EA201892465A1 - METHOD FOR LASER TREATMENT OF NON-METAL PLATES - Google Patents

METHOD FOR LASER TREATMENT OF NON-METAL PLATES

Info

Publication number
EA201892465A1
EA201892465A1 EA201892465A EA201892465A EA201892465A1 EA 201892465 A1 EA201892465 A1 EA 201892465A1 EA 201892465 A EA201892465 A EA 201892465A EA 201892465 A EA201892465 A EA 201892465A EA 201892465 A1 EA201892465 A1 EA 201892465A1
Authority
EA
Eurasian Patent Office
Prior art keywords
plates
technical result
metal plates
laser treatment
laser
Prior art date
Application number
EA201892465A
Other languages
Russian (ru)
Other versions
EA036002B1 (en
Inventor
Александр Фёдорович Коваленко
Original Assignee
Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" filed Critical Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова"
Publication of EA201892465A1 publication Critical patent/EA201892465A1/en
Publication of EA036002B1 publication Critical patent/EA036002B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/08—Preparation of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H01L21/3247—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering for altering the shape, e.g. smoothing the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/42—Bombardment with radiation
    • H01L21/423—Bombardment with radiation with high-energy radiation
    • H01L21/428—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

Изобретение относится к области технологических процессов и может быть использовано для лазерного отжига пластин из полупроводниковых, керамических и стеклообразных материалов. Техническим результатом изобретения является исключение разрушения пластин термоупругими напряжениями в процессе обработки и повышение выхода годных пластин. Технический результат достигается тем, что в способе лазерной обработки неметаллических пластин, заключающемся в облучении их поверхности непрерывным лазерным излучением с плотностью энергии, достаточной для достижения поверхностью пластины температуры отжига, осуществляют предварительный нагрев пластины до температуры, обеспечивающей выполнение критерия термопрочности.The invention relates to the field of technological processes and can be used for laser annealing of wafers made of semiconductor, ceramic and glassy materials. The technical result of the invention is to eliminate the destruction of the plates by thermoelastic stresses during processing and to increase the yield of suitable plates. The technical result is achieved by the fact that in the method of laser processing of non-metallic plates, which consists in irradiating their surface with continuous laser radiation with an energy density sufficient for the plate surface to reach the annealing temperature, the plate is preheated to a temperature that meets the thermal strength criterion.

EA201892465A 2018-06-20 2018-11-28 Laser treatment method for non-metal wafers EA036002B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2018122426A RU2685427C1 (en) 2018-06-20 2018-06-20 Method of laser processing of non-metallic plates

Publications (2)

Publication Number Publication Date
EA201892465A1 true EA201892465A1 (en) 2019-12-30
EA036002B1 EA036002B1 (en) 2020-09-11

Family

ID=66168300

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201892465A EA036002B1 (en) 2018-06-20 2018-11-28 Laser treatment method for non-metal wafers

Country Status (2)

Country Link
EA (1) EA036002B1 (en)
RU (1) RU2685427C1 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2211753C2 (en) * 2000-12-22 2003-09-10 Военная академия Ракетных войск стратегического назначения им. Петра Великого Method for working non-metallic materials
JP4825459B2 (en) * 2005-06-28 2011-11-30 株式会社東芝 Heat treatment apparatus, heat treatment method, and semiconductor device manufacturing method
WO2009104521A1 (en) * 2008-02-19 2009-08-27 新日本製鐵株式会社 Low core loss unidirectional electromagnetic steel plate and method of manufacturing the same
US20100068898A1 (en) * 2008-09-17 2010-03-18 Stephen Moffatt Managing thermal budget in annealing of substrates
US9302348B2 (en) * 2011-06-07 2016-04-05 Ultratech Inc. Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication
CN203900744U (en) * 2014-06-20 2014-10-29 上海和辉光电有限公司 Laser annealing equipment
RU2573181C1 (en) * 2014-11-24 2016-01-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") Laser processing of non-metallic plates
RU2583870C1 (en) * 2015-02-25 2016-05-10 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") Laser processing of nonmetallic plates
RU2602402C1 (en) * 2015-08-14 2016-11-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") Method of laser processing of nonmetallic plates
RU2633860C1 (en) * 2016-06-24 2017-10-18 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") Method of laser annealing of non-metallic materials

Also Published As

Publication number Publication date
RU2685427C1 (en) 2019-04-18
EA036002B1 (en) 2020-09-11

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ KZ KG TJ TM RU