid 5 is applied to the rear face of the microchip 4.
- This fluid of which there are different known types, consists of a vehicle containing magnetic particles in suspension.
- the viscosity of this fluid is such that it will not flow beyond the edges of the chip, and due to the presence of magnetic particles which are in suspension in the fluid, the shape of the latter can be modified by a magnetic flux.
- a commercially available fluid is marketed by the firm Ferro Fluidics Corporation. The fluid must remain stable at the operating temperature of the chip.
- a cooling device 7 which, in the figure, comprises fins 8, but, as will be understood by those skilled in the art, any other cooling technique, including direct contact with other fluids, can be used in the context of the present invention.
- Figure 2 is a section of Figure 1 and shows the details of the magnet 6 and the magnetic fluid 5.
- the chip 4 is again shown, as well as the connections 3, made by reflow soldering , with the substrate 1.
- the magnetic fluid 5 is represented on the rear face of the chip 4.
- the magnet 6 has a shape such that the flux lines, as shown in the figure, go from a peripheral region 9 to a central region 10, so that, as a result of the flow, the fluid 5 assumes a shape which makes it possible to have a greater quantity of fluid than that which the viscosity would normally allow, thus increasing the heat transfer by convection and by conduction from the rear face of the chip to the magnet 6, which is thermally linked to the cooling device 7, which in turn transfers the heat via the fins 8, to the medium in which the assembly is located.
- the configuration of the peripheral region 9 and of the central part 10 of the magnet 6 makes it possible to perform two functions, on the one hand, to give the magnetic fluid 5 a shape such that it allows, if necessary, to have a quantity of fluid greater than that which viscosity would normally allow, and, on the other hand, to keep the fluid in place during vibration and expansion / thermal.
- the shape of the fluid is such that it allows the increase of heat transfer by conduction and by convection.
- the non-uniform magnetic field generally attracts the fluid towards the region in which the magnetic field is most intense, this region being in principle the central part of the chip.
- the description given above relates to the use of a magnet and a magnetic fluid to facilitate the conduction and convection of heat between the rear face of a microchip and a cooling device while at the same time maintaining contact. not rigid but thermally efficient.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82419777A | 1977-08-12 | 1977-08-12 | |
US824197 | 1977-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0000856A1 true EP0000856A1 (de) | 1979-02-21 |
EP0000856B1 EP0000856B1 (de) | 1981-12-16 |
Family
ID=25240847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP78430006A Expired EP0000856B1 (de) | 1977-08-12 | 1978-07-20 | Magnetische Wärmeleitungsanordnung für Halbleiterplättchen |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0000856B1 (de) |
JP (1) | JPS5432074A (de) |
CA (1) | CA1102010A (de) |
DE (1) | DE2861442D1 (de) |
IT (1) | IT1112288B (de) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495838A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de refroidissement amovible pour supports de circuits integres |
US4445735A (en) * | 1980-12-05 | 1984-05-01 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Electrical connection device for high density contacts |
US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
FR2811476A1 (fr) * | 2000-07-07 | 2002-01-11 | Thomson Csf | Dispositif electronique avec encapsulant thermiquement conducteur |
US7031160B2 (en) * | 2003-10-07 | 2006-04-18 | The Boeing Company | Magnetically enhanced convection heat sink |
WO2007030376A2 (en) * | 2005-09-06 | 2007-03-15 | Sun Microsystems, Inc. | Magneto-hydrodynamic heat sink |
US20130148301A1 (en) * | 2011-12-12 | 2013-06-13 | Toyota Motor Engineering & Manufacturing North America | Magnetic fluid cooling devices and power electronics assemblies |
CN114390772A (zh) * | 2021-12-29 | 2022-04-22 | 江苏密特科智能装备制造有限公司 | 一种半导体设备精密组件 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09210801A (ja) * | 1996-02-05 | 1997-08-15 | Yuji Inomata | 流路内配置用検知装置 |
JP6036431B2 (ja) * | 2013-03-18 | 2016-11-30 | 富士通株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
GB1441433A (en) * | 1973-09-18 | 1976-06-30 | Ind Instr Ltd | Heat conductive pastes |
-
1978
- 1978-06-14 CA CA305,488A patent/CA1102010A/en not_active Expired
- 1978-07-07 JP JP8215378A patent/JPS5432074A/ja active Granted
- 1978-07-20 DE DE7878430006T patent/DE2861442D1/de not_active Expired
- 1978-07-20 EP EP78430006A patent/EP0000856B1/de not_active Expired
- 1978-07-26 IT IT26104/78A patent/IT1112288B/it active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
GB1441433A (en) * | 1973-09-18 | 1976-06-30 | Ind Instr Ltd | Heat conductive pastes |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495838A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de refroidissement amovible pour supports de circuits integres |
EP0053967A1 (de) * | 1980-12-05 | 1982-06-16 | COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) | Abnehmbare Kühlanordnung für integrierte Schaltungsträger |
US4445735A (en) * | 1980-12-05 | 1984-05-01 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Electrical connection device for high density contacts |
US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
FR2811476A1 (fr) * | 2000-07-07 | 2002-01-11 | Thomson Csf | Dispositif electronique avec encapsulant thermiquement conducteur |
WO2002005346A1 (fr) * | 2000-07-07 | 2002-01-17 | Thales | Dispositif electronique avec encapsulant thermiquement conducteur |
US6924559B2 (en) | 2000-07-07 | 2005-08-02 | Thales | Electronic device with heat conductive encasing device |
US7031160B2 (en) * | 2003-10-07 | 2006-04-18 | The Boeing Company | Magnetically enhanced convection heat sink |
WO2007030376A2 (en) * | 2005-09-06 | 2007-03-15 | Sun Microsystems, Inc. | Magneto-hydrodynamic heat sink |
WO2007030376A3 (en) * | 2005-09-06 | 2007-07-26 | Sun Microsystems Inc | Magneto-hydrodynamic heat sink |
US7516778B2 (en) | 2005-09-06 | 2009-04-14 | Sun Microsystems, Inc. | Magneto-hydrodynamic heat sink |
EP3096202A1 (de) | 2005-09-06 | 2016-11-23 | Oracle America, Inc. | Magneto-hydrodynamischer kühlkörper |
US20130148301A1 (en) * | 2011-12-12 | 2013-06-13 | Toyota Motor Engineering & Manufacturing North America | Magnetic fluid cooling devices and power electronics assemblies |
US8730674B2 (en) * | 2011-12-12 | 2014-05-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Magnetic fluid cooling devices and power electronics assemblies |
CN114390772A (zh) * | 2021-12-29 | 2022-04-22 | 江苏密特科智能装备制造有限公司 | 一种半导体设备精密组件 |
CN114390772B (zh) * | 2021-12-29 | 2024-03-08 | 江苏密特科智能装备制造有限公司 | 一种半导体设备精密组件 |
Also Published As
Publication number | Publication date |
---|---|
JPS5635026B2 (de) | 1981-08-14 |
JPS5432074A (en) | 1979-03-09 |
IT1112288B (it) | 1986-01-13 |
DE2861442D1 (en) | 1982-02-11 |
IT7826104A0 (it) | 1978-07-26 |
EP0000856B1 (de) | 1981-12-16 |
CA1102010A (en) | 1981-05-26 |
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