EA201492087A1 - Способ текстурирования на подложке, имеющей большую поверхность - Google Patents

Способ текстурирования на подложке, имеющей большую поверхность

Info

Publication number
EA201492087A1
EA201492087A1 EA201492087A EA201492087A EA201492087A1 EA 201492087 A1 EA201492087 A1 EA 201492087A1 EA 201492087 A EA201492087 A EA 201492087A EA 201492087 A EA201492087 A EA 201492087A EA 201492087 A1 EA201492087 A1 EA 201492087A1
Authority
EA
Eurasian Patent Office
Prior art keywords
substrate
bag
buffer
applying
texturing
Prior art date
Application number
EA201492087A
Other languages
English (en)
Russian (ru)
Inventor
Николя Шемэн
Жереми Тессер
Элин Сондергар
Original Assignee
Сэн-Гобэн Гласс Франс
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Сэн-Гобэн Гласс Франс filed Critical Сэн-Гобэн Гласс Франс
Publication of EA201492087A1 publication Critical patent/EA201492087A1/ru

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B29C43/12Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies using bags surrounding the moulding material or using membranes contacting the moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0227Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3644Vacuum bags; Details thereof, e.g. fixing or clamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
EA201492087A 2012-05-14 2013-05-14 Способ текстурирования на подложке, имеющей большую поверхность EA201492087A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1254373A FR2990384B1 (fr) 2012-05-14 2012-05-14 Procede de texturation sur un substrat de grande surface
PCT/FR2013/051048 WO2013171420A1 (fr) 2012-05-14 2013-05-14 Procede de texturation sur un substrat de grande surface

Publications (1)

Publication Number Publication Date
EA201492087A1 true EA201492087A1 (ru) 2015-02-27

Family

ID=48577122

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201492087A EA201492087A1 (ru) 2012-05-14 2013-05-14 Способ текстурирования на подложке, имеющей большую поверхность

Country Status (9)

Country Link
US (1) US9296132B2 (https=)
EP (1) EP2850493A1 (https=)
JP (1) JP6141969B2 (https=)
KR (1) KR20150010726A (https=)
CN (1) CN104272187A (https=)
EA (1) EA201492087A1 (https=)
FR (1) FR2990384B1 (https=)
IN (1) IN2014MN02198A (https=)
WO (1) WO2013171420A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11133118B2 (en) * 2012-05-22 2021-09-28 University Of Massachusetts Patterned nanoparticle structures
US10088110B2 (en) * 2016-05-17 2018-10-02 Hexagon Technology As Pressure vessel liner venting via nanotextured surface
EP3481562A4 (en) * 2016-07-08 2019-06-26 University of Massachusetts STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY
FR3065723B1 (fr) 2017-04-28 2021-09-03 Saint Gobain Article protege par une couche de protection temporaire rugueuse
KR102870782B1 (ko) * 2019-08-06 2025-10-13 엘지전자 주식회사 디스플레이 장치의 제조 방법 및 디스플레이 장치 제조를 위한 전사 기판
US12044963B2 (en) 2020-01-22 2024-07-23 Applied Materials, Inc. High refractive index imprint compositions and materials and processes for making the same
US11892771B2 (en) 2020-04-20 2024-02-06 Applied Materials, Inc. Methods for increasing the density of high-index nanoimprint lithography films
FR3122523B1 (fr) * 2021-04-30 2023-06-09 Commissariat Energie Atomique Procede de structuration de surface hybride par gravure plasma
CN116875091B (zh) * 2023-07-12 2024-08-30 东方绿色能源(河北)有限公司华中分公司 一种不锈钢基体表面超疏水薄膜及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1493348A (en) * 1973-10-30 1977-11-30 Ft Projects Ltd Thermal treatment of heat fusible materials
US4360266A (en) * 1979-08-24 1982-11-23 Dai Nippon Insatsu Kabushiki Kaisha Contact printing method and apparatus
JPS6172529A (ja) * 1984-09-17 1986-04-14 Mitsui Toatsu Chem Inc 複合材料の製法
US5393365A (en) * 1993-11-19 1995-02-28 E. I. Du Pont De Nemours And Company Embossed glass/plastic laminate and process for preparing the same
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
US7635262B2 (en) * 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050084613A1 (en) * 2003-08-19 2005-04-21 Jian Wang Sub-micron-scale patterning method and system
CN100540275C (zh) 2003-11-17 2009-09-16 陶氏康宁公司 固化有机硅树脂基底的压花方法
JP4146817B2 (ja) * 2004-04-16 2008-09-10 サカイオーベックス株式会社 繊維強化積層材の製造方法
US7195733B2 (en) * 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
US7186367B2 (en) * 2004-05-13 2007-03-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Double vacuum bag process for resin matrix composite manufacturing
FR2893610B1 (fr) * 2005-11-23 2008-07-18 Saint Gobain Procede de structuration de surface d'un produit verrier, produit verrier a surface structuree et utilisations
JP2012061820A (ja) * 2010-09-17 2012-03-29 Dainippon Printing Co Ltd 繊維強化複合材料の賦型方法

Also Published As

Publication number Publication date
JP2015522443A (ja) 2015-08-06
FR2990384A1 (fr) 2013-11-15
IN2014MN02198A (https=) 2015-09-11
WO2013171420A1 (fr) 2013-11-21
JP6141969B2 (ja) 2017-06-07
US9296132B2 (en) 2016-03-29
FR2990384B1 (fr) 2015-05-15
CN104272187A (zh) 2015-01-07
EP2850493A1 (fr) 2015-03-25
KR20150010726A (ko) 2015-01-28
US20150140837A1 (en) 2015-05-21

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